JP2000031030A - Aligner, data management method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve collectiveness and the operability with respect to programs and data files generated by other semiconductor aligners, etc. SOLUTION: This aligner connected to a network is provided with a retrieval means, which retrieves a compatible data file or program stored on another aligner 1, a work station 2, or a server 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for printing a circuit pattern or the like on a wafer or the like by a step-and-repeat method, a data management method therefor,
And a device manufacturing method using the same.

[0002]

2. Description of the Related Art Conventionally, programs and data files on a semiconductor exposure apparatus are individually and collectively managed on a single semiconductor exposure apparatus. For users having a plurality of semiconductor exposure apparatuses, each semiconductor exposure apparatus has means for program management and data management,
Each has a program and a data file.
In order to use these programs and data files, data is transferred to another semiconductor exposure apparatus by a method via an auxiliary storage device such as a floppy disk, MO disk, or magnetic tape.

[0003]

However, according to such a conventional technique, programs and data files on a semiconductor exposure apparatus are individually and collectively managed on a single semiconductor exposure apparatus. Users having a plurality of semiconductor exposure apparatuses have means for program management and data management, respectively, and have programs and data files, respectively. There is a lack of flexibility in terms of coordination and operability. In addition, the number of models has increased, and programs and data files that cannot be interchanged among models have emerged. For this reason, the operator must know information such as which models are compatible with each other.

An object of the present invention is to provide an exposure apparatus connected by a network, a data management method in the exposure apparatus, and a device manufacturing method using the same, in view of the problems of the prior art. Another object of the present invention is to improve the coordination and operability of the program and data file created in the above.

[0005]

In order to achieve this object, according to the present invention, in an exposure apparatus connected to a network, a compatible data file or a data file stored in another exposure apparatus, a workstation, or a server is stored. Characterized by having search means for searching for a program,
As a result, coordination and operability with respect to programs and data files created by other semiconductor exposure apparatuses or the like are improved.

A management method according to the present invention is a method for managing the data file in such an exposure apparatus, wherein a part which can be shared with another exposure apparatus, a workstation, or a server and a part unique to the apparatus are included. It is characterized by separate management, thereby facilitating management of information such as compatibility between models.

Further, in the device manufacturing method of the present invention, using the above-described exposure apparatus, a compatible data file or program stored in another exposure apparatus, a workstation, or a server is transmitted via a network. A feature is that a device is manufactured by performing exposure while using the device, thereby improving the efficiency of device manufacturing.

[0008]

In a preferred embodiment of the present invention, the search means responds to a search request from an operator.
The requested data file or program that is compatible with other exposure equipment, workstations,
Or, if stored in the server, display the list. The search means has a selection means for selecting a desired one from the displayed data file or program, and when the operator selects a desired one by the selection means, loads the data file or the program into the apparatus. I do. In addition, at the time of the loading, the search means performs necessary conversion on a parameter value unique to the apparatus. The search means has a table for the conversion.

In the management method according to the present invention, a table is provided which indicates whether a value included in the data file is a value that can be shared with another exposure apparatus, a workstation, or a server, or a value unique to the apparatus. ,
Update or reference this table as needed.

[0010]

FIG. 1 is a perspective view showing the appearance of a semiconductor exposure apparatus according to one embodiment of the present invention. As shown in FIG. 1, the semiconductor exposure apparatus includes a temperature control chamber 101 for controlling an environmental temperature of the apparatus main body, an EWS main body 106 disposed therein and having a CPU for controlling the apparatus main body, and a predetermined Display device 102 for displaying EWS information, monitor TV 105 for displaying image information obtained via the imaging means in the device main body, operation panel 103 for making predetermined input to the device, EW
A console unit including an S keyboard 104 and the like is provided. In the figure, 107 is an ON-OFF switch, 108 is an emergency stop switch, 109 is various switches, a mouse, etc.
10 is a LAN communication cable, 111 is an exhaust duct for generating heat from the console function, and 112 is an exhaust device for the chamber. The semiconductor exposure apparatus main body is installed inside the chamber 101.

The EWS display 102 is of a thin flat type such as EL, plasma, liquid crystal, etc., is housed in the front of the chamber 101, and is connected to the EWS main body 106 by a LAN cable 110. Operation panel 10
3. A keyboard 104, a monitor TV 105, and the like are also installed on the front surface of the chamber 101 so that a console operation similar to the conventional console operation can be performed from the front surface of the chamber 101.

FIG. 2 is a diagram showing the internal structure of the apparatus shown in FIG. FIG. 1 shows a stepper as a semiconductor exposure apparatus. In the drawing, reference numeral 202 denotes a reticle, and 203, a wafer. When a light beam emitted from a light source device 204 illuminates the reticle 202 through an illumination optical system 205, a pattern on the reticle 202 is exposed by a projection lens 206 to a photosensitive area on the wafer 203. Can be transferred to a layer. The reticle 202 is supported by a reticle stage 207 for holding and moving the reticle 202. Wafer 203
Is exposed while being vacuum-sucked by the wafer chuck 291. The wafer chuck 291 is mounted on the wafer stage 20.
9 allows movement in each axis direction. Above the reticle 202, a reticle optical system 281 for detecting the amount of displacement of the reticle is arranged. Above the wafer stage 209, an off-axis microscope 282 is arranged adjacent to the projection lens 206. Off-axis microscope 282
The main function is to detect the relative position between the internal reference mark and the alignment mark on the wafer 203.
In addition, adjacent to these stepper bodies, peripheral devices such as reticle library 220 and wafer carrier elevator 2
The reticle 30 and the necessary reticle and wafer are transferred to the stepper body by the reticle transfer device 221 and the wafer transfer device 231.

The chamber 101 is mainly composed of an air conditioner room 210 for controlling the temperature of air, a filter box 213 for filtering fine foreign matters to form a uniform flow of clean air, and a booth 214 for shutting off the environment of the apparatus from the outside. Have been. In the chamber 101, air whose temperature has been adjusted by the cooler 215 and the reheater 216 in the air conditioner room 210 is supplied into the booth 214 via the air filter g by the blower 217. The air supplied to the booth 214 is returned to the air conditioner room 210 from the return port ra.
And circulates in the chamber 101. Normally, the chamber 101 is not strictly a complete circulation system. To keep the inside of the booth 214 at a positive pressure at all times, about 10% of the circulating air amount outside the booth 214 is provided in the air conditioner room 210. The air is introduced from the outside air inlet oa via a blower.
In this way, the chamber 101 enables the environment temperature where the apparatus is placed to be kept constant and the air to be kept clean.

The light source device 204 is provided with an intake port sa in preparation for cooling of an ultra-high pressure mercury lamp and generation of toxic gas when a laser is abnormal.
And an exhaust port ea, and a part of the air in the booth 214 is forcibly exhausted to factory equipment via a light source device 204 and a dedicated exhaust fan provided in the air conditioner room 210. Further, a chemical adsorption filter cf for removing chemical substances in the air is provided so as to be connected to the outside air introduction port oa and the return port ra of the air conditioner room 210, respectively.

FIG. 3 is a block diagram showing an electric circuit configuration of the apparatus shown in FIG. In the figure, reference numeral 321 denotes a main unit C built in the EWS main unit 106, which controls the entire apparatus.
It is a PU and comprises a central processing unit such as a microcomputer or a minicomputer. 322 is a wafer stage driving device, and 323 is the off-axis microscope 28.
2 is an alignment detection system, 324 is a reticle stage driving device, 325 is an illumination system such as the light source device 204, 3
26 is a shutter driving device, 327 is a focus detection system,
Reference numeral 328 denotes a Z drive, which is a main body CPU 32
1 is controlled. 329 is the reticle transport device 2
21, a transfer system such as a wafer transfer device 231. 330
Is a console unit having the display 102, the keyboard 104, etc., for giving various commands and parameters relating to the operation of the exposure apparatus to the main body CPU 321. That is, it is for exchanging information with the operator. 331 is a console CPU and 332 is an external memory for storing parameters and the like. The console CPU 331 includes a register for temporarily storing various data generated when the CPU executes a predetermined process, and a working memory (RAM) in which a flag is set.

FIG. 4 is a diagram showing a state in which a plurality of apparatuses 1 of FIG. 1, a workstation 2 and a server 3 are connected on a network. FIG. 5 shows that the apparatus of FIG. It is a flowchart at the time of performing a file search process. With reference to these figures, an operation when the apparatus in FIG. 1 performs a job file search will be described.

When the console CPU 331 starts the job file search in accordance with the search request from the operator, first, in step S501, the console CPU 331 searches the internal HD (hard disk) 332 of the apparatus of FIG. If there is a file, those jobs A, B,
After displaying the list of C ..., the process proceeds to step S503. If there is no job file in the built-in HD 332, the process directly proceeds to step S503. Step S50
In step 3, the HD of other semiconductor exposure apparatuses, workstations, and servers connected to the network is searched, and if there is a job file, the process proceeds to step S5.
Go to 04. In step S504, the type of the machine with which the search request is issued is compared, and it is determined whether or not the job file is compatible.
This is displayed in step S505. If the job file exists in the search in step 503 but is determined to be incompatible in the comparison in step S504, it is not displayed. In this way, the operator is notified only of compatible job files among the semiconductor exposure apparatuses, workstations, servers and the like connected via the network.

FIG. 6 is a flowchart showing processing when a job selection command is executed. The operation at the time of job selection will be described with reference to FIG. When a compatible job file is notified to the operator according to the procedure of FIG. 5 and a certain job file is selected by the operator, in step S601, the selected job file is changed to another semiconductor exposure apparatus or work on the network. It is determined whether or not the data is referred to from the station or the server. If it is determined that the selected job file has been referenced from another semiconductor exposure apparatus, workstation or server, in step S602, the job file is referred to the management table shown in FIG. The file is converted and loaded in step S603.

Here, the conversion process is performed by referring to FIG.
It is determined whether or not each parameter is specific to the semiconductor exposure apparatus that has issued the selection request by operating the operator, and if the parameter is specific to the semiconductor exposure apparatus, Is replaced with a value unique to the semiconductor exposure apparatus, and for shared ones, the process of using the parameter value as it is is performed. In addition, newly added parameters, etc.
A default value is entered with reference to the management table of FIG.
The management table in FIG. 7 describes the names and default values of the parameters in the job file and whether the parameters are values unique to the semiconductor exposure apparatus.

As another embodiment, a case of searching for an upgraded program will be described. Place the latest version upgrade program on a server on the network. At this time, when the operator issues a program search request, first, the HD in the semiconductor exposure apparatus that has issued the search request is searched (step S501 in FIG. 5). Next, a search is made for HDs built in other semiconductor exposure apparatuses, workstations, and servers connected to the network (step S50).
3). At this time, if a target version upgrade program is found by searching the HD in the server, the type of the upgrade program is compared with the type of the machine that has issued the search request, and it is determined whether the machine is compatible (step S504). Only the version upgrade program is displayed (step S505).

As described above, the present invention can be applied to all data files and programs related to the semiconductor exposure apparatus.

<Embodiment of Device Manufacturing Method> Next, an embodiment of a device manufacturing method using the above-described exposure apparatus will be described. FIG. 8 shows a flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass.
Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes an assembly process (dicing and bonding).
It includes steps such as a packaging step (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 9 shows the wafer process (step 4).
The detailed flow of is shown. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a resist is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus or exposure method to align and print the circuit pattern of the mask on a plurality of shot areas of the wafer.
Step 17 (development) develops the exposed wafer.
In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps,
Multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, it is possible to produce a large-sized device, which was conventionally difficult to produce, at low cost.

[0025]

As described above, according to the present invention, a data file or a program can be used without being conscious of which exposure apparatus or the like has been created. Further, when data changed in one exposure apparatus is used in another exposure apparatus, there is no need to reset parameters unique to the apparatus, nor to use an auxiliary storage device. Therefore, it is possible to improve cooperability and operability with respect to a program or a data file created by another semiconductor exposure apparatus or the like.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of a semiconductor exposure apparatus according to one embodiment of the present invention.

FIG. 2 is a diagram showing the internal structure of the device of FIG.

FIG. 3 is a block diagram showing an electric circuit configuration of the device shown in FIG.

FIG. 4 is a diagram illustrating an example in which a plurality of apparatuses, workstations, and servers in FIG. 1 are connected on a network.

FIG. 5 is a flowchart at the time of a data file search process in the apparatus of FIG. 1;

FIG. 6 is a flowchart showing an operation when a data file is selected in the apparatus of FIG. 1;

FIG. 7 is a diagram of a data file management table.

FIG. 8 is a flowchart illustrating a device manufacturing method that can use the exposure apparatus of the present invention.

FIG. 9 is a detailed flowchart of a wafer process in FIG. 8;

[Explanation of symbols]

1: semiconductor exposure apparatus, 2: workstation, 3: server, 101: temperature control chamber, 102: EWS display device, 103: operation panel, 104: EWS keyboard, 105: monitor TV, 106: EWS main body,
107: ON-OFF switch, 108: Emergency stop switch, 109: Various switches, mouse, etc., 110: LA
N: communication cable, 111: exhaust duct, 112: exhaust device, 202: reticle, 203: wafer, 204: light source device, 205: illumination optical system, 206: projection lens, 20
7: reticle stage, 209: wafer stage, 28
1: reticle microscope, 282: off-axis microscope, 2
10: air conditioner room, 213: filter box, 214:
Booth, 217: blower, g: air filter, cf: chemical adsorption filter, oa: outside air introduction port, ra: return port, 321: main body CPU, 330: console, 33
1: Console CPU, 332: External memory.

Claims (8)

[Claims] 1. An exposure apparatus connected to a network, comprising: a search unit for searching for a compatible data file or program stored in another exposure apparatus, a workstation, or a server. apparatus. 2. The search means according to claim 1, wherein said requested data file or program, which is compatible with said search request, is stored in another exposure apparatus, workstation, or server. 2. The exposure apparatus according to claim 1, wherein the list is displayed. 3. The search means has a selection means for selecting a desired one from the displayed data file or program. When an operator selects a desired one from the displayed data file or program, the data file or program is displayed. 3. The exposure apparatus according to claim 2, wherein the program is loaded into the apparatus. 4. The exposure apparatus according to claim 3, wherein said retrieval means performs necessary conversion on a parameter value unique to the apparatus at the time of loading. 5. An exposure apparatus according to claim 4, wherein said search means has a table for said conversion. 6. A method for managing the data file in the exposure apparatus according to claim 1, wherein a part that can be shared with another exposure apparatus, a workstation, or a server is separated from a part unique to the apparatus. A data management method characterized in that data management is performed. 7. A table is provided which indicates whether the value of a parameter included in the data file is a value that can be shared with another exposure apparatus, a workstation, or a server, or a value unique to the apparatus. 7. The data management method according to claim 6, wherein the data is updated or referred to. 8. Exposure using the exposure apparatus according to claim 1 while using a compatible data file or program stored in another exposure apparatus, a workstation or a server via a network. A device manufacturing method by performing the following.