IT981202B - PROCEDURE FOR FIXING MICROMINIATURIZED CIRCUITS TO SUPPORT MODULES AND INSULATING ADHESIVE COMPOUND USED IN THIS PROCESS - Google Patents
PROCEDURE FOR FIXING MICROMINIATURIZED CIRCUITS TO SUPPORT MODULES AND INSULATING ADHESIVE COMPOUND USED IN THIS PROCESSInfo
- Publication number
- IT981202B IT981202B IT21312/73A IT2131273A IT981202B IT 981202 B IT981202 B IT 981202B IT 21312/73 A IT21312/73 A IT 21312/73A IT 2131273 A IT2131273 A IT 2131273A IT 981202 B IT981202 B IT 981202B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- fixing
- compound used
- insulating adhesive
- adhesive compound
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H01L2924/102—Material of the semiconductor or solid state bodies
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- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
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- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/181—Encapsulation
Abstract
1419163 Microcircuit assemblies INTERNATIONAL BUSINESS MACHINES CORP 13 April 1973 [31 May 1972] 17806/73 Heading H1K An electronic circuit assembly comprises a microcircuit chip bonded to a substrate using an adhesive comprising an epoxy resin (I), a stoichiometric amount of an aromatic diamine curing agent (II) and 50-80% by wt. of the composition of alumina, silica or zirconium orthosilicate of particle size 6-12 Á. I may be a diglycidyl ether of bisphenol A or an epoxy novolac resin. II may comprise 55-75% mphenylenediamine and 45-25% methylenedianiline. In examples silicon chips are bonded to novolac, copper and aluminium substrates.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25816772A | 1972-05-31 | 1972-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT981202B true IT981202B (en) | 1974-10-10 |
Family
ID=22979383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT21312/73A IT981202B (en) | 1972-05-31 | 1973-03-08 | PROCEDURE FOR FIXING MICROMINIATURIZED CIRCUITS TO SUPPORT MODULES AND INSULATING ADHESIVE COMPOUND USED IN THIS PROCESS |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS521738B2 (en) |
DE (1) | DE2315714A1 (en) |
FR (1) | FR2186732A1 (en) |
GB (1) | GB1419163A (en) |
IT (1) | IT981202B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS584842B2 (en) * | 1975-01-06 | 1983-01-28 | 日本電信電話株式会社 | Manufacturing method of mechanical transducer for low wave device |
JPS5321771A (en) * | 1976-08-11 | 1978-02-28 | Sharp Kk | Electronic parts mounting structure |
JPS5491180A (en) * | 1977-12-28 | 1979-07-19 | Fujitsu Ltd | Mounting method of semiconductor device |
JPS5491178A (en) * | 1977-12-28 | 1979-07-19 | Fujitsu Ltd | Mounting method of semiconductor device |
JPS54121673A (en) * | 1978-03-15 | 1979-09-20 | Hitachi Ltd | Insulator coating material and semiconductor device using the said material |
JPS5582125A (en) * | 1978-12-19 | 1980-06-20 | Dainippon Toryo Co Ltd | Preparation of resin particle |
GB2097998B (en) * | 1981-05-06 | 1985-05-30 | Standard Telephones Cables Ltd | Mounting of integrated circuits |
US4630172A (en) * | 1983-03-09 | 1986-12-16 | Printed Circuits International | Semiconductor chip carrier package with a heat sink |
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1973
- 1973-03-08 IT IT21312/73A patent/IT981202B/en active
- 1973-03-29 DE DE2315714A patent/DE2315714A1/en active Pending
- 1973-04-13 GB GB1780673A patent/GB1419163A/en not_active Expired
- 1973-04-13 JP JP48041516A patent/JPS521738B2/ja not_active Expired
- 1973-04-19 FR FR7315257A patent/FR2186732A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2186732A1 (en) | 1974-01-11 |
JPS4931747A (en) | 1974-03-22 |
JPS521738B2 (en) | 1977-01-18 |
DE2315714A1 (en) | 1973-12-20 |
GB1419163A (en) | 1975-12-24 |
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