HK1026507A1 - Axially-lead type electronic parts and circuit substrate device for mounting the same. - Google Patents

Axially-lead type electronic parts and circuit substrate device for mounting the same.

Info

Publication number
HK1026507A1
HK1026507A1 HK00105719A HK00105719A HK1026507A1 HK 1026507 A1 HK1026507 A1 HK 1026507A1 HK 00105719 A HK00105719 A HK 00105719A HK 00105719 A HK00105719 A HK 00105719A HK 1026507 A1 HK1026507 A1 HK 1026507A1
Authority
HK
Hong Kong
Prior art keywords
axially
mounting
same
circuit substrate
electronic parts
Prior art date
Application number
HK00105719A
Inventor
Makoto Negishi
Original Assignee
Taiyo Yuden Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Kk filed Critical Taiyo Yuden Kk
Publication of HK1026507A1 publication Critical patent/HK1026507A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
HK00105719A 1998-08-28 2000-09-11 Axially-lead type electronic parts and circuit substrate device for mounting the same. HK1026507A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24400498A JP3836263B2 (en) 1998-08-28 1998-08-28 Axial lead type electronic component and circuit board device mounted with axial lead type electronic component

Publications (1)

Publication Number Publication Date
HK1026507A1 true HK1026507A1 (en) 2000-12-15

Family

ID=17112291

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00105719A HK1026507A1 (en) 1998-08-28 2000-09-11 Axially-lead type electronic parts and circuit substrate device for mounting the same.

Country Status (5)

Country Link
JP (1) JP3836263B2 (en)
KR (1) KR100657112B1 (en)
CN (1) CN1158681C (en)
HK (1) HK1026507A1 (en)
TW (1) TW442804B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535105B2 (en) * 2000-03-30 2003-03-18 Avx Corporation Electronic device and process of making electronic device
KR100822987B1 (en) * 2001-09-11 2008-04-16 주식회사 포스코 Sludge cake supply apparatus on belt conveyer for coke transferring
JP4453915B2 (en) * 2005-03-18 2010-04-21 富士通株式会社 Crossbar device, control method and program
JP5040715B2 (en) 2007-07-19 2012-10-03 パナソニック株式会社 Electronic parts and lead wires, and methods for producing them
WO2009011096A1 (en) * 2007-07-19 2009-01-22 Panasonic Corporation Electronic component, lead wire and their production methods
JP2010199171A (en) 2009-02-24 2010-09-09 Shinko Electric Ind Co Ltd Chip component mounted wiring board
CN111922474B (en) * 2020-07-08 2022-01-11 安徽工程大学 Metal and ceramic welding device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027410A (en) * 1987-12-30 1990-01-11 Tdk Corp Chip-shaped electronic component and its manufacture
JPH03157909A (en) * 1989-11-16 1991-07-05 Taiyo Yuden Co Ltd Cylindrical ceramic capacitor

Also Published As

Publication number Publication date
JP2000077257A (en) 2000-03-14
CN1248778A (en) 2000-03-29
KR20000017518A (en) 2000-03-25
TW442804B (en) 2001-06-23
KR100657112B1 (en) 2006-12-15
JP3836263B2 (en) 2006-10-25
CN1158681C (en) 2004-07-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090828