GB9616793D0 - Apparatus and method for soldering - Google Patents

Apparatus and method for soldering

Info

Publication number
GB9616793D0
GB9616793D0 GB9616793A GB9616793A GB9616793D0 GB 9616793 D0 GB9616793 D0 GB 9616793D0 GB 9616793 A GB9616793 A GB 9616793A GB 9616793 A GB9616793 A GB 9616793A GB 9616793 D0 GB9616793 D0 GB 9616793D0
Authority
GB
United Kingdom
Prior art keywords
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9616793A
Other versions
GB2316235A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Israel Ltd
Original Assignee
Motorola Israel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Israel Ltd filed Critical Motorola Israel Ltd
Priority to GB9616793A priority Critical patent/GB2316235A/en
Publication of GB9616793D0 publication Critical patent/GB9616793D0/en
Publication of GB2316235A publication Critical patent/GB2316235A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB9616793A 1996-08-09 1996-08-09 Heat sink and grounding arrangement Withdrawn GB2316235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9616793A GB2316235A (en) 1996-08-09 1996-08-09 Heat sink and grounding arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9616793A GB2316235A (en) 1996-08-09 1996-08-09 Heat sink and grounding arrangement

Publications (2)

Publication Number Publication Date
GB9616793D0 true GB9616793D0 (en) 1996-09-25
GB2316235A GB2316235A (en) 1998-02-18

Family

ID=10798290

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9616793A Withdrawn GB2316235A (en) 1996-08-09 1996-08-09 Heat sink and grounding arrangement

Country Status (1)

Country Link
GB (1) GB2316235A (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2552585B1 (en) * 1983-09-27 1985-11-08 Europ Composants Electron HOUSING FOR ELECTRONIC COMPONENT, ESPECIALLY FOR TELEPHONE PROTECTION
GB8531565D0 (en) * 1985-12-21 1986-02-05 Marston Palmer Ltd Heat sink
US4945401A (en) * 1987-07-20 1990-07-31 The Staver Company Inc. Heat dissipator for semiconductor unit
GB2236213A (en) * 1989-09-09 1991-03-27 Ibm Integral protective enclosure for an assembly mounted on a flexible printed circuit board
GB9218233D0 (en) * 1992-08-27 1992-10-14 Dsk Technology International L Cooling of electronics equipment
US5381041A (en) * 1994-04-05 1995-01-10 Wakefield Engineering, Inc. Self clamping heat sink

Also Published As

Publication number Publication date
GB2316235A (en) 1998-02-18

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)