GB8502074D0 - Transport system - Google Patents

Transport system

Info

Publication number
GB8502074D0
GB8502074D0 GB858502074A GB8502074A GB8502074D0 GB 8502074 D0 GB8502074 D0 GB 8502074D0 GB 858502074 A GB858502074 A GB 858502074A GB 8502074 A GB8502074 A GB 8502074A GB 8502074 D0 GB8502074 D0 GB 8502074D0
Authority
GB
United Kingdom
Prior art keywords
transport system
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB858502074A
Other versions
GB2156582A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Biosystems Inc
Original Assignee
Perkin Elmer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perkin Elmer Corp filed Critical Perkin Elmer Corp
Publication of GB8502074D0 publication Critical patent/GB8502074D0/en
Publication of GB2156582A publication Critical patent/GB2156582A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • B65G54/025—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic the load being magnetically coupled with a piston-like driver moved within a tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
GB08502074A 1984-03-29 1985-01-28 Small part transport system Withdrawn GB2156582A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59500584A 1984-03-29 1984-03-29

Publications (2)

Publication Number Publication Date
GB8502074D0 true GB8502074D0 (en) 1985-02-27
GB2156582A GB2156582A (en) 1985-10-09

Family

ID=24381310

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08502074A Withdrawn GB2156582A (en) 1984-03-29 1985-01-28 Small part transport system

Country Status (3)

Country Link
JP (1) JPS60227439A (en)
DE (1) DE3504021A1 (en)
GB (1) GB2156582A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3608783A1 (en) * 1986-03-15 1987-09-17 Telefunken Electronic Gmbh Gas-phase epitaxial method and apparatus for carrying it out
JPS636857A (en) * 1986-06-26 1988-01-12 Fujitsu Ltd Wafer transfer device
US4846626A (en) * 1987-02-09 1989-07-11 The Perkin-Elmer Corporation Wafer handling system
GB9006471D0 (en) * 1990-03-22 1990-05-23 Surface Tech Sys Ltd Loading mechanisms
USH1373H (en) * 1992-04-06 1994-11-01 American Telephone And Telegraph Company Wafer handling apparatus and method
GB2266992A (en) * 1992-05-06 1993-11-17 Surface Tech Sys Ltd Apparatus for loading semi-conductor wafers
US5377816A (en) * 1993-07-15 1995-01-03 Materials Research Corp. Spiral magnetic linear translating mechanism
US5711647A (en) * 1994-10-17 1998-01-27 Aesop, Inc. Method of and apparatus for locating and orientating a part on a gripper and transferring it to a tool while maintaining location and orientation on the tool
US6672819B1 (en) * 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
US5833426A (en) * 1996-12-11 1998-11-10 Applied Materials, Inc. Magnetically coupled wafer extraction platform
US6005226A (en) * 1997-11-24 1999-12-21 Steag-Rtp Systems Rapid thermal processing (RTP) system with gas driven rotating substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1317105A (en) * 1971-02-18 1973-05-16 Marine Eng Co Stockport Ltd Fluid operated device for moving articles
DE2948204C2 (en) * 1979-11-30 1982-06-16 Festo-Maschinenfabrik Gottlieb Stoll, 7300 Esslingen Pressure medium-operated actuator for a work or transport device

Also Published As

Publication number Publication date
DE3504021A1 (en) 1985-10-03
GB2156582A (en) 1985-10-09
JPS60227439A (en) 1985-11-12

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)