GB2491733B - Heat sink with multiple vapor chambers - Google Patents

Heat sink with multiple vapor chambers

Info

Publication number
GB2491733B
GB2491733B GB1212820.3A GB201212820A GB2491733B GB 2491733 B GB2491733 B GB 2491733B GB 201212820 A GB201212820 A GB 201212820A GB 2491733 B GB2491733 B GB 2491733B
Authority
GB
United Kingdom
Prior art keywords
heat sink
vapor chambers
multiple vapor
activation point
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1212820.3A
Other versions
GB201212820D0 (en
GB2491733A (en
Inventor
John P Franz
Sarah Nicole Anthony
Joseph R Allen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of GB201212820D0 publication Critical patent/GB201212820D0/en
Publication of GB2491733A publication Critical patent/GB2491733A/en
Application granted granted Critical
Publication of GB2491733B publication Critical patent/GB2491733B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink is disclosed. The heat sink comprises a base (102, 402) with at least one vapor chamber (208, 408) containing a fluid with a first activation point. The base has at least one vapor chamber (212, 412) containing a fluid with a second activation point. The first activation point is different than the second activation point.
GB1212820.3A 2010-01-26 2010-01-26 Heat sink with multiple vapor chambers Expired - Fee Related GB2491733B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2010/022087 WO2011093852A1 (en) 2010-01-26 2010-01-26 Heat sink with multiple vapor chambers

Publications (3)

Publication Number Publication Date
GB201212820D0 GB201212820D0 (en) 2012-09-05
GB2491733A GB2491733A (en) 2012-12-12
GB2491733B true GB2491733B (en) 2013-12-04

Family

ID=44319607

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1212820.3A Expired - Fee Related GB2491733B (en) 2010-01-26 2010-01-26 Heat sink with multiple vapor chambers

Country Status (5)

Country Link
US (1) US20120012281A1 (en)
CN (1) CN102713787A (en)
DE (1) DE112010004802T5 (en)
GB (1) GB2491733B (en)
WO (1) WO2011093852A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2808639A4 (en) * 2012-01-27 2015-08-05 Furukawa Electric Co Ltd Heat transport apparatus
CN102683520A (en) * 2012-05-31 2012-09-19 华南理工大学 LED aluminium vapor chamber integrated radiating structure and preparation method thereof
US9610955B2 (en) 2013-11-11 2017-04-04 Smartdrive Systems, Inc. Vehicle fuel consumption monitor and feedback systems
CN103824823B (en) * 2014-03-10 2017-07-18 吴鸿平 Endogenous fluids heat-exchange system
WO2015184603A1 (en) * 2014-06-04 2015-12-10 华为技术有限公司 Electronic device
CN105636405A (en) * 2014-11-05 2016-06-01 福特全球技术公司 Highly integrated power electronic module assembly
TWM512883U (en) * 2015-05-05 2015-11-21 Cooler Master Co Ltd Heat dissipation module, water-cooling heat dissipation module and heat dissipation system
CN105261596A (en) * 2015-09-23 2016-01-20 吴鸿平 Lighting LED integrated thermal movement device
US9880595B2 (en) 2016-06-08 2018-01-30 International Business Machines Corporation Cooling device with nested chambers for computer hardware
US20180177073A1 (en) * 2016-12-21 2018-06-21 Delphi Technologies, Inc. Compression fit heat sink for electronic components
US20180213679A1 (en) * 2017-01-26 2018-07-26 Asia Vital Components Co., Ltd. Heat dissipation unit
US11110833B2 (en) * 2017-08-31 2021-09-07 Faurecia Automotive Seating, Llc Thermal-transfer component for a vehicle seat
DE102018109920A1 (en) * 2018-04-25 2019-10-31 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Cooling of power electronic circuits
US11387506B2 (en) * 2018-10-31 2022-07-12 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal management systems including vapor chambers and phase change materials and vehicles including the same
JP6725180B2 (en) * 2018-12-07 2020-07-15 ホアウェイ・テクノロジーズ・カンパニー・リミテッド Electronic device
CN112566444B (en) * 2019-09-25 2023-01-20 深圳富泰宏精密工业有限公司 Composite material radiator and electronic device thereof
CN115151119A (en) * 2021-03-29 2022-10-04 北京小米移动软件有限公司 Electronic device
US20230320034A1 (en) * 2022-03-22 2023-10-05 Baidu Usa Llc Thermal management device for high density processing unit
US20230345669A1 (en) * 2022-04-20 2023-10-26 Quanta Computer Inc. Heat-Absorbing Chassis For Fan-Less Electronic Component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030121643A1 (en) * 2002-01-03 2003-07-03 Connors Matthew Joseph Bi-level heat sink
US20050128710A1 (en) * 2003-12-15 2005-06-16 Beiteimal Abdlmonem H. Cooling system for electronic components
US20060096740A1 (en) * 2004-11-10 2006-05-11 Wen-Chun Zheng Nearly isothermal heat pipe heat sink and process for making the same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3618660A (en) * 1969-11-21 1971-11-09 Euratom Heat transfer device
JPH02229455A (en) * 1989-03-02 1990-09-12 Furukawa Electric Co Ltd:The Apparatus of heat pipe system
US5253702A (en) * 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate
JPH05248778A (en) * 1992-03-03 1993-09-24 Hitachi Cable Ltd Composite heat pipe
JP3020790B2 (en) * 1993-12-28 2000-03-15 株式会社日立製作所 Heat pipe type cooling device and vehicle control device using the same
US7090001B2 (en) * 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
TWI229789B (en) * 2003-12-29 2005-03-21 Li Mei Feng Cooling method and device of micro heat pipe with pressure difference flow shunt
CN2681218Y (en) * 2004-02-13 2005-02-23 鸿富锦精密工业（深圳）有限公司 Liquid cooling type heat sink
US20050274487A1 (en) * 2004-05-27 2005-12-15 International Business Machines Corporation Method and apparatus for reducing thermal resistance in a vertical heat sink assembly
CN100377343C (en) * 2004-09-21 2008-03-26 鸿富锦精密工业（深圳）有限公司 Manufacturing method of heat radiation device
CN100529636C (en) * 2005-09-05 2009-08-19 鸿富锦精密工业（深圳）有限公司 Heat pipe and method for manufacturing same
US7272005B2 (en) * 2005-11-30 2007-09-18 International Business Machines Corporation Multi-element heat exchange assemblies and methods of fabrication for a cooling system
US7694727B2 (en) * 2007-01-23 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with multiple heat pipes
US20090059524A1 (en) * 2007-08-27 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN101500372B (en) * 2009-01-21 2011-07-06 深圳市深南电路有限公司 Electronic appliance and heat radiation substrate
CN101945561A (en) * 2009-07-07 2011-01-12 富准精密工业(深圳)有限公司 Dissipation device and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030121643A1 (en) * 2002-01-03 2003-07-03 Connors Matthew Joseph Bi-level heat sink
US20050128710A1 (en) * 2003-12-15 2005-06-16 Beiteimal Abdlmonem H. Cooling system for electronic components
US20060096740A1 (en) * 2004-11-10 2006-05-11 Wen-Chun Zheng Nearly isothermal heat pipe heat sink and process for making the same

Also Published As

Publication number Publication date
GB201212820D0 (en) 2012-09-05
DE112010004802T5 (en) 2012-11-15
US20120012281A1 (en) 2012-01-19
GB2491733A (en) 2012-12-12
WO2011093852A1 (en) 2011-08-04
CN102713787A (en) 2012-10-03

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20160825 AND 20160831

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20170126