GB2400925B - Agent-based control architecture - Google Patents

Agent-based control architecture

Info

Publication number
GB2400925B
GB2400925B GB0412557A GB0412557A GB2400925B GB 2400925 B GB2400925 B GB 2400925B GB 0412557 A GB0412557 A GB 0412557A GB 0412557 A GB0412557 A GB 0412557A GB 2400925 B GB2400925 B GB 2400925B
Authority
GB
United Kingdom
Prior art keywords
agent
based control
control architecture
architecture
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0412557A
Other versions
GB0412557D0 (en
GB2400925A (en
Inventor
Michael L Miller
Jason A Grover
Michael R Conboy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of GB0412557D0 publication Critical patent/GB0412557D0/en
Publication of GB2400925A publication Critical patent/GB2400925A/en
Application granted granted Critical
Publication of GB2400925B publication Critical patent/GB2400925B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32097—Recipe programming for flexible batch
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Factory Administration (AREA)
  • Multi-Process Working Machines And Systems (AREA)
GB0412557A 2002-01-10 2002-10-31 Agent-based control architecture Expired - Lifetime GB2400925B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4464002A 2002-01-10 2002-01-10
PCT/US2002/034850 WO2003060779A1 (en) 2002-01-10 2002-10-31 Agent-based control architecture

Publications (3)

Publication Number Publication Date
GB0412557D0 GB0412557D0 (en) 2004-07-07
GB2400925A GB2400925A (en) 2004-10-27
GB2400925B true GB2400925B (en) 2005-08-03

Family

ID=21933483

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0412557A Expired - Lifetime GB2400925B (en) 2002-01-10 2002-10-31 Agent-based control architecture

Country Status (8)

Country Link
JP (1) JP4849773B2 (en)
KR (1) KR100939329B1 (en)
CN (1) CN100449551C (en)
AU (1) AU2002343588A1 (en)
DE (1) DE10297636B4 (en)
GB (1) GB2400925B (en)
TW (1) TWI312448B (en)
WO (1) WO2003060779A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8032348B2 (en) 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8296687B2 (en) 2003-09-30 2012-10-23 Tokyo Electron Limited System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
US8050900B2 (en) 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US8036869B2 (en) 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8073667B2 (en) 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US7542880B2 (en) * 2006-04-06 2009-06-02 Advanced Micro Devices, Inc. Time weighted moving average filter
DE102007014970B3 (en) * 2007-03-28 2008-07-31 Siemens Ag Process e.g. medical treatment, configuration method, involves configuring process step, where process includes parallel running process steps, and configuration of process steps determines sequence of process steps
DE102008035258A1 (en) * 2008-07-29 2010-03-25 Siemens Aktiengesellschaft Method for testing data consistency of technical system, involves testing data consistency of control parameters marked by part of tag groups based on preset validation rules for providing test results
DE102011109388A1 (en) * 2011-08-04 2013-02-07 Heidelberger Druckmaschinen Aktiengesellschaft Automatic press improvement
KR101739532B1 (en) * 2012-02-21 2017-06-08 어플라이드 머티어리얼스, 인코포레이티드 Enhanced rehosting capability for legacy hardware and software
US20130282333A1 (en) * 2012-04-23 2013-10-24 Abb Technology Ag Service port explorer
DE102019218623A1 (en) * 2019-11-29 2021-06-02 Sms Group Gmbh Control system for an industrial plant, in particular for a plant for the production or processing of metallic strips or sheets, and method for controlling an industrial plant, in particular a plant for the production or processing of metallic strips or sheets

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5975736A (en) * 1994-07-15 1999-11-02 Ontrak Systems, Inc. Scrubber control system
WO2001050520A1 (en) * 2000-01-04 2001-07-12 Advanced Micro Devices, Inc. In-situ contril of a dry etcher
JP2001338856A (en) * 2000-05-30 2001-12-07 Tokyo Seimitsu Co Ltd Process controller for semiconductor manufacturing system
WO2001097280A2 (en) * 2000-06-02 2001-12-20 Timbre Technologies, Inc. Quality control using profile library

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4276711B2 (en) * 1998-01-05 2009-06-10 株式会社日立国際電気 Semiconductor manufacturing equipment control system
JP3002776B1 (en) * 1998-07-16 2000-01-24 横河電機株式会社 Production system and processing apparatus selection method in production system
JP3704698B2 (en) * 1998-08-12 2005-10-12 横河電機株式会社 Production system
JP2000158297A (en) * 1998-12-01 2000-06-13 Dainippon Screen Mfg Co Ltd Job management system, job management method, and record medium

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5975736A (en) * 1994-07-15 1999-11-02 Ontrak Systems, Inc. Scrubber control system
WO2001050520A1 (en) * 2000-01-04 2001-07-12 Advanced Micro Devices, Inc. In-situ contril of a dry etcher
JP2001338856A (en) * 2000-05-30 2001-12-07 Tokyo Seimitsu Co Ltd Process controller for semiconductor manufacturing system
WO2001097280A2 (en) * 2000-06-02 2001-12-20 Timbre Technologies, Inc. Quality control using profile library

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
(H. JURGEN MULLER) "Towards agent systems engineering", Data & Knowledge Engineering 23 (1997) 217-245. *
(TAPIO HEIKKILA et al.) "An agent architecture for manufacturing control: manAge". Computers in Industry 46 (2001), 315-331. *

Also Published As

Publication number Publication date
DE10297636B4 (en) 2008-05-08
DE10297636T5 (en) 2005-01-05
KR100939329B1 (en) 2010-01-28
AU2002343588A1 (en) 2003-07-30
CN100449551C (en) 2009-01-07
JP2005515623A (en) 2005-05-26
CN1610908A (en) 2005-04-27
WO2003060779A1 (en) 2003-07-24
TW200301854A (en) 2003-07-16
GB0412557D0 (en) 2004-07-07
JP4849773B2 (en) 2012-01-11
TWI312448B (en) 2009-07-21
GB2400925A (en) 2004-10-27
KR20040074116A (en) 2004-08-21

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20221030