GB2398937B - Connecting method and connecting structure of printed circuit boards - Google Patents

Connecting method and connecting structure of printed circuit boards

Info

Publication number
GB2398937B
GB2398937B GB0404460A GB0404460A GB2398937B GB 2398937 B GB2398937 B GB 2398937B GB 0404460 A GB0404460 A GB 0404460A GB 0404460 A GB0404460 A GB 0404460A GB 2398937 B GB2398937 B GB 2398937B
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
connecting structure
connecting method
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0404460A
Other versions
GB0404460D0 (en
GB2398937A (en
Inventor
Makoto Totani
Toshihiro Miyake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000242784A external-priority patent/JP3767346B2/en
Priority claimed from JP2000397994A external-priority patent/JP3800958B2/en
Application filed by Denso Corp filed Critical Denso Corp
Priority claimed from GB0118814A external-priority patent/GB2368471B/en
Publication of GB0404460D0 publication Critical patent/GB0404460D0/en
Publication of GB2398937A publication Critical patent/GB2398937A/en
Application granted granted Critical
Publication of GB2398937B publication Critical patent/GB2398937B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
GB0404460A 2000-08-04 2001-08-01 Connecting method and connecting structure of printed circuit boards Expired - Fee Related GB2398937B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000242784A JP3767346B2 (en) 2000-08-04 2000-08-04 Connection method of printed wiring board
JP2000397994A JP3800958B2 (en) 2000-12-27 2000-12-27 Printed wiring board connection method and connection structure
GB0118814A GB2368471B (en) 2000-08-04 2001-08-01 Connecting method and connecting structure of printed circuit boards

Publications (3)

Publication Number Publication Date
GB0404460D0 GB0404460D0 (en) 2004-03-31
GB2398937A GB2398937A (en) 2004-09-01
GB2398937B true GB2398937B (en) 2005-03-02

Family

ID=32830353

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0404459A Expired - Fee Related GB2398936B (en) 2000-08-04 2001-08-01 Connecting method and connecting structure of printed circuit boards
GB0404460A Expired - Fee Related GB2398937B (en) 2000-08-04 2001-08-01 Connecting method and connecting structure of printed circuit boards

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB0404459A Expired - Fee Related GB2398936B (en) 2000-08-04 2001-08-01 Connecting method and connecting structure of printed circuit boards

Country Status (1)

Country Link
GB (2) GB2398936B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0501414A1 (en) * 1991-02-28 1992-09-02 Rohm Co., Ltd. A method for connecting electrodes of a display apparatus
US5511719A (en) * 1993-06-01 1996-04-30 Nippondenso Co., Ltd. Process of joining metal members
US6089442A (en) * 1996-04-10 2000-07-18 Canon Kabushiki Kaisha Electrode connection method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0501414A1 (en) * 1991-02-28 1992-09-02 Rohm Co., Ltd. A method for connecting electrodes of a display apparatus
US5511719A (en) * 1993-06-01 1996-04-30 Nippondenso Co., Ltd. Process of joining metal members
US6089442A (en) * 1996-04-10 2000-07-18 Canon Kabushiki Kaisha Electrode connection method

Also Published As

Publication number Publication date
GB0404460D0 (en) 2004-03-31
GB2398936B (en) 2005-03-02
GB0404459D0 (en) 2004-03-31
GB2398937A (en) 2004-09-01
GB2398936A (en) 2004-09-01

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 20060920

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20180801