GB2336032A - Wafer collecting method and system - Google Patents
Wafer collecting method and system Download PDFInfo
- Publication number
- GB2336032A GB2336032A GB9906155A GB9906155A GB2336032A GB 2336032 A GB2336032 A GB 2336032A GB 9906155 A GB9906155 A GB 9906155A GB 9906155 A GB9906155 A GB 9906155A GB 2336032 A GB2336032 A GB 2336032A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafer
- mounting member
- base mounting
- slice base
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A wafer collecting method comprises the steps of; cleaning a wafer (W) formed by slicing an ingot which has a slice base mounting member (64), in a one-by-one manner, cleaning the wafer having the slice based mounting member, removing the slice base mounting member (64) from the cleaned wafer (W) in a one-by-one manner, and putting the wafer (W) from which the slice base mounting member was removed, into a container (50).
Description
1 2336032 WAFER COLLECTING METHOD AND SYSTEM The present invention relates
to a wafer collecting method and a system therefor. In particular, the present invention relates to a method and a system, for putting wafers into a container after the wafer was cleaned and a slice base mounting member was removed from the wafer.
According to an earlier development, wafers formed by slicing an ingot are put into a container in a one-by-one manner. When the container is full of the wafers, the container is transferred to a cleaning apparatus. The wafers are cleaned by immersing them in a cleaning bath in a state that the container contains the wafers.
In order to slice an ingot, the ingot is fixed to a slice base mounting member (a supporting member) with an adhesive. When the ingot is sliced, the slice base mounting member is also sliced. The slice base mounting member is bonded to a wafer formed by slicing the ingot. It is necessary that the slice base mounting member is removed from the wafer after the ingot was sliced. In order to remove the slice base mounting member 1 from the wafer, the wafer is taken out of the container in a one-by-one manner. After the slice base mounting member was removed from the wafer, the wafer is put into the same container that the waf er was put into bef ore the slice base mounting member was removed from the waf er, or is put into another container.
However, when the wafers formed by slicing the ingot are put into a container, it is necessary that the wafers are spaced enough to immerse the front and the rear surfaces of each wafer in cleaning liquid. Therefore, the number of wafers which can be put into a container is necessarily small. In order to put all of the wafers formed by slicing one ingot into containers, it is necessary to use a number of containers. For the reason, it is necessary to obtain a large space for attaching the containers.
In order to remove a slice base mounting member from the wafer, it is necessary that the wafer is taken out of the container in a one-by-one manner. It is troublesome to carry out the above operations.
Further, because the cleaning operations are carried out by the container, the cleaning operations cannot be carried out until at least one container is full of the wafers formed by slicing an ingot. The cleaning operations cannot be carried out efficiently.
2 The present invention was developed in view of these problems.
An object of the present invention is to provide a wafer collecting method and a system theref or, in which the cleaning operations for wafers and the slice base mounting member removing operations can be carried out efficiently.
That is, in accordance with one aspect of the present invention, the wafer collecting method comprises the steps of; cleaning a wafer formed by slicing an ingot which has a slice base mounting member, in a one-by- one manner, removing the slice base mounting member from the cleaned wafer in a one-by-one manner, and putting the waf er from which the slice base mounting member was removed, into a container.
The wafer collecting method can be applied to all of the wafers which are obtained by an inner diameter saw, a wire saw or the other slicing means. In particular, when the waf er is formed by slicing an ingot in a one-byone manner, the wafer collecting method can be efficlently applied.
According to the above-described method, because the wafer is put into the container after the wafer was cleaned and af ter the slice base mounting member was removed f rom the waf er, 3 it is not necessary that the wafers are spaced when the wafers are put into the container. As a result, because the wafers can be arranged so as to erect them in a state that the f ront surf ace of one waf er is contact with the rear surf ace of another wafer in the container, the wafers can be efficiently put into the container. Because not only the step of putting into the wafer after the ingot was sliced and before the slice base mounting member is removed from the wafer can be saved but also the cleaning operations can be carried out subsequently to the slicing operations, the whole operations f or collecting waf ers can be efficiently carried out. Further, because the step of taking out of the wafer in a one-by-one manner can be saved when the slice base mounting member removing operations are carried out, the whole operations can be efficiently carried out.
The wafer collecting method may further comprise a step of drying the cleaned wafer in a one-by-one manner. The step of cleaning the wafer may be carried out by immersing the waf er formed by slicing the ingot in a cleaning bath. The step of cleaning the wafer may be carried by irradiating the wafer formed by slicing the ingot with an ultrasonic wave through cleaning liquid. The step of drying the waf er may be carried out by blowing cleaning liquid on the cleaned wafer with air. The step of removing the slice base mounting member may be carried out by heating the cleaned wafer and then by cutting 4 off the slice base mounting member.
In accordance with another aspect of the present invention, the wafer collecting system comprises; a wafer cleaning apparatus for cleaning a wafer formed by slicing an ingot which has a slice base mounting member, in a one-by-one manner, a slice base mounting member removing apparatus for removing the slice base mounting member from the cleaned wafer in a one-by-one manner, and a container attachment part for attaching a container for containing the wafer from which the slice base mounting member was removed.
The wafer collecting system can be applied to all of the wafers which are obtained by an inner diameter saw, a wire saw or the other slicing means. In particular, when the wafer is formed by slicing an ingot In a one-byone manner, the wafer collecting system can be efficiently applied.
According to the above-described system, because the wafer is put into the container after the wafer was cleaned and af ter the slice base mounting member was removed f rom the waf er, it is not necessary that the wafers are spaced when the wafers are put into the container. As a result, because the wafers can be arranged so as to erect them in a state that the f ront surf ace of one waf er is contact with the rear surf ace of another wafer in the container, the wafers can be efficiently put into the container. Because not only the step of putting into the wafer after the ingot was sliced and before the slice base mounting member is removed from the wafer can be saved but also the cleaning operations can be carried out subsequently to the slicing operations, the whole operations f or collecting waf ers can be efficiently carried out. Further, because the step of taking out of the wafer in a one-by-one manner can be saved when the slice base mounting member removing operations are carried out, the whole operations can be efficiently carried out.
The waf er collecting system may f urther comprise a waf er drying apparatus for drying the cleaned wafer in a one-by-one manner. The wafer formed by slicing the ingot may be formed by slicing the ingot with an inner diameter saw.
The wafer cleaning apparatus may be an ultrasonic cleaning apparatus.
According to the above-described system, because the wafer is irradiated with ultrasonic wave, dust adhering to the f ront and the rear surf ace of the waf er when the ingot is sliced, can be sufficiently removed from the wafer.
The waf er drying apparatus may be an air drying apparatus.
According to the above-described system, because the wafer is dried with air, the thermal shock caused by drying the 6 waf er with a heating means such as an infrared lamp is not caused. As a result, the wafer can be previously prevented from being destroyed.
The slice base mounting member removing apparatus may comprise a heater for heating the cleaned wafer and a cutter for cutting off the slice base mounting member.
According to the above-described system, because the adhesive with which the slice base mounting member is fixed to the wafer is transformed by the heater and the slice base mounting member is cut of f by the cutter, the slice base mounting member can be easily removed from the wafer. The adhesive can be transformed relatively at low temperature such as 1000C. No strong heater which causes thermal shock on a waf er is required.
The waf er cleaning apparatus, the waf er drying apparatus, the slice base mounting member removing apparatus and the container attachment part may be disposed in a straight line. The wafer cleaning apparatus, the wafer drying apparatus, the slice base mounting member removing apparatus and the container attachment part may be arranged in order of the slice base mounting member removing apparatus. the waf er drying apparatus, the waf er cleaning apparatus and the container attachment part. The straight line may be approximately perpendicular to a line connecting the center of an ingot slicing apparatus with that 7 of the waf er cleaning apparatus. The waf er collecting system may further comprise a wafer transferring apparatus for transferring a wafer from the wafer cleaning apparatus to in order of the slice base mounting member removing apparatus and the container attachment part in a one -by- one manner. Thewafer transferring apparatus may comprise an arm and a chucking disc.
In accordance with another aspect of the present invention, the wafer collecting method comprises the steps of; transf erring the waf er f ormed by slicing an ingot which has a slice base mounting member, to a cleaning apparatus in a one-by-one manner, cleaning the wafer formed by slicing the ingot, in a one-by-one manner, transferring the cleaned wafer to a slice base mounting member removing apparatus in a one-by-one manner removing the slice base mounting member from the cleaned waf er in a one- by-one manner, and putting the waf er from which the slice base mounting member was removed, into a container.
According to the present invention, because the wafer formed by slicing an ingot is put into a container after the wafer was cleaned and the slice base mounting members was removed from the wafer, it is not necessary that the wafers are spaced when the waf ers are put into the container. As a result, because the wafers can be arranged so as to erect them in a state 8 that the front surface of one wafer is contact with the rear surface of another wafer in the container, the wafers can be ef f iciently put into the container. Because not only the step of putting into the wafer after the ingot was sliced and before the slice base mounting member is removed from the wafer can be saved but also the cleaning operations can be carried out subsequently to the slicing operations, the whole operations for collecting wafers can be efficiently carried out. Further, because the step of taking out of the waf er in a one-by-one manner can be saved when the slice base mounting member removing operations are carried out. the whole operations can be efficiently carried out.
An embodiment in accordance with this invention will now be described with reference to the accompanying drawings; in which:- FIG. 1 is a plan view schematically showing a system for carrying out a method for collecting wafers formed by slicing an ingot according to the present invention; and FIG. 2 is a front view schematically showing a system for 9 carrying out a method for collecting wafers formed by slicing an ingot according to the present invention.
FIGS. 1 and 2 show a wafer collecting system for carrying out a method for collecting wafers formed by slicing an ingot according to the present invention. FIG. 1 is a plane view thereof. FIG - 2 is a f ront view thereof. The system comprises an ingot slicing apparatus 10, a wafer cleaning apparatus 20, a wafer drying apparatus 30, a slice base mounting member removing apparatus 40 and a container attachment part 50.
The ingot slicing apparatus 10 comprises an inner diameter saw 13 formed by depositing (or plating) diamond particles 12 on the inner circumference edge of a ring-shaped blade 11. An ingot 1 is set in the ingot slicing apparatus 10 so as to direct the central axis thereof in the vertical direction (that is, in the direction normal to the surface of the sheet in the case of the system shown in FIG. 1). A wafer W is formed by rotating the inner diameter saw 13 so as to slice the ingot 1 horizontally. The ingot 1 is fixed to a slice base mounting member 2 made of carbon with an adhesive. When the waf er W is f ormed by slicing the ingot 1, the slice base mounting member 2 is also sliced by the inner diameter saw 13 at the same time.
The waf er cleaning apparatus 20 comprises a cleaning bath 21 and an arm 22 moving up and down in the cleaning bath 21. Further, the wafer cleaning apparatus 20 comprises an ultrasonic wave oscillator 24 in the cleaning bath 21. The cleaning bath 21 is stored with pure water 23. The arm 22 keeps the wafer W in a horizontal state by using the end thereof and moves up and down the wafer W in the pure water 23. The pure water can be heated by an additional heater for increasing cleaning effect and initialing the transformation of the adhesive. Chemicals such as surfactant can be added to pure water. Another bath for rinsing can be added when the surfactant is used in the cleaning bath 21.
The waf er drying apparatus 30 provides a duct 31 extending in a horizontal direction. A plurality of air nozzles 32 are attached to the duct 31 along a longitudinal direction thereof The wafer drying apparatus 30 removes water from the wafer W before heating the wafer W. The reason why water is removed f rom the waf er W is that if water is on the surf ace to be heated, of the wafer W, a large thermal shock is caused to the wafer W by the water when the wafer W is heated. A blower which is 11 not shown in figure. is connected with the duct 31. Compressed air supplied by the blower is blown by the air nozzle 32.
The slice base mounting member removing apparatus 40 comprises a heater 41 and a cutter 42. The heater 41 heats the adhesive with which the wafer W is bonded to the slice base mounting member 2 in order to transform it. The cutter 42 moves in a direction of the arrow A1 shown in FIG. 1 in order to cut off the slice base mounting member 2 to which the wafer W is bond.
The container attachment part 50 is an attachment part f or attaching a container 51 f or putting the waf ers W thereinto. The container 51 to be attached to the container attachment part 50 comprises partitions 51a arranged at suitable intervals in order to keep the wafers W erected.
The slice base mounting member removing apparatus 40, the wafer drying apparatus 30, the wafer cleaning apparatus 20 and the container attachment part 50 are disposed in a straight line in this order as shown in FIG. 1. The ingot slicing apparatus 10 is disposed so that a line connecting the center of the ingot slicing apparatus 10 with that of the wafer cleaning apparatus 20 is approximately perpendicular to the straight line.
The wafer collecting system comprises a wafer transferring apparatus 60 for transferring wafers W from the ingot slicing apparatus 10 to the wafer cleaning apparatus 20, which is disposed between the ingot slicing apparatus 10 and 12 the wafer cleaning apparatus 20. The wafer transferring apparatus 60 comprises a fork 61 for mounting wafer W thereon in order to transfer it.
The ingot slicing apparatus 10 comprises a waf er chucking device which is not shown in the figure. The wafers W are sent to the wafer transferring apparatus 60 by the wafer chucking device. In the concrete, the ingot 1 is sliced from the bottom thereof. In the above method of slicing the wafer, when the ingot 1 is sliced, the inner diameter saw 13 is set to the ingot 1 so as to slice the slice base mounting member 2 af ter the ingot 1 was sliced. When the wafer W is sliced off by slicing the ingot 1, the wafer W is chucked by the wafer chucking device disposed under the waf er W. The waf er chucking device chucking the wafer W is revolved 1800 around the position close to the center of the inner diameter saw 13. In the state that the waf er chucking device was revolved, the wafer W is sent to the wafer transferring apparatus 60.
The wafer collecting system comprises a plurality of wafer transferring apparatuses 62 for transferring the wafer W from the waf er cleaning apparatus 20 to in the order of the wafer drying apparatus 30, the slice base mounting member removing apparatus 40 and the container attachment part 50. The wafer transferring apparatus 62 comprises a chucking disc 64 attached to the end of an arm 63. The chucking disc 64 chucks the wafer W by using a vacuum pump which is not shown in the 13 figure. The arm 63 of the wafer transferring apparatus 62 is moved up and down and is rotated by an actuator which is not shown in the figure.
By the wafer collecting system constructed as described above, while the wafer W formed by slicing the ingot 1 in a horizontal direction with the ingot slicing apparatus 10 is kept in a horizontal state, the wafer W is transferred to the upper position of the wafer cleaning apparatus 20 by the wafer transferring apparatus 60. The wafer W is sent to the arm 22 of the wafer cleaning apparatus 20. The wafer W sent to the arm 22 is moved down into the cleaning bath 21 in a horizontal state so as to immerse it in the pure water 23. While the wafer w is moved up and down (is shaken) in the pure water 23 by the arm 22, the ultrasonic cleaning is carried out. The cleaned wafer W is moved up to the upper position of the wafer cleaning apparatus 20, and is sent to the wafer transferring apparatus 62. The wafer W sent to the wafer transferring apparatus 62 is rotated 900 as shown in FIG. 2, and is transferred to the wafer drying apparatus 30 in a vertical state. The wafer W is moved up and down with respect to the duct 31 of the waf er drying apparatus 30 in the vertical state in order to dry the wafer W by blowing air from the air nozzle 32. The wafer W is transferred to the slice base mounting member removing apparatus 40 in the vertical state by the wafer transferring apparatus 62, and is contact with the heater 41 in order to heat 14 the wafer W. When the wafer W is suitably heated, the slice base mounting member 2 is cut off by the cutter 42. While, the wafer W is kept in the vertical state by the wafer transferring apparatus 62, the wafer from which the slice base mounting member 2 is removed is transferred to the upper position of the container attachment part 50, and is moved down to the container 51 attached to the container attachment part 50 in order to put it thereinto. By repeating the above operations, whenever the wafer W is formed by slicing the ingot 1 with the ingot slicing apparatus 10, each wafer W is put into the container 51 through the above apparatuses in a one-by-one manner.
Claims (19)
1 - A wafer collecting method comprising the steps of; cleaning a wafer formed by slicing an ingot which has a slice base mounting member, in a one-by-one manner, removing the slice base mounting member from the cleaned wafer in a one-by-one manner, and putting the wafer from which the slice base mounting member was removed, into a container.
2. A wafer collecting method as claimed in claim 1, further comprising a step of drying the cleaned wafer in a one-by-one manner.
3. A wafer collecting method as claimed in claim 1 or 2, wherein the step of cleaning the wafer is carried out by immersing the wafer formed by slicing the ingot in a cleaning bath.
4. A wafer collecting method as claimed in claim 1, 2 or 3. wherein the step of cleaning the waf er is carried by irradiating the wafer formed by slicing the ingot with an ultrasonic wave through cleaning liquid.
5. A wafer collecting method as claimed in claim 2, wherein the step of drying the wafer is carried out by blowing 16 cleaning liquid cff the cleaned wafer with air.
6. A wafer collecting method as claimed any claim, wherein the step of removing the slice base mounting member is carried out by heating the cleaned wafer and then by cutting off the slice base mounting member.
7. A wafer collecting system comprising; a wafer cleaning apparatus for cleaning a wafer formed by slicing an ingot which has a slice base mounting member. in a one-by-one manner, a slice base mounting member removing apparatus for removing the slice base mounting member from the cleaned wafer in a one-by-one manner, and a container attachment part for attaching a container for containing the wafer from which the slice base mounting member was removed.
8. A wafer collecting system as claimed in claim 7, further comprising a wafer drying apparatus for drying the cleaned wafer in a one-by-one manner.
9. A wafer collecting system as claimed in claim 7 or 8, wherein the wafer formed by slicing the ingot is formed by slicing the ingot with an inner diameter saw.
17
10. A wafer collecting system as claimed in claim 7, 8 or 9, wherein the waf er cleaning apparatus is an ultrasonic cleaning apparatus.
11. A wafer collecting system as claimed in claim 8, wherein the wafer drying apparatus is an air drying apparatus.
12. A wafer collecting system as claimed in any of cl 7 to 11, wherein the slice base mounting member removing apparatus comprises a heater for heating the cleaned wafer and a cutter for cutting off the slice base mounting member.
13. A wafer collecting system as claimed inclaim 8 or 11, wherein the wafer cleaning apparatus, the wafer drying apparatus, the slice base mounting member removing apparatus and the container attachment part are disposed in a straight line.
14. A wafer collecting system as claimed in claim 13, wherein the wafer cleaning apparatus, the wafer drying apparatus, the slice base mounting member removing apparatus and the container attachment part are arranged in order of the slice base mounting member removing apparatus, the waf er drying apparatus, the wafer cleaning apparatus and the container 18 attachment part.
15. A wafer collecting system as claimed in claim 13 or 14, wherein the straight line is approximately perpendicular to a line connecting the center of an ingot slicing apparatus with that of the wafer cleaning apparatus.
16. A mafer collecting system as cla in any of cl 7 to 15, further comprising a wafer transferring apparatus for transf erring a waf er f rom the waf er cleaning apparatus to in order of the slice base mounting member removing apparatus and the container attachment part in a one-by-one manner.
17. A wafer collecting system as claimed in claim 16, wherein the wafer transferring apparatus comprises an arm and a chucking disc.
18. A wafer collecting method comprising the steps of; transferring the wafer formed by slicing an ingot which has a slice base mounting member, to a cleaning apparatus in a one-by-one manner, cleaning the wafer formed by slicing the ingot, in a one-by-one manner, transf erring the cleaned wafer to a slice base mounting member removing apparatus in a one-by-one manner 19 removing the slice base mounting member from the cleaned wafer in a one- by-one manner, and putting the wafer from which the slice base mounting member was removed, into a container.
19. A wafer collecting method or system substantially as described with reference to the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8424898A JPH11283942A (en) | 1998-03-30 | 1998-03-30 | Method and device for recovering wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9906155D0 GB9906155D0 (en) | 1999-05-12 |
| GB2336032A true GB2336032A (en) | 1999-10-06 |
Family
ID=13825170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9906155A Withdrawn GB2336032A (en) | 1998-03-30 | 1999-03-17 | Wafer collecting method and system |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH11283942A (en) |
| GB (1) | GB2336032A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013004626A (en) * | 2011-06-14 | 2013-01-07 | Shinryo Corp | Wafer manufacturing method and wafer manufacturing apparatus |
| CN110202709A (en) * | 2019-07-09 | 2019-09-06 | 深圳市雯逸水晶有限公司 | A kind of adjustable cutting washing degumming device of single crystal product article |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5427644A (en) * | 1993-01-11 | 1995-06-27 | Tokyo Seimitsu Co., Ltd. | Method of manufacturing semiconductor wafer and system therefor |
-
1998
- 1998-03-30 JP JP8424898A patent/JPH11283942A/en active Pending
-
1999
- 1999-03-17 GB GB9906155A patent/GB2336032A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5427644A (en) * | 1993-01-11 | 1995-06-27 | Tokyo Seimitsu Co., Ltd. | Method of manufacturing semiconductor wafer and system therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11283942A (en) | 1999-10-15 |
| GB9906155D0 (en) | 1999-05-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |