GB2335539B - Manufacturing method for self-aligned local interconnects and contacts - Google Patents

Manufacturing method for self-aligned local interconnects and contacts

Info

Publication number
GB2335539B
GB2335539B GB9805671A GB9805671A GB2335539B GB 2335539 B GB2335539 B GB 2335539B GB 9805671 A GB9805671 A GB 9805671A GB 9805671 A GB9805671 A GB 9805671A GB 2335539 B GB2335539 B GB 2335539B
Authority
GB
United Kingdom
Prior art keywords
contacts
self
manufacturing
local interconnects
aligned local
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9805671A
Other versions
GB2335539A (en
GB9805671D0 (en
Inventor
Shih-Wei Sun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to GB9805671A priority Critical patent/GB2335539B/en
Publication of GB9805671D0 publication Critical patent/GB9805671D0/en
Publication of GB2335539A publication Critical patent/GB2335539A/en
Application granted granted Critical
Publication of GB2335539B publication Critical patent/GB2335539B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB9805671A 1998-03-17 1998-03-17 Manufacturing method for self-aligned local interconnects and contacts Expired - Fee Related GB2335539B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9805671A GB2335539B (en) 1998-03-17 1998-03-17 Manufacturing method for self-aligned local interconnects and contacts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9805671A GB2335539B (en) 1998-03-17 1998-03-17 Manufacturing method for self-aligned local interconnects and contacts

Publications (3)

Publication Number Publication Date
GB9805671D0 GB9805671D0 (en) 1998-05-13
GB2335539A GB2335539A (en) 1999-09-22
GB2335539B true GB2335539B (en) 2000-02-02

Family

ID=10828722

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9805671A Expired - Fee Related GB2335539B (en) 1998-03-17 1998-03-17 Manufacturing method for self-aligned local interconnects and contacts

Country Status (1)

Country Link
GB (1) GB2335539B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630718B1 (en) * 1999-07-26 2003-10-07 Micron Technology, Inc. Transistor gate and local interconnect
KR100333353B1 (en) * 2000-02-21 2002-04-18 박종섭 Contact hole and fabricating method thereof
US6791190B1 (en) * 2003-05-09 2004-09-14 Macronix International Co., Ltd. Self-aligned contact/borderless contact opening and method for forming same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2187889A (en) * 1986-03-14 1987-09-16 Motorola Inc Providing contact separation in silicided devices
US5621232A (en) * 1993-10-05 1997-04-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including a local interconnection between an interconnection layer and an adjoining impurity region

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2187889A (en) * 1986-03-14 1987-09-16 Motorola Inc Providing contact separation in silicided devices
US5621232A (en) * 1993-10-05 1997-04-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including a local interconnection between an interconnection layer and an adjoining impurity region

Also Published As

Publication number Publication date
GB2335539A (en) 1999-09-22
GB9805671D0 (en) 1998-05-13

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100317