GB2324651B - Improved solid state image sensor - Google Patents

Improved solid state image sensor

Info

Publication number
GB2324651B
GB2324651B GB9708574A GB9708574A GB2324651B GB 2324651 B GB2324651 B GB 2324651B GB 9708574 A GB9708574 A GB 9708574A GB 9708574 A GB9708574 A GB 9708574A GB 2324651 B GB2324651 B GB 2324651B
Authority
GB
United Kingdom
Prior art keywords
image sensor
solid state
state image
improved solid
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9708574A
Other versions
GB9708574D0 (en
GB2324651A (en
Inventor
Jonathan Ephriam David Hurwitz
Peter Brian Denyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VLSI Vision Ltd
Original Assignee
VLSI Vision Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VLSI Vision Ltd filed Critical VLSI Vision Ltd
Priority to GB9708574A priority Critical patent/GB2324651B/en
Publication of GB9708574D0 publication Critical patent/GB9708574D0/en
Priority to PCT/GB1998/001214 priority patent/WO1998049729A1/en
Priority to EP98919307A priority patent/EP0978142A1/en
Publication of GB2324651A publication Critical patent/GB2324651A/en
Application granted granted Critical
Publication of GB2324651B publication Critical patent/GB2324651B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14806—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14831—Area CCD imagers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
GB9708574A 1997-04-25 1997-04-25 Improved solid state image sensor Expired - Fee Related GB2324651B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB9708574A GB2324651B (en) 1997-04-25 1997-04-25 Improved solid state image sensor
PCT/GB1998/001214 WO1998049729A1 (en) 1997-04-25 1998-04-24 Improved solid state image sensor
EP98919307A EP0978142A1 (en) 1997-04-25 1998-04-24 Improved solid state image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9708574A GB2324651B (en) 1997-04-25 1997-04-25 Improved solid state image sensor

Publications (3)

Publication Number Publication Date
GB9708574D0 GB9708574D0 (en) 1997-06-18
GB2324651A GB2324651A (en) 1998-10-28
GB2324651B true GB2324651B (en) 1999-09-01

Family

ID=10811468

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9708574A Expired - Fee Related GB2324651B (en) 1997-04-25 1997-04-25 Improved solid state image sensor

Country Status (3)

Country Link
EP (1) EP0978142A1 (en)
GB (1) GB2324651B (en)
WO (1) WO1998049729A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7750958B1 (en) 2005-03-28 2010-07-06 Cypress Semiconductor Corporation Pixel structure
US7808022B1 (en) 2005-03-28 2010-10-05 Cypress Semiconductor Corporation Cross talk reduction
US8476567B2 (en) 2008-09-22 2013-07-02 Semiconductor Components Industries, Llc Active pixel with precharging circuit

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953060A (en) * 1995-10-31 1999-09-14 Imec Vzw Method for reducing fixed pattern noise in solid state imaging devices
EP0883187A1 (en) 1997-06-04 1998-12-09 Interuniversitair Micro-Elektronica Centrum Vzw A detector for electromagnetic radiation, pixel structure with high sensitivity using such detector and method of manufacturing such detector
US7199410B2 (en) 1999-12-14 2007-04-03 Cypress Semiconductor Corporation (Belgium) Bvba Pixel structure with improved charge transfer
US6815791B1 (en) 1997-02-10 2004-11-09 Fillfactory Buried, fully depletable, high fill factor photodiodes
US20010045508A1 (en) 1998-09-21 2001-11-29 Bart Dierickx Pixel structure for imaging devices
US6011251A (en) * 1997-06-04 2000-01-04 Imec Method for obtaining a high dynamic range read-out signal of a CMOS-based pixel structure and such CMOS-based pixel structure
EP0875939A1 (en) * 1997-04-30 1998-11-04 Interuniversitair Micro-Elektronica Centrum Vzw A spatially-modulated detector for electromagnetic radiation
EP0875946A1 (en) 1997-04-30 1998-11-04 Interuniversitair Micro-Elektronica Centrum Vzw Light emitting diode with a microcavity and a method of producing such device
US8063963B2 (en) 1998-02-09 2011-11-22 On Semiconductor Image Sensor Imaging device having a pixel structure with high dynamic range read-out signal
US7106373B1 (en) 1998-02-09 2006-09-12 Cypress Semiconductor Corporation (Belgium) Bvba Method for increasing dynamic range of a pixel by multiple incomplete reset
NL1011381C2 (en) * 1998-02-28 2000-02-15 Hyundai Electronics Ind Photodiode for a CMOS image sensor and method for its manufacture.
FR2781929B1 (en) 1998-07-28 2002-08-30 St Microelectronics Sa IMAGE SENSOR WITH PHOTODIODE ARRAY
JP4604296B2 (en) * 1999-02-09 2011-01-05 ソニー株式会社 Solid-state imaging device and manufacturing method thereof
US6350663B1 (en) * 2000-03-03 2002-02-26 Agilent Technologies, Inc. Method for reducing leakage currents of active area diodes and source/drain diffusions
EP1208599A1 (en) 2000-03-09 2002-05-29 Koninklijke Philips Electronics N.V. Solid state imaging sensor in a submicron technology and method of manufacturing and use of a solid state imaging sensor
FR2820883B1 (en) 2001-02-12 2003-06-13 St Microelectronics Sa HIGH CAPACITY PHOTODIODE
FR2820882B1 (en) 2001-02-12 2003-06-13 St Microelectronics Sa THREE TRANSISTOR PHOTODETECTOR
FR2824665B1 (en) * 2001-05-09 2004-07-23 St Microelectronics Sa CMOS TYPE PHOTODETECTOR
CN108257996A (en) * 2017-12-07 2018-07-06 德淮半导体有限公司 Pixel unit and its manufacturing method and imaging device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0240238A2 (en) * 1986-03-25 1987-10-07 Sony Corporation Solid state imager device
EP0360595A2 (en) * 1988-09-22 1990-03-28 Matsushita Electronics Corporation Solid state image sensor
US5514887A (en) * 1993-12-09 1996-05-07 Nec Corporation Solid state image sensor having a high photoelectric conversion efficiency

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0624233B2 (en) * 1985-04-30 1994-03-30 キヤノン株式会社 Photoelectric conversion device
US5151381A (en) * 1989-11-15 1992-09-29 Advanced Micro Devices, Inc. Method for local oxidation of silicon employing two oxidation steps
JPH08255907A (en) * 1995-01-18 1996-10-01 Canon Inc Insulated gate transistor and fabrication thereof
US5625210A (en) * 1995-04-13 1997-04-29 Eastman Kodak Company Active pixel sensor integrated with a pinned photodiode

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0240238A2 (en) * 1986-03-25 1987-10-07 Sony Corporation Solid state imager device
EP0360595A2 (en) * 1988-09-22 1990-03-28 Matsushita Electronics Corporation Solid state image sensor
US5514887A (en) * 1993-12-09 1996-05-07 Nec Corporation Solid state image sensor having a high photoelectric conversion efficiency

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7750958B1 (en) 2005-03-28 2010-07-06 Cypress Semiconductor Corporation Pixel structure
US7808022B1 (en) 2005-03-28 2010-10-05 Cypress Semiconductor Corporation Cross talk reduction
US8476567B2 (en) 2008-09-22 2013-07-02 Semiconductor Components Industries, Llc Active pixel with precharging circuit

Also Published As

Publication number Publication date
GB9708574D0 (en) 1997-06-18
EP0978142A1 (en) 2000-02-09
WO1998049729A1 (en) 1998-11-05
GB2324651A (en) 1998-10-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20010425