GB2284706B - Treatment apparatus - Google Patents

Treatment apparatus

Info

Publication number
GB2284706B
GB2284706B GB9411291A GB9411291A GB2284706B GB 2284706 B GB2284706 B GB 2284706B GB 9411291 A GB9411291 A GB 9411291A GB 9411291 A GB9411291 A GB 9411291A GB 2284706 B GB2284706 B GB 2284706B
Authority
GB
United Kingdom
Prior art keywords
treatment apparatus
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9411291A
Other versions
GB9411291D0 (en
GB2284706A (en
Inventor
Hiroyuki Iwai
Tamotsu Tanifuji
Takanobu Asano
Ryoichi Okura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Tokyo Electron Tohoku Ltd
Original Assignee
Tokyo Electron Ltd
Tokyo Electron Tohoku Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Tokyo Electron Tohoku Ltd filed Critical Tokyo Electron Ltd
Publication of GB9411291D0 publication Critical patent/GB9411291D0/en
Publication of GB2284706A publication Critical patent/GB2284706A/en
Application granted granted Critical
Publication of GB2284706B publication Critical patent/GB2284706B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
GB9411291A 1993-12-03 1994-06-06 Treatment apparatus Expired - Fee Related GB2284706B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33952993A JP3543987B2 (en) 1993-12-03 1993-12-03 Processing equipment

Publications (3)

Publication Number Publication Date
GB9411291D0 GB9411291D0 (en) 1994-07-27
GB2284706A GB2284706A (en) 1995-06-14
GB2284706B true GB2284706B (en) 1997-07-09

Family

ID=18328346

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9411291A Expired - Fee Related GB2284706B (en) 1993-12-03 1994-06-06 Treatment apparatus

Country Status (3)

Country Link
JP (1) JP3543987B2 (en)
GB (1) GB2284706B (en)
SG (1) SG47806A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100203782B1 (en) * 1996-09-05 1999-06-15 윤종용 Heat treatment apparatus for semiconductor wafer
JP3635061B2 (en) 1999-07-14 2005-03-30 東京エレクトロン株式会社 Opening / closing device for opening / closing lid of object to be processed containing box and processing system for object to be processed
KR100745867B1 (en) * 2000-08-23 2007-08-02 동경 엘렉트론 주식회사 Vertical heat treatment system and method for transferring object to be treated
FR2902235B1 (en) * 2006-06-09 2008-10-31 Alcatel Sa DEVICE FOR TRANSPORTING, STORING AND TRANSFERRING SUBSTRATES
JP4884180B2 (en) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP5277572B2 (en) * 2007-06-26 2013-08-28 大日本印刷株式会社 Plate-like material storage and transfer system and plate-like material storage and transfer method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991002106A1 (en) * 1989-08-07 1991-02-21 General Signal Corporation Enhanced vertical thermal reactor system
GB2265634A (en) * 1992-03-27 1993-10-06 Toshiba Kk Substrate processing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991002106A1 (en) * 1989-08-07 1991-02-21 General Signal Corporation Enhanced vertical thermal reactor system
GB2265634A (en) * 1992-03-27 1993-10-06 Toshiba Kk Substrate processing

Also Published As

Publication number Publication date
SG47806A1 (en) 1998-04-17
GB9411291D0 (en) 1994-07-27
GB2284706A (en) 1995-06-14
JPH07161797A (en) 1995-06-23
JP3543987B2 (en) 2004-07-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030606