GB2237691A - Semiconductor device and wiring board module - Google Patents

Semiconductor device and wiring board module Download PDF

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Publication number
GB2237691A
GB2237691A GB9023214A GB9023214A GB2237691A GB 2237691 A GB2237691 A GB 2237691A GB 9023214 A GB9023214 A GB 9023214A GB 9023214 A GB9023214 A GB 9023214A GB 2237691 A GB2237691 A GB 2237691A
Authority
GB
United Kingdom
Prior art keywords
board
semiconductor elements
wiring pattern
electronic device
electronic parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9023214A
Other versions
GB9023214D0 (en
GB2237691B (en
Inventor
Tetsuroo Tsuzi
Hitoshi Toda
Tsugio Tabaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9023214D0 publication Critical patent/GB9023214D0/en
Publication of GB2237691A publication Critical patent/GB2237691A/en
Application granted granted Critical
Publication of GB2237691B publication Critical patent/GB2237691B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

An electronic module comprises a board (11) supporting a wiring pattern, semiconductor elements (12) surface mounted on the board, and lead terminals (13) installed at the end of the board. The module is mounted on another board (16) to form an electronic device. Thus, the semiconductor elements can be compactly and densely incorporated into the electronic device because of the surface mounting thereof, and the electronic device can be easily assembled and maintained by using the module. <IMAGE>

Description

TITLE OF THE INVENTION Electronic Parts and Electronic Device Incorporating the Same BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an electronic parts, in which semiconductor elements are mounted on a board by surface mounting, and an electronic device incorporating the electronic parts.
Description of the Prior Art In a case of mounting semiconductor elements on a board such as a printed board, a lead inserting method has been widly used. Fig. 9 is a side view showing a conventional electronic device in which each of semiconductor elements is mounted on a printed board by the use of the lead inserting method.
Referring to Fig. 9, a printed board 1 has many through holes 2 formed at prescribed positions thereof and a wiring pattern (not shown) formed on a bottom surface thereof. The leads 4 of each semiconductor element 3 such as a memory IC and so on are inserted into the through holes 2 respectively, and the end of each lead 4 is connected with the wiring pattern at the bottom surface side of the printed board 1 by a soldering process such as a reflow soldering process and so on. Thus, the semiconductor elements 3 are mounted on the printed board 1.
In the conventional electronic device 5 thus assembled, however, it is impossible to put the semiconductor elements 3 close to each other because of the through holes 2, and a semiconductor element package as a lead inserting type package tends to become larger and higher, which eventually makes a mounting area for the semiconductor elements 3 larger.
Additionally, in a case where, for example, a memory circuit consisting of a plurality of memory ICs of the same kind and a driving circuit for driving the memory circuit are formed on one board, it becomes convenient to assemble and maintain the electronic device 5 or to change the design of the electronic device 5, if it is possible to deal with the memory circuit as one module. In the conventional electronic device 5, however, the memory circuit can not be dealt with as one module, since each memory IC 3 of the memory circuit is directly mounted on the board 1 with the other semiconductor elements 3 of the driving circuit.
SUMMARY OF THE INVENTION The present invention is directed to an electronic parts incorporating a plurality of semiconductor elements and an electronic device incorporating the electronic parts.
The inventive electronic parts comprises a board on which a wiring pattern is formed; a plurality of semiconductor elements which are mounted on the board by surface mounting and electrically connected with the wiring pattern respectively; and a plurality of lead terminals which are installed at an end of the board and electrically connected with the semiconductor elements through the wiring pattern.
The inventive electronic device comprises (a) a first board on which a first wiring pattern is formed; and (b) an electronic parts mounted on the first board, the electronic parts including (b-1) a second board on which a second wiring pattern is formed, (b-2) a plurality of semiconductor elements which are mounted on the second board by surface mounting and electrically connected with the second wiring pattern respecively, and (b-3) a plurality of lead terminals which are installed at an end of the second board and electrically connected with the semiconductor elements through the second wiring pattern, the lead terminals being electrically connected with the first wiring pattern.
Accordingly, a principal object of the present invention is to provide an electronic parts which can compactly and densely incorporate semiconductor elements into an electronic device, and which can easily assemble and maintain the electronic device or to easily change the design of the electronic device.
Another object of the present invention is to provide an electronic device, in which the semiconductor elements are compactly and densely mounted, which can be easily assembled and maintained, and the design of which can be easily changed.
According to the inventive electronic parts, the semiconductor elements are mounted on the board by the surface mounting, which eventually makes it possible to compactly and densely incorporate the semiconductor elements into an electronic device. In addition, the lead terminals are installed at the end of the board on which the semiconductor elements are mounted, whereby it is possible to deal with the circuit formed by the semiconductor elements as one module, which eventually makes it possible to easily assemble and maintain the electronic device incorporating the semiconductor elements or to easily change the design of the electronic device.
According to the inventive electronic device, the electronic parts, in which the semiconductor elements are mounted on the second board by the surface mounting, is mounted through the lead terminals thereof on the first board, by which the semiconductor elements are compactly and densely incorporated into the electronic device, which eventually makes it easy to assemble and maintain the electronic device, and which eventually also makes it easy to change the design of the electronic device.
These and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an embodiment of an electronic parts according to the present invention; Fig. 2 is a side view showing the electronic parts; Fig. 3 is a front view showing a clip lead frame; Fig. 4 is a side view showing the clip lead frame; Fig. 5 is a side view showing a part of the electronic parts; Fig. 6 is a plan view showing a part of a printed board; Fig. 7 is a wire diagram showing an example of a memory circuit in the electronic parts; Fig. 8 is a side view showing an electronic device incorporating the electronic parts; and Fig. 9 is a side view showing a conventional electronic device.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Fig. 1 is a plan view showing an embodiment of an electronic parts according to the present invention, and Fig. 2 is a side view of the electronic parts.
Referring to Figs. 1 and 2, an electronic parts 10 has a board 11, a plurality of semiconductor elements 12, and a plurality of lead terminals 13.
The board 11 is a rectangular printed board having a prescribed wiring pattern (not shown) on a top surface and a bottom surface thereof.
Each of the semiconductor elements 12 is a memory IC having a surface mounting type package, and is mounted on the printed board 11 by surface mounting as follows: First, a soldering paste is printed at prescribed positions on the wiring pattern formed on the both surfaces of the printed board 11. And then, the semiconductor elements 12 are temporarily affixed on the soldering paste at the both surfaces of the printed board 11. Thereafter, the semiconductor elements 12 are firmly affixed to the printed board 11 through a soldering process such as a reflow soldering process and so on. Thus, the semiconductor elements 12 are mounted on the printed board 11 and electrically connected with the wiring pattern of the printed board 11.
The lead terminals 13 are installed at both ends of the printed board 11 as follows: First, a pair of clip lead frame 14 are prepared as shown in Figs. 3 and 4, in which only one clip lead frame 14 is shown for reason of convenience. Each of the clip lead frame 14 has clip parts 14a for clipping the end of the printed board 11, connecting parts 14b respectively extended from the clip parts 14a, and a tie bar 14c for tying the connecting parts 14b. Next, the clip lead frames 14 are temporalily installed at both ends of printed board 11 by inserting each end of the printed board 11 into the clip parts 14a of each clip lead frame 14, as shown in Fig. 5.In this case, a plurality of soldering paste regions 15 electrically connected with the wiring pattern of the printed board 11 are previously formed on the top and the bottom surfaces of the printed board 11 along both ends of the printed board 11 as shown in Figs. 5 and 6, and each clip part 14 comes into contact with each soldering paste region 15. Thereafter, the connecting parts 14b of each clip lead frame 14 are cut at prescribed positions respectively to remove the tie bar 14c, whereby the lead terminals 13 consisting of the clip parts 14a and the connecting parts 14b are formed. Finally, the clip parts 14a of the lead terminals 13 are firmly affixed to the soldering paste regions 15 through a soldering process such as a solder dipping process and so on.Thus, the lead terminals 13 are installed along the opposed sides of the printed board 11 and electrically connected with the semiconductor elements 12 through the soldering paste regions 15 and the wiring pattern of the printed board 11.
The electronic parts 10 thus formed can be used as one module, which functions as a memory circuit including the memory ICs 12. Fig. 7 is a wire diagram showing an example of the memory circuit in the electronic parts 10.
In the memory circuit of Fig. 7, sixteen memory ICs 12 and many lead terminals 13 numbered from 1 to 64 are provided on the printed board 11, respectively. The lead terminals 13 are used as clip select input terminals, a write control input terminal, address input terminals, an output enable input terminal, data input/output terminals, GND power terminals, and Vcc power terminals, respectively. Fig. 7 merely shows a wiring, not the disposition of the memory ICs 12 and the lead terminals 13. Actually, the memory ICs 12 are separately mounted on the top and bottom surfaces of the printed board 11, and the lead terminals 13 are suitably separately installed at the both ends of the printed board 11.
As shown in Fig. 8, for example, the electronic parts 10 is mounted on the other printed board 16 as follows: First, the printed board 16 having a wiring pattern thereon is prepared. Net, the electronic parts 10 is put on the printed board 16 so that the connecting parts 14b of the lead terminals 13 are allocated at the prescribed positions on the wiring pattern of the printed board 16.
Thereafter, the connecting parts 14b of the lead terminals 13 are affixed to the wiring pattern of the printed board 16 through a soldering process such as a solder dipping process and so on. On the other hand, a driving circuit (not shown) for driving the memory circuit of the electronic parts 10 is provided on the other area of the printed board 16, and the driving circuit is electrically connected with the electronic parts 10 through the wiring pattern of the printed board 16. Thus, an electronic device 17 consisting of the printed board 16, the memory circuit formed by the electronic parts 10, and the driving circuit for driving the memory circuit, is formed.
According to the electronic parts 10, since the memory ICs 12 are mounted on the printed board 11 by the surface mounting, the following effect can be obtained. It is possible to allocate the memory ICs 12 and the lead terminals 13 close to each other since there are no through holes on the printed board 11. It is also possible to increase a wiring density on the printed board 11 since there are no through holes on the printed board 11. It is also possible to decrease the thickness and the weight of the surface mounting type package more than that of the conventional lead inserting type package. Thus, it is possible to make the mounting area for the memory ICs 12 smaller, which eventually makes it possible to incorporate the memory ICs 12 into the electronic device 17 compactly and densely.
Moreover, since the memory ICs 12 are separately mounted on both surfaces of the printed board 11, the mounting area for the memory ICs 12 can be more decreased.
Moreover, since the semiconductor elements mounted on the printed board 11 are the memory ICs 12 of the same kind, the wiring pattern on the printed board 11 becomes simple, whereby the mounting area for the memory ICs 12 can be more decreased.
Additionally, in the electronic parts 10, the lead terminals 13 are installed at both ends of the printed board 11 on which the memory ICs 12 are mounted, and therefore it is possible to deal with the memory circuit of electronic parts 10 as one module. As a result, it is possible to form a memory circuit on the printed board 16 by merely mounting the electronic parts 10 on the printed board 16, which eventually makes it possible to easily assemble the electronic device 17. It is also possible to repair the memory circuit by merely exchanging the electronic parts 10 on the printed board 16, which eventually makes it possible to easily maintain the electronic device 17. With exchanging the electronic parts 10, it is also possible to easily change the design of the electronic device 17.
In the above embodiment, although the memory ICs 12 are mounted on both surfaces of the printed board 11, they may be mounted on a single surface of the printed board 11.
As shown in Fig. 1, although the lead terminals 13 are installed at two opposed sides of the pritned board 11, they may be installed at three sides of or four sides of the printed board 11. Lead pins instead of the clip leads of Fig. 5 may be used as lead terminals 13.
In the above embodiment, the memory circuit is formed by sixteen memory ICs 12 and the lead terminals 13 numbered from 1 to 64 as shown in Fig. 7, but the memory circuit is not restricted to that.
In the above embodiment, although the semiconductor elements 12 which are mounted on the printed board 11 are the memory ICs, the other semiconductor elements such as power elements and so on may be mounted on the printed board 11. The semiconductor elements of the different kind may be also mounted on the printed board 11 instead of the semiconductor elements 12 of the same kind.
The printed board 11 or 16 may be a polyimide resin board, a ceramic board or the like.
Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation. The spirit and scope of the present invention should be limited only by the terms of the appended claims.

Claims (16)

CLAIM
1. An electronic parts comprising: a board on which a wiring pattern is formed; a plurality of semiconductor elements which are mounted on said board by surface mounting and electrically connected with said wiring pattern respectively; and a plurality of lead terminals which are installed at an end of said board and electrically connected with said semiconductor elements through said wiring pattern.
2. An electronic parts of claim 1, wherein said wiring pattern is formed on a top surface and a bottom surface of said board, said semiconductor elements being respectively mounted on said top and bottom surfaces of said board to electrically connect with said wiring pattern.
3. An electronic parts of claim 1 or 2, wherein said semiconductor elements are things of the same kind.
4. An electronic parts of claim 3, wherein each of said semiconductor elements is a memory element.
5. An electronic parts of claim 3, wherein each of said semiconductor elements is a power element.
6. An electronic parts of claim 1 or 2, wherein said board is a rectangle, said lead terminals being allocated along two opposed sides of said board respectively.
7. An electronic parts of claim 1 or 2, wherein each of said lead terminals has a clip part for clipping said end of said board and a connecting part extended from said clip part.
8. An electronic parts of claim 1 or 2, wherein said board is a printed board.
9. An electronic device comprising: (a) a first board on which a first wiring pattern is formed; and (b) an electronic parts mounted on said first board, said electronic parts including (b-1) a second board on which a second wiring pattern is formed, (b-2) a plurality of semiconductor elements which are mounted on said second board by surface mounting and electrically connected with said second wiring pattern respectively, and (b-3) a plurality of lead terminals which are installed at an end of said second board and electically connected with said semiconductor elements through said second wiring pattern, said lead terminals being electrically connected with said first wiring pattern.
10. An electronic device of claim 9, wherein said second wiring pattern is formed on a top surface and a bottom surface of said second board, said semiconductor elements being respectively mounted on said top and bottom surfaces of said second board to electrically connect with said second wiring pattern.
11. An electronic device of claim 9 or 10, wherein said semiconductor elements are things of the same kind.
12. An electronic device of claim 11, wherein each of said semiconductor elements is a memory element.
13. An electronic device of claim 11, wherein each of said semiconductor elements is a power element.
14. An electronic device of claim 9 or 10, wherein said second board is a rectangle, said lead terminals being allocated along two opposed sides of said second board respectively.
15. An electronic device of claim 9 or 10, wherein each of said lead terminals has a clip part for clipping said end of said second board and a connecting part extend from said clip part, each said connecting part is electrically connected with said first wiring pattern.
16. An electronic device of claim 9 or 10, wherein said first and second boards are printed boards.
GB9023214A 1989-10-30 1990-10-25 Electronic device Expired - Lifetime GB2237691B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1283351A JPH03145186A (en) 1989-10-30 1989-10-30 Semiconductor module

Publications (3)

Publication Number Publication Date
GB9023214D0 GB9023214D0 (en) 1990-12-05
GB2237691A true GB2237691A (en) 1991-05-08
GB2237691B GB2237691B (en) 1993-08-25

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Family Applications (1)

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GB (1) GB2237691B (en)

Cited By (12)

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GB2255675A (en) * 1991-05-10 1992-11-11 Technophone Ltd Circuit board mounting of matched devices
US5252857A (en) * 1991-08-05 1993-10-12 International Business Machines Corporation Stacked DCA memory chips
GB2304234A (en) * 1995-08-07 1997-03-12 Mecanismos Aux Ind Electronic assemblies
US5640308A (en) * 1991-06-14 1997-06-17 Aptix Corporation Field programmable circuit module
US5669136A (en) * 1994-06-24 1997-09-23 International Business Machines Corporation Method of making high input/output density MLC flat pack
US5759049A (en) * 1996-05-15 1998-06-02 Dallas Semiconductor Corp. Electrical contact clip
WO1999036959A1 (en) * 1998-01-20 1999-07-22 Viking Components, Inc. High-density computer modules with stacked parallel-plane packaging
US6222739B1 (en) 1998-01-20 2001-04-24 Viking Components High-density computer module with stacked parallel-plane packaging
US6521984B2 (en) 2000-11-07 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor module with semiconductor devices attached to upper and lower surface of a semiconductor substrate
EP1333443A1 (en) * 2002-01-31 2003-08-06 Infineon Technologies AG Memory system
EP1884953A2 (en) 1997-09-26 2008-02-06 Rambus, Inc. High frequency bus system
CN102625624A (en) * 2011-01-27 2012-08-01 英业达股份有限公司 Electronic device

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GB1137907A (en) * 1964-12-09 1968-12-27 Signetics Corp Improvements in or relating to multiple-chip integrated circuit assembly with interconnection structure
GB1259602A (en) * 1968-01-26 1972-01-05
GB1384220A (en) * 1972-11-30 1975-02-19 Ibm Circuit assemblies
EP0065425A2 (en) * 1981-05-18 1982-11-24 Matsushita Electric Industrial Co., Ltd. Hybrid integrated circuit component and printed circuit board mounting said component
GB2130025A (en) * 1982-11-08 1984-05-23 Control Data Corp Memory board stacking module
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
GB2169751A (en) * 1985-01-11 1986-07-16 Fuji Electrochemical Co Ltd An electronic circuit module
EP0339154A2 (en) * 1988-04-26 1989-11-02 Citizen Watch Co. Ltd. Memory card

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Publication number Priority date Publication date Assignee Title
GB1137907A (en) * 1964-12-09 1968-12-27 Signetics Corp Improvements in or relating to multiple-chip integrated circuit assembly with interconnection structure
GB1259602A (en) * 1968-01-26 1972-01-05
GB1384220A (en) * 1972-11-30 1975-02-19 Ibm Circuit assemblies
EP0065425A2 (en) * 1981-05-18 1982-11-24 Matsushita Electric Industrial Co., Ltd. Hybrid integrated circuit component and printed circuit board mounting said component
GB2130025A (en) * 1982-11-08 1984-05-23 Control Data Corp Memory board stacking module
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
GB2169751A (en) * 1985-01-11 1986-07-16 Fuji Electrochemical Co Ltd An electronic circuit module
EP0339154A2 (en) * 1988-04-26 1989-11-02 Citizen Watch Co. Ltd. Memory card

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5319525A (en) * 1991-05-10 1994-06-07 Nokia Mobile Phones (U.K.) Ltd. Circuit assembly
GB2255675B (en) * 1991-05-10 1995-09-27 Technophone Ltd Circuit assembly
GB2255675A (en) * 1991-05-10 1992-11-11 Technophone Ltd Circuit board mounting of matched devices
US5640308A (en) * 1991-06-14 1997-06-17 Aptix Corporation Field programmable circuit module
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US5790386A (en) * 1994-06-24 1998-08-04 International Business Machines Corporation High I/O density MLC flat pack electronic component
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GB9023214D0 (en) 1990-12-05
JPH03145186A (en) 1991-06-20
GB2237691B (en) 1993-08-25

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