GB2221570B - Bonding a semiconductor to a substrate - Google Patents

Bonding a semiconductor to a substrate

Info

Publication number
GB2221570B
GB2221570B GB8818522A GB8818522A GB2221570B GB 2221570 B GB2221570 B GB 2221570B GB 8818522 A GB8818522 A GB 8818522A GB 8818522 A GB8818522 A GB 8818522A GB 2221570 B GB2221570 B GB 2221570B
Authority
GB
United Kingdom
Prior art keywords
bonding
semiconductor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8818522A
Other versions
GB8818522D0 (en
GB2221570A (en
Inventor
Arthur Walker
Peter Martin Bartholomew
Richard Fasching Murison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
STC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STC PLC filed Critical STC PLC
Priority to GB8818522A priority Critical patent/GB2221570B/en
Publication of GB8818522D0 publication Critical patent/GB8818522D0/en
Publication of GB2221570A publication Critical patent/GB2221570A/en
Application granted granted Critical
Publication of GB2221570B publication Critical patent/GB2221570B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/29111—Tin [Sn] as principal constituent
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    • H01L2224/484—Connecting portions
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    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
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    • H01L2224/838—Bonding techniques
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    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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GB8818522A 1988-08-04 1988-08-04 Bonding a semiconductor to a substrate Expired - Fee Related GB2221570B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8818522A GB2221570B (en) 1988-08-04 1988-08-04 Bonding a semiconductor to a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8818522A GB2221570B (en) 1988-08-04 1988-08-04 Bonding a semiconductor to a substrate

Publications (3)

Publication Number Publication Date
GB8818522D0 GB8818522D0 (en) 1988-09-07
GB2221570A GB2221570A (en) 1990-02-07
GB2221570B true GB2221570B (en) 1992-02-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB8818522A Expired - Fee Related GB2221570B (en) 1988-08-04 1988-08-04 Bonding a semiconductor to a substrate

Country Status (1)

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GB (1) GB2221570B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5197654A (en) * 1991-11-15 1993-03-30 Avishay Katz Bonding method using solder composed of multiple alternating gold and tin layers
US5234153A (en) * 1992-08-28 1993-08-10 At&T Bell Laboratories Permanent metallic bonding method
KR19990029741A (en) * 1997-09-29 1999-04-26 갈라스 윌리엄 이 How to solder without flux using gold plated solder material and solder
US7129638B2 (en) 2000-08-09 2006-10-31 Avago Technologies General Ip (Singapore) Pte. Ltd. Light emitting devices with a phosphor coating having evenly dispersed phosphor particles and constant thickness
EP1575089B1 (en) * 2004-03-09 2007-11-14 Infineon Technologies AG Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
EP1810351B1 (en) * 2004-10-22 2013-08-07 Seoul Opto Device Co., Ltd. Gan compound semiconductor light emitting element
US7400042B2 (en) 2005-05-03 2008-07-15 Rosemount Aerospace Inc. Substrate with adhesive bonding metallization with diffusion barrier
US7538401B2 (en) 2005-05-03 2009-05-26 Rosemount Aerospace Inc. Transducer for use in harsh environments
US7628309B1 (en) 2005-05-03 2009-12-08 Rosemount Aerospace Inc. Transient liquid phase eutectic bonding
CN101361203B (en) * 2006-10-13 2012-05-02 三洋电机株式会社 Semiconductor light-emitting element, lighting apparatus, and manufacturing method of semiconductor light-emitting element
JP2015173215A (en) * 2014-03-12 2015-10-01 株式会社東芝 Semiconductor device and method of manufacturing the same
DE102017119346A1 (en) * 2017-08-24 2019-02-28 Osram Opto Semiconductors Gmbh Component with buffer layer and method for producing a component
CN116352244A (en) * 2023-04-12 2023-06-30 汕尾市栢林电子封装材料有限公司 Preparation method for presetting gold-tin soldering lug by utilizing transient liquid phase diffusion soldering

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137131A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Bonding semiconductive bodies

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137131A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Bonding semiconductive bodies

Also Published As

Publication number Publication date
GB8818522D0 (en) 1988-09-07
GB2221570A (en) 1990-02-07

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