GB2213319B - A method of forming electrical conductors - Google Patents
A method of forming electrical conductorsInfo
- Publication number
- GB2213319B GB2213319B GB8728371A GB8728371A GB2213319B GB 2213319 B GB2213319 B GB 2213319B GB 8728371 A GB8728371 A GB 8728371A GB 8728371 A GB8728371 A GB 8728371A GB 2213319 B GB2213319 B GB 2213319B
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrical conductors
- forming electrical
- forming
- conductors
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8728371A GB2213319B (en) | 1987-12-04 | 1987-12-04 | A method of forming electrical conductors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8728371A GB2213319B (en) | 1987-12-04 | 1987-12-04 | A method of forming electrical conductors |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8728371D0 GB8728371D0 (en) | 1988-01-13 |
GB2213319A GB2213319A (en) | 1989-08-09 |
GB2213319B true GB2213319B (en) | 1991-03-06 |
Family
ID=10627984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8728371A Expired - Fee Related GB2213319B (en) | 1987-12-04 | 1987-12-04 | A method of forming electrical conductors |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2213319B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4326424A1 (en) * | 1993-08-06 | 1995-02-09 | Ant Nachrichtentech | Process for the production of TAB film supports |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1383297A (en) * | 1972-02-23 | 1974-02-12 | Plessey Co Ltd | Electrical integrated circuit package |
EP0083488A2 (en) * | 1981-12-31 | 1983-07-13 | O'Hara, James Brian | Method of producing printed circuits |
GB2187331A (en) * | 1986-02-28 | 1987-09-03 | Seiko Epson Corp | Leads for an integrated circuit |
-
1987
- 1987-12-04 GB GB8728371A patent/GB2213319B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1383297A (en) * | 1972-02-23 | 1974-02-12 | Plessey Co Ltd | Electrical integrated circuit package |
EP0083488A2 (en) * | 1981-12-31 | 1983-07-13 | O'Hara, James Brian | Method of producing printed circuits |
GB2187331A (en) * | 1986-02-28 | 1987-09-03 | Seiko Epson Corp | Leads for an integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
GB8728371D0 (en) | 1988-01-13 |
GB2213319A (en) | 1989-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |