GB2186745A - Mounting electronic devices - Google Patents
Mounting electronic devices Download PDFInfo
- Publication number
- GB2186745A GB2186745A GB08703155A GB8703155A GB2186745A GB 2186745 A GB2186745 A GB 2186745A GB 08703155 A GB08703155 A GB 08703155A GB 8703155 A GB8703155 A GB 8703155A GB 2186745 A GB2186745 A GB 2186745A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electronic device
- adhesive
- circuit board
- assembled electronic
- electroconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
An assembled electronic device is prepared by electrically connecting the terminal electrodes (2) of an electronic device (1) to corresponding terminals (4) of an electronic circuit board (3) made of an elastically flexible material and each shaped in the form of a mobile flap by being partly surrounded by an incision (5) using an anisotropically conductive adhesive (6) made by dispersing conductive particles in an adhesive matrix and exhibiting electric conductivity only in the direction of the thickness of the layer. The electrical connection between the electrodes of the assembled electronic device is firm and reliable. <IMAGE>
Description
SPECIFICATION
Assembled Electronic Device
Background of the Invention
The present invention relates to an assembled electronic device, more particularly to an electronic device such as a resistor, a diode, a transistor, a capacitor, an integrated circuit (IC) or the like connected to a circuit board using an anisotropically electro-conductive adhesive.
Electronic devices are usually connected to an electronic circuit board by soldering their respective terminal electrodes together but an alternative method is known in which the electronic device is connected to a circuit board as described in
Japanese Patent Publication No. 59-2179, in which method the electrical connection is obtained by adhesive bonding using an anisotropically electroconductive adhesive prepared by mixing and dispersing conductive particles in the matrix of an insulating adhesive, so that the adhesive is electrically conductive in the direction of the thickness of the layer thereof but insulating in the direction parallel to the surfaces.
However, in spite of success in obtaining electrical connection between the electronic device and the circuit board and at the same time keeping them bonded together, the anisotropically conductive adhesive has several disadvantages. For example, the generally low adhesive bonding strength may cause detachment as a result of a shock during transfer in the course of the assembly operation or a shock due to vibration of the finished appliances and the adhesive may display low heat-resistance and low moisture-resistance.
Other disadvantages arising from the abovementioned method of connecting the respective terminal electrodes of the electronic device and the circuit board using an anisotropically conductive adhesive containing electroconductive particles to obtain electric conduction therebetween are firstly, that electric conduction may be lost in the areas of concavities on the surfaces of one or both of the electrodes and secondly, that no definite contact resistance may be obtained in the initial stage since the electrode surfaces have microscopic undulations or irregularities.
Summary of the Invention
The assembled electronic device of the invention comprises an electronic device having a terminal electrode and an electronic circuit board having a terminal made of an elastically flexible material and shaped in the form of a movable flap by being partly surrounded by a line incision, the terminal electrode of the electronic device and the terminal of the circuit board being adhesively bonded together with a layer of an anisotropically electroconductive adhesive intervening therebetween which is electroconductive in the direction of the thickness of the layer but insulating within the plane of the layer.
Brief Description of the Drawings
Figure 1 is a perspective view of a first embodiment of the assembled electronic device of the invention as disassembled into its parts;
Figure 2 is a plan view of an integrated circuit;
Figure 3 is a cross-sectional view of an assembled electronic device incorporating the integrated circuit of Figure 2;
Figure 4 is a partial plan view of the circuit board used for the assembled electronic device of Figures 2 and 3; and Figure 5 is a cross-sectional view of the assembled electronic device described in Example 2.
Detailed Description of the Preferred Embodiments
The present invention relates to an assembly of an electronic device connected to an electronic circuit board without the above-described disadvantages.
The invention has been devised after extensive studies by the inventors of methods of keeping an electronic device and an electronic circuit board firmly bonded together by adhesion, leading to confirmation that reliable mechanical and electrical connection can be obtained even when the electrode terminal of the electronic device has concavities on the surface, by constructing the assembly according to the present invention.
Examples of the electronic device which may be employed in the present invention include resistors, diodes, transistors, capacitors, integrated circuits (ICs) and the like but all sorts of hitherto known electronic devices may be employed within the scope of the invention. These electronic devices are usually sized from a few millimeters to several centimeters in each of three dimensions and shaped in the form of a cube, rectangular parallelepiped or cylinder, with preference being given to cubes and rectangular parallelepipeds which include an electrode structured with a flat surface, since such flat surfaces give better connection to the circuit board by adhesive bonding.The devices should usually be of the type without lead-wires but even those provided with lead-wires may also be used in the assembled device according to the invention when the lead-wires are bent in a J-wise manner.
Any known types of electronic circuit boards are suitable for use in the assembled electronic device of the invention and they can be prepared by conventional methods, including that comprising printing a desired circuit pattern on an insulating board with an electroconductive ink and that comprising mounting a preformed terminal electrode on a metal foil etched beforehand by a conventional method to give a pattern of the circuit.
Each of the terminal electrodes, at least at the points of connection of the circuit boards, should be made of a flexible or elastically deformable material to meet the requirement to conform to the undulations and irregularities of the surface of the electronic devices at the portion of the terminal electrodes thereof in order to obtain reliable electrical conduction. Examples of the flexible material include films of polyester and polyimide resins.
In addition, the terminal electrodes of the circuit board should be made in the form of a mobile flap by being partly surrounded by a line incision in order to sufficiently allow for the undulations and irregularities of the terminal portions of the electronic devices and, moreover, to avoid influence of the distortion of the electronic circuit board per se when it is adhesively bonded to the other parts. The incision may be formed by any convenient method in the electronic circuit board, optionally with the layer of the anisotropically conductive adhesive applied thereto. For example, the incision may be formed using an edge cutter or a combination of an edged core and a die simultaneously with punching of the outer shape of the electronic circuit board.
Larger mobile flaps with the terminal electrodes formed by the incision are preferred, in order to obtain an increased adhesive bonding strength.
The anisotropically electroconductive adhesive used with the aim of electrically connecting the electronic device to the circuit board in the invention may be selected from conventionally used ones.
These adhesives are prepared by adding and dispersing 5 to 30 parts by volume of a finely divided electrically conductive material to and in 100 parts by volume of an insulating adhesive matrix.
The conductive material may be particles of a metal such as gold, silver, palladium, nickel, tin, tungsten and solder alloys, particles of conductive ceramics such as molybdenum silicide (MoSi2), tungsten carbide (WC) and titanium carbide (TiC) and particles and fibres of carbon. The insulating adhesive matrix may be a thermosetting adhesive, a thermoplastic adhesive, an ultraviolet-curable adhesive, an electron beam-curable adhesive or an anaerobically curable adhesive. Insulating adhesive matrices with reaction-curability generally give a high adhesive bonding strength but have the disadvantages of a short pot-life and a long reaction time, while adhesive matrices of the thermoplastic type have the drawback of low adhesive bonding strength though advantageous in respect of the short reaction time.Thus the insulating adhesive matrix should be suitably selected taking into account considerations of workability, adhesive strength and cost. The anisotropically conductive adhesives are usually in the form of a liquid and applied to the substrate surface by spreading to form a thin coating film but alternatively an adhesive in the form of a solid film may also be used for the bonding work by mounting on the circuit board.
The assembled electronic device according to the present invention will now be further described with reference to the accompanying drawings.
As already indicated, Figure 1 is a perspective view of a first embodiment of the assembled electronic device of the invention as disassembled into its parts and wherein an electronic device 1 in the form of a rectangular parallelepiped provided with terminal electrodes 2 is pressed down on a circuit board 3 provided with a coating film 6 of an anisotropically conductive adhesive so that the terminal electrodes 2 of the electronic device 1 are electrically connected to the terminal electrodes 4 of the circuit board 3.An improvement is obtained in the reliability and firmness of the electrical and mechanical connection between the terminal electrodes 2 and 4 respectively as a result of the combined effects of the elastic resilience of the elastically flexible material of the terminal electrode 2 of the electronic device 1 and the shape of the terminal electrode 4 of the circuit board 3, which is in the form of a mobile flap formed by the incision 5 partly surrounding it.
The following Examples illustrate the assembled electronic device of the invention in more detail.
EXAMPLE 1
An integrated circuit (IC) 8 illustrated in Figure 2, having terminal electrodes 7 bent in a J-wise form, was mounted on a circuit board 9 as illustrated in
Figure 3. The circuit board 9 was prepared using a flexible board composed of a polyimide film base having a thickness of 25 pm and laminated with a copper foil weighing 21 oz/ft2 and gold-plated. As shown in Figure 4, the circuit board 9 had electrodes 10 corresponding to the terminal electrodes 7 of the
IC 8, each in the form of a mobile flap partly surrounded by an incision 11. Athin coating film 12 of an anisotropically conductive adhesive having a thickness of 40 pm was formed on the circuit board 9 by screen printing.The anisotropically conductive adhesive was ultraviolet-curable and manufactured by mixing and dispersing 7% by volume of a silvercopper alloy in a silver to copper alloying ratio of 8:2 by weight and a particle size distribution ranging from 10 lim to 30 pm, in an ultraviolet-curable insulating liquid adhesive matrix. The assembly of the IC 8 and the circuit board 9 was irradiated with ultraviolet light to give a dose of 2000 mJ/cm2to fully cure the coating film while the assembly was firmly held together using a clamp made in part of glass to ensure transparency at least in one direction for ultraviolet irradiation.
The electrical performance of the fixed assembly remained sound and unaffected even after 1000 cycles of thermal shock tests between +85 C and i -40"C.
EXAMPLE 2
A cylindrical resistor 13 was mounted on a flexible circuit board 16 reinforced partly with a reinforcing plate 15 and laminated with a film 14 prepared by casting an anisotropically conductive adhesive, as shown in Figure 5. The flexible circuit board 16 was prepared by printing a circuit pattern using a silver paste on a polyester substrate having a thickness of 38 pm and terminal electrodes were formed thereon each in the form of a mobile flap as in Example 1.
The anisotropically conductive adhesive was prepared by mixing and dispersing 6.5% by volume of spherical particles of a solder alloy having a particle size distribution ranging from 5pm to 15 pm in an insulating adhesive matrix of a thermoplastic
SBR resin. The assembly was subjected to heatpressing at 1 50 C under a pressure of 30 kg/cm2 while being fixed using a clamp provided with an elastomeric member capable of conforming to the cylindrical surface of the resistor so that the assembly was firmly integrated together.
Measurement of the contact resistance of the assembled electronic device gave an initial resistance of 0.63 ohm on an average and only a slight increase of the average value of resistance to 0.71 ohm after a heat-treatment at 70 C for 1000 hours. A similar resistor assembly built in a conventional manner showed an initial resistance of 0.65 ohm on an average and an increase of the average resistance value to 1.53 ohm after a heattreatment at 700C for 1000 hours.
Claims (8)
1. An assembled electronic device which comprises an electronic device having a terminal electrode and an electronic circuit board having a terminal made of an elastically flexible material and shaped in the form of a movable flap by being partly surrounded by a line incision, the terminal electrode of the electronic device and the terminal of the circuit board being adhesively bonded together with a layer of an anisotropically electroconductive adhesive intervening therebetween which is electroconductive in the direction of the thickness of the layer but insulating within the plane of the layer.
2. An assembled electronic device as claimed in claim 1, in which the elastically flexible material is a polyester resin or a polyimide resin.
3. An assembled electronic device as claimed in claim 1 or claim 2, in which the anisotropically electroconductive adhesive comprises 5 to 30 parts by volume of a finely divided electroconductive material dispersed in a matrix of 100 parts by volume of an insulating adhesive.
4. An assembled electronic device as claimed in any of claims 1 to 3, in which the electroconductive material is a metal, an electroconductive ceramic or carbon.
5. An assembled electronic device as claimed in any of claims 1 to 4, in which the anisotropically electroconductive adhesive is a thermosetting adhesive, a thermoplastic adhesive, an ultravioletcurable adhesive, an electron beam-curable adhesive or an anaerobically curable adhesive.
6. An assembled electronic device substantially as hereinbefore described with reference to, and as illustrated in, Figure 1 of the accompanying drawings.
7. An assembled electronic device substantially as hereinbefore described in Example 1 with reference to, and as illustrated in, Figures 2 to 4 of the accompanying drawings.
8. An assembled electronic device substantially as hereinbefore described in Example 2 with reference to, and as illustrated in, Figure 5 of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61030118A JPS62194692A (en) | 1986-02-14 | 1986-02-14 | Electronic parts |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8703155D0 GB8703155D0 (en) | 1987-03-18 |
| GB2186745A true GB2186745A (en) | 1987-08-19 |
| GB2186745B GB2186745B (en) | 1989-05-10 |
Family
ID=12294866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8703155A Expired GB2186745B (en) | 1986-02-14 | 1987-02-11 | An electronic device adhesively bonded to a circuit board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS62194692A (en) |
| GB (1) | GB2186745B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0623954A1 (en) * | 1993-05-07 | 1994-11-09 | AT&T Corp. | Molded plastic packaging of electronic devices |
| GB2283863A (en) * | 1993-11-16 | 1995-05-17 | Ibm | Direct chip attach module |
| WO2010126410A1 (en) * | 2009-04-28 | 2010-11-04 | Telefonaktiebolaget L M Ericsson (Publ) | Assembly for carrying electronic components |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH053092U (en) * | 1991-07-01 | 1993-01-19 | 住友重機械工業株式会社 | Vessel hull resistance reduction device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1392278A (en) * | 1972-05-18 | 1975-04-30 | Jaeger | Printer circuit on a flexible support |
| GB1583778A (en) * | 1977-05-10 | 1981-02-04 | Martin Marietta Corp | Multilayer circuit board with integral flexible appendages |
| GB2093612A (en) * | 1981-02-23 | 1982-09-02 | Fontainemelon Horlogerie | Improvements relating to printed circuits with resonators fixed thereto |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2652951A1 (en) * | 1976-11-22 | 1978-05-24 | Vdo Schindling | Circuit component mounting and contact - uses small circuit board to support component with contact pads soldered to main circuit board conductors |
| JPS60170995A (en) * | 1984-02-16 | 1985-09-04 | 松下電器産業株式会社 | Circuit board |
-
1986
- 1986-02-14 JP JP61030118A patent/JPS62194692A/en active Pending
-
1987
- 1987-02-11 GB GB8703155A patent/GB2186745B/en not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1392278A (en) * | 1972-05-18 | 1975-04-30 | Jaeger | Printer circuit on a flexible support |
| GB1583778A (en) * | 1977-05-10 | 1981-02-04 | Martin Marietta Corp | Multilayer circuit board with integral flexible appendages |
| GB2093612A (en) * | 1981-02-23 | 1982-09-02 | Fontainemelon Horlogerie | Improvements relating to printed circuits with resonators fixed thereto |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0623954A1 (en) * | 1993-05-07 | 1994-11-09 | AT&T Corp. | Molded plastic packaging of electronic devices |
| GB2283863A (en) * | 1993-11-16 | 1995-05-17 | Ibm | Direct chip attach module |
| WO2010126410A1 (en) * | 2009-04-28 | 2010-11-04 | Telefonaktiebolaget L M Ericsson (Publ) | Assembly for carrying electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2186745B (en) | 1989-05-10 |
| JPS62194692A (en) | 1987-08-27 |
| GB8703155D0 (en) | 1987-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PE20 | Patent expired after termination of 20 years |
Effective date: 20070210 |