GB2171850A - Mounting surface acoustic wave components - Google Patents

Mounting surface acoustic wave components Download PDF

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Publication number
GB2171850A
GB2171850A GB08504660A GB8504660A GB2171850A GB 2171850 A GB2171850 A GB 2171850A GB 08504660 A GB08504660 A GB 08504660A GB 8504660 A GB8504660 A GB 8504660A GB 2171850 A GB2171850 A GB 2171850A
Authority
GB
United Kingdom
Prior art keywords
printed wiring
wiring substrate
saw
component
saw component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08504660A
Other versions
GB8504660D0 (en
GB2171850B (en
Inventor
John Willis Arthur
Angus David Mclachlan
Raymond Ronald Halstead
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Garrett Motion UK Ltd
Original Assignee
Racal MESL Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Racal MESL Ltd filed Critical Racal MESL Ltd
Priority to GB08504660A priority Critical patent/GB2171850B/en
Publication of GB8504660D0 publication Critical patent/GB8504660D0/en
Publication of GB2171850A publication Critical patent/GB2171850A/en
Application granted granted Critical
Publication of GB2171850B publication Critical patent/GB2171850B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

A surface acoustic wave (SAW) component (8) is mounted face down on a printed wiring substrate (1) with the surface transducers arranged in alignment with respective conductors (6) on the printed wiring substrate (1). The conductors and transducers are connected together by conductive epoxy adhesive (12). A fillet (16) of room temperature vulcanising (RTV) adhesive is applied all around the SAW component (8) to prevent ingress of moisture, solvents, etc. An air gap (14) is formed between the transducer- carrying surface (10) of the SAW component (8) and the surface of the printed wiring substrate (1) by the slightly raised nature of the conductors (6). A bleed hole (18) allows back filling of the gap (4) with an inert gas e.g. nitrogen and subsequent sealing with a disc (20). <IMAGE>

Description

SPECIFICATION Mounting saw components The present invention relates to methods of mounting surface acoustic wave (SAW) components to substrates such as circuit boards.
Conventionally, SAW components such as delay lines and filters have been mounted to printed circuit boards (PCBs) by first packaging them into sealed containers having externally projecting connecting pins which are then soldered to tracks already printed on the circuit board. It is thus necessary to connect wire bonds from the transducers of the SAW device to each of the pins and then enclose the connected SAW device into a sealed package.
This form of mounting is both bulky and relatively expensive, as many of the pins require glass to metal seals for isolation from the body of the package.
It is presently becoming increasingly the practice to mount components directly to the surface of a circuit board substrate. This technique is known as surface mounting and has been used for mounting integrated circuits.
The packages, instead of having pins, are provided simply with bonding pads at their edges or on their lower surface which can be directly connected to correspondingly arranged pads on the surface of the printed circuit board by thermocompression bonding or soldering. This method has the advantage of producing a very low profile assembly but does not avoid the bulk and expense of packaging.
It would be clearly advantageous to be able to mount SAW devices directly onto printed wiring substrates without the expense and bulk of packaging by, for example, bringing the bond pads of the device into direct contact with the printed wiring substrate. However, the problem of providing a sealed air space adjacent to the active region of the device surface has to be overcome, as this surface must be kept free from contact with any other surface and from contamination of any kind which would impede the propagation of surface waves. Further, without a conducting metal package the problem of providing suitable electromagnetic screening must also be overcome.
Finally, SAW devices may be fragile, and sensitive to stress caused by differential thermal expansion if directly adhered to a rigid surface with a much different coefficient of expansion. They can also be damaged by direct application of heat.
The present invention accordingly provides a method of mounting an unpackaged SAW component having transducers on one surface of a substrate, to a printed wiring substrate carrying conductors to be connected to the SAW transducers, comprising the steps of applying a conductive adhesive to predetermined areas of said one surface of the SAW component and/or of the printed wiring substrate, placing said one surface of the SAW component over the printed wiring substrate such that the transducers are in contact, via the adhesive, with the conductors to which they are to be connected and a space is defined between said one surface of the SAW component and the printing wiring substrate, and sealing said space.
The use of a conducting adhesive, for example a conducting, silver-loaded epoxy resin, avoids the need for gold wire bonding or application of heat to the SAW component.
In order to define the space, the conductors on the printed wiring substrate are preferably slightly raised from the surface of the substrate, so that when the component is inverted over the substrate a small air gap results. This gap prevents any adverse effect that surface contact between the substrate and the SAW component would have on the surface waves produced during operation of the component. In a preferred embodiment means are provided for filling this space with a dry inert gas such as nitrogen for better operating conditions.
Preferably sealing is ensured by applying a fillet of non-conductive, flexible adhesive all around the edge of the SAW component between the component and the printed wiring substrate to prevent the ingress of moisture, solvents or dirt which could have an adverse effect on the operation of the component if allowed to become deposited on the surface carrying the transducers. A suitable adhesive for this fillet is a room temperature vulcanising synthetic rubber adhesive. This advantage ously has the further property of absorbing any residual acoustic energy impinging on the edge of the component.
Another problem associated with the surface mounting of SAW components is the avoidance of stress on the component which may cause changes in the response of the transducers due to variation of the stress of the mount. The use of the above-mentioned flexible adhesive fillet as set out above helps in the removal of such stress. In accordance with a preferred embodiment of this invention the printed wiring substrate is a soft circuit board substrate such as a polytetrafluroethylene-based dielectric material. It will be noted that such substrates are cost effective compared with harder substrates but they are not ideal for the use of thermocompression bonding techniques, and therefore the adhesive mounting technique of the present invention is highly advantageous in enabling further reduction of stress in the mounting of the SAW component.
It is preferable that the printed wiring substrate has a stiffening backing such as an aluminium plate on the surface directly opposite the SAW component. Conveniently, this may provide an excellent ground plane for electro magnetic screening.
An embodiment of the invention will now be described, by way of example only, with reference to the accompanying diagrammatic drawing which shows a cross-section through a SAW component mounted to a printed wiring substrate in accordance with the invention A printed wiring substrate 1 comprises a metal substrate backing plate 2 provided with an upper, dielectric layer 4. The plate 2 may be an aluminium plate and provides stiffening and a ground plane for electromagnetic screening. In a soft printed wiring substrate the dielectric layer 4 may be based on polytetrafluroethylene material and is relatively resilient.
A pattern of conductors 6 is applied to the surface of the dielectric layer 4 to establish the interconnections required between a SAW component 8 and other components to be mounted on the substrate 1. The conductors are preferably gold plated copper tracks. The SAW component 8 comprises in a known manner a substrate of, for example, quartz on which an aluminium surface film (not shown) has been applied to the face 10 in an appropriate pattern to form the surface acoustic wave transducers of the component. Each transducer is normally required to be connected to a particular conductor on the printed wiring substrate. The terminations of these conductors are arranged so that when the component 8 is placed with its active surface 10 facing towards the substrate 1 the various portions of the transducers to be connected are aligned with their respective conductors.
In order to achieve a connection between the transducers and conductors 6 a conductive epoxy adhesive 12 is applied in appropriate predetermined regions either to the surface of the printed wiring substrate 1 or to the surface 10 of the SAW component or to both surfaces. The application of the adhesive may be such as to cover only those areas between the conductors 6 and transducers to be connected or may extend more widely so that a bond can be formed between the conductor and the SAW substrate in order to give improved adhesion. It will be appreciated that the pattern of adhesive must be arranged so as to avoid producing an electrical connection between the different transducers. A silver loaded epoxy resin is a suitable adhesive for this purpose.
The pattern and height of the conductors 6 is such that when the SAW component is mounted face down on top of the conductors a small air gap 14 is formed between the transducer-carrying surface 10 of the component and the surface of the dielectric material 4. This prevents any adverse effects on the propagation of the surface acoustic waves that could be caused by surface contact between the dielectric material 4 and the SAW component 8.
In order to avoid the ingress of moisture, solvents or dirt, a fillet of non-conducting flexible adhesive 16 is applied all around the edge of the SAW component. A suitable adhesive for this purpose is a room temperature vulcanising (RTV) synthetic rubber adhesive.
A bleed-hole 18 is provided to allow back filling of the air gap 14 with inert gas, such as nitrogen. A small disc 20 is stuck down with adhesive, e.g. epoxy, to reform the seal after the inert gas has been introduced to replace the air. The hole 18 may also be used to attach equipment to test the seal between the component 8 and the substrate 1.
The above described mounting technique may be used on printed circuit boards to which other components are mounted by either through hole or surface mounting. For hybrid circuits the entire assembly together with other components mounted to the printed wiring substrate 1 may be encapsulated in non-conducting epoxy for ruggedness and improvement of the seal. Conductive paint or metal foil may also be applied to the back of the SAW component to improve electromagnetic screening.
Because of the presence of the fillet 16 the surface 10 of the SAW component is not affected by deposit of any products emanating from this epoxy which could have an adverse effect on the operation of the SAW component.
The material of the plate 2 is preferably chosen so that the coefficient of expansion of the substrate 1 is as similar as possible to the coefficient of expansion of the SAW component to guard against the component becoming dislodged if the assembly is subjected to wide temperature fluctuations.
In a modification the RTV adhesive can be extended to not only provide the fillet 16 but also to cover the entire back of the SAW component 8 to a depth which may be substantially equal to the thickness of the substrate of the SAW component. This layer of adhesive can then be encapsulated in a hard epoxy resin to provide mechanical protection and also to increase the longevity of the seal between the SAW component and the substrate 1, provided by the adhesive. If the encapsulating expoxy resin is conducting further electromagnetic screening is provided. Alternatively a screening metal layer may be provided inside or outside the hard epoxy encapsulation.

Claims (13)

1. A method of mounting an unpackaged SAW component having transducers on one surface of a substrate, to a printed wiring substrate carrying conductors to be connected to the SAW transducers, comprising the steps of applying a conductive adhesive to predetermined areas of said one surface of the SAW component and/or of the printed wiring sub strate, placing said one surface of the SAW component over the printed wiring substrate such that the transducers are in contact, via the adhesive, with the conductors to which they are to be connected and a space is defined between said one surface of the SAW component and the printing wiring substrate, and sealing said space.
2. A method as claimed in claim 1, wherein the adhesive is a conducting, silver-loaded epoxy resin.
3. A method as claimed in claim 1 or 2, further comprising the step of filling said space defined between said one surface of the 8AW component and the printing wiring substrate with a dry inert gas.
4. A method as claimed in claim 3, wherein the inert gas is nitrogen.
5. A method as claimed in any one of the preceding claims, wherein the sealing step comprises applying a fillet of non-conductive, flexible adhesive all around the edge of the SAW component between the component and the printed wiring substrate.
6. A method as claimed in claim 5, wherein the fillet is made of a room temperature vulcanising synthetic rubber adhesive.
7. A printed wiring substrate carrying a surface mounted unpackaged SAW component having transducers on one surface, the printed wiring substrate carrying conductors which, at least in the region at which they contact the transducers of the SAW component, are raised from the surface of the printed wiring substrate, said one surface of the SAW component facing the printed wiring substrate so that a space is defined between their surfaces, conducting adhesive holding the SAW component to the printed wiring substrate and making the required electrical connections between the transducers and the conductors on the printed wiring substrate, and a fillet of non-conductive, flexible adhesive surrounding the edge of the SAW component and sealing said space.
8. An assembly as claimed in claim 7, wherein the printed wiring substrate is a soft circuit board substrate.
9. An assembly as claimed in claim 8, wherein the soft circuit board substrate is a polytetrafluoroethylene-based dielectric material.
10. An assembly as claimed in any one of the preceding claims wherein the printed wiring substrate has a stiffening backing.
11. An assembly as claimed in claim 10, wherein the stiffening backing comprises an aluminium plate disposed on the surface oppo- site the SAW component.
12. A method of mounting an unpackaged SAW component to a printed wiring substrate substantially as herein described with reference to the accompanying drawings.
13. An assembly of an unpackaged SAW conponent on a printed wiring substrate substantially as herein described with reference to the accompanying drawings.
GB08504660A 1985-02-22 1985-02-22 Mounting surface acoustic wave components Expired GB2171850B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08504660A GB2171850B (en) 1985-02-22 1985-02-22 Mounting surface acoustic wave components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08504660A GB2171850B (en) 1985-02-22 1985-02-22 Mounting surface acoustic wave components

Publications (3)

Publication Number Publication Date
GB8504660D0 GB8504660D0 (en) 1985-03-27
GB2171850A true GB2171850A (en) 1986-09-03
GB2171850B GB2171850B (en) 1988-05-18

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0495316A2 (en) * 1990-12-28 1992-07-22 Raytheon Company Saw device and method of manufacture
DE19548046A1 (en) * 1995-12-21 1997-06-26 Siemens Matsushita Components Method for producing contacts of electrical components suitable for flip-chip assembly
WO1998006244A1 (en) * 1996-08-02 1998-02-12 Italtel S.P.A. Surface mounting process of components for oscillators on printed circuits using conductive epoxy adhesive
FR2786959A1 (en) * 1998-12-08 2000-06-09 Thomson Csf ENCAPSULATED SURFACE WAVE COMPONENT AND COLLECTIVE MANUFACTURING METHOD
US6628179B2 (en) * 1998-02-09 2003-09-30 Japan Radio Co Ltd Surface acoustic wave device with a window for adjustment of the device
EP1553630A1 (en) * 2002-07-03 2005-07-13 Sony Corporation Modular board device and high frequency module and method for producing them
WO2017025542A1 (en) * 2015-08-12 2017-02-16 Schweizer Electronic Ag High-frequency antenna, high-frequency substrate with high-frequency antenna, and production method

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0495316A3 (en) * 1990-12-28 1992-11-04 Raytheon Company Saw device and method of manufacture
US5208504A (en) * 1990-12-28 1993-05-04 Raytheon Company Saw device and method of manufacture
EP0495316A2 (en) * 1990-12-28 1992-07-22 Raytheon Company Saw device and method of manufacture
DE19548046A1 (en) * 1995-12-21 1997-06-26 Siemens Matsushita Components Method for producing contacts of electrical components suitable for flip-chip assembly
DE19548046C2 (en) * 1995-12-21 1998-01-15 Siemens Matsushita Components Method for producing contacts of electrical components suitable for flip-chip assembly
WO1998006244A1 (en) * 1996-08-02 1998-02-12 Italtel S.P.A. Surface mounting process of components for oscillators on printed circuits using conductive epoxy adhesive
US6628179B2 (en) * 1998-02-09 2003-09-30 Japan Radio Co Ltd Surface acoustic wave device with a window for adjustment of the device
FR2786959A1 (en) * 1998-12-08 2000-06-09 Thomson Csf ENCAPSULATED SURFACE WAVE COMPONENT AND COLLECTIVE MANUFACTURING METHOD
WO2000035085A1 (en) * 1998-12-08 2000-06-15 Thomson-Csf Encapsulated surface wave component and collective method for making same
US6852561B2 (en) 1998-12-08 2005-02-08 Thomson-Csf Encapsulated surface acoustic wave component and method of collective fabrication
EP1553630A1 (en) * 2002-07-03 2005-07-13 Sony Corporation Modular board device and high frequency module and method for producing them
EP1553630A4 (en) * 2002-07-03 2008-08-13 Sony Corp Modular board device and high frequency module and method for producing them
US7470977B2 (en) 2002-07-03 2008-12-30 Sony Corporation Modular board device, high frequency module, and method of manufacturing same
WO2017025542A1 (en) * 2015-08-12 2017-02-16 Schweizer Electronic Ag High-frequency antenna, high-frequency substrate with high-frequency antenna, and production method
US10602606B2 (en) 2015-08-12 2020-03-24 Schweizer Electronic Ag Radio-frequency antenna, radio-frequency substrate with radio-frequency antenna, and production method

Also Published As

Publication number Publication date
GB8504660D0 (en) 1985-03-27
GB2171850B (en) 1988-05-18

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PCNP Patent ceased through non-payment of renewal fee