GB2030779A - Improvements in or relating to the manufacture of flexible printed circuits - Google Patents

Improvements in or relating to the manufacture of flexible printed circuits Download PDF

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Publication number
GB2030779A
GB2030779A GB7838301A GB7838301A GB2030779A GB 2030779 A GB2030779 A GB 2030779A GB 7838301 A GB7838301 A GB 7838301A GB 7838301 A GB7838301 A GB 7838301A GB 2030779 A GB2030779 A GB 2030779A
Authority
GB
United Kingdom
Prior art keywords
base board
flexible printed
printed circuit
sheet
substrate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7838301A
Other versions
GB2030779B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Co Ltd filed Critical Marconi Co Ltd
Priority to GB7838301A priority Critical patent/GB2030779B/en
Publication of GB2030779A publication Critical patent/GB2030779A/en
Application granted granted Critical
Publication of GB2030779B publication Critical patent/GB2030779B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

A method of manufacturing a flexible printed circuit board comprising bonding, by means of a thermoplastic adhesive film, a sheet of flexible substrate material to a rigid base board of for example fibre glass, prior to processing the sheet to form a printed circuit. The flexible printed circuit board is then removed from the base board by peeling. <IMAGE>

Description

SPECIFICATION Improvements in or relating to the manufacture of flexible printed circuits.
This invention relates to the manufacture of flexible printed circuits.
As is well known a flexible printed circuit consists of a sheet of relatively flimsy material quite commonly only 0.004" (0.1 mm approx- imately) thick upon which conductive tracks are provided by a printing process. The complete manufacture of a flexible printed circuit involves a number of processes including cleaning, the photographic conductor forming process and often machining in order to provide patterns of holes. Due to the relative flimsiness of the material the handling during such processing is difficult.
Furthermore in order to save cost, a plurality of individual flexible printed circuits are normally processed upon a single blank of substrate material commonly 24" by 12" (61 cm by 30.5 cm approximately). Apart from the above-mentioned difficulty of handling it has also been found that during processing the substrate material shrinks-typically by .025" (.64 mm approximately) in 24" (61 cm approximately). This shrinkage leads to difficulty during final processing, e.g. screen printing or drilling carried out on the processed circuit since, unless due allowance is made and this is difficult since the exact amount of shrinkage is difficult to predict in a given cast the hole pattern and/or printing pattern does not line up with the formed circuit pattern.
The present invention seeks to provide a method of manufacturing a flexible printed circuit in which the above difficulties are reduced.
According to this invention a method of manufacturing a flexible printed circuit board comprises the step of bonding by means of a thermo-plastic adhesive film, a sheet of flexible substrate material to a relatively rigid base board prior to processing said sheet to form a finished circuit from said base board by peeling.
Where machining operations are to be carried out, in order for example to provide a pattern of holes, such operations will also be carried out whilst said sheet of flexible substrate material is on said base board.
Preferably said base board is a panel of fibreglass or synthetic resin-bonded paper. A preferred thermoplastic adhesive material for use in bonding said substrate material to said base board is a photosensitive polymeric film.
The invention is further described with reference to the accompanying drawing which is highly schematic diagram illustrating the essential steps in the manufacture of a flexible printed circuit in accordance with the present invention.
Referring to the drawing a sheet of fibreglass 0.062" (1.57 mm approximately) 1 is passed through a suitable "hot roll" laminator 2 in order to apply a thermoplastic photosensitive polymeric adhesive film .002" (.05mm approximately) thick as represented at (A). A sheet 4 of substrate material of which the flexible printed circuit is to be formed is then applied over the film 3 and the assembly is once more passed through the hot rollers of the laminator 2 in order to achieve a satisfactory bond. It will be noted, of course, that in this second passage through the laminator 2 it is only the hot rollers thereof which are operative and no application of thermoplastic adhesive material is involved.
As represented by the block 5 the substrate material 4 is then processed to form the required conductive pattern on its surface and any drilling or screen printing operations are then carried out on the processed circuit.
Finally as represented at (B) the finished flexible printed circuit is simply peeled off the base board 1.
It has been found that the use of thermoplastic adhesive material bonding the substrate 4 to the base board 1 results in the substrate 4 peeling off quite cleanly whilst at the same time the bond is sufficient to enable adequate location of the substrate 4 on the base board 1 during handling and processing.
The adhesion is also sufficient to prevent undue shrinkage of the substrate 4 during processing.

Claims (6)

1. A method of manufacturing a flexible printed circuit board comprising the step of bonding, by means of a thermo-plastic adhesive film, a sheet of flexible substrate material to a relatively rigid base board prior to processing said sheet to form a finished circuit and subsequently removing the processed printed circuit from said base board by peeling.
2. A method as claimed in claim 1 and wherein machining operations area carried out whilst said sheet of flexible substrate material is on said base board.
3. An arrangement as claimed in claim 1 or 2 and wherein said base board is a panel of fibreglass.
4. A method as claimed in claim 1 or 2 and wherein said base board is synthetic resin-bonded paper.
5. A method as claimed in any of the above claims and wherein said thermoplastic adhesive material is a photo-sensitive polymer- ic film.
6. A method of manufacturing a flexible printed circuit board substantially as herein described with reference to the accompanying drawing.
GB7838301A 1978-09-27 1978-09-27 Manufacture of flexible printed circuits Expired GB2030779B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7838301A GB2030779B (en) 1978-09-27 1978-09-27 Manufacture of flexible printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7838301A GB2030779B (en) 1978-09-27 1978-09-27 Manufacture of flexible printed circuits

Publications (2)

Publication Number Publication Date
GB2030779A true GB2030779A (en) 1980-04-10
GB2030779B GB2030779B (en) 1982-10-13

Family

ID=10499937

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7838301A Expired GB2030779B (en) 1978-09-27 1978-09-27 Manufacture of flexible printed circuits

Country Status (1)

Country Link
GB (1) GB2030779B (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998052391A1 (en) * 1997-05-16 1998-11-19 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, and processing a flexible circuit
EP1006762A2 (en) * 1998-12-03 2000-06-07 Leuze electronic GmbH + Co. Arrangement for processing a circuit board
EP1198161A1 (en) * 2000-10-10 2002-04-17 Morton International, Inc. Method for securing and processing thin film materials
EP1333708A1 (en) * 2001-07-19 2003-08-06 Toray Industries, Inc. CIRCUIT BOARD&comma; CIRCUIT BOARD&minus;USE MEMBER AND PRODUCTION METHOD THEREFOR AND METHOD OF LAMINATING FEXIBLE FILM
US6687969B1 (en) 1997-05-16 2004-02-10 Micron Technology, Inc. Methods of fixturing flexible substrates and methods of processing flexible substrates
WO2005048669A1 (en) * 2003-11-14 2005-05-26 Koninklijke Philips Electronics N.V. Flexible devices
EP1571894A1 (en) * 2002-11-01 2005-09-07 Daisho Denshi Co. Ltd. Holding/convey jig and holding/convey method
WO2008109412A1 (en) * 2007-03-02 2008-09-12 Raytheon Company Method for fabricating electrical circuitry on ultra-thin plastic films
US20100203296A1 (en) * 2009-02-10 2010-08-12 Industrial Technology Research Institute Transferring structure for flexible electronic device and method for fabricating flexible electronic device
CN107889364A (en) * 2017-11-21 2018-04-06 江门市浩远电子科技有限公司 A kind of FPC processing fixing device

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998052391A1 (en) * 1997-05-16 1998-11-19 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, and processing a flexible circuit
US5972152A (en) * 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
US6458234B1 (en) * 1997-05-16 2002-10-01 Micron Technology, Inc. Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate
US6687969B1 (en) 1997-05-16 2004-02-10 Micron Technology, Inc. Methods of fixturing flexible substrates and methods of processing flexible substrates
EP1006762A2 (en) * 1998-12-03 2000-06-07 Leuze electronic GmbH + Co. Arrangement for processing a circuit board
EP1006762A3 (en) * 1998-12-03 2002-01-02 Leuze electronic GmbH + Co. Arrangement for processing a circuit board
EP1198161A1 (en) * 2000-10-10 2002-04-17 Morton International, Inc. Method for securing and processing thin film materials
EP1333708A1 (en) * 2001-07-19 2003-08-06 Toray Industries, Inc. CIRCUIT BOARD&comma; CIRCUIT BOARD&minus;USE MEMBER AND PRODUCTION METHOD THEREFOR AND METHOD OF LAMINATING FEXIBLE FILM
US7534361B2 (en) 2001-07-19 2009-05-19 Toray Industries, Inc. Methods for making laminated member for circuit board, making circuit board and laminating flexible film
EP1333708A4 (en) * 2001-07-19 2008-08-13 Toray Industries Circuit board, circuit board-use member and production method therefor and method of laminating fexible film
EP1571894A4 (en) * 2002-11-01 2007-11-07 Daisho Denshi Co Ltd Holding/convey jig and holding/convey method
EP1571894A1 (en) * 2002-11-01 2005-09-07 Daisho Denshi Co. Ltd. Holding/convey jig and holding/convey method
US7963029B2 (en) 2002-11-01 2011-06-21 Daisho Denshi Co., Ltd. Holding/convey jig and holding/convey method
WO2005048669A1 (en) * 2003-11-14 2005-05-26 Koninklijke Philips Electronics N.V. Flexible devices
WO2008109412A1 (en) * 2007-03-02 2008-09-12 Raytheon Company Method for fabricating electrical circuitry on ultra-thin plastic films
US8114576B2 (en) 2007-03-02 2012-02-14 Raytheon Company Method for fabricating electrical circuitry on ultra-thin plastic films
US8535797B2 (en) 2007-03-02 2013-09-17 Raytheon Company Method for fabricating electrical circuitry on ultra-thin plastic films
US20100203296A1 (en) * 2009-02-10 2010-08-12 Industrial Technology Research Institute Transferring structure for flexible electronic device and method for fabricating flexible electronic device
US8715802B2 (en) * 2009-02-10 2014-05-06 Industrial Technology Research Institute Transferring structure for flexible electronic device and method for fabricating flexible electronic device
CN107889364A (en) * 2017-11-21 2018-04-06 江门市浩远电子科技有限公司 A kind of FPC processing fixing device

Also Published As

Publication number Publication date
GB2030779B (en) 1982-10-13

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee