GB201320925D0 - Semiconductor devices and fabrication methods - Google Patents
Semiconductor devices and fabrication methodsInfo
- Publication number
- GB201320925D0 GB201320925D0 GB201320925A GB201320925A GB201320925D0 GB 201320925 D0 GB201320925 D0 GB 201320925D0 GB 201320925 A GB201320925 A GB 201320925A GB 201320925 A GB201320925 A GB 201320925A GB 201320925 D0 GB201320925 D0 GB 201320925D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor devices
- fabrication methods
- fabrication
- methods
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02647—Lateral overgrowth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02647—Lateral overgrowth
- H01L21/0265—Pendeoepitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3081—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
- H01L33/18—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1320925.9A GB2520687A (en) | 2013-11-27 | 2013-11-27 | Semiconductor devices and fabrication methods |
CN201480073098.1A CN105917444A (en) | 2013-11-27 | 2014-11-25 | Semiconductor devices and fabrication methods |
EP14803236.0A EP3075002A1 (en) | 2013-11-27 | 2014-11-25 | Semiconductor devices and fabrication methods |
PCT/GB2014/053496 WO2015079222A1 (en) | 2013-11-27 | 2014-11-25 | Semiconductor devices and fabrication methods |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1320925.9A GB2520687A (en) | 2013-11-27 | 2013-11-27 | Semiconductor devices and fabrication methods |
Publications (2)
Publication Number | Publication Date |
---|---|
GB201320925D0 true GB201320925D0 (en) | 2014-01-08 |
GB2520687A GB2520687A (en) | 2015-06-03 |
Family
ID=49918277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1320925.9A Withdrawn GB2520687A (en) | 2013-11-27 | 2013-11-27 | Semiconductor devices and fabrication methods |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3075002A1 (en) |
CN (1) | CN105917444A (en) |
GB (1) | GB2520687A (en) |
WO (1) | WO2015079222A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190139766A1 (en) * | 2017-11-09 | 2019-05-09 | Nanya Technology Corporation | Semiconductor structure and method for preparing the same |
WO2019206844A1 (en) * | 2018-04-22 | 2019-10-31 | Epinovatech Ab | Reinforced thin-film device |
KR20210078555A (en) * | 2018-10-26 | 2021-06-28 | 에바텍 아크티엔게젤샤프트 | Deposition process for piezoelectric coatings |
FR3088478B1 (en) | 2018-11-08 | 2020-10-30 | Soitec Silicon On Insulator | COLLECTIVE MANUFACTURING PROCESS OF A PLURALITY OF SEMI-CONDUCTIVE STRUCTURES |
EP3836227A1 (en) | 2019-12-11 | 2021-06-16 | Epinovatech AB | Semiconductor layer structure |
EP3866189B1 (en) | 2020-02-14 | 2022-09-28 | Epinovatech AB | A mmic front-end module |
EP3879706A1 (en) | 2020-03-13 | 2021-09-15 | Epinovatech AB | Field-programmable gate array device |
EP4101945B1 (en) | 2021-06-09 | 2024-05-15 | Epinovatech AB | A device for performing electrolysis of water, and a system thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040029365A1 (en) * | 2001-05-07 | 2004-02-12 | Linthicum Kevin J. | Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby |
US20060189079A1 (en) * | 2005-02-24 | 2006-08-24 | Merchant Tushar P | Method of forming nanoclusters |
KR100668964B1 (en) * | 2005-09-27 | 2007-01-12 | 엘지전자 주식회사 | Light emitting device with nano-groove and method for fabricating the same |
GB2488587B (en) * | 2011-03-03 | 2015-07-29 | Seren Photonics Ltd | Semiconductor devices and fabrication methods |
-
2013
- 2013-11-27 GB GB1320925.9A patent/GB2520687A/en not_active Withdrawn
-
2014
- 2014-11-25 CN CN201480073098.1A patent/CN105917444A/en active Pending
- 2014-11-25 WO PCT/GB2014/053496 patent/WO2015079222A1/en active Application Filing
- 2014-11-25 EP EP14803236.0A patent/EP3075002A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2015079222A1 (en) | 2015-06-04 |
EP3075002A1 (en) | 2016-10-05 |
CN105917444A (en) | 2016-08-31 |
GB2520687A (en) | 2015-06-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |