GB1365497A - Method of making printed circuit - Google Patents

Method of making printed circuit

Info

Publication number
GB1365497A
GB1365497A GB5707371A GB5707371A GB1365497A GB 1365497 A GB1365497 A GB 1365497A GB 5707371 A GB5707371 A GB 5707371A GB 5707371 A GB5707371 A GB 5707371A GB 1365497 A GB1365497 A GB 1365497A
Authority
GB
United Kingdom
Prior art keywords
electroless
resist
exposed
boards
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5707371A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB1365497A publication Critical patent/GB1365497A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1365497 Electroless and electrolytic plating HITACHI Ltd 8 Dec 1971 [16 Dec 1970] 57073/71 Headings C7B and C7F [Also in Division H1] In a process for making printed circuits by applying an electroless all-over coating and thickening electrolytically the conductor portions after photo-resist masking the areas that are not to be thickened, the resist layer is thicker than the final conductor thickness to ensure that the conductors have a substantially rectangular cross-section. An insulating substrate with preformed through holes is treated with a bonding agent such as nitrile, neoprene, butyl or styrene rubber modified with phenolic or epoxy resin. After being semi-cured and cleaned with a . sulphuric acid/chromic acid mixture the bonding agent is sensitized with a 0À2% aqeuous solution of PdCl and electrolessly plated with Cu from a solution comprising 10g CuSO 4 ; 25ml formalin and 50g Rochelle salt per litre of water, with the pH adjusted to 12À5 by NaOH. Alternative electroless platings are Ni; Ni-P; Ni-Co or Ni- Co-P. A solid photo-resist such as that sold under the trade mark "Riston" is applied and exposed using a mask and parallel light. Unpolymerized portions of the "Riston" are removed with trichloroethane and the exposed portions of the metal layer are thickened electrolytically with Cu from a solution comprising 85g copper pyrophosphate 320g potassium pyrophosphate per litre of water plus a little ammonia, at a current density of 3 amp/square decimetre. After electrolysis the exposed resist is removed with methylene chloride and the underlying electroless deposit by chromic acid or hydrochloric acid. Ni and Au layers may be electro-deposited on the conductors. A multi-layer board may be made by laminating together two boards produced as above using prepreg, boring through holes and metalizing them and circuit areas on the exposed surfaces of the boards in the same way as described above with reference to the individual boards.
GB5707371A 1970-12-16 1971-12-08 Method of making printed circuit Expired GB1365497A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11179870 1970-12-16

Publications (1)

Publication Number Publication Date
GB1365497A true GB1365497A (en) 1974-09-04

Family

ID=14570407

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5707371A Expired GB1365497A (en) 1970-12-16 1971-12-08 Method of making printed circuit

Country Status (2)

Country Link
DE (1) DE2161829B2 (en)
GB (1) GB1365497A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0083488A2 (en) * 1981-12-31 1983-07-13 O'Hara, James Brian Method of producing printed circuits
CN112747844A (en) * 2020-12-22 2021-05-04 北京航空航天大学杭州创新研究院 Preparation method of sandwich structure touch sensing array

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04100294A (en) * 1990-08-20 1992-04-02 Mitsubishi Rayon Co Ltd Manufacture of printed wiring board
US5252195A (en) * 1990-08-20 1993-10-12 Mitsubishi Rayon Company Ltd. Process for producing a printed wiring board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0083488A2 (en) * 1981-12-31 1983-07-13 O'Hara, James Brian Method of producing printed circuits
EP0083488A3 (en) * 1981-12-31 1985-11-06 O'Hara, James Brian Method of producing printed circuits
CN112747844A (en) * 2020-12-22 2021-05-04 北京航空航天大学杭州创新研究院 Preparation method of sandwich structure touch sensing array
CN112747844B (en) * 2020-12-22 2022-04-29 北京航空航天大学杭州创新研究院 Preparation method of sandwich structure touch sensing array

Also Published As

Publication number Publication date
DE2161829A1 (en) 1972-06-29
DE2161829B2 (en) 1974-06-12

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees