GB1012736A - Improvements in or relating to cooling devices for semiconducting power rectifiers - Google Patents

Improvements in or relating to cooling devices for semiconducting power rectifiers

Info

Publication number
GB1012736A
GB1012736A GB3645462A GB3645462A GB1012736A GB 1012736 A GB1012736 A GB 1012736A GB 3645462 A GB3645462 A GB 3645462A GB 3645462 A GB3645462 A GB 3645462A GB 1012736 A GB1012736 A GB 1012736A
Authority
GB
United Kingdom
Prior art keywords
rectifier assembly
air
rectifiers
relating
bank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3645462A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Praha DIZ AS
Original Assignee
CKD Praha DIZ AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CKD Praha DIZ AS filed Critical CKD Praha DIZ AS
Publication of GB1012736A publication Critical patent/GB1012736A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)

Abstract

1,012,736. Cooling semi-conductor rectifiers. C. K. D. PRAHA NARODNI PODNIK. Sept. 25, 1962 [Nov. 2, 1961], No. 36454/62. Heading H1K. A semi-conductor rectifier assembly is cooled by the provision of a central air duct extending from the outer atmosphere through the rectifier assembly and into a common chamber into which open further air ducts housing rectifying elements. In the embodiment (Fig. 1) partitions such as 5 divide the rectifier assembly to form a system of air ducts in such a fashion that each duct channels air through either the cooling ribs of the lower halves of a bank of rectifiers or through the upper parts of each rectifying element in a bank. All the air is subsequently directed into a common chamber 2. Air flow through the rectifier assembly is controlled by the provision of louvres (Figs. 3, 4 and 5, not shown) of shapes corresponding to the shape of the rectifier assembly.
GB3645462A 1961-11-02 1962-09-25 Improvements in or relating to cooling devices for semiconducting power rectifiers Expired GB1012736A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS648661 1961-11-02

Publications (1)

Publication Number Publication Date
GB1012736A true GB1012736A (en) 1965-12-08

Family

ID=5412012

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3645462A Expired GB1012736A (en) 1961-11-02 1962-09-25 Improvements in or relating to cooling devices for semiconducting power rectifiers

Country Status (1)

Country Link
GB (1) GB1012736A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995025255A1 (en) * 1992-09-28 1995-09-21 Aavid Engineering, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995025255A1 (en) * 1992-09-28 1995-09-21 Aavid Engineering, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet

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