GB0423599D0 - Electro-optical device - Google Patents
Electro-optical deviceInfo
- Publication number
- GB0423599D0 GB0423599D0 GBGB0423599.0A GB0423599A GB0423599D0 GB 0423599 D0 GB0423599 D0 GB 0423599D0 GB 0423599 A GB0423599 A GB 0423599A GB 0423599 D0 GB0423599 D0 GB 0423599D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electro
- optical device
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
- H01L31/1808—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System including only Ge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0423599.0A GB0423599D0 (en) | 2004-10-23 | 2004-10-23 | Electro-optical device |
PCT/GB2005/004109 WO2006043105A1 (en) | 2004-10-23 | 2005-10-24 | Electro-optical device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0423599.0A GB0423599D0 (en) | 2004-10-23 | 2004-10-23 | Electro-optical device |
Publications (1)
Publication Number | Publication Date |
---|---|
GB0423599D0 true GB0423599D0 (en) | 2004-11-24 |
Family
ID=33485111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0423599.0A Ceased GB0423599D0 (en) | 2004-10-23 | 2004-10-23 | Electro-optical device |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB0423599D0 (en) |
WO (1) | WO2006043105A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2954831B1 (en) * | 2009-12-30 | 2013-02-08 | Commissariat Energie Atomique | INTEGRATED PIXELIZED IMAGING DEVICE WITH DIAMOND TRANSDUCTION AND METHOD OF MAKING SAME |
FR2982079A1 (en) * | 2011-10-28 | 2013-05-03 | Commissariat Energie Atomique | IMOSUR CMOS UTBB |
KR20230062676A (en) * | 2014-03-13 | 2023-05-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Imaging device |
EP3738147B1 (en) * | 2018-01-12 | 2021-11-24 | IRIS Industries SA | Short-wave infrared detector and its integration with cmos compatible substrates |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2681472B1 (en) * | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | PROCESS FOR PRODUCING THIN FILMS OF SEMICONDUCTOR MATERIAL. |
JP5066321B2 (en) * | 2000-08-04 | 2012-11-07 | 台湾積體電路製造股▲ふん▼有限公司 | Silicon wafer with embedded optoelectronic material for monolithic OEIC |
US6583440B2 (en) * | 2000-11-30 | 2003-06-24 | Seiko Epson Corporation | Soi substrate, element substrate, semiconductor device, electro-optical apparatus, electronic equipment, method of manufacturing the soi substrate, method of manufacturing the element substrate, and method of manufacturing the electro-optical apparatus |
-
2004
- 2004-10-23 GB GBGB0423599.0A patent/GB0423599D0/en not_active Ceased
-
2005
- 2005-10-24 WO PCT/GB2005/004109 patent/WO2006043105A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2006043105A1 (en) | 2006-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |