GB0118572D0 - Stone cold - Google Patents
Stone coldInfo
- Publication number
- GB0118572D0 GB0118572D0 GB0118572A GB0118572A GB0118572D0 GB 0118572 D0 GB0118572 D0 GB 0118572D0 GB 0118572 A GB0118572 A GB 0118572A GB 0118572 A GB0118572 A GB 0118572A GB 0118572 D0 GB0118572 D0 GB 0118572D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- stone cold
- stone
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0118572A GB0118572D0 (en) | 2001-07-31 | 2001-07-31 | Stone cold |
PCT/GB2002/003518 WO2003012865A2 (en) | 2001-07-31 | 2002-07-31 | Cooling apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0118572A GB0118572D0 (en) | 2001-07-31 | 2001-07-31 | Stone cold |
Publications (1)
Publication Number | Publication Date |
---|---|
GB0118572D0 true GB0118572D0 (en) | 2001-09-19 |
Family
ID=9919477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0118572A Ceased GB0118572D0 (en) | 2001-07-31 | 2001-07-31 | Stone cold |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB0118572D0 (en) |
WO (1) | WO2003012865A2 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0130279B1 (en) * | 1983-03-25 | 1989-03-08 | Mitsubishi Denki Kabushiki Kaisha | Heat radiator assembly for cooling electronic parts |
US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
JP3236137B2 (en) * | 1993-07-30 | 2001-12-10 | 富士通株式会社 | Semiconductor element cooling device |
US6037659A (en) * | 1997-04-28 | 2000-03-14 | Hewlett-Packard Company | Composite thermal interface pad |
US6114761A (en) * | 1998-01-20 | 2000-09-05 | Lsi Logic Corporation | Thermally-enhanced flip chip IC package with extruded heatspreader |
JP2928236B1 (en) * | 1998-07-23 | 1999-08-03 | 米沢日本電気株式会社 | Heat dissipating member for heating element |
-
2001
- 2001-07-31 GB GB0118572A patent/GB0118572D0/en not_active Ceased
-
2002
- 2002-07-31 WO PCT/GB2002/003518 patent/WO2003012865A2/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2003012865A3 (en) | 2003-09-04 |
WO2003012865A2 (en) | 2003-02-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |