FR2980280B1 - Procede de separation d'une couche dans une structure composite - Google Patents

Procede de separation d'une couche dans une structure composite

Info

Publication number
FR2980280B1
FR2980280B1 FR1158331A FR1158331A FR2980280B1 FR 2980280 B1 FR2980280 B1 FR 2980280B1 FR 1158331 A FR1158331 A FR 1158331A FR 1158331 A FR1158331 A FR 1158331A FR 2980280 B1 FR2980280 B1 FR 2980280B1
Authority
FR
France
Prior art keywords
separating
layer
composite structure
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1158331A
Other languages
English (en)
Other versions
FR2980280A1 (fr
Inventor
Didier Landru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1158331A priority Critical patent/FR2980280B1/fr
Application filed by Soitec SA filed Critical Soitec SA
Priority to US14/346,238 priority patent/US10220603B2/en
Priority to SG11201400366YA priority patent/SG11201400366YA/en
Priority to KR1020147010321A priority patent/KR20140065449A/ko
Priority to DE112012003512.7T priority patent/DE112012003512T5/de
Priority to CN201280045524.1A priority patent/CN103814435B/zh
Priority to PCT/IB2012/001406 priority patent/WO2013011372A1/fr
Priority to TW101128667A priority patent/TWI594297B/zh
Publication of FR2980280A1 publication Critical patent/FR2980280A1/fr
Application granted granted Critical
Publication of FR2980280B1 publication Critical patent/FR2980280B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Filters (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Prostheses (AREA)
FR1158331A 2011-07-20 2011-09-20 Procede de separation d'une couche dans une structure composite Active FR2980280B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR1158331A FR2980280B1 (fr) 2011-09-20 2011-09-20 Procede de separation d'une couche dans une structure composite
SG11201400366YA SG11201400366YA (en) 2011-09-20 2012-07-18 Method for separating a layer from a composite structure
KR1020147010321A KR20140065449A (ko) 2011-09-20 2012-07-18 복합 구조로부터 층을 분리하기 위한 방법
DE112012003512.7T DE112012003512T5 (de) 2011-09-20 2012-07-18 Verfahren zum Trennen einer Schicht von einer Verbundstruktur
US14/346,238 US10220603B2 (en) 2011-09-20 2012-07-18 Method for separating a layer from a composite structure
CN201280045524.1A CN103814435B (zh) 2011-07-20 2012-07-18 用于使层从复合结构分离的方法
PCT/IB2012/001406 WO2013011372A1 (fr) 2011-07-20 2012-07-18 Procédé de séparation d'une couche d'une structure composite
TW101128667A TWI594297B (zh) 2011-09-20 2012-08-08 自複合結構分離出一層之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1158331A FR2980280B1 (fr) 2011-09-20 2011-09-20 Procede de separation d'une couche dans une structure composite

Publications (2)

Publication Number Publication Date
FR2980280A1 FR2980280A1 (fr) 2013-03-22
FR2980280B1 true FR2980280B1 (fr) 2013-10-11

Family

ID=46598874

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1158331A Active FR2980280B1 (fr) 2011-07-20 2011-09-20 Procede de separation d'une couche dans une structure composite

Country Status (8)

Country Link
US (1) US10220603B2 (fr)
KR (1) KR20140065449A (fr)
CN (1) CN103814435B (fr)
DE (1) DE112012003512T5 (fr)
FR (1) FR2980280B1 (fr)
SG (1) SG11201400366YA (fr)
TW (1) TWI594297B (fr)
WO (1) WO2013011372A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2995445B1 (fr) 2012-09-07 2016-01-08 Soitec Silicon On Insulator Procede de fabrication d'une structure en vue d'une separation ulterieure
FR2995447B1 (fr) 2012-09-07 2014-09-05 Soitec Silicon On Insulator Procede de separation d'au moins deux substrats selon une interface choisie
FR2995444B1 (fr) * 2012-09-10 2016-11-25 Soitec Silicon On Insulator Procede de detachement d'une couche
KR102015400B1 (ko) * 2012-11-29 2019-10-22 삼성디스플레이 주식회사 캐리어 기판의 박리 장치, 캐리어 기판의 박리 방법 및 표시 장치의 제조 방법
US20180019169A1 (en) * 2016-07-12 2018-01-18 QMAT, Inc. Backing substrate stabilizing donor substrate for implant or reclamation

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476566A (en) * 1992-09-02 1995-12-19 Motorola, Inc. Method for thinning a semiconductor wafer
CN1143394C (zh) 1996-08-27 2004-03-24 精工爱普生株式会社 剥离方法、溥膜器件的转移方法和薄膜器件
JPH1126733A (ja) 1997-07-03 1999-01-29 Seiko Epson Corp 薄膜デバイスの転写方法、薄膜デバイス、薄膜集積回路装置，アクティブマトリクス基板、液晶表示装置および電子機器
JP4085459B2 (ja) * 1998-03-02 2008-05-14 セイコーエプソン株式会社 ３次元デバイスの製造方法
JP3962282B2 (ja) * 2002-05-23 2007-08-22 松下電器産業株式会社 半導体装置の製造方法
JP4565804B2 (ja) * 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
US7507312B2 (en) * 2005-08-23 2009-03-24 The Boeing Company Using laser shock loads to debond structures
TWI410329B (zh) * 2009-03-09 2013-10-01 Ind Tech Res Inst 可撓式裝置的取下設備及其取下方法
JP5439583B2 (ja) * 2009-04-16 2014-03-12 スス マイクロテク リソグラフィー，ゲーエムベーハー 一時的なウェハーボンディング及びデボンディングのための改善された装置
CN102652354B (zh) * 2009-12-15 2015-02-18 索泰克公司 用于重复利用衬底的处理
US8679280B2 (en) * 2010-05-27 2014-03-25 International Business Machines Corporation Laser ablation of adhesive for integrated circuit fabrication

Also Published As

Publication number Publication date
US10220603B2 (en) 2019-03-05
US20140326416A1 (en) 2014-11-06
CN103814435A (zh) 2014-05-21
WO2013011372A1 (fr) 2013-01-24
CN103814435B (zh) 2016-08-31
TWI594297B (zh) 2017-08-01
SG11201400366YA (en) 2014-09-26
DE112012003512T5 (de) 2014-12-31
KR20140065449A (ko) 2014-05-29
WO2013011372A8 (fr) 2014-04-24
TW201316379A (zh) 2013-04-16
FR2980280A1 (fr) 2013-03-22

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