FR2970116B1 - METHOD FOR ENCAPSULATING A MICROCOMPONENT - Google Patents
METHOD FOR ENCAPSULATING A MICROCOMPONENTInfo
- Publication number
- FR2970116B1 FR2970116B1 FR1150046A FR1150046A FR2970116B1 FR 2970116 B1 FR2970116 B1 FR 2970116B1 FR 1150046 A FR1150046 A FR 1150046A FR 1150046 A FR1150046 A FR 1150046A FR 2970116 B1 FR2970116 B1 FR 2970116B1
- Authority
- FR
- France
- Prior art keywords
- microcomponent
- encapsulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1150046A FR2970116B1 (en) | 2011-01-04 | 2011-01-04 | METHOD FOR ENCAPSULATING A MICROCOMPONENT |
US13/977,897 US8906750B2 (en) | 2011-01-04 | 2012-01-02 | Method of encapsulation of a microcomponent |
EP12700322.6A EP2661413B1 (en) | 2011-01-04 | 2012-01-02 | Method for encapsulating a micro-component |
PCT/EP2012/050023 WO2012093105A1 (en) | 2011-01-04 | 2012-01-02 | Method for encapsulating a micro-component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1150046A FR2970116B1 (en) | 2011-01-04 | 2011-01-04 | METHOD FOR ENCAPSULATING A MICROCOMPONENT |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2970116A1 FR2970116A1 (en) | 2012-07-06 |
FR2970116B1 true FR2970116B1 (en) | 2013-08-16 |
Family
ID=44515193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1150046A Expired - Fee Related FR2970116B1 (en) | 2011-01-04 | 2011-01-04 | METHOD FOR ENCAPSULATING A MICROCOMPONENT |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2970116B1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3035267B1 (en) * | 2015-04-20 | 2018-05-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | ELECTRONIC CHIP COMPRISING A PROTECTED BACK PANEL |
FR3042909B1 (en) | 2015-10-21 | 2017-12-15 | Commissariat Energie Atomique | METHOD FOR ENCAPSULATING A MICROELECTRONIC COMPONENT |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101309854A (en) * | 2005-11-17 | 2008-11-19 | 皇家飞利浦电子股份有限公司 | Electronic device comprising a MEMS element |
US20070298532A1 (en) * | 2006-06-27 | 2007-12-27 | Andrew Machauf | Micro-Electro-mechanical (MEMS) encapsulation using buried porous silicon |
US20080290494A1 (en) * | 2007-05-21 | 2008-11-27 | Markus Lutz | Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same |
US7993950B2 (en) * | 2008-04-30 | 2011-08-09 | Cavendish Kinetics, Ltd. | System and method of encapsulation |
EP2256084B1 (en) * | 2009-05-27 | 2012-07-11 | Nxp B.V. | Method of manufacturing a MEMS element |
-
2011
- 2011-01-04 FR FR1150046A patent/FR2970116B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2970116A1 (en) | 2012-07-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 6 |
|
ST | Notification of lapse |
Effective date: 20170929 |