FR2845517B1 - IMPLEMENTING A DEMONDABLE SEMICONDUCTOR SUBSTRATE AND OBTAINING A SEMICONDUCTOR ELEMENT - Google Patents
IMPLEMENTING A DEMONDABLE SEMICONDUCTOR SUBSTRATE AND OBTAINING A SEMICONDUCTOR ELEMENTInfo
- Publication number
- FR2845517B1 FR2845517B1 FR0212443A FR0212443A FR2845517B1 FR 2845517 B1 FR2845517 B1 FR 2845517B1 FR 0212443 A FR0212443 A FR 0212443A FR 0212443 A FR0212443 A FR 0212443A FR 2845517 B1 FR2845517 B1 FR 2845517B1
- Authority
- FR
- France
- Prior art keywords
- demondable
- implementing
- obtaining
- semiconductor substrate
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0212443A FR2845517B1 (en) | 2002-10-07 | 2002-10-07 | IMPLEMENTING A DEMONDABLE SEMICONDUCTOR SUBSTRATE AND OBTAINING A SEMICONDUCTOR ELEMENT |
FR0350130A FR2845518B1 (en) | 2002-10-07 | 2003-04-25 | IMPLEMENTING A DEMONDABLE SEMICONDUCTOR SUBSTRATE AND OBTAINING A SEMICONDUCTOR ELEMENT |
PCT/FR2003/050077 WO2004032183A2 (en) | 2002-10-07 | 2003-10-03 | Method for making a detachable semiconductor substrate and for obtaining a semiconductor element |
JP2005500039A JP4777774B2 (en) | 2002-10-07 | 2003-10-03 | Method for forming a peelable semiconductor substrate and method for obtaining a semiconductor element |
EP03780289A EP1550158B1 (en) | 2002-10-07 | 2003-10-03 | Method for making a detachable semiconductor substrate and for obtaining a semiconductor element |
US10/530,640 US7238598B2 (en) | 2002-10-07 | 2003-10-03 | Formation of a semiconductor substrate that may be dismantled and obtaining a semiconductor element |
AT03780289T ATE539446T1 (en) | 2002-10-07 | 2003-10-03 | PRODUCTION OF A REMOVABLE SEMICONDUCTOR SUBSTRATE AND A SEMICONDUCTOR ELEMENT |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0212443A FR2845517B1 (en) | 2002-10-07 | 2002-10-07 | IMPLEMENTING A DEMONDABLE SEMICONDUCTOR SUBSTRATE AND OBTAINING A SEMICONDUCTOR ELEMENT |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2845517A1 FR2845517A1 (en) | 2004-04-09 |
FR2845517B1 true FR2845517B1 (en) | 2005-05-06 |
Family
ID=32011478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0212443A Expired - Fee Related FR2845517B1 (en) | 2002-10-07 | 2002-10-07 | IMPLEMENTING A DEMONDABLE SEMICONDUCTOR SUBSTRATE AND OBTAINING A SEMICONDUCTOR ELEMENT |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2845517B1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2748851B1 (en) * | 1996-05-15 | 1998-08-07 | Commissariat Energie Atomique | PROCESS FOR PRODUCING A THIN FILM OF SEMICONDUCTOR MATERIAL |
US5877070A (en) * | 1997-05-31 | 1999-03-02 | Max-Planck Society | Method for the transfer of thin layers of monocrystalline material to a desirable substrate |
JP3697106B2 (en) * | 1998-05-15 | 2005-09-21 | キヤノン株式会社 | Method for manufacturing semiconductor substrate and method for manufacturing semiconductor thin film |
FR2797347B1 (en) * | 1999-08-04 | 2001-11-23 | Commissariat Energie Atomique | METHOD FOR TRANSFERRING A THIN FILM HAVING A SURFRAGILILIZATION STEP |
FR2809867B1 (en) * | 2000-05-30 | 2003-10-24 | Commissariat Energie Atomique | FRAGILE SUBSTRATE AND METHOD FOR MANUFACTURING SUCH SUBSTRATE |
-
2002
- 2002-10-07 FR FR0212443A patent/FR2845517B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2845517A1 (en) | 2004-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20140630 |