FR2799857A1 - METHOD FOR REINFORCING AN INTEGRATED SMART CARD CIRCUIT MODULE - Google Patents
METHOD FOR REINFORCING AN INTEGRATED SMART CARD CIRCUIT MODULE Download PDFInfo
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- FR2799857A1 FR2799857A1 FR9913057A FR9913057A FR2799857A1 FR 2799857 A1 FR2799857 A1 FR 2799857A1 FR 9913057 A FR9913057 A FR 9913057A FR 9913057 A FR9913057 A FR 9913057A FR 2799857 A1 FR2799857 A1 FR 2799857A1
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- Prior art keywords
- module
- chip
- card
- reinforcing element
- integrated circuit
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
<B>- 1</B> PROCEDE POUR<B>LE</B> RENFORCEMENT<B>D 'UN MODULE DE</B> CIRCUIT INTÉGRÉ<B>DE</B> CARTE<B>À PUCE</B> La présente invention concerne le domaine des cartes électroniques ou cartes<B>à</B> puces. Elle concerne en particulier le renforcement des modules de circuit intégré rentrant dans la constitution des cartes<B>à</B> puces, et plus particulièrement le renforcement des modules de circuit intégré portant au moins une puce de circuit intégré de grandes dimensions et de forte capacité. <B> - 1 </ B> <B> <B> <BR> <BR> <BR> <BR> <BR> <BR> <BR> <B> <B> MODULE </ B> INTEGRATED <B> CHIP <B> CIRCUIT </ B> CIRCUIT </ B> The present invention relates to the field of electronic cards or cards to chips. It relates in particular to the reinforcement of integrated circuit modules included in the constitution of cards <B> to </ B> chips, and more particularly to the strengthening of integrated circuit modules carrying at least one large-scale integrated circuit chip and strong capacity.
on entend par puce de grande taille une puce de circuits intégrés ayant une surface supérieure<B>à 0 5</B> CM2, de préférence comprise entre<B>1</B> et<B>10</B> cm2, et puce de grande capacité une puce ayant un grand nombre <B>d</B> entrées/sorties, pouvant se chiffrer par dizaines, exemple<B>100.</B> "Large chip" means an integrated circuit chip having an area greater than <5> <5> <5> <5> <5> <5> <5> CM2, preferably between <B> 1 </ B> and <B> 10 </ B> cm2 , and chip of large capacity a chip having a large number of <B> d </ B> inputs / outputs, being able to be counted by tens, example <B> 100. </ B>
Il est connu de rigidifier les modules de circuits intégrés pour cartes<B>à</B> puce de façon<B>à</B> les protéger contre les risques de déformation et/ou de cassure induits par des mouvements de courbure du corps carte. Les techniques de rigidification ou renforcement actuellement préconisées, consistent essentiellement a munir ledit module d'un élément de renforcement se refermant sur lui-même, avec ou sans discontinuité, entourant le circuit intégré<B>à</B> une certaine distance de celui-ci. It is known to rigidify the integrated circuit modules for <B> to </ B> chip so as to <B> protect them against the risk of deformation and / or breakage induced by bending movements of the board. body map. The stiffening or reinforcement techniques currently recommended, essentially consist in providing said module with a reinforcement element closing on itself, with or without discontinuity, surrounding the integrated circuit <B> at </ B> a certain distance from the -this.
Le module décrit dans EP-A-484 <B>353</B> est muni d'un élément, situé entièrement<B>à</B> l'intérieur du périmètre du module et dont le profil est avantageusement une couronne circulaire, munie d'ergots de repérage et ayant également pour fonction de servir d'élément de retenue pour la résine de protection de la puce et des câblages la puce de circuit intégré fixée sur le module ainsi préalablement renforcé. Ledit élément est muni d'un adhésif et fixé au moyen de celui-ci sur le substrat de support flexible du module. The module described in EP-A-484 <B> 353 </ B> is provided with an element, located entirely <B> to </ B> inside the perimeter of the module and whose profile is advantageously a circular crown. , provided with locating pins and also having the function of serving as a retaining element for the protective resin of the chip and wiring the integrated circuit chip fixed on the module thus previously reinforced. The element is provided with an adhesive and attached thereto to the flexible support substrate of the module.
Dans le document US-A-5.581.445 est décrit un élément de renforcement pour module de circuit intégré destiné<B>à</B> une carte<B>à</B> puce, cet élément ayant un profil figure géométrique fermée convexe, continue ou interrompue en un ou plusieurs points, et dans ce dernier cas il comporte soit un élément unique encerclant la puce<B>à</B> une certaine distance de celle-ci, soit au moins deux sous-éléments, identiques ou non, dont chacun entoure la puce sur un périmètre inférieur<B>à</B> moitié du périmètre de la puce. La structure de renforcement est introduite et fixée de préférence au moyen d'un adhésif dans une cavité qui lui est dédiée, avant le report du module dans la cavité qui lui est propre. US-A-5,581,445 discloses a reinforcement element for an integrated circuit module for a chip card, this element having a closed geometric figure profile. convex, continuous or interrupted at one or more points, and in the latter case it comprises either a single element encircling the chip <B> to </ B> a certain distance from it, or at least two identical sub-elements or not, each of which surrounds the chip on a perimeter smaller <B> than half the perimeter of the chip. The reinforcing structure is introduced and preferably fixed by means of an adhesive in a cavity which is dedicated to it, before the transfer of the module into the cavity which is specific to it.
Dans toutes les formes de réalisation ainsi proposées dans la technique antérieure,<B>f</B> rette ou la structure de renforcement est sollicitée dans son ensemble lors d'une flexion/torsion du corps de carte comportant un module renforcé par ce moyen. Une telle structure apporte sa rigidité propre, sans contribuer autre manière au couple de torsion. Elle peut donc conduire<B>à</B> un décollement du module et<B>à</B> altérations la puce et/ou de ses connexions. In all the embodiments thus proposed in the prior art, the reinforcement structure is stressed as a whole during flexion / torsion of the card body comprising a reinforced module by this means. . Such a structure provides its own rigidity, without contributing in any other way to the torsional torque. It can therefore lead <B> to </ B> a detachment of the module and <B> to </ B> alterations the chip and / or its connections.
De plus, le collage de l'élément de renforcement et module nécessitent des étapes opératoires successives. In addition, the bonding of the reinforcing element and module require successive operating steps.
Au surplus, pour les puces de grande taille et/ou de grande capacité, qui sont des puces plus fragiles que celles de petite taille, un élément de renforcement du type de ceux décrits dans les documents mentionnés ci- dessus ne peut convenir. En effet la taille proportionnellement grande de l'élément renforcement, dont l'épaisseur ne doit pas dépasser 0,4 mm, le rend lui-même sensible aux flexions et aux torsions, notamment par gauchissement, ce qui l'empêche de jouer un rôle pleinement efficace dans une tel application. En outre, les modules contenant de grandes puces, ainsi que les grandes puces sur leur substrat<B>1</B> origine qui peuvent constituer le module en elles-mêmes, ont encore plus tendance<B>à</B> être altérées ou décollées sur leur péripherie du corps de carte sur ou dans lequel elles sont fixées. In addition, for chips of large size and / or large capacity, which are more fragile chips than those of small size, a reinforcing element of the type described in the documents mentioned above can not be suitable. Indeed, the proportionally large size of the reinforcing element, the thickness of which must not exceed 0.4 mm, makes it itself sensitive to bending and twisting, in particular by warping, which prevents it from playing a role. fully effective in such an application. In addition, modules containing large chips, as well as large chips on their original <B> 1 </ B> substrate that may constitute the module in themselves, are even more likely to <B> to </ B> be altered or detached on their periphery of the card body on or in which they are fixed.
but de l'invention est de procurer des moyens de renforcement pour module de carte<B>à</B> puce, notamment mais non exclusivement avec puces de grande taille et/ou de grande capacité, tout en préservant la cohésion entre le corps carte et le module qui<B>y</B> est fixé, de façon<B>à</B> protéger efficacement ledit module même lors d'une flexion et/ou d'une torsion du dit corps carte. The object of the invention is to provide reinforcement means for a chip card module, particularly but not exclusively with large and / or large chips, while preserving the cohesion between the body. card and the module that <B> y </ B> is fixed, so as <B> to </ B> effectively protect said module even when bending and / or twisting said card body.
autre but de l'invention est de rendre le renforcement d'un module de carte a puce<B>plus</B> économique, tout en lui conservant toute la fiabilité requise. Another object of the invention is to make the reinforcement of a smart card module <B> more economical, while retaining all the required reliability.
L invention a pour premier objet un procédé pour le renforcement d'un module de circuit intégré pour carte<B>à</B> puce, utilisant au moins un élément renforcement destiné<B>à</B> prendre place à,11intérieur du volume du corps de carte et ayant un module d'élasticité supérieur<B>à</B> celui du matériau de ladite carte, caractérisé en ce qu'on fixe l'élément de renforcement au module au moyen d'une fraction d'une matière adhésive appliquée sur la face<B>-</B> encarter dudit module et destinée a coller ledit module dans une cavité du corps de carte. The invention firstly relates to a method for reinforcing an integrated circuit module for a chip card, using at least one reinforcement element intended to be used in the interior. of the volume of the card body and having a modulus of elasticity greater than that of the material of said card, characterized in that the reinforcing element is fixed to the module by means of a fraction of an adhesive material applied to the face of said module and intended to stick said module in a cavity of the card body.
,invention consiste ainsi, sous l'angle le plus général,<B>à</B> procurer<B>à</B> un module électronique une surface adhésive destinée<B>à</B> se fixer sur un corps de carte<B>à</B> puce, ce même adhésif étant utilisé pour la fixation d'un élément de renforcement. , invention thus consists, under the most general angle, <B> to </ B> provide <B> to </ B> an electronic module an adhesive surface for <B> to </ B> attach to a body card to chip, the same adhesive being used for attaching a reinforcing member.
D'autres caractéristiques et avantages de l'invention apparaîtront<B>à</B> la lecture de la description détaillée qui suit et qui est fournie en référence aux dessins annexés, dans lesquels: Fig. <B>1</B> est une vue en coupe transversale schématique d'un module de circuit intégré muni d'un élément de renforcement fixé selon l'invention, <B>.</B> 2 est une vue en coupe transversale schématique partielle d'une carte électronique dans laquelle a été reporte un module renforcé conformément<B>à</B> l'invention. Other features and advantages of the invention will appear on reading the following detailed description, which is given with reference to the accompanying drawings, in which: FIG. <B> 1 </ B> is a schematic cross-sectional view of an integrated circuit module having a fixed reinforcing member according to the invention, <B>. </ B> 2 is a cross-sectional view schematic partial of an electronic card in which was postponed a reinforced module according to <B> to </ B> the invention.
L'élément de renforcement<B>1</B> mis en oeuvre dans le procedé selon l'invention peut avoir une forme et des dimensions quelconques. Il doit seulement être apte<B>à</B> circonscrire en totalité ou même seulement en partie périphérie du module de circuit intégré 4<B>à</B> renforcer et a pouvoir prendre place<B>à</B> l'intérieur du corps carte<B>6.</B> The reinforcement element <B> 1 </ B> used in the process according to the invention may have any shape and dimensions. It must only be able to circumscribe in whole or even only in part periphery of the integrated circuit module 4 <B> to </ B> strengthen and be able to take place <B> to </ B> inside the body card <B> 6. </ B>
<B>D</B> une manière générale, l'élément de renforcement selon l'invention est apte<B>à</B> entourer ou<B>à</B> enserrer au moins partiellement une puce de circuit intégré 2. Ladite puce, portée par un support<B>3,</B> fait partie d'un module 4 pour carte<B>à</B> puce, ledit module pouvant être aussi bien un module<B>à</B> contacts affleurants qu'un module sans contact ou un module hybride, ces expressions étant connues de l'homme du métier, entend ici par "circuit intégré" aussi bien des circuits intégrés simples que des circuits intégrés comportant également des éléments passifs, tels que par exemple des condensateurs, des résistances, des inductances, etc., comme dans le cas des circuits logiques<B>à</B> résistances -condensateurs<B>-</B>transistors (RCTL, en anglais resistor-capacitor-transistor logic). <B> D </ B> in general, the reinforcement element according to the invention is able to <B> to </ B> surround or <B> to </ B> at least partially enclose an integrated circuit chip 2. Said chip, carried by a support <B> 3, </ B> is part of a module 4 for a card <B> to </ B> chip, said module can be both a module <B> to < / B> flush contacts that a contactless module or a hybrid module, these expressions being known to those skilled in the art, here means "integrated circuit" as well as simple integrated circuits that integrated circuits also comprising passive elements, such as for example capacitors, resistors, inductors, etc., as in the case of logic circuits <B> to </ B> resistors -condensors <B> - </ B> transistors (RCTL, in English resistor- capacitor-transistor logic).
Dans l'exemple de réalisation représenté sur les Figs. <B>1</B> et 2, au moins une puce est interconnectée aux interfaces de communication par la technique dite 11wire bonding'l. In the embodiment shown in Figs. <B> 1 </ B> and 2, at least one chip is interconnected to the communication interfaces by the so-called 11wire bonding'l technique.
En variante, la puce 2 peut être positionnée dans module 4 selon la technique dite Flip-Chip, qui est une technique de connexion directe, sans fils, de puces<B>à</B> contacts protubérants. Cela ne modifie cependant pas la technique de fixation de l'élément de renforcement selon l'invention. Alternatively, the chip 2 can be positioned in module 4 according to the so-called Flip-Chip technique, which is a technique of direct connection, without wires, chips <B> to </ B> protruding contacts. However, this does not change the fixing technique of the reinforcing element according to the invention.
Dans un mode de réalisation du procédé selon l'invention, l'élément de renforcement<B>1</B> est fixé sur la face libre d'un film adhésif double face, dont l'autre face adhère au support du dit module. Dans cette réalisation, ledit adhésif double face pour collage<B>à</B> froid représente la matière adhésive<B>.</B> In one embodiment of the method according to the invention, the reinforcing element <B> 1 </ B> is fixed on the free face of a double-sided adhesive film, the other side of which adheres to the support of said module . In this embodiment, said double-sided <B> cold </ B> adhesive is the adhesive material <B>. </ B>
En variante, ladite matière adhésive<B>5</B> peut être composée d'une feuille adhésive thermofusible, de type "hot meltIl. L'élément de renforcement est dans ce cas fixé par pressage<B>à</B> chaud sur cet adhesif. Alternatively, said adhesive material may be composed of a hot-melt adhesive sheet of the hot-melt type, the reinforcing element being in this case fixed by pressing <B> to </ B>. hot on this adhesive.
L'élément de renforcement<B>1</B> peut en variante, être inséré dans un logement<B>7</B> du corps carte<B>6</B> et être collé avec le module 4 lors de l'encartage de celui-ci. The reinforcing element <B> 1 </ B> can alternatively be inserted into a housing <B> 7 </ B> of the card body <B> 6 </ B> and glued with the module 4 when inserting it.
Dans une forme de réalisation, ledit élément de renforcement prend place dans un logement débouchant dans un premier plan Pl d'une cavite <B>8</B> comportant deux plans Pl et P2 du corps de carte<B>6</B> dans laquelle est reporté le module 4 lors de son encartage dans ledit corps de carte. In one embodiment, said reinforcing element takes place in a housing opening into a first plane Pl of a cavity <B> 8 </ B> having two planes P1 and P2 of the card body <B> 6 </ B in which is reported the module 4 when inserted into said card body.
Dans une réalisation avantageuse, on utilise la cavité<B>8</B> dans laquelle ledit module est encarté pour loger l'élément de renforcement. In an advantageous embodiment, the cavity <B> 8 </ B> in which said module is embedded to accommodate the reinforcing element is used.
En variante, le logement dédié<B>à</B> l'élément de renforcement<B>1</B> débouche dans le fond de la cavité<B>8</B> pour l'encartage du dit module dans ledit corps de carte. Alternatively, the dedicated housing <B> to </ B> the reinforcing element <B> 1 </ B> opens into the bottom of the cavity <B> 8 </ B> for inserting said module into said card body.
En d'autres termes, le logement<B>7</B> peut être différent de la cavité<B>8,</B> ou complémentaire de celle-ci ou commune avec elle. Le logement<B><I>.</I></B><I> s</I><B>1</B> il est dédié<B>à</B> l'élément de renforcement, est avantageusement de forme et de dimensions adaptées au profil celui-ci. In other words, the housing <B> 7 </ B> may be different from the cavity <B> 8, </ B> or complementary to it or common with it. The slot <B> <I>. </ I> <I> s </ I> <B> 1 </ B> it is dedicated <B> to </ B> the reinforcement element, is advantageously of shape and dimensions adapted to the profile thereof.
Dans une forme de mise en oeuvre préférée de l'invention, au moins un élément renforcement<B>1</B> est fixé sur un module 4<B>déjà</B> muni d'au moins une puce de circuit intégré 2 reliée<B>à</B> une interface de communication et éventuellement recouverte d'une résine protectrice. In a preferred embodiment of the invention, at least one reinforcing element <B> 1 </ B> is attached to a module 4 <B> already </ B> provided with at least one integrated circuit chip 2 connected <B> to </ B> a communication interface and possibly covered with a protective resin.
Dans une forme de réalisation avantageuse de l'invention, ledit élément de renforcement n'entoure pas la Luce 2 en totalité, libérant ainsi plus de ière adhésive<B>5</B> pour le collage du module 4. In an advantageous embodiment of the invention, said reinforcing element does not surround the entire Luce 2, thus releasing more adhesive <B> 5 </ B> for bonding the module 4.
Dans cette forme de réalisation, l'élément de renforcement a ainsi avantageusement une structure ouverte. Il peut par exemple prendre la forme<B>1</B> un U, d'un L, d'un<B>S,</B> d'un T ou toute autre forme ouverte appropriee. In this embodiment, the reinforcing element thus advantageously has an open structure. For example, it can take the form <B> 1 </ B> of a U, an L, a <B> S, </ B> of a T, or any other suitable open form.
Cependant, toute autre forme est également possible pour l'élément de renforcement<B>1.</B> Ainsi, une structure fermée, par exemple annulaire, est envisageable. However, any other shape is also possible for the reinforcing element <B> 1. </ B> Thus, a closed structure, for example annular, is conceivable.
L'invention a également pour objet un module de circuit intégré pour carte<B>à</B> puce comportant au moins un renforcement fixé par collage sur une couche adhésive disposée sur sa face destinée<B>à</B> l'encartage ainsi qu'une carte<B>à</B> puce comportant au moins un tel module de circuit intégré, le module étant fixé au corps de carte par la même couche adhésive. Avantageusement ladite carte<B>à</B> puce comporte une puce de grande dimension et/ou de grande capacité. The subject of the invention is also an integrated circuit module for a chip card comprising at least one reinforcement fixed by gluing on an adhesive layer placed on its face intended to be inserting and a chip card comprising at least one such integrated circuit module, the module being attached to the card body by the same adhesive layer. Advantageously said chip card <B> comprises a chip of large size and / or large capacity.
L'invention a en outre pour objet l'utilisation d'une matière adhésive<B>5</B> pour fixer au moins un élément de renforcement<B>1</B> sur la face<B>à</B> encarter d'un module de circuit intégré 4 et pour coller ledit module dans une cavité<B>8</B> d'un corps de carte<B>6</B> d'une carte<B>à</B> puce. The invention further relates to the use of an adhesive material <B> 5 </ B> for fixing at least one reinforcing element <B> 1 </ B> on the face <B> to </ B> embedding an integrated circuit module 4 and sticking said module in a cavity <B> 8 </ B> of a card body <B> 6 </ B> of a card <B> to </ B> chip.
Quel que soit sa forme de réalisation de fixation l'élément de renforcement<B>1</B> selon l'invention n'est destiné<B>à</B> servir de barrage de retenue pour la résine de protection de la puce 2. Il ne peut même pas avoir implicitement cette fonction, puisqu'il n, pas conçu pour constituer un endiguement continu autour de la goutte de résine utilisée pour l'enrobage de ladite puce. Whatever its embodiment of fixing the reinforcing element <B> 1 </ B> according to the invention is intended <B> to </ B> serve as a dam for retaining the protective resin of the chip 2. It can not even implicitly have this function, since it is not designed to constitute a continuous containment around the drop of resin used for the coating of said chip.
Dans la pratique ledit élément de renforcement peut prendre avantageusement la forme d'un jonc rigide, ayant une section transversale quelconque, par exemple circulaire, carrée, ovale, ou même en L, en<B>U,</B> en<B>S</B> ou en T, entre autres. In practice, said reinforcing element may advantageously take the form of a rigid rod having any cross section, for example circular, square, oval, or even in L, in <B> U, </ B> in <B > S </ B> or T, among others.
on peut, selon les cas, être amené<B>à</B> prévoir dans corps de carte<B>6</B> une seule cavité ou plusieurs communicantes ou non. La cavité unique ou la première ces cavités reçoit une puce et éventuellement au moins un élément de renforcement selon l'invention, tandis l'autre ou les autres cavités éventuelles peuvent être conçues pour recevoir soit une autre puce seule, soit une autre puce et un élément de renforcement selon l'invention, soit seulement un élément de renforcement <B>ou</B> une partie d'élément de renforcement selon l'invention. it is possible, depending on the case, to be provided <B> to </ B> provide in card body <B> 6 </ B> a single cavity or several communicating or not. The single cavity or the first cavity receives a chip and possibly at least one reinforcing element according to the invention, while the other or other cavities may be designed to receive either another chip alone or another chip and a reinforcing element according to the invention, either only a reinforcement element <B> or </ B> a reinforcing element part according to the invention.
La ou les dites cavités peuvent être ménagées et/ou réalisées dans le corps de carte<B>6</B> par tous moyens appropriés, connus de l'homme du métier. The said cavity or cavities may be formed and / or made in the card body <B> 6 </ B> by any appropriate means known to those skilled in the art.
L'élément de renforcement selon l'invention peut être réalisé en tout matériau tel qu'un métal, un alliage ou un matériau synthétique approprié, pour autant qu'il ait un module d'élasticité supérieur<B>à</B> celui matériau de ladite carte et/ou une mémoire forme. The reinforcement element according to the invention can be made of any material such as a metal, an alloy or a suitable synthetic material, provided that it has a modulus of elasticity greater than the <B> at </ B> material of said card and / or memory form.
cartes<B>à</B> puce dans lesquelles un tel module 4 son élément de renforcement<B>1</B> sont encartés peuvent alors être notamment des cartes<B>à</B> puce<B>à</B> contacts, cartes avec module d'identification d'abonné pour téléphones portables, dites SIM (I'Subscriber Identity Module") et plus communément dénommées 11plugs", des cartes sans contact ou des cartes de type hybride. chip cards in which such a module 4 its reinforcement element <B> 1 </ B> are inset can then be including cards <B> to </ B> chip <B> to < Contacts, cards with subscriber identification module for mobile phones, called SIM (I'Subscriber Identity Module) and more commonly known as 11plugs, contactless cards or hybrid type cards.
Le module comprend une puce connectée<B>à</B> une interface de communication, qui peut être composée de plages de contact ou d'une antenne. L'interface de communication peut être constituée d'une grille métallique estampée, poinçonnée ou obtenue par tout autre moyen. Dans sa version la plus simple, le module peut être composé d'une puce et de contacts. The module includes a chip connected to a communication interface, which may be composed of contact pads or an antenna. The communication interface may consist of a stamped metal grid punched or obtained by any other means. In its simplest version, the module can be composed of a chip and contacts.
Le module peut aussi être relié<B>à</B> des points de connexion métalliques destinés<B>à</B> être reliés<B>à</B> l'interface de communication, tandis qu'un film support peut être présent en option pour renforcer le module et/ou le supporter. The module can also be connected <B> to </ B> metal connection points intended to <B> to <B> be connected to </ B> the communication interface, while a support film may be present as an option to strengthen the module and / or support.
module peut être hybride et comporter une interface de communication<B>à</B> contacts et/ou <B>à</B> antenne. connexion de la puce<B>à</B> l'interface de communication peut être effectuée par tous moyens connus de homme du métier, par exemple par connexion directe ou indirecte. module can be hybrid and include a communication interface <B> to </ B> contacts and / or <B> to </ B> antenna. connection of the chip <B> to </ B> the communication interface can be performed by any means known to those skilled in the art, for example by direct or indirect connection.
Dans sa version sans contact, le module peut ne comporter qu'une puce et une antenne connectée<B>à</B> celle- ci, sur une feuille support ou même sur le substrat d'origine de la puce. Sur la face opposée on place selon l'invention une feuille d'adhésif, par exemple thermofusible, sous laquelle on place un élément de renforcement, puis une feuille comportant le logement susdit pour ledit élément de renforcement. In its contactless version, the module may have only one chip and an antenna connected to it, on a support sheet or even on the original substrate of the chip. On the opposite side is placed according to the invention a sheet of adhesive, for example hot melt, under which is placed a reinforcing element, then a sheet having the aforesaid housing for said reinforcing element.
Il importe seulement que la structure du module concerné permette la fixation de l'élément de renforcement autour de la périphérie ou d'une partie de la périphérie de la puce, sans que cela nuise aux connexions avec la ou les interfaces de communication, en particulier avec les spires d'antenne dans cas des cartes sans contact. It is only important that the structure of the module concerned makes it possible to fix the reinforcing element around the periphery or a part of the periphery of the chip, without affecting the connections with the communication interface or interfaces, in particular with antenna turns in case of contactless cards.
L'invention s'applique de manière plus particulière aux modules contenant de grandes puces, ainsi qu'aux grandes puces maintenues sur leur substrat d'origine qui peuvent constituer le module en elles-mêmes, pour fixation sur ou dans des cartes<B>à</B> puces appropriées.The invention applies more particularly to modules containing large chips, as well as large chips held on their original substrate which can constitute the module in themselves, for attachment to or in cards <B> to </ b> appropriate chips.
Claims (1)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9913057A FR2799857A1 (en) | 1999-10-14 | 1999-10-14 | METHOD FOR REINFORCING AN INTEGRATED SMART CARD CIRCUIT MODULE |
| PCT/FR2000/002748 WO2001027872A1 (en) | 1999-10-14 | 2000-10-04 | Reinforcement of a chip card module |
| AU76722/00A AU7672200A (en) | 1999-10-14 | 2000-10-04 | Reinforcement of a chip card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9913057A FR2799857A1 (en) | 1999-10-14 | 1999-10-14 | METHOD FOR REINFORCING AN INTEGRATED SMART CARD CIRCUIT MODULE |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2799857A1 true FR2799857A1 (en) | 2001-04-20 |
Family
ID=9551120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9913057A Pending FR2799857A1 (en) | 1999-10-14 | 1999-10-14 | METHOD FOR REINFORCING AN INTEGRATED SMART CARD CIRCUIT MODULE |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU7672200A (en) |
| FR (1) | FR2799857A1 (en) |
| WO (1) | WO2001027872A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003058713A2 (en) * | 2002-01-08 | 2003-07-17 | Infineon Technologies Ag | Chip module for chip cards |
| WO2003073373A1 (en) * | 2002-02-26 | 2003-09-04 | Infineon Technologies Ag | Intermediate support for inserting into a support and support comprising an intermediate support |
| EP1519310A3 (en) * | 2003-09-26 | 2005-07-06 | Kabushiki Kaisha Toshiba | Portable electronic device |
| DE102006060411B3 (en) * | 2006-12-20 | 2008-07-10 | Infineon Technologies Ag | Chip module and method for producing a chip module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2580416A1 (en) * | 1985-04-12 | 1986-10-17 | Radiotechnique Compelec | METHOD AND DEVICE FOR MANUFACTURING AN ELECTRONIC IDENTIFICATION CARD |
| DE3924439A1 (en) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | CARRIER ELEMENT WITH AT LEAST ONE INTEGRATED CIRCUIT, ESPECIALLY FOR INSTALLATION IN CHIP CARDS, AND METHOD FOR THE PRODUCTION OF THESE CARRIER ELEMENTS |
| JPH04179595A (en) * | 1990-11-14 | 1992-06-26 | Dainippon Printing Co Ltd | Ic card and its manufacture |
| EP0554916A2 (en) * | 1986-11-20 | 1993-08-11 | GAO Gesellschaft für Automation und Organisation mbH | Module with integrated circuits |
| DE4427309A1 (en) * | 1994-08-02 | 1996-02-15 | Ibm | Production of a carrier element module for installation in chip cards or other data carrier cards |
| EP0766197A1 (en) * | 1995-04-13 | 1997-04-02 | Dai Nippon Printing Co., Ltd. | Ic card and ic module |
| WO1999021132A1 (en) * | 1997-10-16 | 1999-04-29 | Citizen Watch Co., Ltd. | Ic card |
-
1999
- 1999-10-14 FR FR9913057A patent/FR2799857A1/en active Pending
-
2000
- 2000-10-04 AU AU76722/00A patent/AU7672200A/en not_active Abandoned
- 2000-10-04 WO PCT/FR2000/002748 patent/WO2001027872A1/en active Search and Examination
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2580416A1 (en) * | 1985-04-12 | 1986-10-17 | Radiotechnique Compelec | METHOD AND DEVICE FOR MANUFACTURING AN ELECTRONIC IDENTIFICATION CARD |
| EP0554916A2 (en) * | 1986-11-20 | 1993-08-11 | GAO Gesellschaft für Automation und Organisation mbH | Module with integrated circuits |
| DE3924439A1 (en) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | CARRIER ELEMENT WITH AT LEAST ONE INTEGRATED CIRCUIT, ESPECIALLY FOR INSTALLATION IN CHIP CARDS, AND METHOD FOR THE PRODUCTION OF THESE CARRIER ELEMENTS |
| JPH04179595A (en) * | 1990-11-14 | 1992-06-26 | Dainippon Printing Co Ltd | Ic card and its manufacture |
| DE4427309A1 (en) * | 1994-08-02 | 1996-02-15 | Ibm | Production of a carrier element module for installation in chip cards or other data carrier cards |
| EP0766197A1 (en) * | 1995-04-13 | 1997-04-02 | Dai Nippon Printing Co., Ltd. | Ic card and ic module |
| WO1999021132A1 (en) * | 1997-10-16 | 1999-04-29 | Citizen Watch Co., Ltd. | Ic card |
| EP0952545A1 (en) * | 1997-10-16 | 1999-10-27 | Citizen Watch Co., Ltd. | Ic card |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 016, no. 487 (M - 1323) 9 October 1992 (1992-10-09) * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003058713A2 (en) * | 2002-01-08 | 2003-07-17 | Infineon Technologies Ag | Chip module for chip cards |
| WO2003058713A3 (en) * | 2002-01-08 | 2004-02-26 | Infineon Technologies Ag | Chip module for chip cards |
| CN100380638C (en) * | 2002-01-08 | 2008-04-09 | 因芬尼昂技术股份公司 | Chip module |
| WO2003073373A1 (en) * | 2002-02-26 | 2003-09-04 | Infineon Technologies Ag | Intermediate support for inserting into a support and support comprising an intermediate support |
| EP1519310A3 (en) * | 2003-09-26 | 2005-07-06 | Kabushiki Kaisha Toshiba | Portable electronic device |
| US7063267B2 (en) | 2003-09-26 | 2006-06-20 | Kabushiki Kaisha Toshiba | Portable electronic device |
| DE102006060411B3 (en) * | 2006-12-20 | 2008-07-10 | Infineon Technologies Ag | Chip module and method for producing a chip module |
| US7714454B2 (en) | 2006-12-20 | 2010-05-11 | Infineon Technologies Ag | Chip module and method for producing a chip module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001027872A1 (en) | 2001-04-19 |
| AU7672200A (en) | 2001-04-23 |
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