FR2794443B1 - METHOD FOR TRANSFERRING ELEMENTS AND DEVICE FOR PROVIDING SAME - Google Patents
METHOD FOR TRANSFERRING ELEMENTS AND DEVICE FOR PROVIDING SAMEInfo
- Publication number
- FR2794443B1 FR2794443B1 FR9906951A FR9906951A FR2794443B1 FR 2794443 B1 FR2794443 B1 FR 2794443B1 FR 9906951 A FR9906951 A FR 9906951A FR 9906951 A FR9906951 A FR 9906951A FR 2794443 B1 FR2794443 B1 FR 2794443B1
- Authority
- FR
- France
- Prior art keywords
- transferring elements
- providing same
- providing
- same
- transferring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9906951A FR2794443B1 (en) | 1999-06-02 | 1999-06-02 | METHOD FOR TRANSFERRING ELEMENTS AND DEVICE FOR PROVIDING SAME |
PCT/FR2000/001507 WO2000075968A1 (en) | 1999-06-02 | 2000-05-31 | Method for transferring elements and device enabling said transfer |
EP00938871A EP1183714A1 (en) | 1999-06-02 | 2000-05-31 | Method for transferring elements and device enabling said transfer |
JP2001502148A JP2003501827A (en) | 1999-06-02 | 2000-05-31 | Method for transferring elements and apparatus for enabling such transfer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9906951A FR2794443B1 (en) | 1999-06-02 | 1999-06-02 | METHOD FOR TRANSFERRING ELEMENTS AND DEVICE FOR PROVIDING SAME |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2794443A1 FR2794443A1 (en) | 2000-12-08 |
FR2794443B1 true FR2794443B1 (en) | 2001-06-22 |
Family
ID=9546278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9906951A Expired - Fee Related FR2794443B1 (en) | 1999-06-02 | 1999-06-02 | METHOD FOR TRANSFERRING ELEMENTS AND DEVICE FOR PROVIDING SAME |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1183714A1 (en) |
JP (1) | JP2003501827A (en) |
FR (1) | FR2794443B1 (en) |
WO (1) | WO2000075968A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7045878B2 (en) | 2001-05-18 | 2006-05-16 | Reveo, Inc. | Selectively bonded thin film layer and substrate layer for processing of useful devices |
US6875671B2 (en) | 2001-09-12 | 2005-04-05 | Reveo, Inc. | Method of fabricating vertical integrated circuits |
US7163826B2 (en) | 2001-09-12 | 2007-01-16 | Reveo, Inc | Method of fabricating multi layer devices on buried oxide layer substrates |
DE102004027489B4 (en) | 2004-06-04 | 2017-03-02 | Infineon Technologies Ag | A method of arranging chips of a first substrate on a second substrate |
JP5740939B2 (en) * | 2010-11-29 | 2015-07-01 | 住友電気工業株式会社 | Manufacturing method of semiconductor device |
US9308649B2 (en) | 2013-02-25 | 2016-04-12 | LuxVue Techonology Corporation | Mass transfer tool manipulator assembly |
KR101787860B1 (en) | 2013-02-25 | 2017-10-18 | 애플 인크. | Mass transfer tool manipulator assembly and micro pick up array mount with integrated displacement sensor |
CN109449102B (en) * | 2018-11-09 | 2021-03-19 | 京东方科技集团股份有限公司 | Manufacturing method of driving substrate, display panel and display device |
KR102156263B1 (en) * | 2019-02-27 | 2020-09-16 | 서울대학교산학협력단 | Transferring apparatus |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5851530A (en) * | 1981-09-22 | 1983-03-26 | Toshiba Corp | Apparatus and method of arranging semiconductor pellet |
JPS5984438A (en) * | 1982-11-04 | 1984-05-16 | Nec Corp | Sheet expansion device |
JPS6226833A (en) * | 1985-07-26 | 1987-02-04 | Mitsubishi Electric Corp | Die bonding device |
JPS6323334A (en) * | 1987-05-29 | 1988-01-30 | Sony Corp | Processing of semiconductor element |
JPH03212940A (en) * | 1990-01-17 | 1991-09-18 | Rohm Co Ltd | Supplying method of semiconductor chip for lead frame |
-
1999
- 1999-06-02 FR FR9906951A patent/FR2794443B1/en not_active Expired - Fee Related
-
2000
- 2000-05-31 WO PCT/FR2000/001507 patent/WO2000075968A1/en not_active Application Discontinuation
- 2000-05-31 EP EP00938871A patent/EP1183714A1/en not_active Withdrawn
- 2000-05-31 JP JP2001502148A patent/JP2003501827A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2000075968A1 (en) | 2000-12-14 |
JP2003501827A (en) | 2003-01-14 |
FR2794443A1 (en) | 2000-12-08 |
EP1183714A1 (en) | 2002-03-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20060228 |