FR2786010B1 - CARD WITH ELECTRONIC MODULE DECOUPLED FROM CARD BODY - Google Patents

CARD WITH ELECTRONIC MODULE DECOUPLED FROM CARD BODY

Info

Publication number
FR2786010B1
FR2786010B1 FR9814408A FR9814408A FR2786010B1 FR 2786010 B1 FR2786010 B1 FR 2786010B1 FR 9814408 A FR9814408 A FR 9814408A FR 9814408 A FR9814408 A FR 9814408A FR 2786010 B1 FR2786010 B1 FR 2786010B1
Authority
FR
France
Prior art keywords
card
electronic module
decoupled
module decoupled
card body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9814408A
Other languages
French (fr)
Other versions
FR2786010A1 (en
Inventor
Christian Guion
Michel Gouiller
Benoit Thevenot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Schlumberger Systemes SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Systemes SA filed Critical Schlumberger Systemes SA
Priority to FR9814408A priority Critical patent/FR2786010B1/en
Publication of FR2786010A1 publication Critical patent/FR2786010A1/en
Application granted granted Critical
Publication of FR2786010B1 publication Critical patent/FR2786010B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
FR9814408A 1998-11-17 1998-11-17 CARD WITH ELECTRONIC MODULE DECOUPLED FROM CARD BODY Expired - Fee Related FR2786010B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9814408A FR2786010B1 (en) 1998-11-17 1998-11-17 CARD WITH ELECTRONIC MODULE DECOUPLED FROM CARD BODY

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9814408A FR2786010B1 (en) 1998-11-17 1998-11-17 CARD WITH ELECTRONIC MODULE DECOUPLED FROM CARD BODY

Publications (2)

Publication Number Publication Date
FR2786010A1 FR2786010A1 (en) 2000-05-19
FR2786010B1 true FR2786010B1 (en) 2001-11-23

Family

ID=9532807

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9814408A Expired - Fee Related FR2786010B1 (en) 1998-11-17 1998-11-17 CARD WITH ELECTRONIC MODULE DECOUPLED FROM CARD BODY

Country Status (1)

Country Link
FR (1) FR2786010B1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
DE19500925C2 (en) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Method for producing a contactless chip card

Also Published As

Publication number Publication date
FR2786010A1 (en) 2000-05-19

Similar Documents

Publication Publication Date Title
FR2734071B1 (en) ELECTRONIC PAYMENT CARD WITH INTERCHANGEABLE MODULE
FR2724794B1 (en) ELECTRONIC DEVICE HAVING A R.F. CIRCUIT INTEGRATED IN A MOBILE HOUSING ELEMENT
DE69722403T2 (en) Banknote with an integrated circuit
DE69731719D1 (en) Connectors with integrated circuit board arrangement
DE69624160T2 (en) Connector arrangement for integrated circuit card
DE69524690D1 (en) Electronic secretary
BR9707743A (en) Electronic device with supplementary housing
DE69513058D1 (en) Electronic circuitry
DE59510572D1 (en) electronic module
FR2724750B1 (en) ELECTRONIC CARD WITH PERFORMANCE INDICATOR
DE60038526D1 (en) Electronic module
KR970703047A (en) Electronic component comprising a thin-film structure with passive elements
BR9603810A (en) Electronic card
FR2762115B1 (en) METHOD FOR INSERTING AN ELECTRONIC MODULE INTO AN ELECTRONIC MEMORY CARD BODY
FR2786010B1 (en) CARD WITH ELECTRONIC MODULE DECOUPLED FROM CARD BODY
DE59811878D1 (en) Electronic control module
DE59906543D1 (en) ELECTRONIC MODULE
DE29808147U1 (en) Electronic memory card
DE69602663T2 (en) Electronic power module
DE69825604D1 (en) ELECTRONIC CARD
FR2792091B1 (en) SECURE ELECTRONIC MEMORY CARD
DE59408442D1 (en) Electronic circuit module
DE29714414U1 (en) Electronic business card with microchip
FR2752077B1 (en) INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE
FR2804827B1 (en) ELECTRONIC CARD WITH CONNECTIONS AND MULTIPLE FUNCTIONS

Legal Events

Date Code Title Description
ST Notification of lapse