FR2773177B1 - PROCESS FOR OBTAINING A SINGLE-CRYSTAL GERMANIUM OR SILICON LAYER ON A SILICON OR SINGLE-CRYSTAL GERMANIUM SUBSTRATE, RESPECTIVELY, AND MULTILAYER PRODUCTS OBTAINED - Google Patents
PROCESS FOR OBTAINING A SINGLE-CRYSTAL GERMANIUM OR SILICON LAYER ON A SILICON OR SINGLE-CRYSTAL GERMANIUM SUBSTRATE, RESPECTIVELY, AND MULTILAYER PRODUCTS OBTAINEDInfo
- Publication number
- FR2773177B1 FR2773177B1 FR9716631A FR9716631A FR2773177B1 FR 2773177 B1 FR2773177 B1 FR 2773177B1 FR 9716631 A FR9716631 A FR 9716631A FR 9716631 A FR9716631 A FR 9716631A FR 2773177 B1 FR2773177 B1 FR 2773177B1
- Authority
- FR
- France
- Prior art keywords
- crystal germanium
- silicon
- obtaining
- products obtained
- silicon layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/08—Germanium
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/52—Alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/0251—Graded layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9716631A FR2773177B1 (en) | 1997-12-29 | 1997-12-29 | PROCESS FOR OBTAINING A SINGLE-CRYSTAL GERMANIUM OR SILICON LAYER ON A SILICON OR SINGLE-CRYSTAL GERMANIUM SUBSTRATE, RESPECTIVELY, AND MULTILAYER PRODUCTS OBTAINED |
EP98403096A EP0930382B1 (en) | 1997-12-29 | 1998-12-09 | Process for obtaining a layer of single crystal germanium or silicon on single cystal silicon or germanium substrate respectively, and multilayer products thus obtained |
DE69807314T DE69807314D1 (en) | 1997-12-29 | 1998-12-09 | Process for producing a layer of single-crystalline silicon or germanium on a single-crystalline substrate made of or germanium or silicon and multi-layer products produced thereafter |
US09/217,025 US6117750A (en) | 1997-12-29 | 1998-12-21 | Process for obtaining a layer of single-crystal germanium or silicon on a substrate of single-crystal silicon or germanium, respectively |
US09/659,913 US6429098B1 (en) | 1997-12-29 | 2000-09-11 | Process for obtaining a layer of single-crystal germanium or silicon on a substrate of single-crystal silicon or germanium, respectively, and multilayer products obtained |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9716631A FR2773177B1 (en) | 1997-12-29 | 1997-12-29 | PROCESS FOR OBTAINING A SINGLE-CRYSTAL GERMANIUM OR SILICON LAYER ON A SILICON OR SINGLE-CRYSTAL GERMANIUM SUBSTRATE, RESPECTIVELY, AND MULTILAYER PRODUCTS OBTAINED |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2773177A1 FR2773177A1 (en) | 1999-07-02 |
FR2773177B1 true FR2773177B1 (en) | 2000-03-17 |
Family
ID=9515239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9716631A Expired - Lifetime FR2773177B1 (en) | 1997-12-29 | 1997-12-29 | PROCESS FOR OBTAINING A SINGLE-CRYSTAL GERMANIUM OR SILICON LAYER ON A SILICON OR SINGLE-CRYSTAL GERMANIUM SUBSTRATE, RESPECTIVELY, AND MULTILAYER PRODUCTS OBTAINED |
Country Status (4)
Country | Link |
---|---|
US (2) | US6117750A (en) |
EP (1) | EP0930382B1 (en) |
DE (1) | DE69807314D1 (en) |
FR (1) | FR2773177B1 (en) |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1016129B2 (en) † | 1997-06-24 | 2009-06-10 | Massachusetts Institute Of Technology | Controlling threading dislocation densities using graded layers and planarization |
US7227176B2 (en) * | 1998-04-10 | 2007-06-05 | Massachusetts Institute Of Technology | Etch stop layer system |
WO2001054175A1 (en) * | 2000-01-20 | 2001-07-26 | Amberwave Systems Corporation | Low threading dislocation density relaxed mismatched epilayers without high temperature growth |
US6750130B1 (en) | 2000-01-20 | 2004-06-15 | Amberwave Systems Corporation | Heterointegration of materials using deposition and bonding |
US6602613B1 (en) | 2000-01-20 | 2003-08-05 | Amberwave Systems Corporation | Heterointegration of materials using deposition and bonding |
US6506653B1 (en) * | 2000-03-13 | 2003-01-14 | International Business Machines Corporation | Method using disposable and permanent films for diffusion and implant doping |
WO2001093338A1 (en) | 2000-05-26 | 2001-12-06 | Amberwave Systems Corporation | Buried channel strained silicon fet using an ion implanted doped layer |
JP2003158075A (en) * | 2001-08-23 | 2003-05-30 | Sumitomo Mitsubishi Silicon Corp | Method for manufacturing semiconductor substrate, method for manufacturing field effect transistor, semiconductor substrate and field effect transistor |
AU2001283138A1 (en) * | 2000-08-07 | 2002-02-18 | Amberwave Systems Corporation | Gate technology for strained surface channel and strained buried channel mosfet devices |
WO2002015244A2 (en) | 2000-08-16 | 2002-02-21 | Massachusetts Institute Of Technology | Process for producing semiconductor article using graded expitaxial growth |
US6649480B2 (en) | 2000-12-04 | 2003-11-18 | Amberwave Systems Corporation | Method of fabricating CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETs |
US20020090772A1 (en) * | 2000-12-11 | 2002-07-11 | Seiko Epson Corporation | Method for manufacturing semiconductor lamination, method for manufacturing lamination, semiconductor device, and electronic equipment |
US6593641B1 (en) | 2001-03-02 | 2003-07-15 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
EP1364411A1 (en) * | 2001-03-02 | 2003-11-26 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed cmos electronics and high speed analog circuits |
US6830976B2 (en) * | 2001-03-02 | 2004-12-14 | Amberwave Systems Corproation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
US6724008B2 (en) | 2001-03-02 | 2004-04-20 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
US6703688B1 (en) | 2001-03-02 | 2004-03-09 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
US6900103B2 (en) | 2001-03-02 | 2005-05-31 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
US6723661B2 (en) * | 2001-03-02 | 2004-04-20 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
WO2002082514A1 (en) | 2001-04-04 | 2002-10-17 | Massachusetts Institute Of Technology | A method for semiconductor device fabrication |
GB0111207D0 (en) * | 2001-05-08 | 2001-06-27 | Btg Int Ltd | A method to produce germanium layers |
US6849508B2 (en) * | 2001-06-07 | 2005-02-01 | Amberwave Systems Corporation | Method of forming multiple gate insulators on a strained semiconductor heterostructure |
US6900094B2 (en) * | 2001-06-14 | 2005-05-31 | Amberwave Systems Corporation | Method of selective removal of SiGe alloys |
US7301180B2 (en) | 2001-06-18 | 2007-11-27 | Massachusetts Institute Of Technology | Structure and method for a high-speed semiconductor device having a Ge channel layer |
EP1399974A1 (en) * | 2001-06-21 | 2004-03-24 | Massachusetts Institute Of Technology | Mosfets with strained semiconductor layers |
US6730551B2 (en) | 2001-08-06 | 2004-05-04 | Massachusetts Institute Of Technology | Formation of planar strained layers |
US7138649B2 (en) * | 2001-08-09 | 2006-11-21 | Amberwave Systems Corporation | Dual-channel CMOS transistors with differentially strained channels |
US6974735B2 (en) * | 2001-08-09 | 2005-12-13 | Amberwave Systems Corporation | Dual layer Semiconductor Devices |
EP1428262A2 (en) | 2001-09-21 | 2004-06-16 | Amberwave Systems Corporation | Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same |
US6933518B2 (en) | 2001-09-24 | 2005-08-23 | Amberwave Systems Corporation | RF circuits including transistors having strained material layers |
US6515335B1 (en) * | 2002-01-04 | 2003-02-04 | International Business Machines Corporation | Method for fabrication of relaxed SiGe buffer layers on silicon-on-insulators and structures containing the same |
US6723622B2 (en) | 2002-02-21 | 2004-04-20 | Intel Corporation | Method of forming a germanium film on a semiconductor substrate that includes the formation of a graded silicon-germanium buffer layer prior to the formation of a germanium layer |
AU2003222003A1 (en) | 2002-03-14 | 2003-09-29 | Amberwave Systems Corporation | Methods for fabricating strained layers on semiconductor substrates |
US7074623B2 (en) | 2002-06-07 | 2006-07-11 | Amberwave Systems Corporation | Methods of forming strained-semiconductor-on-insulator finFET device structures |
US20030227057A1 (en) | 2002-06-07 | 2003-12-11 | Lochtefeld Anthony J. | Strained-semiconductor-on-insulator device structures |
US7335545B2 (en) | 2002-06-07 | 2008-02-26 | Amberwave Systems Corporation | Control of strain in device layers by prevention of relaxation |
US6995430B2 (en) | 2002-06-07 | 2006-02-07 | Amberwave Systems Corporation | Strained-semiconductor-on-insulator device structures |
US7307273B2 (en) | 2002-06-07 | 2007-12-11 | Amberwave Systems Corporation | Control of strain in device layers by selective relaxation |
US7138310B2 (en) | 2002-06-07 | 2006-11-21 | Amberwave Systems Corporation | Semiconductor devices having strained dual channel layers |
US7615829B2 (en) | 2002-06-07 | 2009-11-10 | Amberwave Systems Corporation | Elevated source and drain elements for strained-channel heterojuntion field-effect transistors |
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US7682947B2 (en) * | 2003-03-13 | 2010-03-23 | Asm America, Inc. | Epitaxial semiconductor deposition methods and structures |
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US20070154637A1 (en) * | 2005-12-19 | 2007-07-05 | Rohm And Haas Electronic Materials Llc | Organometallic composition |
US20070262296A1 (en) * | 2006-05-11 | 2007-11-15 | Matthias Bauer | Photodetectors employing germanium layers |
US8157914B1 (en) | 2007-02-07 | 2012-04-17 | Chien-Min Sung | Substrate surface modifications for compositional gradation of crystalline materials and associated products |
US7799600B2 (en) * | 2007-05-31 | 2010-09-21 | Chien-Min Sung | Doped diamond LED devices and associated methods |
FR2929756B1 (en) * | 2008-04-08 | 2010-08-27 | Commissariat Energie Atomique | PROCESS FOR FORMING POROUS MATERIAL IN MICROCAVITY OR MICROPASSING BY MECHANICAL CHEMICAL POLISHING |
KR20100064742A (en) * | 2008-12-05 | 2010-06-15 | 한국전자통신연구원 | Growth of pure ge layer with low threadin dislocation density |
CN103717351A (en) * | 2011-08-01 | 2014-04-09 | 巴斯夫欧洲公司 | A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or si1-xgex material in the presence of a CMP composition having a ph value of 3.0 to 5.5 |
US9127345B2 (en) | 2012-03-06 | 2015-09-08 | Asm America, Inc. | Methods for depositing an epitaxial silicon germanium layer having a germanium to silicon ratio greater than 1:1 using silylgermane and a diluent |
US9171715B2 (en) | 2012-09-05 | 2015-10-27 | Asm Ip Holding B.V. | Atomic layer deposition of GeO2 |
US9218963B2 (en) | 2013-12-19 | 2015-12-22 | Asm Ip Holding B.V. | Cyclical deposition of germanium |
DE102014223603B4 (en) * | 2014-11-19 | 2018-05-30 | Siltronic Ag | Semiconductor wafer and method for its production |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4861393A (en) * | 1983-10-28 | 1989-08-29 | American Telephone And Telegraph Company, At&T Bell Laboratories | Semiconductor heterostructures having Gex Si1-x layers on Si utilizing molecular beam epitaxy |
US5442205A (en) * | 1991-04-24 | 1995-08-15 | At&T Corp. | Semiconductor heterostructure devices with strained semiconductor layers |
FR2678647A1 (en) * | 1991-07-05 | 1993-01-08 | Centre Nat Rech Scient | PROCESS FOR PRODUCING A MESH GRADIENT CRYSTAL. |
US5354700A (en) * | 1993-07-26 | 1994-10-11 | United Microelectronics Corporation | Method of manufacturing super channel TFT structure |
-
1997
- 1997-12-29 FR FR9716631A patent/FR2773177B1/en not_active Expired - Lifetime
-
1998
- 1998-12-09 DE DE69807314T patent/DE69807314D1/en not_active Expired - Lifetime
- 1998-12-09 EP EP98403096A patent/EP0930382B1/en not_active Expired - Lifetime
- 1998-12-21 US US09/217,025 patent/US6117750A/en not_active Expired - Lifetime
-
2000
- 2000-09-11 US US09/659,913 patent/US6429098B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69807314D1 (en) | 2002-09-26 |
US6429098B1 (en) | 2002-08-06 |
FR2773177A1 (en) | 1999-07-02 |
EP0930382B1 (en) | 2002-08-21 |
US6117750A (en) | 2000-09-12 |
EP0930382A1 (en) | 1999-07-21 |
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