FR2757313A1 - Integrated circuit substrate manufacturing method - Google Patents
Integrated circuit substrate manufacturing method Download PDFInfo
- Publication number
- FR2757313A1 FR2757313A1 FR9615365A FR9615365A FR2757313A1 FR 2757313 A1 FR2757313 A1 FR 2757313A1 FR 9615365 A FR9615365 A FR 9615365A FR 9615365 A FR9615365 A FR 9615365A FR 2757313 A1 FR2757313 A1 FR 2757313A1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- thermoadhesive
- support film
- tape
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 title abstract 3
- 239000002775 capsule Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 10
- 239000000109 continuous material Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000003856 thermoforming Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
PROCEDE DE FABRICATION D'UN FILM SUPPORT EQUIPE
DE CIRCUIT INTEGRE ET FILM SUPPORT
La présente invention concerne le procédé de fabrication d'un film support équipé de circuit intégré et le film support ainsi obtenu.METHOD FOR MANUFACTURING AN EQUIPPED SUPPORT FILM
INTEGRATED CIRCUIT AND SUPPORT FILM
The present invention relates to the method of manufacturing a support film equipped with an integrated circuit and the support film thus obtained.
Le procédé selon l'invention consiste:
- à fabriquer une bande thermoadhésive, sous forme de matériau continu, associée, à des intervalles réguliers correspondant aux intervalles de positionnement du circuit intégré sur le film support, à des capsules thermoformées disposées dans des ouvertures ou interruptions de la bande thermoadhésive;
- à assembler la bande thermoadhésive pourvue de capsules au film support de circuit intégré.The method according to the invention consists:
to manufacture a thermoadhesive strip, in the form of continuous material, associated, at regular intervals corresponding to the positioning intervals of the integrated circuit on the support film, with thermoformed capsules placed in openings or interruptions in the thermoadhesive strip;
- to assemble the thermoadhesive strip provided with capsules to the integrated circuit support film.
Selon une autre particularité, le procédé consiste:
- à découper les éléments support dans l'assemblage film supporticouches thermoadhésiveslcapsule et les placer dans une encoche du support de données;
- à relier l'élément support avec le corps de la carte dans l'encoche sous l'action de la chaleur et de la pression.According to another particularity, the method consists:
- to cut the support elements in the film assembly of thermoadhesive adhesiveslcapsule film and place them in a notch of the data support;
- to connect the support element with the body of the card in the notch under the action of heat and pressure.
Selon une autre particularité la bande continue thermoadhésive recouvre au moins partiellement les rebords de la capsule sur au moins une face. According to another particular feature, the thermoadhesive continuous strip at least partially covers the edges of the capsule on at least one face.
Selon une autre particularité, la bande continue thermoadhésive recouvre au moins partiellement les rebords de la capsule sur les deux faces. According to another particular feature, the thermoadhesive continuous strip at least partially covers the edges of the capsule on the two faces.
Selon une autre particularité, les capsules sont reliées entre elles par de la matière thermoformable de façon à former une bande et cette bande est recouverte d'un ruban thermoadhésif sur ses deux faces, ledit ruban sur chacune des faces étant pourvu d'ouvertures ou d'interruptions correspondant substantiellement à la taille de la capsule. According to another particularity, the capsules are connected together by thermoformable material so as to form a strip and this strip is covered with a thermoadhesive tape on its two faces, said tape on each of the faces being provided with openings or d 'interruptions corresponding substantially to the size of the capsule.
Selon une autre particularité, le ruban thermoadhésif est découpé à intervalles réguliers par un poinçon et dans les ouvertures formées dans le ruban sont insérées des capsules obtenues par découpage d'un ruban thermoformable après avoir thermoformé ce ruban sur une roue pourvue d'alvéoles de thermoformage dans lesquelles une dépression permet d'aspirer la matière en vue de sa déformation. According to another particularity, the thermoadhesive tape is cut at regular intervals by a punch and into the openings formed in the tape are inserted capsules obtained by cutting a thermoformable tape after having thermoformed this tape on a wheel provided with thermoforming cells in which a vacuum makes it possible to aspirate the material with a view to its deformation.
Un autre but de l'invention est de proposer un film support ainsi obtenu. Another object of the invention is to provide a support film thus obtained.
Ce but est atteint par le fait que le film support équipé de circuit intégré sous forme de matériau continu, ledit circuit intégré étant relié par des conducteurs électriques à des surfaces de contact disposées sur la face du film support opposée à celle supportant le circuit intégré, est caractérisé en ce que ledit circuit intégré est protégé par une capsule thermoformée fixée sur la face du film support supportant le circuit intégré, et au moins les intervalles séparant deux capsules adjacentes étant pourvus de matières thermoadhésives. This object is achieved by the fact that the support film equipped with an integrated circuit in the form of continuous material, said integrated circuit being connected by electrical conductors to contact surfaces disposed on the face of the support film opposite to that supporting the integrated circuit, is characterized in that said integrated circuit is protected by a thermoformed capsule fixed to the face of the support film supporting the integrated circuit, and at least the intervals separating two adjacent capsules being provided with thermoadhesive materials.
D'autres particularités et avantages de la présente invention apparaîtront plus clairement à la lecture de la description ci-après faite en référence aux dessins annexés dans lesquels:
la figure 1A représente une première variante de réalisation du support équipé de circuit intégré selon l'invention;
la figure i B représente une deuxième variante de réalisation du film support selon l'invention;
la figure 1C représente une troisième variante de réalisation du film support selon l'invention;
la figure 2 représente schématiquement les deux étapes de réalisation du film support selon le procédé de l'invention.Other features and advantages of the present invention will appear more clearly on reading the description below made with reference to the accompanying drawings in which:
FIG. 1A represents a first alternative embodiment of the support equipped with an integrated circuit according to the invention;
Figure i B shows a second alternative embodiment of the support film according to the invention;
FIG. 1C represents a third alternative embodiment of the support film according to the invention;
FIG. 2 schematically represents the two stages of production of the support film according to the method of the invention.
Le procédé de l'invention consiste à découper dans un ruban thermoadhésif (4) à intervalles réguliers des ouvertures (40) à l'aide d'un poinçon (9). Dans les ouvertures (40) de ce ruban sont disposées des capsules (3) en matériau thermoformable, les capsules pouvant être individuelles ou reliées entre elles par de la matière thermoformable en ruban. Le ruban (30) de matière thermoformable passe sur une roue (7) pourvue d'alvéoles (70) soumises à une dépression qui aspire le ruban (30) dans les alvéoles de façon à déformer ce ruban sous forme de capsules qui pour la variante de réalisation de la figure lA sont découpées à l'aide d'un poinçon (8) et insérées dans le ruban thermoadhésif (4). Le ruban thermoadhésif (4) pourvu de capsules (3) est ensuite déposé sur un film support (1) de circuit intégré (2). Ce circuit intégré (2) est pourvu de conducteurs de raccordement (6) qui sont reliés aux surfaces de contact sur la face opposée du film (1) à celle sur laquelle le circuit intégré (2) est disposé. The method of the invention consists in cutting openings (40) from a thermoadhesive tape (4) at regular intervals using a punch (9). In the openings (40) of this ribbon are arranged capsules (3) of thermoformable material, the capsules being able to be individual or connected to each other by thermoformable material in ribbon. The ribbon (30) of thermoformable material passes over a wheel (7) provided with cells (70) subjected to a vacuum which sucks the ribbon (30) in the cells so as to deform this ribbon in the form of capsules which for the variant of embodiment of FIG. 1A are cut using a punch (8) and inserted into the thermoadhesive tape (4). The thermoadhesive tape (4) provided with capsules (3) is then deposited on a support film (1) of integrated circuit (2). This integrated circuit (2) is provided with connection conductors (6) which are connected to the contact surfaces on the opposite face of the film (1) to that on which the integrated circuit (2) is arranged.
Dans la variante de réalisation la figure 1B, après l'étape de mise en place des capsules (3) dans un premier ruban thermoadhésif (4), un second ruban thermoadhésif (5) est disposé sur l'autre face du rebord (33) de la capsule avant l'assemblage du ruban thermoadhésif ainsi formé avec le film support (1) du circuit intégré (2). In the alternative embodiment in FIG. 1B, after the step of placing the capsules (3) in a first thermoadhesive tape (4), a second thermoadhesive tape (5) is placed on the other face of the flange (33) of the capsule before assembly of the thermoadhesive tape thus formed with the support film (1) of the integrated circuit (2).
Dans la variante de la figure lC, le ruban thermodéformable (30) n'est pas découpé. Le ruban (30) est recouvert sur ses deux faces d'un thermoadhésif (4, 5) de façon à relier entre elles les capsules (3) découpées uniquement d'ouvertures de façon à laisser l'accès à la capsule. L'ensemble ruban thermoadhésif/capsule est ensuite mis en place sur le film support (1) pourvu de son circuit intégré. Le film support pourvu du circuit intégré, protégé par la capsule maintenue sur le film support est ensuite découpé pour que le module ainsi obtenu puisse être collé dans le logement prévu dans une feuille de matériau plastique, découpée au format souhaité telle qu'une carte ou un module SIM. In the variant of FIG. 1C, the heat-deformable strip (30) is not cut. The tape (30) is covered on both sides with a thermoadhesive (4, 5) so as to connect together the capsules (3) cut only from openings so as to allow access to the capsule. The thermoadhesive tape / capsule assembly is then placed on the support film (1) provided with its integrated circuit. The support film provided with the integrated circuit, protected by the capsule maintained on the support film is then cut so that the module thus obtained can be stuck in the housing provided in a sheet of plastic material, cut to the desired format such as a card or a SIM module.
D'autres modifications à la portée de l'homme de métier font également partie de l'esprit de l'invention. Other modifications within the reach of the skilled person are also part of the spirit of the invention.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9615365A FR2757313B3 (en) | 1996-12-13 | 1996-12-13 | METHOD FOR MANUFACTURING A SUPPORT FILM HAVING INTEGRATED CIRCUIT AND SUPPORT FILM |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9615365A FR2757313B3 (en) | 1996-12-13 | 1996-12-13 | METHOD FOR MANUFACTURING A SUPPORT FILM HAVING INTEGRATED CIRCUIT AND SUPPORT FILM |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2757313A1 true FR2757313A1 (en) | 1998-06-19 |
| FR2757313B3 FR2757313B3 (en) | 1999-01-22 |
Family
ID=9498662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9615365A Expired - Lifetime FR2757313B3 (en) | 1996-12-13 | 1996-12-13 | METHOD FOR MANUFACTURING A SUPPORT FILM HAVING INTEGRATED CIRCUIT AND SUPPORT FILM |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2757313B3 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2832354A1 (en) * | 2001-11-20 | 2003-05-23 | Arjo Wiggins Sa | Manufacture of article containing electronic chip has cavity in base layer and chip inserted on carrier layer |
| WO2006136229A1 (en) * | 2005-04-29 | 2006-12-28 | Giesecke & Devrient Gmbh | Method for producing a portable data carrier |
| EP2180433A2 (en) | 2008-10-27 | 2010-04-28 | Giesecke & Devrient GmbH | Method for producing a portable data carrier and the portable data carrier produced therefrom |
| US11013119B2 (en) | 2019-05-03 | 2021-05-18 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with deformed layer for accommodating component |
-
1996
- 1996-12-13 FR FR9615365A patent/FR2757313B3/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2832354A1 (en) * | 2001-11-20 | 2003-05-23 | Arjo Wiggins Sa | Manufacture of article containing electronic chip has cavity in base layer and chip inserted on carrier layer |
| WO2003055683A1 (en) * | 2001-11-20 | 2003-07-10 | Arjo Wiggins Security Sas | Method for making an article comprising a sheet and at least an element directly mounted thereon |
| US7128272B2 (en) | 2001-11-20 | 2006-10-31 | Arjo Wiggins Security Sas | Method for making an article comprising a sheet and at least an element directly mounted thereon |
| WO2006136229A1 (en) * | 2005-04-29 | 2006-12-28 | Giesecke & Devrient Gmbh | Method for producing a portable data carrier |
| EP2180433A2 (en) | 2008-10-27 | 2010-04-28 | Giesecke & Devrient GmbH | Method for producing a portable data carrier and the portable data carrier produced therefrom |
| DE102008053368A1 (en) | 2008-10-27 | 2010-04-29 | Giesecke & Devrient Gmbh | Method of making a portable data carrier and portable data carrier |
| US11013119B2 (en) | 2019-05-03 | 2021-05-18 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with deformed layer for accommodating component |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2757313B3 (en) | 1999-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property |