FR2439322A1 - METHOD AND DEVICE FOR CONNECTING TWO ELEMENTS AND TOOL FOR EXECUTING THE PROCESS - Google Patents

METHOD AND DEVICE FOR CONNECTING TWO ELEMENTS AND TOOL FOR EXECUTING THE PROCESS

Info

Publication number
FR2439322A1
FR2439322A1 FR7829845A FR7829845A FR2439322A1 FR 2439322 A1 FR2439322 A1 FR 2439322A1 FR 7829845 A FR7829845 A FR 7829845A FR 7829845 A FR7829845 A FR 7829845A FR 2439322 A1 FR2439322 A1 FR 2439322A1
Authority
FR
France
Prior art keywords
executing
tool
hole
elements
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7829845A
Other languages
French (fr)
Other versions
FR2439322B1 (en
Inventor
Patrick Courant
Raymond Delorme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SA
Original Assignee
Bull SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull SA filed Critical Bull SA
Priority to FR7829845A priority Critical patent/FR2439322A1/en
Priority to NL7905081A priority patent/NL7905081A/en
Priority to SE7906963A priority patent/SE7906963L/en
Priority to GB7929888A priority patent/GB2036624B/en
Priority to JP13007779A priority patent/JPS5556694A/en
Priority to IT7926531A priority patent/IT7926531A0/en
Priority to DE19792942344 priority patent/DE2942344A1/en
Publication of FR2439322A1 publication Critical patent/FR2439322A1/en
Application granted granted Critical
Publication of FR2439322B1 publication Critical patent/FR2439322B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0471—Heating appliances electric using resistance rod or bar, e.g. carbon silica
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connection Of Plates (AREA)

Abstract

L'INVENTION SE RAPPORTE A UN DISPOSITIF 30 DE LIAISON DE DEUX CONDUCTEURS 31, 32 DISPOSES DE PART ET D'AUTRE D'UN SUBSTRAT ISOLANT 33 TRAVERSE PAR UN TROU 35. SELON L'INVENTION, LE CONDUCTEUR 31 BOUCHE LE TROU 35 ET DE LA SOUDURE EST DEPOSEE DANS CE TROU, A LAQUELLE EST SOUDEE L'EXTREMITE DU CONDUCTEUR 32. CE DISPOSITIF EVITE L'EMPLOI DES TROUS METALLISES CLASSIQUES. L'INVENTION A AUSSI POUR OBJETS UN PROCEDE DE LIAISON ET UN OUTIL POUR L'EXECUTION DE CE PROCEDE. L'INVENTION S'APPLIQUE NOTAMMENT AUX SUBSTRATS D'INTERCONNEXION DE DISPOSITIFS A CIRCUITS INTEGRES.THE INVENTION RELATES TO A DEVICE 30 FOR CONNECTING TWO CONDUCTORS 31, 32 PROVIDED ON EACH OTHER OF AN INSULATING SUBSTRATE 33 THROUGH A HOLE 35. ACCORDING TO THE INVENTION, THE CONDUCTOR 31 CAPS THE HOLE 35 AND OF THE WELDING IS DEPOSITED IN THIS HOLE, TO WHICH THE END OF THE CONDUCTOR 32 IS WELDED. THIS DEVICE AVOIDS THE USE OF CLASSIC METAL HOLES. THE OBJECTS OF THE INVENTION ALSO ARE A LINKING PROCESS AND A TOOL FOR EXECUTING THIS PROCESS. THE INVENTION APPLIES IN PARTICULAR TO SUBSTRATES FOR THE INTERCONNECTION OF DEVICES WITH INTEGRATED CIRCUITS.

FR7829845A 1978-10-19 1978-10-19 METHOD AND DEVICE FOR CONNECTING TWO ELEMENTS AND TOOL FOR EXECUTING THE PROCESS Granted FR2439322A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR7829845A FR2439322A1 (en) 1978-10-19 1978-10-19 METHOD AND DEVICE FOR CONNECTING TWO ELEMENTS AND TOOL FOR EXECUTING THE PROCESS
NL7905081A NL7905081A (en) 1978-10-19 1979-06-29 METHOD AND APPARATUS FOR CONNECTING TWO ELEMENTS AND TOOL FOR CARRYING OUT THE METHOD
SE7906963A SE7906963L (en) 1978-10-19 1979-08-21 SET AND DEVICE FOR CONNECTING TWO ELECTRICALLY CONDUCTIVE BODIES
GB7929888A GB2036624B (en) 1978-10-19 1979-08-29 Soldering together two elements arranged on opposite sides of a substrat
JP13007779A JPS5556694A (en) 1978-10-19 1979-10-11 Device for connecting two elements and method thereof
IT7926531A IT7926531A0 (en) 1978-10-19 1979-10-16 DEVICE AND PROCEDURE FOR CONNECTING TWO ELEMENTS, AND TOOL FOR CARRYING OUT THE PROCEDURE.
DE19792942344 DE2942344A1 (en) 1978-10-19 1979-10-19 METHOD AND ARRANGEMENT FOR CONNECTING TWO ELEMENTS AND TOOL FOR IMPLEMENTING THE METHOD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7829845A FR2439322A1 (en) 1978-10-19 1978-10-19 METHOD AND DEVICE FOR CONNECTING TWO ELEMENTS AND TOOL FOR EXECUTING THE PROCESS

Publications (2)

Publication Number Publication Date
FR2439322A1 true FR2439322A1 (en) 1980-05-16
FR2439322B1 FR2439322B1 (en) 1981-04-17

Family

ID=9213943

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7829845A Granted FR2439322A1 (en) 1978-10-19 1978-10-19 METHOD AND DEVICE FOR CONNECTING TWO ELEMENTS AND TOOL FOR EXECUTING THE PROCESS

Country Status (7)

Country Link
JP (1) JPS5556694A (en)
DE (1) DE2942344A1 (en)
FR (1) FR2439322A1 (en)
GB (1) GB2036624B (en)
IT (1) IT7926531A0 (en)
NL (1) NL7905081A (en)
SE (1) SE7906963L (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496519A1 (en) * 1980-12-19 1982-06-25 Far Fab Assortiments Reunies MULTIPLE THERMODES WELDING TOOL
EP0250296A2 (en) * 1986-06-19 1987-12-23 Fairchild Semiconductor Corporation Apparatus and method for tape bonding
US4774633A (en) * 1985-06-26 1988-09-27 Bull S.A. Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device
EP2717658A1 (en) * 2011-05-26 2014-04-09 Kabushiki Kaisha Toyota Jidoshokki Wiring board and method for manufacturing wiring board

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
DE8711105U1 (en) * 1987-08-14 1987-11-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
US4965702A (en) * 1989-06-19 1990-10-23 E. I. Du Pont De Nemours And Company Chip carrier package and method of manufacture
JP2831970B2 (en) * 1996-04-12 1998-12-02 山一電機株式会社 Interlayer connection method for circuit boards

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2258928A1 (en) * 1974-01-25 1975-08-22 Bunker Ramo
US3977074A (en) * 1975-02-06 1976-08-31 General Motors Corporation Double sided printed circuit board and method for making same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2258928A1 (en) * 1974-01-25 1975-08-22 Bunker Ramo
US3977074A (en) * 1975-02-06 1976-08-31 General Motors Corporation Double sided printed circuit board and method for making same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496519A1 (en) * 1980-12-19 1982-06-25 Far Fab Assortiments Reunies MULTIPLE THERMODES WELDING TOOL
US4774633A (en) * 1985-06-26 1988-09-27 Bull S.A. Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device
EP0250296A2 (en) * 1986-06-19 1987-12-23 Fairchild Semiconductor Corporation Apparatus and method for tape bonding
EP0250296A3 (en) * 1986-06-19 1990-07-11 Fairchild Semiconductor Corporation Apparatus and method for tape bonding
EP2717658A1 (en) * 2011-05-26 2014-04-09 Kabushiki Kaisha Toyota Jidoshokki Wiring board and method for manufacturing wiring board
EP2717658A4 (en) * 2011-05-26 2015-08-12 Toyota Jidoshokki Kk Wiring board and method for manufacturing wiring board
US9332638B2 (en) 2011-05-26 2016-05-03 Kabushiki Kaisha Toyota Jidoshokki Wiring board and method for manufacturing wiring board

Also Published As

Publication number Publication date
DE2942344A1 (en) 1980-04-30
GB2036624B (en) 1982-09-08
SE7906963L (en) 1980-04-20
NL7905081A (en) 1980-04-22
FR2439322B1 (en) 1981-04-17
IT7926531A0 (en) 1979-10-16
GB2036624A (en) 1980-07-02
JPS5556694A (en) 1980-04-25

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Legal Events

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