FI952093A0 - Kapsling foer med akustiska ytvaogefunktionerande byggelement - Google Patents

Kapsling foer med akustiska ytvaogefunktionerande byggelement

Info

Publication number
FI952093A0
FI952093A0 FI952093A FI952093A FI952093A0 FI 952093 A0 FI952093 A0 FI 952093A0 FI 952093 A FI952093 A FI 952093A FI 952093 A FI952093 A FI 952093A FI 952093 A0 FI952093 A0 FI 952093A0
Authority
FI
Finland
Prior art keywords
ytvaogefunktionerande
kapsling
aciskaiska
byggelement
foer
Prior art date
Application number
FI952093A
Other languages
English (en)
Inventor
Bruno Fuerbacher
Pahl Wolfgang
Trausch Guenter
Lupp Friedrich
Leonhard Reindl
Werner Ruile
Martin Honsberg
Original Assignee
Siemens Matsushita Components
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components filed Critical Siemens Matsushita Components
Publication of FI952093A0 publication Critical patent/FI952093A0/fi

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/08—Holders with means for regulating temperature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Casings For Electric Apparatus (AREA)
FI952093A 1994-05-02 1995-05-02 Kapsling foer med akustiska ytvaogefunktionerande byggelement FI952093A0 (fi)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4415411 1994-05-02
DE4432566 1994-09-13
DE19512797 1995-04-05

Publications (1)

Publication Number Publication Date
FI952093A0 true FI952093A0 (fi) 1995-05-02

Family

ID=25936202

Family Applications (2)

Application Number Title Priority Date Filing Date
FI952093A FI952093A0 (fi) 1994-05-02 1995-05-02 Kapsling foer med akustiska ytvaogefunktionerande byggelement
FI964394A FI964394A (fi) 1994-05-02 1996-10-31 Elektronisten komponenttien kotelo

Family Applications After (1)

Application Number Title Priority Date Filing Date
FI964394A FI964394A (fi) 1994-05-02 1996-10-31 Elektronisten komponenttien kotelo

Country Status (9)

Country Link
US (2) US5831369A (fi)
EP (1) EP0759231B1 (fi)
JP (1) JPH09512677A (fi)
KR (1) KR100648751B1 (fi)
CN (1) CN1099158C (fi)
DE (1) DE59504639D1 (fi)
FI (2) FI952093A0 (fi)
RU (1) RU2153221C2 (fi)
WO (1) WO1995030276A1 (fi)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59504639D1 (de) * 1994-05-02 1999-02-04 Siemens Matsushita Components Verkapselung für elektronische bauelemente
DE19548048C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement (OFW-Bauelement)
DE19820049C2 (de) * 1998-05-05 2001-04-12 Epcos Ag Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente
JP2000114918A (ja) * 1998-10-05 2000-04-21 Mitsubishi Electric Corp 表面弾性波装置及びその製造方法
JP4151164B2 (ja) * 1999-03-19 2008-09-17 株式会社デンソー 半導体装置の製造方法
US6287894B1 (en) 1999-10-04 2001-09-11 Andersen Laboratories, Inc. Acoustic device packaged at wafer level
DE10006446A1 (de) * 2000-02-14 2001-08-23 Epcos Ag Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung
US6653762B2 (en) * 2000-04-19 2003-11-25 Murata Manufacturing Co., Ltd. Piezoelectric type electric acoustic converter
EP1313217A4 (en) * 2000-07-06 2008-09-24 Toshiba Kk SURFACE WAVE COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
US6621163B2 (en) * 2000-11-09 2003-09-16 Koninklijke Philips Electronics N.V. Electronic device having an electronic component with a multi-layer cover, and method
JP3974346B2 (ja) * 2001-03-30 2007-09-12 富士通メディアデバイス株式会社 弾性表面波装置
US6930364B2 (en) 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
DE10164494B9 (de) 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
DE10206919A1 (de) * 2002-02-19 2003-08-28 Infineon Technologies Ag Verfahren zur Erzeugung einer Abdeckung, Verfahren zum Herstellen eines gehäusten Bauelements
US6877209B1 (en) 2002-08-28 2005-04-12 Silicon Light Machines, Inc. Method for sealing an active area of a surface acoustic wave device on a wafer
US6846423B1 (en) 2002-08-28 2005-01-25 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
DE10253163B4 (de) 2002-11-14 2015-07-23 Epcos Ag Bauelement mit hermetischer Verkapselung und Waferscale Verfahren zur Herstellung
DE10300958A1 (de) * 2003-01-13 2004-07-22 Epcos Ag Modul mit Verkapselung
US7108344B2 (en) * 2003-11-03 2006-09-19 Hewlett-Packard Devleopment Company, L.P. Printmode for narrow margin printing
DE102004005668B4 (de) 2004-02-05 2021-09-16 Snaptrack, Inc. Elektrisches Bauelement und Herstellungsverfahren
US7750420B2 (en) * 2004-03-26 2010-07-06 Cypress Semiconductor Corporation Integrated circuit having one or more conductive devices formed over a SAW and/or MEMS device
US7259499B2 (en) 2004-12-23 2007-08-21 Askew Andy R Piezoelectric bimorph actuator and method of manufacturing thereof
US8074622B2 (en) * 2005-01-25 2011-12-13 Borgwarner, Inc. Control and interconnection system for an apparatus
US7288847B2 (en) * 2005-01-25 2007-10-30 Medtronic, Inc. Assembly including a circuit and an encapsulation frame, and method of making the same
DE102005034011B4 (de) * 2005-07-18 2009-05-20 Infineon Technologies Ag Halbleiterbauteil für Hochfrequenzen über 10 GHz und Verfahren zur Herstellung desselben
JP4760357B2 (ja) * 2005-12-19 2011-08-31 パナソニック株式会社 電子部品パッケージ
DE102007058951B4 (de) 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
US8059425B2 (en) * 2008-05-28 2011-11-15 Azurewave Technologies, Inc. Integrated circuit module with temperature compensation crystal oscillator
DE102008030842A1 (de) 2008-06-30 2010-01-28 Epcos Ag Integriertes Modul mit intrinsischem Isolationsbereich und Herstellungsverfahren
DE102008040775A1 (de) * 2008-07-28 2010-02-04 Robert Bosch Gmbh Verkapselung, MEMS sowie Verfahren zum selektiven Verkapseln
DE102008042106A1 (de) 2008-09-15 2010-03-18 Robert Bosch Gmbh Verkapselung, MEMS sowie Verfahren zum Verkapseln
JP5453787B2 (ja) * 2008-12-03 2014-03-26 パナソニック株式会社 弾性表面波デバイス
WO2012120968A1 (ja) * 2011-03-09 2012-09-13 株式会社村田製作所 電子部品
US9812350B2 (en) 2013-03-06 2017-11-07 Qorvo Us, Inc. Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer
US9583414B2 (en) 2013-10-31 2017-02-28 Qorvo Us, Inc. Silicon-on-plastic semiconductor device and method of making the same
JP2014192782A (ja) * 2013-03-28 2014-10-06 Japan Radio Co Ltd 封止部材、封止補助部材、封止方法および封止補助方法
JP5695145B2 (ja) * 2013-08-19 2015-04-01 スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 弾性表面波デバイス
JP5543044B1 (ja) * 2013-08-30 2014-07-09 新電元工業株式会社 電気機器およびその製造方法、並びに電気機器の設計方法
TWI582847B (zh) 2014-09-12 2017-05-11 Ｒｆ微型儀器公司 包含具有聚合物基板之半導體裝置的印刷電路模組及其製造方法
US10085352B2 (en) 2014-10-01 2018-09-25 Qorvo Us, Inc. Method for manufacturing an integrated circuit package
US10431533B2 (en) 2014-10-31 2019-10-01 Ati Technologies Ulc Circuit board with constrained solder interconnect pads
US9530709B2 (en) 2014-11-03 2016-12-27 Qorvo Us, Inc. Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
JP5921733B2 (ja) * 2015-02-05 2016-05-24 スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 弾性表面波デバイスを製造する方法
US9960145B2 (en) 2015-03-25 2018-05-01 Qorvo Us, Inc. Flip chip module with enhanced properties
US9613831B2 (en) 2015-03-25 2017-04-04 Qorvo Us, Inc. Encapsulated dies with enhanced thermal performance
US20160343604A1 (en) 2015-05-22 2016-11-24 Rf Micro Devices, Inc. Substrate structure with embedded layer for post-processing silicon handle elimination
US10276495B2 (en) 2015-09-11 2019-04-30 Qorvo Us, Inc. Backside semiconductor die trimming
JP6350510B2 (ja) * 2015-12-24 2018-07-04 株式会社村田製作所 弾性表面波装置
US10020405B2 (en) 2016-01-19 2018-07-10 Qorvo Us, Inc. Microelectronics package with integrated sensors
US10090262B2 (en) 2016-05-09 2018-10-02 Qorvo Us, Inc. Microelectronics package with inductive element and magnetically enhanced mold compound component
US10784149B2 (en) 2016-05-20 2020-09-22 Qorvo Us, Inc. Air-cavity module with enhanced device isolation
US10773952B2 (en) 2016-05-20 2020-09-15 Qorvo Us, Inc. Wafer-level package with enhanced performance
US10468329B2 (en) 2016-07-18 2019-11-05 Qorvo Us, Inc. Thermally enhanced semiconductor package having field effect transistors with back-gate feature
US10103080B2 (en) 2016-06-10 2018-10-16 Qorvo Us, Inc. Thermally enhanced semiconductor package with thermal additive and process for making the same
CN109716511A (zh) 2016-08-12 2019-05-03 Qorvo美国公司 具有增强性能的晶片级封装
SG11201901194SA (en) 2016-08-12 2019-03-28 Qorvo Us Inc Wafer-level package with enhanced performance
EP3497719B1 (en) 2016-08-12 2020-06-10 Qorvo Us, Inc. Wafer-level package with enhanced performance
US10109502B2 (en) 2016-09-12 2018-10-23 Qorvo Us, Inc. Semiconductor package with reduced parasitic coupling effects and process for making the same
US10090339B2 (en) 2016-10-21 2018-10-02 Qorvo Us, Inc. Radio frequency (RF) switch
US10749518B2 (en) 2016-11-18 2020-08-18 Qorvo Us, Inc. Stacked field-effect transistor switch
US10068831B2 (en) 2016-12-09 2018-09-04 Qorvo Us, Inc. Thermally enhanced semiconductor package and process for making the same
US10755992B2 (en) 2017-07-06 2020-08-25 Qorvo Us, Inc. Wafer-level packaging for enhanced performance
RU2658596C1 (ru) * 2017-08-07 2018-06-21 Акционерное общество "Научно-производственное предприятие "Радар ммс" Чувствительный элемент на поверхностных акустических волнах для измерения давления жидкостей и газов
US10784233B2 (en) 2017-09-05 2020-09-22 Qorvo Us, Inc. Microelectronics package with self-aligned stacked-die assembly
US10366972B2 (en) 2017-09-05 2019-07-30 Qorvo Us, Inc. Microelectronics package with self-aligned stacked-die assembly
US11152363B2 (en) 2018-03-28 2021-10-19 Qorvo Us, Inc. Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
US10804246B2 (en) 2018-06-11 2020-10-13 Qorvo Us, Inc. Microelectronics package with vertically stacked dies
US11069590B2 (en) 2018-10-10 2021-07-20 Qorvo Us, Inc. Wafer-level fan-out package with enhanced performance
US10964554B2 (en) 2018-10-10 2021-03-30 Qorvo Us, Inc. Wafer-level fan-out package with enhanced performance
US11646242B2 (en) 2018-11-29 2023-05-09 Qorvo Us, Inc. Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
US11387157B2 (en) 2019-01-23 2022-07-12 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
US20200235066A1 (en) 2019-01-23 2020-07-23 Qorvo Us, Inc. Rf devices with enhanced performance and methods of forming the same
US20200235040A1 (en) 2019-01-23 2020-07-23 Qorvo Us, Inc. Rf devices with enhanced performance and methods of forming the same
KR20210129656A (ko) 2019-01-23 2021-10-28 코르보 유에스, 인크. Rf 반도체 디바이스 및 이를 형성하는 방법
US11646289B2 (en) 2019-12-02 2023-05-09 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
US11923238B2 (en) 2019-12-12 2024-03-05 Qorvo Us, Inc. Method of forming RF devices with enhanced performance including attaching a wafer to a support carrier by a bonding technique without any polymer adhesive

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE252473C (fi)
US2824219A (en) * 1954-11-08 1958-02-18 Midland Mfg Co Inc Piezoelectric crystal assembly
US3622816A (en) * 1970-06-12 1971-11-23 Electro Dynamics Piezoelectric crystal assembly
DE2610172C3 (de) * 1975-03-12 1980-08-21 Murata Manufacturing Co., Ltd., Nagaokakyo, Kyoto (Japan) Filter auf der Basis der akustischen Oberflächenwellen
GB1512593A (en) * 1975-03-13 1978-06-01 Murata Manufacturing Co Elastic surface wave filter
DE2819499C3 (de) * 1978-05-03 1981-01-29 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gehäuse für eine Halbleiteranordnung
US4213104A (en) * 1978-09-25 1980-07-15 United Technologies Corporation Vacuum encapsulation for surface acoustic wave (SAW) devices
JPS55112019A (en) * 1979-02-22 1980-08-29 Murata Mfg Co Ltd Elastic surface wave device
US4270105A (en) * 1979-05-14 1981-05-26 Raytheon Company Stabilized surface wave device
CH626479A5 (fi) * 1979-07-05 1981-11-13 Suisse Horlogerie
CH625372A5 (fi) * 1979-07-06 1981-09-15 Ebauchesfabrik Eta Ag
GB2100521B (en) * 1981-05-13 1984-09-12 Plessey Co Plc Electrical device package
FR2516702A1 (fr) * 1981-11-18 1983-05-20 Dassault Electronique Boitier pour circuits electroniques
EP0157938A3 (de) * 1984-03-23 1987-05-13 Siemens Aktiengesellschaft Gehäuse für elektrische Bauelemente
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
JPS61152112A (ja) * 1984-12-26 1986-07-10 Hitachi Ltd 弾性表面波装置
JPS6297418A (ja) * 1985-10-23 1987-05-06 Clarion Co Ltd 弾性表面波装置のパツケ−ジ方法
DD252473A1 (de) * 1986-08-19 1987-12-16 Berlin Treptow Veb K Gehaeuse fuer integrierte optoelektronische systeme
US5010270A (en) * 1986-12-22 1991-04-23 Raytheon Company Saw device
US4855868A (en) * 1987-01-20 1989-08-08 Harding Ade Yemi S K Preformed packaging arrangement for energy dissipating devices
JPH01229514A (ja) * 1988-03-10 1989-09-13 Matsushita Electric Ind Co Ltd 弾性表面波装置
JPH01231415A (ja) * 1988-03-11 1989-09-14 Matsushita Electric Ind Co Ltd 弾性表面波装置
US5107586A (en) * 1988-09-27 1992-04-28 General Electric Company Method for interconnecting a stack of integrated circuits at a very high density
EP0367181B1 (en) * 1988-10-31 1994-04-20 Hitachi, Ltd. Surface acoustic wave filter device
JPH02143466A (ja) * 1988-11-25 1990-06-01 Mitsubishi Electric Corp 半導体装置の製造方法
JPH0316311A (ja) * 1989-03-30 1991-01-24 Canon Inc 弾性表面波素子およびその製造法
JPH02305013A (ja) * 1989-05-18 1990-12-18 Nec Corp 弾性表面波素子の実装構造
JPH03104409A (ja) * 1989-09-19 1991-05-01 Fujitsu Ltd 弾性表面波デバイス
JPH03173216A (ja) * 1989-12-01 1991-07-26 Matsushita Electric Ind Co Ltd 弾性表面波装置
JPH03173214A (ja) * 1989-12-01 1991-07-26 Matsushita Electric Ind Co Ltd 弾性表面波デバイス
EP0509065A1 (en) * 1990-08-01 1992-10-21 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5059848A (en) * 1990-08-20 1991-10-22 The United States Of America As Represented By The Secretary Of The Army Low-cost saw packaging technique
US5214844A (en) * 1990-12-17 1993-06-01 Nchip, Inc. Method of assembling integrated circuits to a silicon board
US5237235A (en) * 1991-09-30 1993-08-17 Motorola, Inc. Surface acoustic wave device package
JPH066169A (ja) * 1992-06-23 1994-01-14 Mitsubishi Electric Corp 弾性表面波装置
JP3222220B2 (ja) * 1992-10-19 2001-10-22 株式会社村田製作所 チップ型圧電共振子の製造方法
US5410789A (en) * 1992-11-13 1995-05-02 Murata Manufacturing Co., Ltd. Method of manufacturing piezoelectric-resonator having vibrating spaces formed therein
CA2109687A1 (en) * 1993-01-26 1995-05-23 Walter Schmidt Method for the through plating of conductor foils
US5502344A (en) * 1993-08-23 1996-03-26 Rohm Co., Ltd. Packaged piezoelectric oscillator incorporating capacitors and method of making the same
DE59504639D1 (de) * 1994-05-02 1999-02-04 Siemens Matsushita Components Verkapselung für elektronische bauelemente
US5467253A (en) * 1994-06-30 1995-11-14 Motorola, Inc. Semiconductor chip package and method of forming
EP0794616B1 (en) * 1996-03-08 2003-01-29 Matsushita Electric Industrial Co., Ltd. An electronic part and a method of production thereof

Also Published As

Publication number Publication date
DE59504639D1 (de) 1999-02-04
EP0759231A1 (de) 1997-02-26
JPH09512677A (ja) 1997-12-16
KR970703062A (ko) 1997-06-10
FI964394A0 (fi) 1996-10-31
CN1147319A (zh) 1997-04-09
RU2153221C2 (ru) 2000-07-20
KR100648751B1 (ko) 2007-03-02
US6446316B1 (en) 2002-09-10
US5831369A (en) 1998-11-03
CN1099158C (zh) 2003-01-15
EP0759231B1 (de) 1998-12-23
FI964394A (fi) 1996-10-31
WO1995030276A1 (de) 1995-11-09

Similar Documents

Publication Publication Date Title
FI952093A0 (fi) Kapsling foer med akustiska ytvaogefunktionerande byggelement
ATA166795A (de) Bis-resorcinyltriazine
ATA147195A (de) Alkoxyphenyl-substituierte bisbenzoylphosphinoxide
ATA163695A (de) 2-hydroxyphenyltriazine
ATA108995A (de) Differenzdruckakkumulator
ATA11894A (de) Stauförderbahn
FI1458U1 (fi) Med vaermeelement foersedd ackumulator
FI1678U1 (fi) Fiskfjaellare med skaeregg
FI1857U1 (fi) Kantele med mekanik
FI1854U1 (fi) Pumpstations- eller maetarbrunn med underhaollsrum
FI940861A0 (fi) Kretskort med spaenningsfaelt foer elektronikapplikationer
FI945103A0 (fi) Ringmotor med elektromagnetisk kraftoeverfoering
FI943505A0 (fi) Laett slaepvagns med hydraulisk drivanordning foer bromsar foersedda dragaenda
FI942977A0 (fi) Flaskstaell med handtag
FIU940048U0 (fi) Skidvallningsstaell med sugkoppfaesten
FI945267A0 (fi) Med vattentryck fungerande kraftkaella
FI953587A0 (fi) Flygplan med vridbara vingar
FI940578A0 (fi) Transportabelt rumsutrymme med reglerbar storlek
FI941158A0 (fi) Foerflyttbar dagsljuslampa med stativ
FI944616A0 (fi) Vaexellaoda med koniskahjul
FI1727U1 (fi) Ansiktsskydd i samband med haortvaettning
FI1363U1 (fi) Anlaeggning i pappersmaskin i samband med kantsprutroeren
FI1793U1 (fi) Med stoerthaol foersett bildaeck till bilfaerja
FI943432A0 (fi) Tillverkning av plastroerelement foersett med loesmuffoerbandsmedel
ATE197372T1 (de) Vorteig