FI20106217L - Method and scale part - Google Patents
Method and scale part Download PDFInfo
- Publication number
- FI20106217L FI20106217L FI20106217A FI20106217A FI20106217L FI 20106217 L FI20106217 L FI 20106217L FI 20106217 A FI20106217 A FI 20106217A FI 20106217 A FI20106217 A FI 20106217A FI 20106217 L FI20106217 L FI 20106217L
- Authority
- FI
- Finland
- Prior art keywords
- scale part
- scale
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/02—Electrolytic coating other than with metals with organic materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20106217A FI20106217L (en) | 2010-11-18 | 2010-11-18 | Method and scale part |
JP2013539307A JP2014503994A (en) | 2010-11-18 | 2011-11-08 | Method for manufacturing a covered structure |
CN2011800555599A CN103348779A (en) | 2010-11-18 | 2011-11-08 | Method for manufacturing cover structure |
PCT/FI2011/050992 WO2012066187A1 (en) | 2010-11-18 | 2011-11-08 | Method for manufacturing a cover structure |
KR1020137015482A KR20130138279A (en) | 2010-11-18 | 2011-11-08 | Method for manufacturing a cover structure |
TW100141959A TWI516190B (en) | 2010-11-18 | 2011-11-17 | Method and cover part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20106217A FI20106217L (en) | 2010-11-18 | 2010-11-18 | Method and scale part |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20106217A0 FI20106217A0 (en) | 2010-11-18 |
FI20106217L true FI20106217L (en) | 2012-05-19 |
Family
ID=43268995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20106217A FI20106217L (en) | 2010-11-18 | 2010-11-18 | Method and scale part |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2014503994A (en) |
KR (1) | KR20130138279A (en) |
CN (1) | CN103348779A (en) |
FI (1) | FI20106217L (en) |
TW (1) | TWI516190B (en) |
WO (1) | WO2012066187A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220007533A1 (en) * | 2019-03-28 | 2022-01-06 | Hewlett-Packard Development Company, L.P. | Covers for electronic devices |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948876B2 (en) * | 1980-03-11 | 1984-11-29 | 三菱電機株式会社 | Heat sink surface treatment method |
JP3007723U (en) * | 1994-08-11 | 1995-02-28 | 古野電気株式会社 | Resin case for electronic devices |
JP3982780B2 (en) * | 1998-03-26 | 2007-09-26 | 日立金属株式会社 | Method for manufacturing forged thin-walled casing made of magnesium alloy |
DE69913018T2 (en) * | 1998-03-26 | 2004-08-05 | Tokyo Seitan Inc. | Forged magnesium alloy body and process for making it |
JP2001170734A (en) * | 1998-12-28 | 2001-06-26 | Tokyo Seitankosho:Kk | Magnesium alloy thin formed body and its manufacturing method |
JP2000246386A (en) * | 1998-12-28 | 2000-09-12 | Tokyo Seitankosho:Kk | Manufacture of magnesium alloy thin molding element, and thin molding element |
JP2001162346A (en) * | 1998-12-28 | 2001-06-19 | Tokyo Seitankosho:Kk | Manufacturing method of magnesium alloy thin formed body, and thin formed body |
JP2002344154A (en) * | 2001-05-15 | 2002-11-29 | Sharp Corp | Frame |
JP2003160898A (en) * | 2001-09-17 | 2003-06-06 | Fujitsu Ltd | Method for coloring magnesium material and housing made from magnesium material colored with the same |
TWI258329B (en) * | 2002-12-04 | 2006-07-11 | Fih Co Ltd | Method of manufacturing multihole cover |
JP4839618B2 (en) * | 2004-10-14 | 2011-12-21 | 日立電線株式会社 | Optical transceiver |
CN1774158A (en) * | 2004-11-11 | 2006-05-17 | 鸿富锦精密工业(深圳)有限公司 | Portable electronic device case and producing method thereof |
US20060228556A1 (en) * | 2005-04-08 | 2006-10-12 | Fenn David R | Electrodepositable coating compositions and methods for their production |
CN101212876A (en) * | 2006-12-29 | 2008-07-02 | 深圳富泰宏精密工业有限公司 | Metal shell and its making method |
CN101340785A (en) * | 2007-07-04 | 2009-01-07 | 深圳富泰宏精密工业有限公司 | Outer casing of electronic product |
JP3144786U (en) * | 2008-07-01 | 2008-09-11 | 徐鉦鑑 | Electronic device shell |
-
2010
- 2010-11-18 FI FI20106217A patent/FI20106217L/en not_active Application Discontinuation
-
2011
- 2011-11-08 CN CN2011800555599A patent/CN103348779A/en active Pending
- 2011-11-08 WO PCT/FI2011/050992 patent/WO2012066187A1/en active Application Filing
- 2011-11-08 JP JP2013539307A patent/JP2014503994A/en active Pending
- 2011-11-08 KR KR1020137015482A patent/KR20130138279A/en not_active Application Discontinuation
- 2011-11-17 TW TW100141959A patent/TWI516190B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2012066187A1 (en) | 2012-05-24 |
CN103348779A (en) | 2013-10-09 |
TWI516190B (en) | 2016-01-01 |
KR20130138279A (en) | 2013-12-18 |
TW201225795A (en) | 2012-06-16 |
FI20106217A0 (en) | 2010-11-18 |
JP2014503994A (en) | 2014-02-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed |