ES2597330A1 - Procedure for manufacturing security seals with a built-in identification chip (Machine-translation by Google Translate, not legally binding) - Google Patents

Procedure for manufacturing security seals with a built-in identification chip (Machine-translation by Google Translate, not legally binding) Download PDF

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Publication number
ES2597330A1
ES2597330A1 ES201531054A ES201531054A ES2597330A1 ES 2597330 A1 ES2597330 A1 ES 2597330A1 ES 201531054 A ES201531054 A ES 201531054A ES 201531054 A ES201531054 A ES 201531054A ES 2597330 A1 ES2597330 A1 ES 2597330A1
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Spain
Prior art keywords
plates
seal
seals
sheet
identification
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES201531054A
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Spanish (es)
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ES2597330B1 (en
Inventor
Juan CRESPO AMIGO
Ramón FRANCISCO LÓPEZ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Precintia Seguridad SL
Original Assignee
Precintia Int S A
PRECINTIA INTERNATIONAL SA
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Priority to ES201531054A priority Critical patent/ES2597330B1/en
Publication of ES2597330A1 publication Critical patent/ES2597330A1/en
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Publication of ES2597330B1 publication Critical patent/ES2597330B1/en
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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/02Forms or constructions
    • G09F3/03Forms or constructions of security seals
    • G09F3/0305Forms or constructions of security seals characterised by the type of seal used
    • G09F3/037Forms or constructions of security seals characterised by the type of seal used having tie-wrap sealing means

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  • Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Procedure for manufacturing security seals with a built-in identification chip; comprising: - the manufacture of a sheet (2) of plastic material, provided with break zones (21) delimiting in said sheet (2) a series of separable plates (22), of a surface equal to or less than of the body (11) of the seal to be manufactured; - the positioning and fixing on each of the plates (22) of the sheet (2) of an identification chip (3) by radiofrequency; and - the arrangement of the plates (22) with the respective identification chips (3) in respective cavities of an injection mold suitable for the manufacture of seals (1); and injection into the mold of a plastic material at a temperature above the melting temperature of the plates (22). (Machine-translation by Google Translate, not legally binding)

Description

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DESCRIPCIONDESCRIPTION

Procedimiento de fabricacion de precintos de seguridad con un chip de identificacion incorporado.Manufacturing procedure for security seals with a built-in identification chip.

Objeto de la invencion.Object of the invention.

El objeto de la presente invencion es un procedimiento de fabricacion de precintos de seguridad con un chip de identificacion incorporado; comprendiendo dichos precintos un cuerpo provisto de un apendice flexible de cierre y de un pasaje de retencion para la introduction y bloqueo del extremo libre del apendice flexible formando un bucle cerrado.The object of the present invention is a method of manufacturing security seals with a built-in identification chip; said seals comprising a body provided with a flexible closing appendix and a retention passage for the introduction and blocking of the free end of the flexible appendix forming a closed loop.

Este procedimiento presenta unas caracteristicas orientadas a facilitar la integration del chip de identificacion en el cuerpo del precinto.This procedure has characteristics aimed at facilitating the integration of the identification chip in the body of the seal.

Campo de aplicacion de la invencion.Field of application of the invention.

Esta invencion es aplicable en el campo dedicado a la fabricacion de precintos de seguridad.This invention is applicable in the field dedicated to the manufacture of security seals.

Estado de la tecnica.State of the art.

En el modelo de utilidad ES 1 133 856 U se describe una etiqueta con dispositivo de radiofrecuencia para precintos de seguridad, susceptible de ser incorporada en aquellos precintos, preferentemente realizados en material termoplastico, siendo del tipo de los que incorporan una tira de abrazo flexible y alargada que finaliza en un ojal con un elemento retenedor en su interior para su cierre; la mencionada etiqueta esta caracterizada por que dispone de un dispositivo de identificacion por radiofrecuencia, que queda alojado y sellado en el interior de la etiqueta (1) del precinto en el proceso de fabricacion, al aplicar el material termoplastico al molde que conforma el precinto.In the utility model ES 1 133 856 U a label with radiofrequency device for security seals is described, which can be incorporated into those seals, preferably made of thermoplastic material, being of the type that incorporates a flexible hug strip and elongated ending in a buttonhole with a retaining element inside for closure; The aforementioned label is characterized in that it has a radiofrequency identification device, which is housed and sealed inside the label (1) of the seal in the manufacturing process, by applying the thermoplastic material to the mold that forms the seal.

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La colocacion del mencionado dispositivo de seguridad por radiofrecuencia en el interior del material inyectado presenta varios problemas tecnicos que no se mencionan ni se resuelven en el mencionado antecedente.The placement of said radiofrequency safety device inside the injected material presents several technical problems that are not mentioned or resolved in the aforementioned background.

Un primer inconveniente es la disposition y sujecion del dispositivo o chip de identification por radiofrecuencia en el interior del molde de inyeccion, de forma que no quede adosado a una de las paredes del molde, ya que en este caso el dispositivo no quedaria alojado y totalmente sellado en el interior de la etiqueta del precinto.A first drawback is the arrangement and fastening of the radiofrequency identification device or chip inside the injection mold, so that it is not attached to one of the mold walls, since in this case the device would not be fully and fully housed. sealed inside the seal label.

Otro inconveniente es que durante la inyeccion del plastico en el interior del molde el dispositivo o chip de identificacion puede ser desplazado contra una pared del molde, no pudiendo garantizarse que dicho dispositivo quede totalmente integrado y recubierto en el cuerpo de material plastico obtenido.Another drawback is that during the injection of the plastic into the mold the identification device or chip can be moved against a wall of the mold, it cannot be guaranteed that said device is fully integrated and covered in the body of obtained plastic material.

Description de la invention.Description of the invention.

Para solventar los inconvenientes mencionados se ha desarrollado el procedimiento de fabrication de precintos de seguridad con un chip de identificacion incorporado; y mas concretamente de precintos de seguridad que dispongan de un cuerpo provisto de un apendice flexible de cierre y de un pasaje de retention para la introduction y bloqueo del extremo libre del apendice flexible formando un bucle cerrado.To solve the aforementioned problems, the manufacturing process for security seals with a built-in identification chip has been developed; and more specifically security seals that have a body provided with a flexible closing appendix and a retention passage for the introduction and blocking of the free end of the flexible appendix forming a closed loop.

Este procedimiento presenta unas caracteristicas orientadas facilitar la integration del chip de identificacion en el cuerpo del precinto, y la colocacion del chip en una position predeterminada en el interior de un molde de inyeccion del precinto; garantizando que se mantenga en dicha posicion predeterminada, separado de las paredes del molde, desde su colocacion hasta la finalizacion de la inyeccion y consiguientemente de la fabricacion del precinto.This procedure has oriented characteristics to facilitate the integration of the identification chip in the body of the seal, and the placement of the chip in a predetermined position inside a mold for injection of the seal; guaranteeing that it remains in said predetermined position, separated from the mold walls, from its placement to the end of the injection and consequently of the manufacture of the seal.

Para ello, y el procedimiento de la invencion comprende las fases siguientes:For this, and the process of the invention comprises the following phases:

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a) la fabrication de una lamina de material plastico, provista de unas zonas de rotura que delimitan en dicha lamina una serie de placas separables, de una superficie igual o inferior a la del cuerpo del precinto a fabricar;a) the manufacture of a sheet of plastic material, provided with breakage zones that delimit in said sheet a series of separable plates, with a surface equal to or less than that of the body of the seal to be manufactured;

b) el posicionamiento y fijacion sobre cada una de las placas de la lamina de un chip de identificacion por radiofrecuencia;b) the positioning and fixation on each of the plates of the sheet of a radiofrequency identification chip;

c) la disposicion de las placas con los respectivos chips de identificacion en respectivas cavidades de un molde de inyeccion adecuado para la fabricacion de precintos; y la inyeccion en el molde de un material plastico a una temperatura superior a la temperatura de fusion de las placas, de modo que cada placa quede fundida en el cuerpo de un precinto, formando parte del mismo y que cada chip de identification quede integrado en el interior del cuerpo del precinto;c) the arrangement of the plates with the respective identification chips in respective cavities of an injection mold suitable for the manufacture of seals; and the injection into the mold of a plastic material at a temperature higher than the melting temperature of the plates, so that each plate is fused into the body of a seal, forming part of it and that each identification chip is integrated into the inside of the body of the seal;

La inyeccion de material plastico en el molde se realiza a una temperatura comprendida entre 300 °C y 350°C. y preferiblemente a 330°, adecuada para provocar que la placa portadora del chip de identificacion se funda al menos parcialmente y quede totalmente integrada en el cuerpo del precinto, formando una pieza unica con el mismo.The injection of plastic material into the mold is carried out at a temperature between 300 ° C and 350 ° C. and preferably at 330 °, suitable to cause the identification chip carrier plate to at least partially melt and be fully integrated into the body of the seal, forming a single piece therewith.

Las placas actuan inicialmente como soportes de los respectivos chips de identificacion por radiofrecuencia, garantizando que los chips queden distanciados de la superficie exterior del cuerpo de los precintos fabricados y por tanto totalmente recubiertos por el material plastico.The plates initially act as supports of the respective radiofrequency identification chips, ensuring that the chips are distanced from the outer surface of the body of the seals manufactured and therefore fully covered by the plastic material.

En esta invention se ha previsto que la colocation y fijacion de los chips de identificacion sobre las placas que actuan de soporte de los mismos se realice automaticamente y por pegado, recurriendo para ello a la utilizacion de unos chips de identificacion provistos de una capa de material autoadhesivo.In this invention it has been provided that the placement and fixing of the identification chips on the plates that act as support thereof is done automatically and by gluing, using for this purpose the use of identification chips provided with a layer of material self adhesive

Description de las figuras.Description of the figures.

Para complementar la descripcion que se esta realizando y con objeto de facilitar la comprension de las caracteristicas de la invencion, se acompana a la presente memoria descriptiva un juego de dibujos en los que, con caracter ilustrativo y noTo complement the description that is being made and in order to facilitate the understanding of the features of the invention, a set of drawings is attached to the present specification in which, for illustrative purposes and not

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limitativo, se ha representado lo siguiente:limiting, the following has been represented:

- La figura 1a, 1b y 1c representan esquematicamente las sucesivas fases del- Figure 1a, 1b and 1c schematically represent the successive phases of the

procedimiento de fabrication de precintos de seguridad con un chip demanufacturing procedure for security seals with a chip

identification incorporadobuilt-in identification

- La figura 2 representa una vista parcial en planta de un grupo de precintos obtenidos por moldeo y cuyos cuerpos integran un placa portador del correspondiente chip de identificacion.- Figure 2 represents a partial plan view of a group of seals obtained by molding and whose bodies comprise a carrier plate of the corresponding identification chip.

Realization preferida de la invention.Preferred embodiment of the invention.

Como se muestra esquematicamente en las figuras 1a, 1b y 1c el procedimiento de la invencion para la fabricacion de precintos de seguridad (1) que comprenden un cuerpo (11) provisto de un apendice flexible (12) de cierre y de un pasaje (13) de retention para la introduction y bloqueo del extremo libre del apendice flexible (12) formando un bucle cerrado, comprende inicialmente la fabricacion de una lamina (2) de material plastico, representada en la figura 1, provista de unas zonas de rotura (21) que delimitan en dicha lamina (2) una serie de placas (22) separables, de una superficie igual o inferior a la del cuerpo (11) del precinto a fabricar:As shown schematically in Figures 1a, 1b and 1c the method of the invention for the manufacture of security seals (1) comprising a body (11) provided with a flexible appendix (12) for closing and a passage (13 ) of retention for the introduction and blocking of the free end of the flexible appendix (12) forming a closed loop, initially comprises the manufacture of a sheet (2) of plastic material, represented in Figure 1, provided with breakage zones (21 ) delimiting in said sheet (2) a series of separable plates (22), of a surface equal to or less than that of the body (11) of the seal to be manufactured:

A continuation y tal como se representa en la figura 1b, se lleva a cabo el posicionamiento y fijacion sobre cada una de las placas (22) de la lamina (2) de un chip de identificacion (3) por radiofrecuencia. En este ejemplo los chips de identificacion (3) comprenden una capa de material autoadhesivo para su fijacion sobre las respectivas placas (22).Next, and as shown in Figure 1b, positioning and fixing on each of the plates (22) of the sheet (2) of an identification chip (3) by radiofrequency is carried out. In this example, the identification chips (3) comprise a layer of self-adhesive material for fixing on the respective plates (22).

Finalmente se disponen las placas (22) con los respectivos chips de identificacion (3) en respectivas cavidades de un molde de inyeccion adecuado para la fabricacion de precintos; y se realiza la inyeccion en el molde de un material plastico a una temperatura superior a la temperatura de fusion de las placas, en este caso concreto , de modo que cada placa quede fundida en el cuerpo (11) de un precinto formando parte del mismo y cada chip de identificacion (3) quede integrado en el interior del cuerpo del precinto tal como se muestra en la figuras ;Finally, the plates (22) with the respective identification chips (3) are arranged in respective cavities of an injection mold suitable for the manufacture of seals; and the injection into the mold of a plastic material is carried out at a temperature higher than the melting temperature of the plates, in this particular case, so that each plate is fused in the body (11) of a seal forming part of it and each identification chip (3) is integrated into the interior of the seal body as shown in the figures;

Mediante la utilization de un molde con de cavidades multiples es posible fabricar simultaneamente un grupo de precintos de seguridad (1), como los representados parcialmente en la figura 2, colocando en el interior del molde la lamina (2) de la figura 1a y una vez posicionado sobre cada una de sus placas (22) el 5 correspondiente chip de identification (3) por radiofrecuencia.By using a mold with multiple cavities it is possible to simultaneously manufacture a group of safety seals (1), such as those partially represented in Figure 2, placing the sheet (2) of Figure 1a and a mold inside the mold once positioned on each of its plates (22) the corresponding identification chip (3) by radiofrequency.

Cabe mencionar que en esta figura 2 se ha representado el contorno de las placas (22) para una mejor comprension, aunque realmente dichas placas (22) quedan fundidas e integradas en el cuerpo (11) de los precintos (1).It is worth mentioning that in this figure 2 the outline of the plates (22) has been represented for a better understanding, although said plates (22) are actually fused and integrated in the body (11) of the seals (1).

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Una vez descrita suficientemente la naturaleza de la invention, asi como un ejemplo de realization preferente, se hace constar a los efectos oportunos que los materiales, forma, tamano y disposition de los elementos descritos podran ser modificados, siempre y cuando ello no suponga una alteration de las caracteristicas 15 esenciales de la invencion que se reivindican a continuation.Once the nature of the invention has been sufficiently described, as well as an example of preferred realization, it is stated to the appropriate effects that the materials, shape, size and disposition of the described elements may be modified, provided that this does not imply an alteration of the essential features of the invention that are claimed below.

Claims (2)

55 1010 15fifteen 20twenty 2525 3030 REIVINDICACIONES 1. Procedimiento de fabrication de precintos de seguridad con un chip de identification incorporado; comprendiendo dichos precintos (1) un cuerpo (11) provisto de un apendice flexible (12) de cierre y de un pasaje (13) de retention para la introduction y bloqueo del extremo libre del apendice flexible (12) formando un bucle cerrado; caracterizado porque comprende:1. Procedure for manufacturing security seals with a built-in identification chip; said seals (1) comprising a body (11) provided with a flexible appendix (12) for closing and a retention passage (13) for the introduction and blocking of the free end of the flexible appendix (12) forming a closed loop; characterized in that it comprises: - la fabricacion de una lamina (2) de material plastico, provista de unas zonas de rotura (21) que delimitan en dicha lamina (2) una serie de placas (22) separables, de una superficie igual o inferior a la del cuerpo (11) del precinto a fabricar;- the manufacture of a sheet (2) of plastic material, provided with breakage zones (21) that delimit in said sheet (2) a series of separable plates (22), of an area equal to or less than that of the body ( 11) of the seal to be manufactured; - el posicionamiento y fijacion sobre cada una de las placas (22) de la lamina (2) de un chip de identificacion (3) por radiofrecuencia;- the positioning and fixing on each of the plates (22) of the sheet (2) of an identification chip (3) by radiofrequency; - la disposition de las placas (22) con los respectivos chips de identificacion (3) en respectivas cavidades de un molde de inyeccion adecuado para la fabricacion de precintos (1); y la inyeccion en el molde de un material plastico a una temperatura superior a la temperatura de fusion de las placas (22), de modo que cada placa quede fundida en el cuerpo (11) de un precinto, formando parte del mismo y cada chip de identificacion (3) quede integrado en el interior del cuerpo (11) del precinto (1).- the arrangement of the plates (22) with the respective identification chips (3) in respective cavities of an injection mold suitable for the manufacture of seals (1); and the injection into the mold of a plastic material at a temperature higher than the melting temperature of the plates (22), so that each plate is fused in the body (11) of a seal, forming part of it and each chip identification (3) is integrated inside the body (11) of the seal (1). 2. - Procedimiento, segun la revindication 1, caracterizado porque la inyeccion de material plastico en el molde se realiza a una temperatura comprendida entre 300°C. y 350°C. y preferiblemente a 330°C. se funde la placa (22) de forma que queda totalmente integrada en el cuerpo (11) del precinto, formando una unica pieza con el mismo.2. - Procedure, according to revindication 1, characterized in that the injection of plastic material into the mold is carried out at a temperature between 300 ° C. and 350 ° C. and preferably at 330 ° C. the plate (22) is melted so that it is fully integrated in the body (11) of the seal, forming a single piece with it.
ES201531054A 2015-07-17 2015-07-17 Manufacturing procedure for security seals with a built-in identification chip Active ES2597330B1 (en)

Priority Applications (1)

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ES201531054A ES2597330B1 (en) 2015-07-17 2015-07-17 Manufacturing procedure for security seals with a built-in identification chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES201531054A ES2597330B1 (en) 2015-07-17 2015-07-17 Manufacturing procedure for security seals with a built-in identification chip

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ES2597330A1 true ES2597330A1 (en) 2017-01-17
ES2597330B1 ES2597330B1 (en) 2017-10-13

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000026856A2 (en) * 1998-10-29 2000-05-11 Intermec Ip Corp. Radio frequency identification system
EP1768080A1 (en) * 2004-07-05 2007-03-28 Brooks/Todo Seguridad en Espana, S.A. Security seal with incorporated chip
EP1884889A2 (en) * 2006-07-28 2008-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
ES1133856U (en) * 2014-10-23 2014-11-21 Royal Pack Productos De Seguridad S.L. Label with radiofrequency device for security seals (Machine-translation by Google Translate, not legally binding)

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000026856A2 (en) * 1998-10-29 2000-05-11 Intermec Ip Corp. Radio frequency identification system
EP1768080A1 (en) * 2004-07-05 2007-03-28 Brooks/Todo Seguridad en Espana, S.A. Security seal with incorporated chip
EP1884889A2 (en) * 2006-07-28 2008-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
ES1133856U (en) * 2014-10-23 2014-11-21 Royal Pack Productos De Seguridad S.L. Label with radiofrequency device for security seals (Machine-translation by Google Translate, not legally binding)

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