EP3588672A1 - Circuit board from a mounting area for electronic components and a circuit board antenna - Google Patents

Circuit board from a mounting area for electronic components and a circuit board antenna Download PDF

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Publication number
EP3588672A1
EP3588672A1 EP19182282.4A EP19182282A EP3588672A1 EP 3588672 A1 EP3588672 A1 EP 3588672A1 EP 19182282 A EP19182282 A EP 19182282A EP 3588672 A1 EP3588672 A1 EP 3588672A1
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EP
European Patent Office
Prior art keywords
circuit board
radiator
printed circuit
conductor
insulating layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19182282.4A
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German (de)
French (fr)
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EP3588672B1 (en
Inventor
Anatoli Stobbe
Andreas Werner
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Astra Gesellschaft fuer Asset Management mbH and Co KG
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Astra Gesellschaft fuer Asset Management mbH and Co KG
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Publication of EP3588672A1 publication Critical patent/EP3588672A1/en
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Publication of EP3588672B1 publication Critical patent/EP3588672B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
    • H01Q5/328—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors between a radiating element and ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
    • H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching

Definitions

  • the invention relates to a printed circuit board consisting of an assembly area for electronic components and a circuit board antenna according to the preamble of claim 1.
  • Planar antennas are often placed as a structure on a printed circuit board, for example PIF antennas (Planar Inverted F-Shaped Antenna).
  • PIF antennas Planar Inverted F-Shaped Antenna
  • the disadvantage of these antennas is that as miniaturization progresses, the currents only flow in the edges and the field strengths of the fields in the circuit board material become relatively high. This results in high losses.
  • the invention is based on the object of designing a printed circuit board from an assembly area for electronic components and a circuit board antenna such that the losses of the circuit board antenna are reduced.
  • the configuration of the circuit board antenna with two congruently opposite conductor tracks on an insulating layer and the conductive layers between the edges of the conductor tracks results in a closed rectangular jacket made of electrically conductive material around a rectangular core made of insulating material.
  • the electrical current is no longer restricted to the edges of the conductor tracks, but can spread throughout the entire conductive sheath. Since the insulating layer of the printed circuit board is separated along the edges of the radiator between the ends of the radiator, the electrical field of the radiator can escape into a space in which there is no lossy dielectric in the form of the insulating material, at least in the immediate vicinity. Due to the current displacement effect at high frequencies, the penetration depth in the electrically conductive material is also small, so that the layer thickness of the conductor tracks and the conductive layers on the sides represent an optimal conductor shape.
  • the design also takes advantage of manufacturing steps that are carried out anyway in a conventional printed circuit board production.
  • Most printed circuit boards are manufactured as double-sided printed circuit boards or multi-layer printed circuit boards.
  • the through-plating is made before the actual structuring of the conductor track image.
  • the conductive layer on the sides of the insulating layer is continuous and at the beginning and at the end of the radiator be interrupted by bores or millings with a clear width larger than a gap created by the separated and removed insulating layer of the printed circuit board.
  • the conductive layer can thus also be produced in the course of the printed circuit board production and can only be separated later from the other conductive material. All that is required is a hole or milling that must be slightly larger than the existing gap, whereby the drill or milling cutter is automatically centered by the existing gap.
  • the arrangement of the radiator of the circuit board antenna as adjoining the component area results in a very compact construction of the printed circuit board from the component area together with the circuit board antenna with low attenuation.
  • the radiator is preferably arranged on an outer side of the printed circuit board.
  • the radiator is exposed over an angular segment of almost 360 ° about the radiator axis, so that no damping of the electrical field component of the electromagnetic field by any conductive components of the printed circuit board can occur in this angular segment.
  • a capacitive or inductive trimmer can be arranged between the radiator and a conductor arranged on the component surface of the printed circuit board.
  • a capacitive or inductive trimmer can be arranged between a feed line and a feed connection of the radiator.
  • the board antenna can be precisely matched to the desired resonance frequency and input impedance, regardless of mechanical manufacturing parameters or tolerances.
  • a conductor can be arranged parallel to the radiator and facing the inside of the printed circuit board, which represents a capacitive coating to the radiator.
  • a mechanically shortened spotlight can be extended electrically using the capacitive covering.
  • the conductor representing a capacitive coating to the radiator comprises both opposite conductor tracks of the printed circuit board coated on both sides and the conductive layer on the side of the slot which runs parallel to the radiator.
  • the conductive layer also connects the opposite conductor tracks in an electrically conductive manner.
  • the conductor has a U-shaped sheath made of electrically conductive material around a core made of insulating material.
  • the conductive layers of the radiator and the capacitive coating face each other in parallel, so that the electrical component of the electromagnetic field can form in between and form a particularly high proportion of the capacitive coating.
  • the radiator can have a course deviating from a straight line.
  • the radiator can be adapted to the shape of a housing and the mechanical length of the radiator can be increased if the course deviates from a straight line.
  • the radiator can have a meandering course between its beginning and end.
  • the mechanical and electrical profile of the radiator can be extended between its beginning and end without extending its overall dimensions.
  • Fig. 1 shows a perspective view of a circular circuit board with a radiator 14.
  • the remaining surface of the circuit board can be provided as a mounting surface 46 for an individual circuit of electronic components, but for reasons of simplification does not contain an individual conductor track structure here.
  • the printed circuit board 12 is coated on both sides and the radiator 14 is separated from the mounting surface 46 by a milled gap 38.
  • the radiator 14 is meandering in the form of a circular section. This course was also created by milling.
  • the remaining surface forms conductor tracks 22 and 24 of the radiator 14.
  • the insulating layer lying between the conductor tracks 22 and 24 of the printed circuit board 12 is coated on its sides with a conductive layer 26 and 28 which, like the surfaces of the printed circuit board, can consist of copper.
  • the other side surfaces of the printed circuit board 12 are also coated with conductive layers.
  • a coupling arrangement is located at a start 16 of the radiator, while a tuning element can be arranged at the other end 18.
  • the conductor tracks 22 and 24 are interrupted by etching 42.
  • the conductive layers 26 and 28 on the side surfaces of the insulating layer are interrupted at the beginning 16 and end 18 of the radiator 14 by bores 44 or millings.
  • the remaining circuit board forms a conductor on the side facing the radiator 14, which consists of conductor tracks 34 and 36 of the circuit board material lying on both sides of the insulating material and a conductive layer 32 connecting the conductor tracks 34 and 36.
  • This capacitance coating, the meandering and the circular arc extend the mechanical length of the radiator 14 between its beginning 16 and its end 18 both mechanically and electrically.
  • a cross section through the radiator represents a closed rectangular jacket made of electrically conductive material around a rectangular core made of insulating material. Since the skin effect, which is effective at high frequencies, is anyway for a low penetration depth of the electrical component of the electromagnetic field into the conductive material ensures that the conductivity of the core is irrelevant and the jacket, which is rectangular in cross section, is thus optimally used.
  • Fig. 2 shows a schematic top view of copper-clad printed circuit board material 10 into which structures 20 are milled.
  • the arrows illustrate the paths in which the milling tool was moved.
  • the milling process creates slots, the side surfaces of which adjoin the copper cladding and the insulating material in between.
  • these side surfaces are provided with a conductive coating, which is realized by a metallization.
  • Fig. 3 shows the circuit board material after metallization of the side surfaces of the milled slots. For better visibility, the thickness of the metallization is drawn more strongly than its actual dimensions. The metallization is carried out in this step anyway in order to metallize bores for the connections of the components in order to contact and connect conductor tracks in several planes and / or on both sides of the circuit board together.
  • the conductor tracks are produced.
  • Fig. 4 shows an exposure mask for the structuring of the conductor tracks. This exposes a light-sensitive coating on the circuit board so that the exposed material can be removed by etching after development.
  • Fig. 5 shows resulting structures of the conductor tracks after the etching process.
  • the top view shows a remaining circuit pattern on a circuit board side 40 and remaining edge metallization 30.
  • the structure on the underside of the circuit board can differ in the area of the remaining circuit. Intermediate layers are also possible.
  • Fig. 6 shows a top view of the in Fig. 5 Printed circuit board, but with a milled outer contour of the radiator of the board antenna.
  • a milling path 50 is shown along an arrow.
  • bores 60 are shown, by means of which the lateral metallizations of the slots are separated in order to form the ends of the conductive regions.
  • Fig. 7 shows a plan view of a finished circuit board.
  • a transforming conductor loop 70 on the circuit board side 40 which has minimal losses due to the side metallization.
  • a spotlight is meandered by one Structure 80 formed, which offers a minimal ohmic loss due to the complete enclosure with conductive material.
  • An air gap 110 additionally improves efficiency, since there are no losses in the dielectric of the printed circuit board material.
  • Additional elements are formed by a feed 100 at one end of the radiator 80 and a separation 90 at the other end of the radiator.
  • a capacitor can be provided for tuning.
  • a reinforcement 120 can be provided to stabilize the circuit board material weakened by the slot.
  • Fig. 8 finally shows a section through the circuit board along an in Fig. 7 Section line 130 shown. Insulating and carrier material 140, copper coatings 150 and metallizations 160 are shown there. LIST OF REFERENCE NUMBERS 10 PCB material 60 drilling 12 circuit board 70 conductor loop 14 spotlight 80 structure 16 Beginning 90 separation 18 The End 100 feed 20 structures 110 air gap 22 conductor path 120 reinforcement 24 conductor path 130 intersection 26 conductive layer 140 Insulating and carrier material 28 conductive layer 150 copper coatings 30 Edge plating 160 metallization 32 conductive layer 34 conductor path 36 conductor path 38 gap 40 PCB side 42 etchings 44 drilling 46 mounting area 50 toolpath

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  • Structure Of Printed Boards (AREA)
  • Waveguide Aerials (AREA)

Abstract

Es wird eine Leiterplatte aus einer Bestückungsfläche für elektronische Bauteile und einer Platinenantenne beschrieben.Die Platinenantenne umfasst einen Strahler (14), der aus zwei deckungsgleich auf einer Isolierschicht gegenüberliegende Leiterbahnen (22, 24) einer beidseitig leitfähig beschichteten Leiterplatte (12) besteht. Die Isolierschicht ist an den Kanten des Strahlers (14) mit jeweils einer weiteren leitfähigen Schicht (26, 28) beschichtet. Alle leitfähigen Schichten (22, 24, 26, 28) sind elektrisch leitend verbunden, derart, dass ein Querschnitt durch den Strahler (14) einen geschlossenen rechteckigen Mantel aus elektrisch leitfähigem Material um einen rechteckigen Kern aus Isoliermaterial darstellt. Zwischen wenigstens einer Kante des Strahlers (14), die an die Bestückungsfläche angrenzt, befindet sich ein Spalt (38). Am Anfang (16) und am Ende (18) des Strahlers (14) ist die weitere leitfähige Schicht (26, 28) durch Bohrungen (44) oder Fräsungen mit einer lichten Weite größer als ein durch die aufgetrennte und entfernte Isolierschicht der Leiterplatte (12) entstandenen Spalt (38) unterbrochen ist.A circuit board consisting of a mounting surface for electronic components and a circuit board antenna is described. The circuit board antenna comprises a radiator (14), which consists of two congruently opposed conductor tracks (22, 24) of a circuit board (12) with a conductive coating on both sides. The insulating layer is coated on the edges of the radiator (14) with a further conductive layer (26, 28). All conductive layers (22, 24, 26, 28) are connected in an electrically conductive manner in such a way that a cross section through the radiator (14) represents a closed rectangular jacket made of electrically conductive material around a rectangular core made of insulating material. There is a gap (38) between at least one edge of the radiator (14) which adjoins the mounting surface. At the beginning (16) and at the end (18) of the radiator (14) the further conductive layer (26, 28) is larger than the one created by the separated and removed insulating layer of the printed circuit board (12) through holes (44) or millings ) resulting gap (38) is interrupted.

Description

Die Erfindung betrifft eine Leiterplatte aus einer Bestückungsfläche für elektronische Bauteile und einer Platinenantenne nach dem Oberbegriff des Anspruchs 1.The invention relates to a printed circuit board consisting of an assembly area for electronic components and a circuit board antenna according to the preamble of claim 1.

Planare Antennen werden häufig als Struktur auf eine Leiterplatte gebracht, zum Beispiel PIF-Antennen (Planar Inverted F-Shaped Antenna). Diese Antennen haben den Nachteil, dass die Ströme bei fortschreitender Miniaturisierung nur in den Kanten fließen und die Feldstärken der Felder im Leiterplattenmaterial relativ hoch werden. Dadurch ergeben sich hohe Verluste.Planar antennas are often placed as a structure on a printed circuit board, for example PIF antennas (Planar Inverted F-Shaped Antenna). The disadvantage of these antennas is that as miniaturization progresses, the currents only flow in the edges and the field strengths of the fields in the circuit board material become relatively high. This results in high losses.

Der Erfindung liegt die Aufgabe zugrunde, eine Leiterplatte aus einer Bestückungsfläche für elektronische Bauteile und einer Platinenantenne dahingehend zu gestalten, dass die Verluste der Platinenantenne geringer werden.The invention is based on the object of designing a printed circuit board from an assembly area for electronic components and a circuit board antenna such that the losses of the circuit board antenna are reduced.

Diese Aufgabe wird bei einer Leiterplatte nach dem Oberbegriff des Anspruchs 1 durch die Merkmale dieses Anspruchs gelöst.This object is achieved in a printed circuit board according to the preamble of claim 1 by the features of this claim.

Weiterbildungen und vorteilhafte Ausgestaltungen ergeben sich aus den Unteransprüchen.Further developments and advantageous refinements result from the subclaims.

Durch die Ausgestaltung der Platinenantenne mit zwei deckungsgleich auf einer Isolierschicht gegenüberliegende Leiterbahnen und den leitfähigen Schichten zwischen den Kanten der Leiterbahnen ergibt sich ein geschlossener rechteckiger Mantel aus elektrisch leitfähigem Material um einen rechteckigen Kern aus Isoliermaterial. Der elektrische Strom ist jetzt nicht mehr auf die Kanten der Leiterbahnen beschränkt, sondern kann sich im gesamten leitfähigen Mantel ausbreiten. Da zwischen den Enden des Strahlers die Isolierschicht der Leiterplatte entlang der Kanten des Strahlers aufgetrennt ist, kann das elektrische Feld des Strahlers in einen Raum austreten, in dem zumindest in unmittelbarer Nähe kein verlustbehaftetes Dielektrikums in Form des Isoliermaterials vorhanden ist. Aufgrund des Stromverdrängungseffekts bei hohen Frequenzen ist zudem die Eindringtiefe im elektrisch leitfähigen Material gering, so dass bereits die Schichtdicke der Leiterbahnen und der leitfähigen Schichten an den Seiten eine optimale Leiterform darstellen.The configuration of the circuit board antenna with two congruently opposite conductor tracks on an insulating layer and the conductive layers between the edges of the conductor tracks results in a closed rectangular jacket made of electrically conductive material around a rectangular core made of insulating material. The electrical current is no longer restricted to the edges of the conductor tracks, but can spread throughout the entire conductive sheath. Since the insulating layer of the printed circuit board is separated along the edges of the radiator between the ends of the radiator, the electrical field of the radiator can escape into a space in which there is no lossy dielectric in the form of the insulating material, at least in the immediate vicinity. Due to the current displacement effect at high frequencies, the penetration depth in the electrically conductive material is also small, so that the layer thickness of the conductor tracks and the conductive layers on the sides represent an optimal conductor shape.

Die Ausgestaltung nutzt zudem Fertigungsschritte aus, die bei einer üblichen Leiterplattenfertigung ohnehin ausgeführt werden. So werden die meisten Leiterplatten als doppelseitige Leiterplatte oder mehrlagige Leiterplatte hergestellt. In diesem Prozess werden vor dem eigentlichen Strukturieren des Leiterbahnenbildes die Durchkontaktierungen gefertigt. In diesem Prozess können auch beliebig geformte Durchkontaktierungen und auch Schlitze, die mit realisiert werden, gefertigt werden. Es lassen sich so leitende Strukturen fertigen, die die Dicke der Leiterplatte haben und somit eine bessere Stromverteilung bieten.The design also takes advantage of manufacturing steps that are carried out anyway in a conventional printed circuit board production. Most printed circuit boards are manufactured as double-sided printed circuit boards or multi-layer printed circuit boards. In this The through-plating is made before the actual structuring of the conductor track image. In this process it is also possible to manufacture through-contacts of any shape and also slots which are also realized. In this way, conductive structures can be produced that have the thickness of the printed circuit board and thus offer better current distribution.

Die leitfähige Schicht an den Seiten der Isolierschicht ist durchgehend vorhanden und am Anfang und am Ende des Strahlers durch Bohrungen oder Fräsungen mit einer lichten Weite größer als ein durch die aufgetrennte und entfernte Isolierschicht der Leiterplatte entstandenen Spalt unterbrochen sein.The conductive layer on the sides of the insulating layer is continuous and at the beginning and at the end of the radiator be interrupted by bores or millings with a clear width larger than a gap created by the separated and removed insulating layer of the printed circuit board.

Die leitfähige Schicht kann so im Rahmen der Leiterplattenfertigung mit hergestellt werden und erst später gezielt vom übrigen leitfähigen Material getrennt werden. Dabei ist lediglich eine Bohrung oder Fräsung nötig, die etwas größer als der bereits vorhandene Spalt sein muss, wodurch der Bohrer oder Fräser durch den vorhandenen Spalt automatisch zentriert wird.The conductive layer can thus also be produced in the course of the printed circuit board production and can only be separated later from the other conductive material. All that is required is a hole or milling that must be slightly larger than the existing gap, whereby the drill or milling cutter is automatically centered by the existing gap.

Durch die Anordnung des Strahlers der Platinenantenne als an die Bestückungsfläche angrenzend, wird ein sehr kompakter Aufbau der Leiterplatte aus der Bestückungsfläche zusammen mit Platinenantenne bei geringer Dämpfung erzielt.The arrangement of the radiator of the circuit board antenna as adjoining the component area results in a very compact construction of the printed circuit board from the component area together with the circuit board antenna with low attenuation.

Vorzugsweise ist der Strahler an einer Außenseite der Leiterplatte angeordnet.The radiator is preferably arranged on an outer side of the printed circuit board.

Dadurch liegt der Strahler über ein Winkelsegment von fast 360° um die Strahlerachse frei, so dass in diesem Winkelsegment keine Dämpfung der elektrischen Feldkomponente des elektromagnetischen Feldes durch irgendwelche leitfähigen Bestandteile der Leiterplatte eintreten kann.As a result, the radiator is exposed over an angular segment of almost 360 ° about the radiator axis, so that no damping of the electrical field component of the electromagnetic field by any conductive components of the printed circuit board can occur in this angular segment.

Gemäß einer Weiterbildung kann wischen dem Strahler und einem auf der Bestückungsfläche der Leiterplatte angeordneten Leiter ein kapazitiver oder induktiver Trimmer angeordnet ist.According to a further development, a capacitive or inductive trimmer can be arranged between the radiator and a conductor arranged on the component surface of the printed circuit board.

Außerdem kann zwischen einer Speiseleitung und einem Speiseanschluss des Strahlers ein kapazitiver oder induktiver Trimmer angeordnet ist.In addition, a capacitive or inductive trimmer can be arranged between a feed line and a feed connection of the radiator.

Mittels dieser Maßnahmen kann unabhängig von mechanischen Fertigungsparametern oder Toleranzen eine genaue Abstimmung der Platinenantenne auf die gewünschte Resonanzfrequenz und Eingangsimpedanz vorgenommen werden,Using these measures, the board antenna can be precisely matched to the desired resonance frequency and input impedance, regardless of mechanical manufacturing parameters or tolerances.

Parallel zum Strahler und zur Innenseite der Leiterplatte weisend kann ein Leiter angeordnet sein, der einen kapazitiven Belag zum Strahler darstellt.A conductor can be arranged parallel to the radiator and facing the inside of the printed circuit board, which represents a capacitive coating to the radiator.

Ein mechanisch verkürzter Strahler kann so über den kapazitiven Belag elektrisch verlängert werden.A mechanically shortened spotlight can be extended electrically using the capacitive covering.

Bei einer praktischen Ausgestaltung umfasst der einen kapazitiven Belag zum Strahler darstellende Leiter sowohl gegenüberliegende Leiterbahnen der beidseitig beschichteten Leiterplatte als auch die leitfähige Schicht an der Seite des Schlitzes, die parallel zum Strahler verläuft. Die leitfähige Schicht verbindet außerdem die gegenüberliegenden Leiterbahnen elektrisch leitend. Hier weist der Leiter einen U-förmigen Mantel aus elektrisch leitfähigem Material um einen Kern aus Isoliermaterial auf.In a practical embodiment, the conductor representing a capacitive coating to the radiator comprises both opposite conductor tracks of the printed circuit board coated on both sides and the conductive layer on the side of the slot which runs parallel to the radiator. The conductive layer also connects the opposite conductor tracks in an electrically conductive manner. Here the conductor has a U-shaped sheath made of electrically conductive material around a core made of insulating material.

Dadurch stehen sich die leitfähigen Schichten des Strahlers und des kapazitiven Belags parallel gegenüber, so dass sich dazwischen die elektrische Komponente des elektromagnetischen Feldes ausbilden kann und einen besonders hohen Anteil des kapazitiven Belags bildet.As a result, the conductive layers of the radiator and the capacitive coating face each other in parallel, so that the electrical component of the electromagnetic field can form in between and form a particularly high proportion of the capacitive coating.

Ferner kann der Strahler einen von einer Geraden abweichenden Verlauf aufweisen.Furthermore, the radiator can have a course deviating from a straight line.

Dadurch kann der Strahler an die Form eines Gehäuses angepasst werden und bei einem von einer Geraden abweichenden Verlauf die mechanische Länge des Strahlers vergrößert werden.As a result, the radiator can be adapted to the shape of a housing and the mechanical length of the radiator can be increased if the course deviates from a straight line.

Gemäß einer Weiterbildung kann der Strahler zwischen seinem Anfang und Ende einen mäanderförmigen Verlauf aufweisen.According to a further development, the radiator can have a meandering course between its beginning and end.

Hierdurch kann der mechanische und elektrische Verlauf des Strahlers zwischen seinem Anfang und Ende verlängert werden, ohne dessen Gesamtabmessungen zu verlängern.As a result, the mechanical and electrical profile of the radiator can be extended between its beginning and end without extending its overall dimensions.

Nachfolgend wird die Erfindung anhand eines Ausführungsbeispiels erläutert, das in der Zeichnung dargestellt ist. Darin zeigen:

Fig. 1
eine perspektivische Ansicht einer kreisförmigen Leiterplatte mit einer Bestückungsfläche und einer Platinenantenne,
Fig. 2
eine schematische Draufsicht auf kupferkaschiertes Leiterplattenmaterial, in das Strukturen gefräst werden,
Fig. 3
das Leiterplattenmaterial nach Metallisierung der Seitenflächen der gefrästen Schlitze,
Fig. 4
eine Draufsicht auf eine Belichtungsmaske für die Strukturierung der Leiterbahnen,
Fig. 5
eine Draufsicht auf die Leiterplatte mit resultierenden Strukturen nach einem Ätzprozess,
Fig. 6
eine Draufsicht auf die Leiterplatte mit gefräster Außenkontur des Strahlers einer Antenne und Bohrungen zur Unterbrechung der Metallisierung von Seitenflächen,
Fig. 7
eine Draufsicht auf eine fertige Leiterplatte und
Fig. 8
einen Schnitt durch die Leiterplatte nach Fig. 7 entlang einer Schnittlinie
The invention is explained below using an exemplary embodiment which is illustrated in the drawing. In it show:
Fig. 1
1 shows a perspective view of a circular printed circuit board with a mounting surface and a circuit board antenna,
Fig. 2
1 shows a schematic top view of copper-clad printed circuit board material into which structures are milled,
Fig. 3
the circuit board material after metallization of the side surfaces of the milled slots,
Fig. 4
a plan view of an exposure mask for structuring the conductor tracks,
Fig. 5
3 shows a plan view of the printed circuit board with resulting structures after an etching process,
Fig. 6
2 shows a plan view of the printed circuit board with milled outer contour of the antenna radiator and bores for interrupting the metallization of side surfaces,
Fig. 7
a top view of a finished circuit board and
Fig. 8
a section through the circuit board Fig. 7 along a cutting line

Fig. 1 zeigt eine perspektivische Ansicht einer kreisförmigen Leiterplatte mit einem Strahler 14. Die übrige Fläche der Leiterplatte kann als Bestückungsfläche 46 für eine individuelle Schaltung aus elektronischen Bauelementen vorgesehen sein, enthält aus Vereinfachungsgründen hier aber keine individuelle Leiterbahnenstruktur. Fig. 1 shows a perspective view of a circular circuit board with a radiator 14. The remaining surface of the circuit board can be provided as a mounting surface 46 for an individual circuit of electronic components, but for reasons of simplification does not contain an individual conductor track structure here.

Die Leiterplatte 12 ist doppelseitig beschichtet und der Strahler 14 ist durch einen gefrästen Spalt 38 von der Bestückungsfläche 46 getrennt. Der Strahler 14 ist in Form eines Kreisabschnitts gebogenen mäanderförmig ausgeführt. Auch dieser Verlauf ist durch Fräsungen entstanden. Die verbleibende Oberfläche bildet Leiterbahnen 22 und 24 des Strahlers 14 Die zwischen den Leiterbahnen 22 und 24 der Leiterplatte 12 liegende Isolierschicht ist an ihren Seiten jeweils mit einer leitfähigen Schicht 26 und 28 beschichtet, die wie die Oberflächen der Leiterplatte aus Kupfer bestehen kann. Auch die übrigen Seitenflächen der Leiterplatte 12 sind mit leitfähigen Schichten beschichtet. An einem Anfang 16 des Strahlers befindet sich eine Einkoppelanordnung, während am anderen Ende 18 ein Abstimmglied angeordnet sein kann. Am Ende 18 des Strahlers 14 sind die Leiterbahnen 22 und 24 durch Ätzungen 42 unterbrochen. Die leitfähigen Schichten 26 und 28 an den Seitenflächen der Isolierschicht sind am Anfang 16 und Ende 18 des Strahlers 14 hingegen durch Bohrungen 44 oder Fräsungen unterbrochen.The printed circuit board 12 is coated on both sides and the radiator 14 is separated from the mounting surface 46 by a milled gap 38. The radiator 14 is meandering in the form of a circular section. This course was also created by milling. The remaining surface forms conductor tracks 22 and 24 of the radiator 14. The insulating layer lying between the conductor tracks 22 and 24 of the printed circuit board 12 is coated on its sides with a conductive layer 26 and 28 which, like the surfaces of the printed circuit board, can consist of copper. The other side surfaces of the printed circuit board 12 are also coated with conductive layers. A coupling arrangement is located at a start 16 of the radiator, while a tuning element can be arranged at the other end 18. At the end 18 of the radiator 14, the conductor tracks 22 and 24 are interrupted by etching 42. In contrast, the conductive layers 26 and 28 on the side surfaces of the insulating layer are interrupted at the beginning 16 and end 18 of the radiator 14 by bores 44 or millings.

Die übrige Leiterplatte bildet an der zum Strahler 14 weisenden Seite einen Leiter, der aus zu beiden Seiten des Isoliermaterials liegenden Leiterbahnen 34 und 36 des Leiterplattenmaterials und einer die Leiterbahnen 34 und 36 verbindenden leitfähigen Schicht 32 besteht. Hierdurch entsteht ein Kapazitätsbelag der Strahlers 14. Durch diesen Kapazitätsbelag, die Mäandrierung und den Kreisbogen ist die geometrische Länge des Strahlers 14 zwischen seinem Anfang 16 und seinem Ende 18 sowohl mechanisch als auch elektrisch verlängert.The remaining circuit board forms a conductor on the side facing the radiator 14, which consists of conductor tracks 34 and 36 of the circuit board material lying on both sides of the insulating material and a conductive layer 32 connecting the conductor tracks 34 and 36. This creates a capacitance coating on the radiator 14. This capacitance coating, the meandering and the circular arc extend the mechanical length of the radiator 14 between its beginning 16 and its end 18 both mechanically and electrically.

14 Ein Querschnitt durch den Strahler stellt einen geschlossenen rechteckigen Mantel aus elektrisch leitfähigem Material um einen rechteckigen Kern aus Isoliermaterial dar. Da der bei hohen Frequenzen wirksame Skineffekt ohnehin für eine geringe Eindringtiefe der elektrischen Komponente des elektromagnetischen Feldes in das leitfähige Material sorgt, ist die Leitfähigkeit des Kerns unerheblich und der im Querschnitt rechteckige Mantel wird somit optimal genutzt.14 A cross section through the radiator represents a closed rectangular jacket made of electrically conductive material around a rectangular core made of insulating material. Since the skin effect, which is effective at high frequencies, is anyway for a low penetration depth of the electrical component of the electromagnetic field into the conductive material ensures that the conductivity of the core is irrelevant and the jacket, which is rectangular in cross section, is thus optimally used.

In den folgenden Figuren wird anhand einer Leiterplatte der Herstellungsprozess bis zur Fertigstellung einer Platinenantenne dargestellt. Fig. 2 zeigt eine schematische Draufsicht auf kupferkaschiertes Leiterplattenmaterial 10, in das Strukturen 20 gefräst werden. Die Pfeile veranschaulichen, in welchen Bahnen das Fräswerkzeug bewegt wurde. Durch den Fräsvorgang entstehen Schlitze, deren Seitenflächen an die Kupferkaschierung und dazwischen das Isoliermaterial angrenzen. Diese Seitenflächen werden in einem nächsten Schritt mit einer leitfähigen Beschichtung versehen, die durch eine Metallisierung realisiert wird.In the following figures, the manufacturing process up to the completion of a circuit board antenna is shown using a printed circuit board. Fig. 2 shows a schematic top view of copper-clad printed circuit board material 10 into which structures 20 are milled. The arrows illustrate the paths in which the milling tool was moved. The milling process creates slots, the side surfaces of which adjoin the copper cladding and the insulating material in between. In a next step, these side surfaces are provided with a conductive coating, which is realized by a metallization.

Fig. 3 zeigt das Leiterplattenmaterial nach Metallisierung der Seitenflächen der gefrästen Schlitze. Zur besseren Sichtbarkeit ist die Dicke der Metallisierung stärker ausgeprägt gezeichnet als ihren wirklichen Abmessungen entspricht. Die Metallisierung wird in diesem Schritt ohnehin durchgeführt, um Bohrungen für die Anschlüsse der Bauteile zu metallisieren um Leiterbahnen in mehreren Ebenen und/oder auf beiden Seiten der Leiterplatte gemeinsam zu kontaktieren und zu verbinden. Fig. 3 shows the circuit board material after metallization of the side surfaces of the milled slots. For better visibility, the thickness of the metallization is drawn more strongly than its actual dimensions. The metallization is carried out in this step anyway in order to metallize bores for the connections of the components in order to contact and connect conductor tracks in several planes and / or on both sides of the circuit board together.

Nachdem die Kupferlagen an den Stellen der Bohrungen und der gefräster Schlitze durch die Metallisierung verbunden sind, werden die Leiterbahnen hergestellt.After the copper layers at the locations of the bores and the milled slots are connected by the metallization, the conductor tracks are produced.

Fig. 4 zeigt dazu eine Belichtungsmaske für die Strukturierung der Leiterbahnen. Hiermit wird eine lichtempfindliche Beschichtung der Leiterplatte belichtet, damit das belichtete Material nach der Entwicklung durch Ätzen entfernt werden kann. Fig. 4 shows an exposure mask for the structuring of the conductor tracks. This exposes a light-sensitive coating on the circuit board so that the exposed material can be removed by etching after development.

Fig. 5 zeigt resultierende Strukturen der Leiterbahnen nach dem Ätzprozess. Die Draufsicht zeigt ein verbleibendes Leiterbild auf einer Leiterplattenseite 40 und verbleibende Kantenmetallisierung 30. Die Struktur auf der Unterseite der Leiterplatte kann im Bereich der restlichen Schaltung abweichen. Zwischenlagen sind ebenfalls möglich. Fig. 5 shows resulting structures of the conductor tracks after the etching process. The top view shows a remaining circuit pattern on a circuit board side 40 and remaining edge metallization 30. The structure on the underside of the circuit board can differ in the area of the remaining circuit. Intermediate layers are also possible.

Fig. 6 zeigt eine Draufsicht auf die in Fig. 5 dargestellte Leiterplatte, jedoch mit gefräster Außenkontur des Strahlers der Platinenantenne. Eine Fräsbahn 50 ist entlang eines Pfeils dargestellt. Außerdem sind Bohrungen 60 dargestellt, mittels denen die seitlichen Metallisierungen der Schlitze aufgetrennt sind, um die Enden der leitfähigen Bereiche zu bilden. Fig. 6 shows a top view of the in Fig. 5 Printed circuit board, but with a milled outer contour of the radiator of the board antenna. A milling path 50 is shown along an arrow. In addition, bores 60 are shown, by means of which the lateral metallizations of the slots are separated in order to form the ends of the conductive regions.

Fig. 7 zeigt eine Draufsicht auf eine fertige Leiterplatte. Auf der Leiterplattenseite 40 befindet sich eine transformierende Leiterschleife 70, die aufgrund der Seitenmetallisierung minimale Verluste aufweist. Ein Strahler wird von einer mäandrierten Struktur 80 gebildet, die aufgrund der kompletten Umschließung mit leitfähigem Material einen minimalen ohmschen Verlust bietet. Ein Luftspalt 110 verbessert zusätzlich die Effizienz, da hier keine Verluste im Dielektrikum des Leiterplattenmaterials entstehen. Fig. 7 shows a plan view of a finished circuit board. There is a transforming conductor loop 70 on the circuit board side 40, which has minimal losses due to the side metallization. A spotlight is meandered by one Structure 80 formed, which offers a minimal ohmic loss due to the complete enclosure with conductive material. An air gap 110 additionally improves efficiency, since there are no losses in the dielectric of the printed circuit board material.

Zusätzliche Elemente sind durch eine Einspeisung 100 an einem Ende der Strahlers 80 und eine Trennung 90 am anderen Ende des Strahlers gebildet. Am Ende des Strahlers kann hier noch z. B. ein Kondensator zur Abstimmung vorgesehen werden. Zur Stabilisierung des durch den Schlitz geschwächten Leiterplattenmaterials kann eine Verstärkung 120 vorgesehen sein.Additional elements are formed by a feed 100 at one end of the radiator 80 and a separation 90 at the other end of the radiator. At the end of the spotlight, z. B. a capacitor can be provided for tuning. A reinforcement 120 can be provided to stabilize the circuit board material weakened by the slot.

Fig. 8 zeigt schließlich einen Schnitt durch die Leiterplatte entlang einer in Fig. 7 dargestellten Schnittlinie 130. Dargestellt sind dort Isolier- und Trägermaterial 140, Kupferbeschichtungen 150 und Metallisierungen 160. Bezugszeichenliste 10 Leiterplattenmaterial 60 Bohrungen 12 Leiterplatte 70 Leiterschleife 14 Strahler 80 Struktur 16 Anfang 90 Trennung 18 Ende 100 Einspeisung 20 Strukturen 110 Luftspalt 22 Leiterbahn 120 Verstärkung 24 Leiterbahn 130 Schnittlinie 26 leitfähige Schicht 140 Isolier- und Trägermaterial 28 leitfähige Schicht 150 Kupferbeschichtungen 30 Kantenmetallisierung 160 Metallisierungen 32 leitfähige Schicht 34 Leiterbahn 36 Leiterbahn 38 Spalt 40 Leiterplattenseite 42 Ätzungen 44 Bohrungen 46 Bestückungsfläche 50 Fräsbahn Fig. 8 finally shows a section through the circuit board along an in Fig. 7 Section line 130 shown. Insulating and carrier material 140, copper coatings 150 and metallizations 160 are shown there. LIST OF REFERENCE NUMBERS 10 PCB material 60 drilling 12 circuit board 70 conductor loop 14 spotlight 80 structure 16 Beginning 90 separation 18 The End 100 feed 20 structures 110 air gap 22 conductor path 120 reinforcement 24 conductor path 130 intersection 26 conductive layer 140 Insulating and carrier material 28 conductive layer 150 copper coatings 30 Edge plating 160 metallization 32 conductive layer 34 conductor path 36 conductor path 38 gap 40 PCB side 42 etchings 44 drilling 46 mounting area 50 toolpath

Claims (8)

Leiterplatte aus einer Bestückungsfläche für elektronische Bauteile und einer Platinenantenne mit einem als gedruckte Leiterbahn ausgeführten Strahler (14), der zwei deckungsgleich auf einer Isolierschicht gegenüberliegende Leiterbahnen (22, 24) einer beidseitig leitfähig beschichteten Leiterplatte (12) umfasst, wobei die Isolierschicht und die beidseitigen leitfähigen Schichten zwischen einem Anfang (16) und einem Ende (18) der Leiterbahnen (22, 24) entlang der Kanten des Strahlers (14) und beide Seiten der verbleibenden und die Leiterbahnen (22, 24) tragenden Isolierschicht zwischen den Kanten des Strahlers (14) mit jeweils einer weiteren leitfähigen Schicht (26, 28) beschichtet sind, die beide Leiterbahnen (22, 24) elektrisch leitend verbinden, derart, dass ein Querschnitt durch den Strahler (14) einen geschlossenen rechteckigen Mantel aus elektrisch leitfähigen Material um einen rechteckigen Kern aus Isoliermaterial darstellt, dadurch gekennzeichnet, dass wenigstens eine Kante des Strahlers (14) an die Bestückungsfläche angrenzt und eine Isolierschicht und deren beidseitigen leitfähigen Schichten zwischen der Kante des Strahlers und einer Kante der Bestückungsfläche unter Bildung eines Spalts (38) aufgetrennt und entfernt sind, dass die weiteren leitfähigen Schichten (26, 28) an den Seiten der Isolierschicht durchgehend vorhanden sind und am Anfang (16) und am Ende (18) des Strahlers (14) durch Bohrungen (44) oder Fräsungen mit einer lichten Weite größer als ein durch die aufgetrennte und entfernte Isolierschicht der Leiterplatte (12) entstandenen Spalt (38) unterbrochen ist.Printed circuit board comprising an assembly area for electronic components and a circuit board antenna with a radiator (14) designed as a printed conductor track, which comprises two conductor tracks (22, 24) of a printed circuit board (12) with a conductive coating on both sides, the insulating layer and the two sides conductive layers between a beginning (16) and an end (18) of the conductor tracks (22, 24) along the edges of the radiator (14) and both sides of the remaining insulating layer and the conductor tracks (22, 24) between the edges of the radiator ( 14) are each coated with a further conductive layer (26, 28) that connects the two conductor tracks (22, 24) in an electrically conductive manner, such that a cross section through the radiator (14) encloses a closed rectangular jacket made of electrically conductive material around a rectangular one Is core of insulating material, characterized in that at least one K ante of the radiator (14) adjoins the assembly surface and an insulating layer and its double-sided conductive layers between the edge of the emitter and an edge of the assembly surface are separated and removed to form a gap (38) that the other conductive Layers (26, 28) are continuously present on the sides of the insulating layer and at the beginning (16) and at the end (18) of the radiator (14) through bores (44) or millings with a clear width greater than that through the separated and removed Insulating layer of the printed circuit board (12) gap (38) is interrupted. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, dass der Strahler (14) an einer Außenseite der Leiterplatte (12) angeordnet ist.Printed circuit board according to claim 1, characterized in that the radiator (14) is arranged on an outside of the printed circuit board (12). Leiterplatte nach Anspruche 1 oder 2, dadurch gekennzeichnet, dass zwischen dem Strahler (14) und einem auf der Bestückungsfläche der Leiterplatte (12) angeordneten Leiter ein kapazitiver oder induktiver Trimmer angeordnet ist.Printed circuit board according to claim 1 or 2, characterized in that a capacitive or inductive trimmer is arranged between the radiator (14) and a conductor arranged on the component surface of the printed circuit board (12). Leiterplatte nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass zwischen einer Speiseleitung und einem Speiseanschluss des Strahlers (14) ein kapazitiver oder induktiver Trimmer angeordnet ist.Printed circuit board according to one of Claims 1 to 3, characterized in that a capacitive or inductive trimmer is arranged between a feed line and a feed connection of the radiator (14). Leiterplatte nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass parallel zum Strahler (14) und zur Bestückungsfläche der Leiterplatte (12) weisend ein Leiter angeordnet ist, der einen kapazitiven Belag zum Strahler (14) darstellt.Printed circuit board according to one of claims 1 to 4, characterized in that a conductor is arranged parallel to the radiator (14) and the component surface of the printed circuit board (12), which represents a capacitive coating to the radiator (14). Leiterplatte nach Anspruch 5, dadurch gekennzeichnet, dass der zur Bestückungsfläche der Leiterplatte (12) weisende Leiter gegenüberliegende Leiterbahnen (34, 36) der beidseitig beschichteten Leiterplatte (12) umfasst und dass die Seite der Isolierschicht, die an die zum Strahler (14) weisenden Kanten der Leiterbahnen (34, 36) angrenzt, mit einer leitfähigen Schicht (28) beschichtet sind, die beide Leiterbahnen (34, 36) elektrisch leitend verbindet, derart, dass ein Querschnitt durch den Leiter einen u-förmigen Mantel aus elektrisch leitfähigen Material um einen Kern aus Isoliermaterial darstellt.Printed circuit board according to Claim 5, characterized in that the conductor (34, 36) facing the assembly surface of the printed circuit board (12) comprises printed conductors (12) coated on both sides and that side of the insulating layer which faces the radiator (14) Edges of the conductor tracks (34, 36) adjoin, are coated with a conductive layer (28) that connects the two conductor tracks (34, 36) in an electrically conductive manner, such that a cross section through the conductor surrounds a U-shaped jacket made of electrically conductive material represents a core of insulating material. Leiterplatte nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass der Strahler (14) einen von einer Geraden abweichenden Verlauf aufweist.Printed circuit board according to one of claims 1 to 6, characterized in that the radiator (14) has a course deviating from a straight line. Leiterplatte nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass der Strahler (14) einen mäanderförmigen Verlauf aufweist.Printed circuit board according to one of claims 1 to 7, characterized in that the radiator (14) has a meandering course.
EP19182282.4A 2018-06-25 2019-06-25 Circuit board from a mounting area for electronic components and a circuit board antenna Active EP3588672B1 (en)

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DE202018103656.4U DE202018103656U1 (en) 2018-06-25 2018-06-27 PCB antenna

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EP3793023A1 (en) * 2019-09-11 2021-03-17 Imst Gmbh Multilayer printed circuit board including an antenna element, and manufacturing method of a multilayer printed circuit board antenna element

Citations (4)

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DE202004021054U1 (en) * 2003-06-19 2007-03-29 Lenovo (Singapore) Pte. Ltd. Antenna devices integrated with metallic display covers for computer equipment
DE202011106847U1 (en) * 2011-10-14 2011-11-02 Metrona Wärmemesser Union Gmbh Loop antenna for radio equipment
US20140203993A1 (en) * 2011-08-24 2014-07-24 Nec Corporation Antenna and electronic device
EP3261172A1 (en) * 2016-06-21 2017-12-27 Axis AB Pcb antenna

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202004021054U1 (en) * 2003-06-19 2007-03-29 Lenovo (Singapore) Pte. Ltd. Antenna devices integrated with metallic display covers for computer equipment
US20140203993A1 (en) * 2011-08-24 2014-07-24 Nec Corporation Antenna and electronic device
DE202011106847U1 (en) * 2011-10-14 2011-11-02 Metrona Wärmemesser Union Gmbh Loop antenna for radio equipment
EP3261172A1 (en) * 2016-06-21 2017-12-27 Axis AB Pcb antenna

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