EP3022689A1 - Electronic chip card - Google Patents
Electronic chip cardInfo
- Publication number
- EP3022689A1 EP3022689A1 EP14752284.1A EP14752284A EP3022689A1 EP 3022689 A1 EP3022689 A1 EP 3022689A1 EP 14752284 A EP14752284 A EP 14752284A EP 3022689 A1 EP3022689 A1 EP 3022689A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- chip card
- biometric
- electronic chip
- card according
- system carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
- G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
Definitions
- the invention relates to an electronic chip card with a multilayer structure, with
- a system carrier which comprises an electrically insulating substrate with conductor tracks arranged thereon,
- a semiconductor component which is designed to evaluate the signals of the biometric sensor and to store biometric data, wherein the semiconductor component is electrically conductively connected to one or more interconnects of the system carrier.
- An electronic chip card of the aforementioned type is known from WO 2013/019701 A1.
- a system carrier is provided on which various electronic components are located, including a biometric sensor, which may be, for example, a fingerprint sensor.
- a power supply circuit is provided, which supplies the biometric sensor and the microcontroller with energy.
- the power supply circuit preferably has an induction antenna which receives high-frequency electromagnetic fields from the environment of the chip card, wherein the induction voltage is used for power supply.
- the previously known electronic chip card has a multilayer construction, wherein the system carrier is embedded with the electronic components thereon between arranged on the top and bottom of the system carrier cover layers.
- the electronic chip card should be as simple as possible, inexpensive and can be produced in larger quantities.
- the invention starting from an electronic chip card of the type mentioned above in that the semiconductor device and the biometric sensor are arranged one above the other, preferably in a common housing, in which the semiconductor device is located below the biometric sensor, wherein the semiconductor device with the biometric Sensor forms a biometric module.
- the core idea of the invention is to combine the biometric sensor with the semiconductor component required for its control and scanning (for example in the form of a microcontroller) in a compact module. So that as little card surface is claimed, the semiconductor component is located below the biometric sensor. That is, the surfaces of the biometric sensor and the semiconductor device - in the direction perpendicular to the plane of the chip card - completely or partially overlap (preferably for the most part).
- the biometric sensor has on its upper side a sensor surface via which the biometric data of a user of the card is detected.
- a sensor surface via which the biometric data of a user of the card is detected.
- temperature- or pressure-sensitive or optical sensor elements for example transistors
- optical sensor elements for example transistors
- the user of the card places his finger on the sensor surface to detect the characteristic skin groove pattern of the fingerprint or pulls his finger over the sensor surface, depending on whether a matrix or a line sensor is installed.
- the sensor data is transmitted to the semiconductor device of the biometric module via suitable electrical connections.
- the semiconductor device evaluates the sensor data and compares it with the stored biometric data of the owner of the card.
- the sensor surface must be freely accessible on the card surface, so that the capture of the biometric data is possible.
- the semiconductor component for activating and interrogating the biometric sensor is located underneath the sensor, so that the area of the card claimed by the biometric sensor is used repeatedly, not only for the sensor surface but also for the electronic components for triggering and interrogation of the biometric sensor.
- the semiconductor device If the sensed sensor data is identical to the stored biometric data, the semiconductor device generates a signal indicating authentication. This can be used to unlock certain functions of the smart card, such as retrieving personal data of the user stored on the card.
- the personal data of the user may relate to medical data, such as pre-existing medical conditions or to a medication of the owner of the card
- the data may also relate to a patient order be used in other areas also beneficial, for example, to release financial transactions.
- the biometric sensor as already mentioned, a fingerprint sensor, wherein the top or bottom cover layer has a recess in the region of the sensor surface of the fingerprint sensor.
- the sensor surface is accessible on the surface of the chip card, so that the biometric data, here fingerprint data, can be detected.
- the recess in the capping layer further allows the biometric module to be inserted ("implanted") into the chip card after the leadframe is connected to the capping layers (for example, by heat laminating)
- the sensitive biometric module is subsequently inserted through the recess in the cover layer and connected in a suitably electrically conductive manner to the conductor tracks of the system carrier provided for this purpose.
- an induction antenna is provided, as well as an energy storage element and a power supply circuit connected to the induction antenna and the at least one energy storage element.
- the autonomous function of the biometric module ensures that the biometric data stored in the biometric module can not be read out via the reading device, since the card can be physically designed such that no data connection can be established between the biometric module and the reader.
- an energy storage element for example, an arrangement of one or more capacitors in question, which can be accommodated in a space-saving manner on the system carrier and can be electrically connected via the conductor tracks of the system carrier.
- the induction antenna can be formed in a preferred embodiment by interconnects of the system carrier.
- the induction antenna is suitable for supplying power to the biometric module, a solar element that converts light incident on the card surface into an electrical voltage.
- the power supply circuit is arranged in the common housing of the biometric module and thus forms an integral part of the biometric module.
- the power supply circuit is arranged in the common housing of the biometric module and thus forms an integral part of the biometric module.
- the power supply circuit is preferably constructed of three levels, of which the top level forms the biometric sensor, while the two underlying levels are formed by the semiconductor device for driving and interrogating the biometric sensor on the one hand and the power supply circuit on the other.
- the planes can each be realized by application-specific integrated circuits (ASIC), which are contacted in the vertical direction (perpendicular to the card plane) with each other directly via bond connections.
- a significant advantage is the small footprint of the realized in this way biometric module.
- Another advantage results from the fact that only a single interface to the other peripherals, which is located on the smart card, is required, for example, a single serial interface to Connection of the biometric module to a central microcontroller of the chip card.
- the biometric module is located within a recess of the system carrier. If the biometric module in the vertical direction, that is perpendicular to the plane of the chip card, take up a lot of space due to the height, it can be provided that the system carrier has a recess into which the biometric module is then inserted. In this embodiment, the biometric module can project beyond the system carrier up and down.
- the chip card can be designed such that it receives the biometric module at normal thickness (in accordance with the ISO standard applicable for chip cards).
- a fingerprint sensor integrated on a semiconductor substrate is used as the biometric sensor.
- So-called "wafer-level” fingerprint sensors eg in CMOS technology, with modularly integrated pixel matrix, interrogation electronics and interface components are commercially available in order to integrate them into the biometric module according to the invention without the thickness of the biometric module and thus the thickness of the card being the limit values exceeds the ISO standard, the semiconductor substrate of the fingerprint sensor can be reduced in thickness from the back of the wafer to a minimum of a few 100 ⁇ or even less than 100 ⁇ , for example by grinding or etching.This does not affect the function of the fingerprint sensor
- the electronic chip card according to the invention preferably has a contact module with electrical contacts arranged on a contact surface, wherein the top or bottom cover layer has a recess in the area of the contact surface Such a reading device can, as explained above, be used to read - after authentication by means of the biometric sensor - stored on the chip card data.
- the electronic chip card preferably has a microcontroller, which is connected in each case via one or more of the conductor tracks of the system carrier on the one hand to the contact module and on the other hand to the biometric module.
- the microcontroller can be a microcontroller customary for chip cards. This is connected according to the invention to the biometric module in order to perform the authentication described above before the owner data stored in the microcontroller can be queried via the reader.
- a display integrated in the card is provided.
- Data displays that can be integrated in electronic chip cards are known per se from the prior art. These can be used to advantage for the electronic chip card according to the invention to display data stored on the smart card after authentication by means of the biometric sensor, without the need for a reader.
- This embodiment ensures a special security, since it can be completely prevented that the data stored on the chip card data leave the card by electronic means in any way.
- the design of the chip card with integrated display in medical applications is advantageous.
- the data stored on the card such as pre-existing conditions or medication-related data, may be made available in an emergency situation, even if no suitable reader is present.
- biometric module Due to the large area of the integrated display takes up a lot of space on the chip card.
- the embodiment of the biometric module according to the invention which, as explained above, occupies very little space on the chip card, enables the combination of a biometric sensor with a display on a chip card. Due to the compact design of the biometric module, there is sufficient space not only for the display itself, but also for a battery or similar power supply with sufficient capacity to operate the display.
- the card according to the invention can be produced by lamination.
- the various layers of the chip card ie the system carrier with the or thereon associated electronic components, and the upper and lower cover layers firmly together, ie undetachably connected.
- the system carrier is first produced, preferably by etching a metallically coated, electrically insulating plate or film. Thereafter, those electronic components that are directly connected to the system carrier, applied (eg the central microcontroller of the card). Then, if necessary, each consisting of several layers upper and lower cover layers are brought to the bottom and top of the system carrier to the plant.
- One or more structured intermediate layers can be provided which compensate for the surface contour of the system carrier including electronic components arranged thereon and / or connected thereto.
- This layer stack is then transferred by hot lamination into a solid composite.
- the recesses for example for the biometric module and the contact module, are milled into the upper and / or lower cover layer.
- the biometric module and the contact module are "implanted" in the recesses provided in each case.
- the upper and lower cover layers can be suitably pre-printed in advance, as is usual with electronic chip cards
- the layers are thermally bonded by a normal temperature solid adhesive located between the layers, but the use of a cold lamination technique using a non-temperature curable adhesive at normal temperature, is particularly advantageous.
- the electronic components of the chip card are not exposed to elevated temperatures and therefore are less likely to be damaged than in the case of hot lamination, and the option of having the biometric module and the contact module already before the lamination process ng to connect to the system carrier.
- the card according to the invention can be connected to the biometric module acoustic or optical signal generator, such as a piezoelectric signal generator or a light emitting diode (LED), which signals a successful or unsuccessful authentication process accordingly.
- acoustic or optical signal generator such as a piezoelectric signal generator or a light emitting diode (LED)
- tactile or haptic features can be arranged on the card surface in the region of the biometric sensor, which are perceived by the user of the card by touch and thus guide the user to the biometric sensor. This makes it possible, e.g. to operate the fingerprint sensor safely, even in the dark or in the eyesight of the cardholder.
- Figure 1 sectional side view of an electronic chip card according to the invention
- Figure 2 top view of the system carrier of the electronic chip card according to the invention with electronic components thereon;
- FIG. 3 schematic view of the biometric module of the chip card according to the invention with induction antenna.
- 1 shows an embodiment of the electronic chip card according to the invention schematically in a sectional side view.
- the structure of the chip card comprises a system carrier 1, which has electrically conductive conductor tracks 2 on its upper side.
- the system carrier 1 with conductor tracks 2 can be produced for example by etching a metallized film.
- cover layers 3 and 4. These each have a multilayer structure.
- the structure consists in each case of a spacer 5, a printing film 6 and a protective coating 7.
- the spacer 5 can, in order to compensate for the contour of the system carrier 1 including the electronic components arranged thereon, even be multilayered (not shown).
- the printing film 6 can arbitrarily for individualization of the chip card be printed.
- the protective coating 7 serves for the mechanical protection of the printing film 6.
- the protective coating 7 also includes a UV protection, so that the pressure on the printing film 6 does not fade.
- the cover layer 3 at the top of the card has recesses 8 and 9, which are introduced during manufacture into the cover layer 3, for example by milling or punching.
- a contact module 10 which is connected to the electrical conductor tracks 2.
- the contact module 10 has on its surface electrodes for producing an electrical contact of the card with a corresponding reading device.
- a biometric module 1 which consists according to the invention of a biometric sensor and a semiconductor device, which is designed for evaluating the signals of the biometric sensor and for storing biometric data.
- the biometric sensor and the semiconductor device are located in a common housing, wherein the semiconductor device is located below the biometric sensor.
- the biometric sensor in the embodiment is a fingerprint sensor having temperature or pressure sensitive elements 12 on the sensor surface for detecting the skin groove pattern of a fingerprint.
- FIG. 2 shows a plan view of the system carrier 1 of the electronic chip card according to the invention.
- a central microcontroller 13 can still be seen, which is connected via the tracks 2 of the system carrier 1 on the one hand to the contact module 10 and on the other hand to the biometric module 1 1.
- a debug module 14 which is provided for testing and debugging the smart card.
- the debug module 14 can be contacted, for example via needle electrodes with an external device.
- a button 15 is used to activate the biometric module 1 1 by the cardholder.
- An induction antenna 16 is formed by conductor tracks of the system carrier.
- the induction antenna 16 is formed as a loop antenna, which surrounds the edge of the system carrier 1.
- Capacitors 17 are provided as energy storage elements, with the induction voltage of Induction antenna 16 is applied and thereby charged.
- a suitable power supply circuit biometric module 1 1 is supplied from the capacitors 17 with energy.
- FIG. 3 schematically shows the biometric module 11 according to the invention.
- the biometric sensor (fingerprint sensor) 18, the semiconductor device 19, which is used for evaluating the signals of the biometric sensor 18 and for storing biometric data, and the energy supply circuit 20 are located on three levels one above the other. That is, the surfaces of the biometric sensor 18, the semiconductor device 19 and the power supply circuit 20 - seen in the direction perpendicular to the plane of the chip card - overlap.
- the total claimed area thus corresponds to the area of the largest of the three elements 18, 19, 20.
- the stacked elements 18, 19 and 20 are connected to each other (in the direction perpendicular to the chip card level direction) directly via bond connections.
- Each of the levels is formed by an application-specific integrated circuit (ASIC).
- ASIC application-specific integrated circuit
- the power supply circuit 20 is connected to the induction antenna 16 in the embodiment only via two outwardly guided contacts.
- the semiconductor device 19 has contacts 21 of a serial interface.
- the contacts 21 can be connected directly to the tracks 2 of the system carrier 1.
- the communication with the microcontroller 13 takes place during the authentication process.
- the common housing of the biometric module 1 1 is indicated in the figure 3 by the reference numeral 22.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automation & Control Theory (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013011812.3A DE102013011812A1 (en) | 2013-07-16 | 2013-07-16 | Electronic chip card |
PCT/EP2014/065208 WO2015007762A1 (en) | 2013-07-16 | 2014-07-16 | Electronic chip card |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3022689A1 true EP3022689A1 (en) | 2016-05-25 |
Family
ID=51355512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14752284.1A Ceased EP3022689A1 (en) | 2013-07-16 | 2014-07-16 | Electronic chip card |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160155039A1 (en) |
EP (1) | EP3022689A1 (en) |
DE (1) | DE102013011812A1 (en) |
WO (1) | WO2015007762A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3159832B1 (en) | 2015-10-23 | 2020-08-05 | Nxp B.V. | Authentication token |
EP3381037A1 (en) * | 2015-11-23 | 2018-10-03 | Srikanth Tatineni | Fabrication of an sd card inserted electronic or a plain identification card |
GB2548637A (en) * | 2016-03-24 | 2017-09-27 | Zwipe As | Method of manufacturing an electronic card |
WO2017210305A1 (en) * | 2016-06-01 | 2017-12-07 | Cpi Card Group - Colorado, Inc. | Ic chip card with integrated biometric sensor pads |
WO2018035258A1 (en) | 2016-08-16 | 2018-02-22 | Cpi Card Group - Colorado, Inc. | Improved ic chip card |
US10984304B2 (en) | 2017-02-02 | 2021-04-20 | Jonny B. Vu | Methods for placing an EMV chip onto a metal card |
JP7000196B2 (en) * | 2018-02-16 | 2022-01-19 | 株式会社東芝 | IC card |
USD956760S1 (en) * | 2018-07-30 | 2022-07-05 | Lion Credit Card Inc. | Multi EMV chip card |
TWI698799B (en) * | 2019-04-16 | 2020-07-11 | 林武旭 | Batteryless Electronic Trading Card |
TWM612841U (en) * | 2021-02-19 | 2021-06-01 | 安帝司股份有限公司 | Fingerprint identification smart card |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19803020C2 (en) * | 1998-01-27 | 1999-12-02 | Siemens Ag | Chip card module for biometric sensors |
DE10043954A1 (en) * | 2000-09-06 | 2002-03-14 | Infineon Technologies Ag | Chip card has integrated fingerprint sensor and integrated display device which can be provided by combined semiconductor component |
DE10139382A1 (en) * | 2001-08-10 | 2003-02-27 | Infineon Technologies Ag | Chip card with integrated fingerprint sensor |
DE10139414A1 (en) * | 2001-08-17 | 2003-02-27 | Giesecke & Devrient Gmbh | Semiconductor circuit arrangement with biometric sensor and evaluation unit |
US7028893B2 (en) * | 2003-12-17 | 2006-04-18 | Motorola, Inc. | Fingerprint based smartcard |
JP2006133217A (en) * | 2004-10-05 | 2006-05-25 | Seiko Epson Corp | Capacitance detector and smart card |
TW200905753A (en) * | 2007-07-18 | 2009-02-01 | Yuen Foong Yu Paper Mfg Co Ltd | Flexible and super-thin smart card and packaging method thereof |
DE102010028868B4 (en) * | 2010-05-11 | 2019-11-14 | Robert Bosch Gmbh | Semiconductor substrate-based arrangement for an RFID device, RFID device and method for producing such a semiconductor substrate-based arrangement |
US8756680B2 (en) | 2011-08-02 | 2014-06-17 | Corning Incorporated | Biometric-enabled smart card |
-
2013
- 2013-07-16 DE DE102013011812.3A patent/DE102013011812A1/en not_active Ceased
-
2014
- 2014-07-16 US US14/905,449 patent/US20160155039A1/en not_active Abandoned
- 2014-07-16 WO PCT/EP2014/065208 patent/WO2015007762A1/en active Application Filing
- 2014-07-16 EP EP14752284.1A patent/EP3022689A1/en not_active Ceased
Non-Patent Citations (2)
Title |
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None * |
See also references of WO2015007762A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2015007762A1 (en) | 2015-01-22 |
DE102013011812A1 (en) | 2015-01-22 |
US20160155039A1 (en) | 2016-06-02 |
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