EP2864432A2 - Heat-conducting adhesive and casting material - Google Patents

Heat-conducting adhesive and casting material

Info

Publication number
EP2864432A2
EP2864432A2 EP13829435.0A EP13829435A EP2864432A2 EP 2864432 A2 EP2864432 A2 EP 2864432A2 EP 13829435 A EP13829435 A EP 13829435A EP 2864432 A2 EP2864432 A2 EP 2864432A2
Authority
EP
European Patent Office
Prior art keywords
heat
casting compound
conductive adhesive
thermally conductive
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13829435.0A
Other languages
German (de)
French (fr)
Inventor
Thomas GÖTZ
Wolfgang Kleiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GOETZ, THOMAS
Kleiner Wolfgang
Zehnder Group International AG
Original Assignee
Zehnder Verkaufs und Verwaltungs AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zehnder Verkaufs und Verwaltungs AG filed Critical Zehnder Verkaufs und Verwaltungs AG
Priority to EP19155595.2A priority Critical patent/EP3508540A3/en
Priority to EP13829435.0A priority patent/EP2864432A2/en
Publication of EP2864432A2 publication Critical patent/EP2864432A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C09J1/02—Adhesives based on inorganic constituents containing water-soluble alkali silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/122—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0089—Systems using radiation from walls or panels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

Definitions

  • the invention relates to a thermally conductive adhesive and casting compound for joining components.
  • Thermally conductive adhesive and casting compounds are known in the art. They are used in particular for the production of heat-conducting plates, that is to produce connections between heat-conducting components such as pipes, sheets or ribs. In this case, in particular heat-conductive materials are used, which have a high thermal conductivity and are simultaneously flowable and moldable, so that the components to be connected can be positively embedded therein.
  • thermally conductive adhesive and casting compound is a mass of a thermally highly conductive material. This contains in particular carbon, which also graphite, foam graphite and the like come into question.
  • the thermally conductive material can either be in a pourable state and poured into the mold, or poured as a loose material into the mold and compacted or pulped.
  • thermally conductive materials are, for example, sheets of graphite foam.
  • the publication OE 19844 617 A1 discloses, for example, an arrangement for the air conditioning of rooms, which consists of climate panels, which have a body made of mineral material and a meandering curved pipe register embedded therein.
  • the mineral material consists of a hydrate mixture of various hydrate stages and mineralogical and / or metallic additives with dense structure.
  • Hydrate mixture can include calcium sulfate, calcium carbonate or
  • the metallic additives may, for example, be granular or powdered copper or copper alloys.
  • the meandering curved tube register is pressed into the hydrate mixture and can thus be coupled in a fluid-conducting manner with the tube registers of adjacent climate plates.
  • the heat-conducting connection takes place via positive contacting benacfibarter "Kiimaplatten.
  • the publication OE 20 2004 002 089 U1 shows a heating element in sandwich construction, in which heating tubes in a thermally conductive, filled with different materials
  • plastic composite layer are pressed.
  • the plastic composite layer has a rigid polyurethane foam filled with heat-conducting material, which contains thermally conductive particles of carbon black, graphite, aluminum powder, aluminum oxide, iron and / or silicate particles.
  • the pipe system is embedded form-fitting.
  • heat exchanger elements are used for heating and / or cooling bodies, comparatively much energy is lost in the transition from the pipe register to the rat.
  • the invention proposes a thermally conductive Ktebe- and casting compound, which has a filler material and a binder, wherein the
  • Filler material has one or more thermally conductive substances, and wherein the binder is an alkali silicate.
  • a binder to the heat-conductive substances having filler material can be a particularly adherent and thermally conductive connection of the components to achieve the adhesive and casting compound.
  • the binder ensures a high adhesion between the adjacent surfaces.
  • the invention provides that the binder is an alkali silicate. Since the heat-conducting components mostly have metallic surfaces, a binder is suitable which forms an active chemical compound with them.
  • the invention is based on the finding that metallic surfaces usually have coatings of metal oxides. If the selected alkali metal silicate now forms a chemical compound to these metal oxide coatings, the desired strong adhesive forces can be achieved.
  • the solution according to the invention can also be used for plastic components.
  • the alkali silicate is then selected so that it forms a chemical compound to the respective plastic.
  • the combination of filling material and binder can produce a
  • Total mass are provided, which has both a high thermal conductivity and a high adhesive force.
  • the binder may be an alkali silicate
  • the proposed alkali silicates are generally known under the name "water glasses".
  • Water glasses have different proportions and types of alkali oxides. Differences are, for example, sodium water glasses and potassium water glasses.
  • Na 2 SiO 3 is a water-bright, oily liquid, which reacts alkaline. In contact with air, this liquid solidifies gradually to a hard, glassy mass.
  • Potassium water glass, chemical formula K 2 SiO 3 has very similar properties as sodium water glass.
  • Water glasses are, as the name implies, related to real glass. Accordingly, the expected thermal conductivity of the pure binder water glass at about 1 W / mK.
  • the water glass used as a binder contains components that enter into an active chemical compound with the surface material of the components to be joined and thus ensure a very good surface connection and thus connection of the components. Decisive for this good surface connection is the alkaline environment of the aqueous water glasses, which leads, for example in the case of metal tube registers to a corresponding chemical activation of the metallic surfaces.
  • the chemical components of the binder penetrate quasi-diffusion into the oxide skins of the metals and settle there in the oxide structure.
  • the invention uses the knowledge that metallic surfaces always have coatings or layers of different metal oxides. This is the basis for a stable and permanent formation of the connection between the adhesive and casting compound according to the invention and the metallic surface.
  • water glasses used as binders wet the filling material and, after drying, also bind it firmly into the mass compound. Overall, a particularly strong connection can be created.
  • the invention may provide that the binder comprises a water-soluble, plastic-containing adhesive.
  • the so-called dispersion adhesives serve as a replacement for the water glass-containing binder.
  • Dispersion adhesives are used in various designs for other construction purposes.
  • other adhesive mixtures such as, for example, reactive resins, are also possible as binders for the heat-conducting material. Binders of this type are particularly suitable when the components to be joined are made of plastic or contain plastic.
  • the invention provides that the heat-conducting substances a
  • the filling material of the adhesive and casting compound is intended to produce a high heat transfer rate between adjacent surfaces.
  • the heat transfer rate should It should also be particularly high, especially with only small temperature differences between adjacent surfaces.
  • materials are required which have a thermal conductivity between 5 and 20 W / mK. These include substances such as aluminum, copper or even steel.
  • both high thermal conductivity and particularly high adhesive strength can be achieved by the heat-conducting adhesive and casting compound consisting of filler material and binder.
  • the heat-conducting substances are formed as fibers, chips, grains and / or powder.
  • the filling material in such a "particle form”
  • a particularly good miscibility with the binder can be achieved.
  • the metallic substances which are particularly advantageous may be "waste substances" from the machining
  • the chips have a thickness of about 0.1 mm to about 0.5 mm and a length of about 0.1 mm to 30 mm.
  • the heat-conducting substances may also have one or more non-metallic substances.
  • the non-metallic substance may be graphite.
  • the excellent thermal conductivity of non-metallic substances can be used. Decisive for achieving a good thermal conductivity is always the good contact between the heat-conductive adhesive and casting compound and the metallic surface.
  • the particle size of the admixed metallic or even non-metallic components is always essential. Grain sizes of 5 ⁇ m to 300 ⁇ m are particularly advantageous on the example of graphite. As a rule, however, mixtures of different particle sizes, with a corresponding particle size spectrum, are used.
  • the filler may also comprise cellulosic fibers.
  • the cellulose fibers serve to increase the strength of the thermally conductive adhesive and casting compound.
  • Cellulosic fibers consist of multiple sugar molecules whose surface structure is such as to provide an optimal bond between cellulose fibers and cellulose fibers
  • Typical addition amounts are in the range of 0.5 to 10 mass percent.
  • Typical fiber lengths of the added cellulose fibers are in the range from 20 .mu.m to 2000 .mu.m.
  • the filler may comprise a water-soluble, plastic-containing adhesive.
  • dispersion adhesive or styrene acrylates a considerable improvement in the ductility of the adhesive and casting compound according to the invention can be achieved.
  • additions of mica, talc, kaolin and / or porcelain flour within the filling material are also conceivable. Mica is particularly advantageously added in amounts of about 10 percent by mass, talc in an amount of 6 to 7 percent by mass and kaolin or porcelain flour in an amount of 0.5 to 10 percent by mass
  • the heat-conductive adhesive and casting compound according to the invention may likewise comprise a solvent.
  • the solvent gives the adhesive and casting compound a processing consistency which makes it possible to join the components to be joined in such a way that only minimal cavities, imperfections or voids are created. Only so can
  • thermally conductive filling materials and the required binder by the addition of the appropriate solvent within a mixing process in a pasty, if desired also liquid-like, state are brought. This allows a technically simple processing and optimum connection of the heat-conducting components depending on the application.
  • the thermally conductive adhesive and casting compound may comprise a hydrophobizing agent.
  • the hydrophobing agent comprises an organosilicon compound.
  • the hydrophobing agent may be alkoxysilanes ("silanes”), alkoxysiloxanes (“siloxanes”),
  • Alkylpolysiloxanes (“silicone resins") or Alkalisiliconate have been described.
  • alkoxysilanes admixed as the water repellents of the composition and / or
  • Alkoxysiloxanes react with water molecules of the alkali metal silicate (water glass)
  • Silicone resin solidifies after the solvent has volatilized.
  • the alkali metal siliconate admixed as a water repellent also reacts with CO 2 from the air to form silicone resin.
  • alkoxysilanes and / or alkoxysiloxanes
  • silanes can be used in one dissolved organic solvent or mixed by means of an emulsifier as an emulsion in water of the mass.
  • the emulsion can be used as a low-viscosity emulsion
  • the hydrophobing makes the thermally conductive adhesive and casting water repellent, whereby penetration of water molecules in the alkali silicate matrix and their
  • the invention continues to provide
  • the invention provides a method for producing a heat conduction plate, wherein one or more components in a flowable, thermally conductive adhesive and casting compound which a filler of one or more thermally conductive substances and a binder of an alkali silicate and / or a water-soluble, plastic-containing adhesive has to be embedded, and being the flowable
  • thermally conductive adhesive and casting compound then hardens upon contact with ambient air.
  • the invention thus provides a total of a thermally conductive adhesive and casting compound for the connection of components, which has the following advantages over the prior art: particularly high adhesive forces by chemical bonding between the alkali silicate or the water-soluble, plastic-containing adhesive and the surface of connecting components,
  • Voids, pores, etc. between the surfaces to be joined are avoided, toxic or environmentally harmful substances, such as used in soldering, are completely eliminated, the investment costs are very low,
  • Filling material, binders and solvents are particularly easy to mix.
  • thermally conductive substances having a particularly high thermal conductivity.
  • These substances are advantageously aluminum, copper and / or steel.
  • the substances are used in the form of fibers, chips, grains and / or as a powder. They have a thickness of about 0.1 mm to 0.5 mm and a length of about 0.1 mm to 30 mm.
  • the metallic substances can be further mixed with a non-metallic substance, such as graphite, so that overall a high thermal conductivity between 5 and 20 W / mK is formed.
  • the filler can also be consolidated with cellulosic fibers. Typical additives are in the range of 0.5 to 10 percent by mass. Typical fiber lengths of the added cellulose fibers are in the
  • the filler can also have a water-soluble, plastic-containing adhesive and / or materials such as mica, talc, kaolin and / or porcelain flour have.
  • the filler material is then mixed with the binder according to the invention.
  • the binder is adjusted to the surface to be joined.
  • an alkali metal silicate such as Na 2 SiO 3 or K 2 SiO 3 is suitable.
  • the binder may also comprise a water-soluble, plastic-containing adhesive, for example a dispersion adhesive.
  • a filler is preferably additionally added to the filler and the binding material.
  • the mixture can be brought into a pasty or even liquid-like state particularly easily by means of a mixing process.
  • the heat-conducting adhesive and casting compound according to the invention is placed in a casting mold and then the components are embedded therein, so that the adhesive and
  • Casting compound is in contact with all surface areas of the components.
  • water glasses used within the filling material can be an active, chemical compound to those existing on the metallic surfaces of the components
  • Metal oxide layers are produced. Due to the alkaline environment of the aqueous
  • Water glasses creates a chemical activation of the metallic surfaces, whereby the chemical components of the water glasses penetrate diffusion-like into the oxide skins of the metals and embed themselves there in the oxide structure. As a result, the particularly strong bond between the adhesive and casting compound and the metallic surface of the component is achieved. Since the filling material of the adhesive and casting compound furthermore has metallic and also non-metallic substances with high thermal conductivity, the adhesive parts also have a particularly high thermal conductivity. This results in a continuous, heat-conducting connection between the heat-conductive adhesive and casting compound and the embedded components, ie the tube register.
  • the composition according to the invention sc can penetrate into the transition regions between the casting compound and components in such a way that only minimal cavities, imperfections or voids are formed. This ensures that, with regard to the heat flow between the components no insulating defects are installed, which reduce the heat flow, especially at low Temperature differences, would result.
  • heat exchangers independently of a predetermined casting mold. It is not a standardized mold provided with tube registers and connections, poured out and then removed the finished molded body of the mold, but it can be poured at will each existing hollow body and serve as a heat exchanger in the poured state. This makes it possible, for example,

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention relates to a heat-conducting adhesive and casting material. Adhesive substances and casting material are used, for example, to embed a tube register and to produce a heat-conducting plate. The aim of the invention is to create a connection between the casting material and the tube register, which is particularly adhesive and at the same time, heat-conducting. The invention proposes a heat-conducting adhesive and casting material which comprises a filler and a binding agent, said filler comprises one or more heat-conducting substances and the binding agent is an alkali silicate.

Description

Wärmeleitende Klebe- und Gießmasse  Thermally conductive adhesive and casting compound
Die Erfindung betrifft eine wärmeleitende Klebe- und Gießmasse zur Verbindung von Bauteilen. The invention relates to a thermally conductive adhesive and casting compound for joining components.
Wärmeleitende Klebe- und Gießmassen sind im Stand der Technik bekannt. Sie werden insbesondere zur Herstellung von Wärmeleitplatten verwendet, das heißt um Verbindungen zwischen wärmeführenden Bauteilen wie Rohren, Blechen oder Rippen herzustellen. Dabei werden insbesondere wärmeleitende Massen eingesetzt, welche eine hohe Wärmeleitfähigkeit besitzen und gleichzeitig fließfähig und formbar sind, damit die zu verbindenden Bauelemente formschlüssig darin eingebettet werden können. Thermally conductive adhesive and casting compounds are known in the art. They are used in particular for the production of heat-conducting plates, that is to produce connections between heat-conducting components such as pipes, sheets or ribs. In this case, in particular heat-conductive materials are used, which have a high thermal conductivity and are simultaneously flowable and moldable, so that the components to be connected can be positively embedded therein.
Es ist ein Verfahren bekannt, bei welchem ein vorgefertigtes Rohrregister in eine Form gelegt und diese mit einer wämeleitenden Klebe- und Gießmasse ausgefüllt wird. Bei der wärmeleitenden Klebe- und Gießmasse handelt es sich um eine Masse aus einem thermisch gut leitfähigen Material. Dieses enthält insbesondere Kohlenstoff, wobei auch Grafit, Schaumgrafit und dergleichen in Frage kommen. Das wärmeleitende Material kann entweder in einem gießfähigen Zustand vorliegen und in die Form gegossen werden, oder als loses Material in die Form geschüttet und verdichtet beziehungsweise eingestampft werden. It is known a method in which a prefabricated pipe register placed in a mold and this is filled with a heat conductive adhesive and casting compound. The thermally conductive adhesive and casting compound is a mass of a thermally highly conductive material. This contains in particular carbon, which also graphite, foam graphite and the like come into question. The thermally conductive material can either be in a pourable state and poured into the mold, or poured as a loose material into the mold and compacted or pulped.
Weiterhin sind im Stand der Technik Verfahren bekannt, bei welchen Rohrregister in Platten aus thermisch leitfähigem Material eingepresst oder zwischen mehreren derartigen Platten verpresst werden. Derartige wärmeleitfähige Materialien sind beispielsweise Platten aus Grafitschaum. Die Druckschrift OE 19844 617 A1 offenbart beispielsweise eine Anordnung zur Klimatisierung von Räumen, welche aus Klimaplatten besteht, die einen Korpus aus mineralischem Material und ein darin eingebettetes mäanderförmig gebogenes Rohrregister aufweisen. Das mineralische Material besteht dabei aus einem Hydratgemisch verschiedener Hydratstufen sowie mineralogischen und/oder metallischen Zusätzen mit dichtem Gefüge. Das Furthermore, in the prior art, methods are known in which tube registers are pressed into plates of thermally conductive material or pressed between a plurality of such plates. Such thermally conductive materials are, for example, sheets of graphite foam. The publication OE 19844 617 A1 discloses, for example, an arrangement for the air conditioning of rooms, which consists of climate panels, which have a body made of mineral material and a meandering curved pipe register embedded therein. The mineral material consists of a hydrate mixture of various hydrate stages and mineralogical and / or metallic additives with dense structure. The
Hydratgemisch kann dabei unter anderem Kalziumsulfat, Kalziumcarbonat oder Hydrate mixture can include calcium sulfate, calcium carbonate or
Magnesiumcarbonat enthalten. Die metallischen Zusätze können beispielsweise granulat- oder pul verförmiges Kupfer oder Kupferlegierungen sein. Das mäanderförmig gebogene Rohrregister wird in das Hydratgemisch eingepresst und kann somit mit den Rohrregistern benachbarter Klimaplatten fluidleitend gekoppelt werden. Die wärmeleitende Verbindung erfolgt dabei über formschlüssige Kontaktierung benacfibarter"Kiimaplatten. Magnesium carbonate included. The metallic additives may, for example, be granular or powdered copper or copper alloys. The meandering curved tube register is pressed into the hydrate mixture and can thus be coupled in a fluid-conducting manner with the tube registers of adjacent climate plates. The heat-conducting connection takes place via positive contacting benacfibarter "Kiimaplatten.
Die Druckschrift OE 20 2004 002 089 U1 zeigt ein Heizelement in Sandwichbauweise, bei welchem Heizrohre in eine wärmeleitende, mit verschiedenen Materialien gefüllte The publication OE 20 2004 002 089 U1 shows a heating element in sandwich construction, in which heating tubes in a thermally conductive, filled with different materials
Kunststoffkompositschicht eingepresst sind. Die Kunststoffkompositschicht weist dabei einen mit wärmeleitendem Material gefüllten Polyurethan-Hartschaum auf, welcher wärmeleitende Partikel aus Ruß, Graphit, Aluminiumpulver, Aluminiumoxid, Eisen und/oder Silikatische Partikel enhält. In diese wärmeleitende Kompositschicht wird das Rohrsystem formschlüssig eingebettet. Plastic composite layer are pressed. In this case, the plastic composite layer has a rigid polyurethane foam filled with heat-conducting material, which contains thermally conductive particles of carbon black, graphite, aluminum powder, aluminum oxide, iron and / or silicate particles. In this thermally conductive composite layer, the pipe system is embedded form-fitting.
Nachteilig, insbesondere bei dem Einpressen von Rohrregistern in eine Platte, ist, dass der Wärmeübergang vom Rohrregister auf die Ratte sehr schlecht ist. Wenn derartige Wärmetauscherelemente für Heiz- und/oder Kühlkörper eingesetzt werden, geht vergleichsweise viel Energie im Übergang von dem Rohrregister auf die Ratte verloren. A disadvantage, in particular in the pressing of tube registers in a plate, is that the heat transfer from the tube register to the rat is very bad. When such heat exchanger elements are used for heating and / or cooling bodies, comparatively much energy is lost in the transition from the pipe register to the rat.
Die im Stand der Technik bekannten Platten, bei welchen das Rohrregister in die The known in the art plates in which the pipe register in the
wärmeleitende Klebe- und Gießmasse eingegossen wurde, haben sich dem gegenüber im Stand der Technik bewährt. Jedoch besteht auch hier der Wunsch, die Wärmeleitfähigkeit und gleichzeitig die Haftfestigkeit der Klebe- und Gießmasse an dem Rohrregister zu erhöhen. heat-conductive adhesive and casting material has been poured, have proven to be the opposite in the prior art. However, there is also a desire here to increase the thermal conductivity and at the same time the adhesive strength of the adhesive and casting compound on the pipe register.
Es ist daher Aufgabe der Erfindung, eine wärmeleitende Klebe- und Gießmasse zu schaffen, welche sowohl eine wärmeleitende als auch eine besonders haftfeste Verbindung zu benachbarten Oberflächen ermöglicht. Zur Lösung dieser Aufgabe schlagt die Erfindung eine wärmeleitende Ktebe- und Gießmasse vor, welche ein Füllmaterial und ein Bindemittel aufweist, wobei das It is therefore an object of the invention to provide a thermally conductive adhesive and casting compound, which allows both a thermally conductive and a particularly adherent connection to adjacent surfaces. To solve this problem, the invention proposes a thermally conductive Ktebe- and casting compound, which has a filler material and a binder, wherein the
Füllmaterial eine oder mehrere wärmeleitende Substanzen aufweist, und wobei das Bindemittel ein Alkalisilikat ist. Filler material has one or more thermally conductive substances, and wherein the binder is an alkali silicate.
Durch die Zugabe eines Bindemittels zu dem wärmeleitende Substanzen aufweisenden Füllmaterial lässt sich eine besonders haftfeste und wärmeleitende Verbindung der Bauteile zu der Klebe- und Gießmasse erreichen. Das Bindemittel sorgt dabei für eine hohe Haftwirkung zwischen den benachbarten Oberflächen. By adding a binder to the heat-conductive substances having filler material can be a particularly adherent and thermally conductive connection of the components to achieve the adhesive and casting compound. The binder ensures a high adhesion between the adjacent surfaces.
Die Erfindung sieht vor, dass das Bindemittel ein Alkalisilikat ist. Da die wärmeführenden Bauteile zumeist metallische Oberflächen aufweisen, bietet sich ein Bindemittel an, welches eine aktive chemische Verbindung zu diesen ausbildet. Dabei liegt der Erfindung die Erkenntnis zugrunde, dass metallische Oberflächen in der Regel Überzüge aus Metalloxiden aufweisen. Sofern das gewählte Alkalisilikat nun zu diesen Metalloxid- Überzügen eine chemische Verbindung eingeht, können die gewünschten starken Haftkräfte erreicht werden. The invention provides that the binder is an alkali silicate. Since the heat-conducting components mostly have metallic surfaces, a binder is suitable which forms an active chemical compound with them. The invention is based on the finding that metallic surfaces usually have coatings of metal oxides. If the selected alkali metal silicate now forms a chemical compound to these metal oxide coatings, the desired strong adhesive forces can be achieved.
Ebenfalls kann die erfindungsgemäße Lösung auch für Kunststoffbauteile genutzt werden. Das Alkalisilikat wird dann so ausgewählt, dass es eine chemische Verbindung zu dem jeweiligen Kunststoff ausbildet. Likewise, the solution according to the invention can also be used for plastic components. The alkali silicate is then selected so that it forms a chemical compound to the respective plastic.
Dadurch, dass die Klebe- und Gießmasse gleichzeitig das wärmeleitende Füllmaterial bereitstellt, kann durch die Verbindung von Füllmaterial und Bindemittel eine Due to the fact that the adhesive and casting compound simultaneously provides the heat-conducting filler material, the combination of filling material and binder can produce a
Gesamtmasse bereitgestellt werden, welche sowohl eine hohe Wärmeleitfähigkeit als auch eine hohe Haftkraft aufweist. Total mass are provided, which has both a high thermal conductivity and a high adhesive force.
Wie durch die Erfindung vorgeschlagen kann das Bindemittel ein Aikalisilikat, As suggested by the invention, the binder may be an alkali silicate,
insbesondere Na2SiO3 oder K2SiO3, sein. Die vorgeschlagenen Alkalisilikate sind dabei allgemein unter der Bezeichnung "Wassergläser" bekannt. Wassergläser weisen unterschiedliche Anteile und Arten von Alkalioxiden auf. Unterschieden werden dabei beispielsweise Natrium wassergläser und Kaliumwassergläser. Das mit Abstand am häufigsten eingesetzte Wasserglas ist das Natriumwasserglas, oder Natronwasserglas, welches die chemische Formel Na2SiO3 aufweist. Na2SiO3 ist eine wasserhelle, ölige Flüssigkeit, welche alkalisch reagiert. Bei Berührung mit Luft erstarrt diese Flüssigkeit allmählich zu einer harten, glasigen Masse. Kaliumwasserglas, chemische Formel K2SiO3, hat ganz ähnliche Eigenschaften wie Natrcnwasserglas. Wassergläser sind, wie der Name schon sagt, mit echtem Glas verwandt. Dementsprechend liegen auch die zu erwartenden Wärmeleitfähigkeitendes reinen Bindemittels Wasserglas bei etwa 1 W/mK. in particular Na 2 SiO 3 or K 2 SiO 3 . The proposed alkali silicates are generally known under the name "water glasses". Water glasses have different proportions and types of alkali oxides. Differences are, for example, sodium water glasses and potassium water glasses. By far the most commonly used water glass is the sodium water glass, or soda water glass, which has the chemical formula Na 2 SiO 3 . Na 2 SiO 3 is a water-bright, oily liquid, which reacts alkaline. In contact with air, this liquid solidifies gradually to a hard, glassy mass. Potassium water glass, chemical formula K 2 SiO 3 , has very similar properties as sodium water glass. Water glasses are, as the name implies, related to real glass. Accordingly, the expected thermal conductivity of the pure binder water glass at about 1 W / mK.
Das als Bindemittel eingesetzte Wasserglas enthält Komponenten, die eine aktive chemische Verbindung mit dem Oberflächenmaterial der zu verbindenden Bauteile eingehen und auf diese Weise für eine sehr gute Oberflächenanbindung und damit Verbindung der Bauteile sorgen. Entscheidend für diese gute Oberflächenanbindung ist das alkalische Milieu der wässrigen Wassergläser, das beispielsweise im Falle von Metallrohrregistern zu einer entsprechenden chemischen Aktivierung der metallischen Oberflächen führt. Dabei dringen die chemischen Komponenten des Bindemittels quasi diffusionsartig in die Oxidhäute der Metalle ein und setzen sich dort in der Oxidstruktur fest. Dabei nutzt die Erfindung die Erkenntnis, dass metallische Oberflächen stets Überzüge beziehungsweise Schichten aus verschiedenen Metailoxiden aufweisen. Gerade dies ist Grundlage für eine stabile und dauerhafte Ausbildung der Verbindung zwischen der erfindungsgemäßen Klebe- und Gießmasse und der metallischen Oberfläche. The water glass used as a binder contains components that enter into an active chemical compound with the surface material of the components to be joined and thus ensure a very good surface connection and thus connection of the components. Decisive for this good surface connection is the alkaline environment of the aqueous water glasses, which leads, for example in the case of metal tube registers to a corresponding chemical activation of the metallic surfaces. The chemical components of the binder penetrate quasi-diffusion into the oxide skins of the metals and settle there in the oxide structure. The invention uses the knowledge that metallic surfaces always have coatings or layers of different metal oxides. This is the basis for a stable and permanent formation of the connection between the adhesive and casting compound according to the invention and the metallic surface.
Weiterhin benetzen die als Bindemittel eingesetzten Wassergläser das Füllmaterial und binden dieses nach der Trocknung gleichfalls fest in den Massenverbund ein. Insgesamt kann so eine besonders haftstarke Verbindung geschaffen werden. Furthermore, the water glasses used as binders wet the filling material and, after drying, also bind it firmly into the mass compound. Overall, a particularly strong connection can be created.
Alternativ kann die Erfindung vorsehen, dass das Bindemittel einen wasserlöslichen, kunststoffhaltigen Kleber aufweist. Die sogenannten Dispersionskleber dienen als Ersatz für das wasserglashaltige Bindemittel. Dispersionskleber werden in verschiedenen Ausführungen für andere Bauzwecke eingesetzt. Alternativ sind neben Dispersionsklebern auch andere Klebegemische wie zum Beispiel Reaktionsharze als Bindemittel für das Wärmeleitmaterial möglich. Bindemittel dieser Art bieten sich insbesondere an, wenn die zu verbindenden Bauteile aus Kunststoff bestehen oder Kunststoff beinhalten. Alternatively, the invention may provide that the binder comprises a water-soluble, plastic-containing adhesive. The so-called dispersion adhesives serve as a replacement for the water glass-containing binder. Dispersion adhesives are used in various designs for other construction purposes. Alternatively, in addition to dispersion adhesives, other adhesive mixtures, such as, for example, reactive resins, are also possible as binders for the heat-conducting material. Binders of this type are particularly suitable when the components to be joined are made of plastic or contain plastic.
Weiterhin sieht die Erfindung vor, dass die wärmeleitenden Substanzen eine Furthermore, the invention provides that the heat-conducting substances a
Wärmeleitfähigkeit zwischen 5 W/mK und 20 W/mK aufweisen. Besonders bevorzugt weisen die Substanzen dabei Aluminium und/oder Kupfer und/oder Stahl auf. Have thermal conductivity between 5 W / mK and 20 W / mK. Particularly preferably, the substances in this case aluminum and / or copper and / or steel.
Durch das Füllmaterial der Klebe- und Gießmasse soll eine hohe Wärmetransportrate zwischen benachbarten Oberflächen hergestellt werden. Die Wärmetransportrate soll dabei auch insbesondere bei nur kleinen Temperaturdifferenzen zwischen benachbarten Oberflächen besonders hoch sein. Um eine solche zu erreichen, sind Materialien erforderlich, welche eine Wärmeleitfähigkeit zwischen 5 und 20 W/mK aufweisen. Dazu zählen Substanzen wie Aluminium, Kupfer oder auch Stahl. Durch die aus Füllmaterial und Bindemittel bestehende wärmeleitende Klebe- und Gießmasse kann somit sowohl eine hohe Wärmeleitfähigkeit als auch eine besonders hohe Haftwrrkung erreicht werden. The filling material of the adhesive and casting compound is intended to produce a high heat transfer rate between adjacent surfaces. The heat transfer rate should It should also be particularly high, especially with only small temperature differences between adjacent surfaces. In order to achieve such, materials are required which have a thermal conductivity between 5 and 20 W / mK. These include substances such as aluminum, copper or even steel. Thus, both high thermal conductivity and particularly high adhesive strength can be achieved by the heat-conducting adhesive and casting compound consisting of filler material and binder.
Vorteilhaft ist dabei vorgesehen, dass die wärmeleitenden Substanzen als Fasern, Späne, Kömer und/oder Pulver ausgebildet sind. Durch die Beibringung des Füllmaterials in einer solchen„Partikelform" kann eine besonders gute Mischbarkeit mit dem Bindemittel erreicht werden . Besonders vorteilhaft können diemetallischen Stoffe dabei "Abfall Stoffe" aus der spanenden Bearbeitung sein. Somit können die in Drehereien, Fräsereien und sonstigen metallverarbeitenden Betrieben anfallenden Metallspäne oder ähnliches weiterhin sinnvoll verarbeitet werden. Für eine gute Mischbarkeit mit dem Bindemittel ist es dabei vorteilhaft, wenn die Späne eine Stärke von ca. 0,1 mm bis ca. 0,5 mm und eine Länge von ca. 0,1 mm bis 30 mm aufweisen. It is advantageously provided that the heat-conducting substances are formed as fibers, chips, grains and / or powder. By providing the filling material in such a "particle form", a particularly good miscibility with the binder can be achieved. <br /> <br /> <br /> <br /> <br /> <br /> <br /> <br /> <br /> <br /> <br /> <br /> The metallic substances which are particularly advantageous may be "waste substances" from the machining For a good miscibility with the binder, it is advantageous if the chips have a thickness of about 0.1 mm to about 0.5 mm and a length of about 0.1 mm to 30 mm.
Weiterhin können die wärmeleitenden Substanzen ebenfalls eine oder mehrere nichtmetallische Substanzen aufweisen. Besonders bevorzugt kann die nichtmetallische Substanz Graphit sein. Dadurch kann die ausgezeichnete Wärmeleitfähigkeit auch von nichtmetallischen Substanzen genutzt werden. Entscheidend für die Erreichung einer guten Wärmeleitfähigkeit ist dabei stets die gute Kontaktierung zwischen der wärmeleitenden Klebe- und Gießmasse und der metallischen Oberfläche. Dabei ist stets die Partikelgröße der beigemengten metallischen oder auch nichtmetallischen Komponenten wesentlich. Am Beispiel von Graphit sind insbesondere Korngrößen von 5 μm bis 300 μm besonders vorteilhaft. In der Regel werden jedoch Mischungen aus unterschiedlichen Korngrößen, mit einem entsprechenden Korngrößenspektrum, eingesetzt. In Bezug auf die Furthermore, the heat-conducting substances may also have one or more non-metallic substances. Most preferably, the non-metallic substance may be graphite. As a result, the excellent thermal conductivity of non-metallic substances can be used. Decisive for achieving a good thermal conductivity is always the good contact between the heat-conductive adhesive and casting compound and the metallic surface. The particle size of the admixed metallic or even non-metallic components is always essential. Grain sizes of 5 μm to 300 μm are particularly advantageous on the example of graphite. As a rule, however, mixtures of different particle sizes, with a corresponding particle size spectrum, are used. Regarding the
nichtmetallische Substanz Graphit sind sowohl Sorten aus umgeblähtem wie auch aus geblähtem Graphit denkbar. non-metallic substance graphite, both flake and blown graphite varieties are conceivable.
Weiterhin kann das Füllmaterial ebenfalls Zellulosefasern aufweisen. Die Zellulosefasern dienen dabei zur Erhöhung der Festigkeit der wärmeleitenden Klebe- und Gießmasse. Zellulosefasern bestehen aus Mehrfachzuckermolekülen, deren Oberflächenstruktur so geartet ist, dass eine optimale Verbindung zwischen Zellulosefasern und Furthermore, the filler may also comprise cellulosic fibers. The cellulose fibers serve to increase the strength of the thermally conductive adhesive and casting compound. Cellulosic fibers consist of multiple sugar molecules whose surface structure is such as to provide an optimal bond between cellulose fibers and cellulose fibers
wasserglashaltigem Bindemittel erreicht wird. Dies stellt eine besonders einfache Möglichkeit dar, die Festigkeitseigenschaften des Wärmeleitmaterials zu verbessern. Typische Zusatzmengen liegen dabei im Bereich von 0,5 bis 10 Massen prozent Typische Faserlängen der zugesetzten Zellulosefasern liegen im Bereich von 20 μm bis 2000 μιτι. wasserglashaltigem binder is achieved. This represents a particularly simple one Possibility to improve the strength properties of the Wärmeleitmaterials. Typical addition amounts are in the range of 0.5 to 10 mass percent. Typical fiber lengths of the added cellulose fibers are in the range from 20 .mu.m to 2000 .mu.m.
Ebenfalls kann das Füllmaterial einen wasserlöslichen, kunststoffhaltigen Kleber aufweisen. Durch die sogenannten Dispersionskleber oder auch Styrolacrylate kann eine erhebliche Verbesserung der Duktilität der erfindungsgemäßen Klebe- und Gießmasse erreicht werden. Alternativ oder zusätzlich sind ebenfalls Zusätze von Glimmer, Talkum, Kaolin und/oder auch Porzellanmehl innerhalb des Füllmaterials denkbar. Besonders vorteilhaft wird Glimmer dabei in Mengen von ca. 10 Massenprozent zugesetzt, Talkum in einer Menge von 6 bis 7 Massenprozent und Kaolin beziehungsweise Porzellanmehl in einer Menge von 0,5 bis 10 Massenprozent Also, the filler may comprise a water-soluble, plastic-containing adhesive. By the so-called dispersion adhesive or styrene acrylates, a considerable improvement in the ductility of the adhesive and casting compound according to the invention can be achieved. Alternatively or additionally, additions of mica, talc, kaolin and / or porcelain flour within the filling material are also conceivable. Mica is particularly advantageously added in amounts of about 10 percent by mass, talc in an amount of 6 to 7 percent by mass and kaolin or porcelain flour in an amount of 0.5 to 10 percent by mass
Schließlich kann die erfindungsgemäße wärmeleitende Klebe- und Gießmasse ebenfalls ein Lösungsmittel aufweisen. Durch das Lösungsmittel erhält die Klebe- und Gießmasse eine Verarbeitungskonsistenz, die es ermöglicht, die zu fügenden Bauteile so zu verbinden, dass nur minimale Hohlräume, Fehlstellen oder Lunker entstehen. Nur so kann Finally, the heat-conductive adhesive and casting compound according to the invention may likewise comprise a solvent. The solvent gives the adhesive and casting compound a processing consistency which makes it possible to join the components to be joined in such a way that only minimal cavities, imperfections or voids are created. Only so can
sichergestellt werden, dass im Hinblick auf den Wärmefluss zwischen den Oberflächen keine isolierenden Fehlstellen eingebaut werden, die eine Reduzierung des Wärmeflusses bei geringen Temperaturdifferenzen zur Folge hätten. Erreicht wird dies dadurch, dass die wärmeleitenden Füllmaterialien sowie das benötigte Bindemittel durch den Zusatz des geeigneten Lösungsmittels innerhalb eines Mischprozesses in einen pastösen, wenn gewünscht auch flüssigkeitsähnlichen, Zustand gebracht werden. Dies ermöglicht eine je nach Anwendungsfall technisch einfache Verarbeitung und optimale Verbindung der wärmeführenden Bauteile. To ensure that heat transfer between the surfaces does not incorporate any insulating imperfections that would reduce the heat flow at low temperature differences. This is achieved in that the thermally conductive filling materials and the required binder by the addition of the appropriate solvent within a mixing process in a pasty, if desired also liquid-like, state are brought. This allows a technically simple processing and optimum connection of the heat-conducting components depending on the application.
Die wärmeleitende Klebe- und Gießmasse kann ein Hydrophobierungsmittel aufweisen.The thermally conductive adhesive and casting compound may comprise a hydrophobizing agent.
Vorzugsweise weist das Hydrophobierungsmittel eine siliciumorganische Verbindung auf.Preferably, the hydrophobing agent comprises an organosilicon compound.
Das Hydrophobierungsmittel kann Alkoxysilane ("Silane"), Alkoxysiloxane ("Siloxane"),The hydrophobing agent may be alkoxysilanes ("silanes"), alkoxysiloxanes ("siloxanes"),
Alkylpolysiloxane ("Siliconharze") oder Alkalisiliconate aufweisen. Alkylpolysiloxanes ("silicone resins") or Alkalisiliconate have.
Die als Hydrophobierungsmittel der Masse beigemischten Alkoxysilane und/oder  The alkoxysilanes admixed as the water repellents of the composition and / or
Alkoxysiloxane reagieren mit Wassermolekülen des Alkalisilikats (Wasserglases) zu Alkoxysiloxanes react with water molecules of the alkali metal silicate (water glass)
Siliconharz. Silicone resin.
Das als Hydrophobierungsmittel der Masse mit einem Lösungsmittel beigemischte  The mixed as a water repellent of the mass with a solvent
Siliconharz verfestigt sich, nachdem das Lösungsmittel sich verflüchtigt hat. Silicone resin solidifies after the solvent has volatilized.
Das als Hydrophobierungsmittel der Masse beigemischte Alkalisiliconat reagiert mit CO2 aus der Luft ebenfalls zu Siliconharz. The alkali metal siliconate admixed as a water repellent also reacts with CO 2 from the air to form silicone resin.
Die Alkoxysilane ("Silane") und/oder Alkoxysiloxane ("Siloxane") können in einem organischen Lösungsmittel gelöst oder mittels eines Emulgators als Emulsion in Wasser der Masse beigemischt werden. Die Emulsion kann als niedrigviskose Emulsion The alkoxysilanes ("silanes") and / or alkoxysiloxanes ("siloxanes") can be used in one dissolved organic solvent or mixed by means of an emulsifier as an emulsion in water of the mass. The emulsion can be used as a low-viscosity emulsion
(dünnflüssige Mikroemulsion) oder als hochviskose Emulsion (thixotrope Paste) eingestellt werden. (low-viscosity microemulsion) or as a high-viscosity emulsion (thixotropic paste) can be adjusted.
Die Hydrophobierung macht die wärmeleitende Klebe- und Gießmasse wasserabweisend, wodurch ein Eindringen von Wassermolekülen in die Alkalisilikat-Matrix und deren The hydrophobing makes the thermally conductive adhesive and casting water repellent, whereby penetration of water molecules in the alkali silicate matrix and their
Erweichen verhindert wird. Softening is prevented.
Neben der wärmeleitenden Klebe- und Gießmasse sieht die Erfindung weiterhin  In addition to the heat-conductive adhesive and casting compound, the invention continues to provide
Wärmeleitplatten vor, welche eine erfindungsgemäße wärmeleitende Klebe- und Wärmeleitplatten before which a heat-conducting adhesive and
Gießmasse aufweisen. Have casting compound.
Weiterhin sieht die Erfindung ein Verfahren zur Herstellung einer Wärmeleitplatte vor, wobei ein oder mehrere Bauteile in eine fließfähige, wärmeleitende Klebe- und Gießmasse, welche ein Füllmaterial aus einer oder mehreren wärmeleitenden Substanzen und ein Bindemittel aus einem Alkalisilikat und/oder einem wasserlöslichen, kunststoffhaltigen Kleber aufweist, eingebettet werden und wobei die fließfähige Furthermore, the invention provides a method for producing a heat conduction plate, wherein one or more components in a flowable, thermally conductive adhesive and casting compound which a filler of one or more thermally conductive substances and a binder of an alkali silicate and / or a water-soluble, plastic-containing adhesive has to be embedded, and being the flowable
wärmeleitende Klebe- und Gießmasse anschließend bei Kontakt mit Umgebungsluft aushärtet. thermally conductive adhesive and casting compound then hardens upon contact with ambient air.
Durch die Erfindung kann somit insgesamt eine wärmeleitende Klebe- und Gießmasse zur Verbindung von Bauteilen geschaffen werden, welche folgende Vorzüge gegenüber dem Stand der Technik aufweist: besonders hohe Haftkräfte durch chemische Verbindung zwischen dem Alkalisilikat bzw. dem wasserlöslichen, kunststoffhaltigen Kleber und der Oberfläche der zu verbindenden Bauteile, The invention thus provides a total of a thermally conductive adhesive and casting compound for the connection of components, which has the following advantages over the prior art: particularly high adhesive forces by chemical bonding between the alkali silicate or the water-soluble, plastic-containing adhesive and the surface of connecting components,
Lunker, Poren usw. zwischen den zu verbindenden Oberflächen werden vermieden, giftige oder umweltschädliche Stoffe, wie beispielsweise beim Löten verwendet, entfallen völlig, die Investitionskosten sind sehr gering, Voids, pores, etc. between the surfaces to be joined are avoided, toxic or environmentally harmful substances, such as used in soldering, are completely eliminated, the investment costs are very low,
Füllmaterial, Bindemittel und Lösungsmittel sind besonders leicht mischbar. Filling material, binders and solvents are particularly easy to mix.
Ein Ausführungsbeispiel der Erfindung wird im Folgenden näher erläutert: An embodiment of the invention is explained in more detail below:
Zur Herstellung einer erfindungsgemäßen wärmeleitenden Klebe- und Gießmasse wird ein Füllmaterial aus wärmeleitenden Substanzen mit besonders hoher Wärmeleitfähigkeit verwendet. Vorteilhaft sind diese Substanzen Aluminium, Kupfer und/oder Stahl. Die Substanzen werden dabei in Form von Fasern, Spänen, Körnern und/oder als Pulver verwendet. Sie weisen eine Stärke von ca. 0,1 mm bis 0,5 mm und eine Länge von ca. 0,1 mm bis 30 mm auf. To produce a thermally conductive adhesive and casting compound according to the invention, a filler of thermally conductive substances having a particularly high thermal conductivity is used. These substances are advantageously aluminum, copper and / or steel. The substances are used in the form of fibers, chips, grains and / or as a powder. They have a thickness of about 0.1 mm to 0.5 mm and a length of about 0.1 mm to 30 mm.
Zusätzlich können die metallischen Substanzen weiterhin mit einer nichtmetallischen Substanz, beispielsweise Graphit, gemischt werden, so dass insgesamt eine hohe Wärmeleitfähigkeit zwischen 5 und 20 W/mK entsteht. Das Füllmaterial kann ebenfalls mit Zellulosefasern verfestigt werden. Typische Zusätze liegen dabei im Bereich von 0,5 bis 10 Massenprozent. Typische Faserlängen der zugesetzten Zellulosefasern sind im In addition, the metallic substances can be further mixed with a non-metallic substance, such as graphite, so that overall a high thermal conductivity between 5 and 20 W / mK is formed. The filler can also be consolidated with cellulosic fibers. Typical additives are in the range of 0.5 to 10 percent by mass. Typical fiber lengths of the added cellulose fibers are in the
Bereich von 20 μm bis 2000 μm. Weiterhin kann das Füllmaterial ebenfalls einen wasserlösichen, kunststoffhaltigen Kleber und/oder Materialen wie Glimmer, Talkum, Kaolin und/oder Porzellanmehl aufweisen. Range from 20 μm to 2000 μm. Furthermore, the filler can also have a water-soluble, plastic-containing adhesive and / or materials such as mica, talc, kaolin and / or porcelain flour have.
Das Füllmaterial wird anschließend mit dem erfindungsgemäßen Bindemittel vermischt. Das Bindemittel wird dabei auf die zu verbindende Oberfläche abgestimmt. Im Falle von metallischen Oberflächen eignet sich beispielsweise ein Alkalisilikat wie Na2SiO3 o d e r K2SiO3. Im Falle von Kunststoffflächen kann das Bindemittel auch einen wasserlöslichen, kunststoffhaltigen Kleber, beispielsweise einen Dispersionskleber, aufweisen. The filler material is then mixed with the binder according to the invention. The binder is adjusted to the surface to be joined. In the case of metallic surfaces, for example, an alkali metal silicate such as Na 2 SiO 3 or K 2 SiO 3 is suitable. In the case of plastic surfaces, the binder may also comprise a water-soluble, plastic-containing adhesive, for example a dispersion adhesive.
Anschließend wird dem Füllmaterial und dem Bindematerial vorzugsweise zusätzlich ein Lösungsmittel zugesetzt. Dadurch kann das Gemisch besonders leicht mittels eines Mischprozesses in einen pastösen oder auch flüssigkeitsähnlichen Zustand gebracht werden. Subsequently, a filler is preferably additionally added to the filler and the binding material. As a result, the mixture can be brought into a pasty or even liquid-like state particularly easily by means of a mixing process.
Zur Herstellung einer Wärmeleitplatte mit beispielsweise metallischen Rohrregistern wird die erfindungsgemäße wärmeleitende Klebe- und Gießmasse in eine Gießform gegeben und anschließend werden die Bauteile darin eingebettet, so dass die Klebe- und For producing a heat conducting plate with, for example, metal tube registers, the heat-conducting adhesive and casting compound according to the invention is placed in a casting mold and then the components are embedded therein, so that the adhesive and
Gießmasse in Kontakt mit allen Oberflächenbereichen der Bauteile steht. Durch die innerhalb des Füllmaterials verwendeten Wassergläser kann eine aktive, chemische Verbindung zu den auf den metallischen Oberflächen der Bauteile vorhandenen Casting compound is in contact with all surface areas of the components. By the water glasses used within the filling material can be an active, chemical compound to those existing on the metallic surfaces of the components
Metalloxidschichten hergestellt werden. Durch das alkalische Milieu der wässrigen Metal oxide layers are produced. Due to the alkaline environment of the aqueous
Wassergläser entsteht eine chemische Aktivierung der metallischen Oberflächen, wobei die chemischen Komponenten der Wassergläser diffusionsartig in die Oxidhäute der Metalle eindringen und sich dort in der Oxidstruktur einbetten. Dadurch wird der besonders starke Haftverbund zwischen der Klebe- und Gießmasse und der metallischen Oberfläche des Bauteils erreicht. Da das Füllmaterial der Klebe- und Gießmasse weiterhin metallische und auch nichtmetallische Substanzen mit hoher Wärmeleitfähigkeit aufweist, besitzt auch die Klebesteile eine besonders hohe Wärmeleitfähigkeit Dadurch entsteht eine kontinuierliche, wärmeleitende Verbindung zwischen der wärmeleitenden Klebe- und Gießmasse und den eingebetteten Bauteilen, d. h. dem Rohrregister. Mittels des in der Masse weiterhin vorhandenen Lösungsmittels kann die erfindungsgemäße Masse sc in die Übergansbereiche zwischen Gießmasse und Bauteilen eindringen, dass nur minimale Hohlräume, Fehlstellen oder Lunker entstehen. Dadurch wird sichergestellt, dass im Hinblick auf den Wärmefluss zwischen den Bauteilen keine isolierenden Fehlstellen eingebaut werden, die eine Reduzierung des Wärmeflusses, insbesondere bei geringen Temperaturdifferenzen, zur Folge hätten. Water glasses creates a chemical activation of the metallic surfaces, whereby the chemical components of the water glasses penetrate diffusion-like into the oxide skins of the metals and embed themselves there in the oxide structure. As a result, the particularly strong bond between the adhesive and casting compound and the metallic surface of the component is achieved. Since the filling material of the adhesive and casting compound furthermore has metallic and also non-metallic substances with high thermal conductivity, the adhesive parts also have a particularly high thermal conductivity. This results in a continuous, heat-conducting connection between the heat-conductive adhesive and casting compound and the embedded components, ie the tube register. By means of the solvent remaining in the mass, the composition according to the invention sc can penetrate into the transition regions between the casting compound and components in such a way that only minimal cavities, imperfections or voids are formed. This ensures that, with regard to the heat flow between the components no insulating defects are installed, which reduce the heat flow, especially at low Temperature differences, would result.
Dadurch, dass das innerhalb der wärmeleitenden Klebe- und Gießmasse enthaltene Bindemittel bei Berührung mit Luft erstarrt, härtet die Flüssigkeit und damit auch die Klebe- und Gießmasse zu einer harten Masse aus. Somit erstarrt die Klebesteile ganz ohne zusätzliche Maßnahmen. The fact that the binder contained within the thermally conductive adhesive and casting compound solidifies on contact with air, hardens the liquid and thus the adhesive and casting compound to a hard mass. Thus, the adhesive parts solidifies completely without additional measures.
Gemäß einer weiteren Ausführungsvariante ist es ebenfalls möglich, Wärmetauscher unabhängig von einer vorgegebenen Gießform herzustellen. Dabei wird nicht eine standardisierte Gießform mit Rohrregistern und Anschlüssen versehen, ausgegossen und anschließend der fertig gegossene Körper der Gießform entnommen, sondern es kann nach Belieben jeder vorhandene Hohlkörper ausgegossen werden und im ausgegossenen Zustand als Wärmetauscher dienen. Dadurch wird es beispielsweise möglich, According to a further embodiment variant, it is likewise possible to produce heat exchangers independently of a predetermined casting mold. It is not a standardized mold provided with tube registers and connections, poured out and then removed the finished molded body of the mold, but it can be poured at will each existing hollow body and serve as a heat exchanger in the poured state. This makes it possible, for example,
Wandelelemente, Möbelteile etc. als Heizkörper zu verwenden, ohne dass diese in dieser Funktion als traditioneller Heizkörper zu erkennen sind. Damit werden insbesondere in Wohnräumen ästhetische Vorteile erzielt. Convertible elements, furniture parts, etc. to use as a radiator, without these are to be recognized in this function as a traditional radiator. This aesthetic benefits are achieved especially in living spaces.

Claims

Patentansprüche claims
1. Wärmelettende Klebe- und Gießmasse zur Verbindung von Bauteilen 1. Heat-insulating adhesive and casting compound for joining components
gekennzeichnet durch  marked by
ein Füllmaterial und ein Bindemittel, wobei das Füllmaterial eine oder mehrere wärmeleitende Substanzen aufweist, und wobei das Bindemittel ein Alkalisilikat ist.  a filler material and a binder, wherein the filler material comprises one or more thermally conductive substances, and wherein the binder is an alkali metal silicate.
2. Wärmeleitende Klebe- und Gießmasse nach Anspruch 1 , dadurch gekennzeichnet, dass das Alkalisilikat Na2SiO3 oder K2SiO3 ist. 2. The heat-conductive adhesive and casting compound according to claim 1, characterized in that the alkali metal silicate is Na 2 SiO 3 or K 2 SiO 3 .
3. Wärmeleitende Klebe- und Gießmasse zur Verbindung von Bauteilen 3. Thermally conductive adhesive and casting compound for joining components
gekennzeichnet du rch  marked by
ein Füllmaterial und ein Bindemittel, wobei das Füllmaterial eine oder mehrere wärmeleitende Substanzen aufweist, und wobei das Bindemittel einen  a filler material and a binder, wherein the filler material comprises one or more thermally conductive substances, and wherein the binder has a
wasserlöslichen kunststoffhaltigen Kleber aufweist.  having water-soluble plastic-containing adhesive.
4. Wärmeleitende Klebe- und Gießmasse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die wärmeleitende Substanz eine Wärmeleitfähigkeit zwischen 5 W/mk und 20 W/mk aufweist. 4. Heat-conductive adhesive and casting compound according to one of the preceding claims, characterized in that the heat-conducting substance has a thermal conductivity between 5 W / mk and 20 W / mk.
5. Wärmeleitende Klebe- und Gießmasse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die wärmeleitenden Substanzen Aluminium und/oder Kupfer und/oder Stahl aufweisen. 5. Thermally conductive adhesive and casting compound according to one of the preceding claims, characterized in that the heat-conducting substances aluminum and / or copper and / or steel.
6. Wärmeleitende Klebe- und Gießmasse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die wärmeleitenden Substanzen als Fasern, Späne, Körner und/oder Pulver ausgebildet sind. 6. Heat-conductive adhesive and casting compound according to one of the preceding claims, characterized in that the heat-conducting substances are formed as fibers, chips, grains and / or powder.
7. Wärmeleitende Klebe- und Gießmasse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die wärmeleitenden Substanzen eine oder mehrere nichtmetallische Substanzen aufweisen. 7. Thermally conductive adhesive and casting compound according to one of the preceding claims, characterized in that the heat-conducting substances have one or more non-metallic substances.
8. Wärmeletende Klebe- und Gießmasse nach Anspruch 7, dadurch gekennzeichnet, dass die nichtmetallische Substanz Graphit ist. 8. Wärmeletende adhesive and casting compound according to claim 7, characterized in that the non-metallic substance is graphite.
9. Wärmeleitende Klebe- und Gießmasse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Füllmaterial Zellulosefasern aufweist. 9. Thermally conductive adhesive and casting compound according to one of the preceding claims, characterized in that the filler material comprises cellulose fibers.
10. Wärmeleitende Klebe- und Gießmasse nach einem der vorhergehenden Ansprüche, dadurchgekennzeichnet, dass das Füllmaterial einen wasserlöslichen, 10. Thermally conductive adhesive and casting compound according to one of the preceding claims, characterized in that the filler material is a water-soluble,
kunststoffhaltigen Kleber aufweist.  having plastic-containing adhesive.
11. Wärmeleitende Klebe- und Gießmasse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Füllmaterial Glimmer, Talkum, Kaolin und/oder Porzellanmehl aufweist. 11. Thermally conductive adhesive and casting compound according to one of the preceding claims, characterized in that the filler mica, talc, kaolin and / or porcelain flour.
12. Wärmeleitende Klebe- und Gießmasse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass diese ein Lösungsmittel aufweist. 12. The heat-conductive adhesive and casting compound according to one of the preceding claims, characterized in that it comprises a solvent.
13. Wärmeleitende Klebe- und Gießmasse nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass diese ein Hydrophobierungsmittel aufweist. 13. The heat-conductive adhesive and casting compound according to one of the preceding claims, characterized in that it comprises a hydrophobizing agent.
14. Wärmeleitende Klebe- und Gießmasse nach Anspruch 13, dadurch gekennzeichnet, dass das Hydrophobierungsmittel eine siliciumorganische Verbindung aufweist. 14. Thermally conductive adhesive and casting compound according to claim 13, characterized in that the hydrophobizing agent has an organosilicon compound.
15. Wärmeleitplatte aufweisend eine wärmeleitende Klebe- und Gießmasse nach einem der Ansprüche 1 bis 14. 15. Thermally conductive plate having a heat-conductive adhesive and casting compound according to one of claims 1 to 14.
16. Verfahren zur Herstellung einer Wärmeleitplatte, wobei ein oder mehrere Bauteile in eine fließfähige, wärmeleitende Klebe- und Gießmasse nach einem der Ansprüche 1 bis 14 eingebettet werden und wobei die fließfähige wärmeleitende Klebe- und Gießmasse anschließend bei Kontakt mit Umgebungsluft aushärtet. 16. A method for producing a heat conducting plate, wherein one or more components are embedded in a flowable, heat-conductive adhesive and casting compound according to one of claims 1 to 14 and wherein the flowable thermally conductive adhesive and casting compound then hardens upon contact with ambient air.
17. Verfahren zur Herstellung einer Wärmeleitplatte, wobei ein oder mehrere Bauteile in eine fließfähige, wärmeleitende Klebe- und Gießmasse, welche ein Füllmaterial aus einer oder mehreren wärmeleitenden Substanzen und ein Bindemittel aus einem Alkalisilikat und/oder einem wasserlöslichen, kunststoffhaltigen Kleber aufweist, eingebettet werden und wobei die fließfähige wärmeleitende Klebe- und Gießmasse anschließend bei Kontakt mit Umgebungsluft aushärtet. 17. A method for producing a heat conduction, wherein one or more components in a flowable, thermally conductive adhesive and casting compound, which comprises a filler of one or more thermally conductive substances and a binder of an alkali metal silicate and / or a water-soluble, plastic-containing adhesive embedded and wherein the flowable thermally conductive adhesive and casting compound then cures on contact with ambient air.
EP13829435.0A 2012-06-22 2013-06-24 Heat-conducting adhesive and casting material Withdrawn EP2864432A2 (en)

Priority Applications (2)

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EP19155595.2A EP3508540A3 (en) 2012-06-22 2013-06-24 Heat conductive adhesive and casting compound
EP13829435.0A EP2864432A2 (en) 2012-06-22 2013-06-24 Heat-conducting adhesive and casting material

Applications Claiming Priority (3)

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EP12173195.4A EP2677011B1 (en) 2012-06-22 2012-06-22 Heat conductive adhesive and cast compound
PCT/IB2013/001326 WO2014027230A2 (en) 2012-06-22 2013-06-24 Heat-conducting adhesive and casting material
EP13829435.0A EP2864432A2 (en) 2012-06-22 2013-06-24 Heat-conducting adhesive and casting material

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EP19155595.2A Withdrawn EP3508540A3 (en) 2012-06-22 2013-06-24 Heat conductive adhesive and casting compound
EP13829435.0A Withdrawn EP2864432A2 (en) 2012-06-22 2013-06-24 Heat-conducting adhesive and casting material

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EP19155595.2A Withdrawn EP3508540A3 (en) 2012-06-22 2013-06-24 Heat conductive adhesive and casting compound

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PL (1) PL2677011T3 (en)
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Also Published As

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EP3508540A3 (en) 2019-12-04
WO2014027230A2 (en) 2014-02-20
EP2677011B1 (en) 2017-10-25
EP2677011A1 (en) 2013-12-25
EP3508540A2 (en) 2019-07-10
PL2677011T3 (en) 2018-04-30
WO2014027230A3 (en) 2014-12-31

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