EP2858093A4 - Photocurable resin composition for imprinting, method for producing same, and structure - Google Patents

Photocurable resin composition for imprinting, method for producing same, and structure

Info

Publication number
EP2858093A4
EP2858093A4 EP13793970.8A EP13793970A EP2858093A4 EP 2858093 A4 EP2858093 A4 EP 2858093A4 EP 13793970 A EP13793970 A EP 13793970A EP 2858093 A4 EP2858093 A4 EP 2858093A4
Authority
EP
European Patent Office
Prior art keywords
imprinting
resin composition
photocurable resin
producing same
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13793970.8A
Other languages
German (de)
French (fr)
Other versions
EP2858093A1 (en
Inventor
Hiroko Yamada
Yasuo Suto
Yukihiro Miyazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soken Kagaku KK
Soken Chemical and Engineering Co Ltd
Original Assignee
Soken Kagaku KK
Soken Chemical and Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soken Kagaku KK, Soken Chemical and Engineering Co Ltd filed Critical Soken Kagaku KK
Publication of EP2858093A1 publication Critical patent/EP2858093A1/en
Publication of EP2858093A4 publication Critical patent/EP2858093A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/005—Surface shaping of articles, e.g. embossing; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/28—Oxygen or compounds releasing free oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Polymerisation Methods In General (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
EP13793970.8A 2012-05-25 2013-05-15 Photocurable resin composition for imprinting, method for producing same, and structure Withdrawn EP2858093A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012119528 2012-05-25
PCT/JP2013/063566 WO2013176020A1 (en) 2012-05-25 2013-05-15 Photocurable resin composition for imprinting, method for producing same, and structure

Publications (2)

Publication Number Publication Date
EP2858093A1 EP2858093A1 (en) 2015-04-08
EP2858093A4 true EP2858093A4 (en) 2015-12-02

Family

ID=49623714

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13793970.8A Withdrawn EP2858093A4 (en) 2012-05-25 2013-05-15 Photocurable resin composition for imprinting, method for producing same, and structure

Country Status (7)

Country Link
US (1) US20150147533A1 (en)
EP (1) EP2858093A4 (en)
JP (2) JP6092200B2 (en)
KR (1) KR20150013477A (en)
CN (1) CN104350580A (en)
TW (1) TWI605928B (en)
WO (1) WO2013176020A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150073954A (en) * 2012-10-22 2015-07-01 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 Photocurable resin composition for imprinting, method for producing mold for imprinting, and mold for imprinting
JP6363473B2 (en) * 2014-11-17 2018-07-25 株式会社トクヤマ Photo-curable composition for imprint, and method for producing resist laminate using the composition
KR20180014287A (en) 2016-07-28 2018-02-08 삼성디스플레이 주식회사 Method for preparing patterned cured product
CN109475436B (en) 2016-08-12 2021-08-27 宝洁公司 Method and apparatus for assembling elastic laminates for absorbent articles with different bond densities
JP6957177B2 (en) * 2017-03-29 2021-11-02 株式会社ダイセル Manufacturing method of resin molded products and manufacturing method of optical parts
JP7357882B2 (en) * 2018-07-27 2023-10-10 学校法人東京理科大学 Method for manufacturing a molded article, method for manufacturing a replica mold, and method for manufacturing a device
CN111187539B (en) * 2019-03-21 2022-05-03 广东聚华印刷显示技术有限公司 Ultraviolet curing ink
US11434312B2 (en) 2020-12-15 2022-09-06 Canon Kabushiki Kaisha Photocurable composition for forming cured layers with high thermal stability

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5989778A (en) * 1997-07-03 1999-11-23 Sumitomo Chemical Company, Limited Photo-curing resin composition for DVD
US20040115436A1 (en) * 2001-03-02 2004-06-17 Zen Komiya Multilayer coating
US20100286300A1 (en) * 2007-11-29 2010-11-11 Nissan Chemical Industries, Ltd. Three-dimensional pattern forming material
JP2011235571A (en) * 2010-05-12 2011-11-24 Fujifilm Corp Method of manufacturing micropattern and substrate with micropattern
WO2011155499A1 (en) * 2010-06-07 2011-12-15 三菱レイヨン株式会社 Method for producing article having fine recessed and projected structure on surface, mold release treatment method for mold, and active energy ray-curable resin composition for mold surface release treatment

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY144124A (en) * 2002-07-11 2011-08-15 Molecular Imprints Inc Step and repeat imprint lithography systems
KR100975088B1 (en) * 2003-11-21 2010-08-11 로드코포레이션 Dual-Stage Wafer Applied Underfills
KR101463849B1 (en) * 2006-09-27 2014-12-04 후지필름 가부시키가이샤 Curable composition for optical nanoimprint lithography and pattern forming method using the same
JP2008202022A (en) * 2007-01-23 2008-09-04 Fujifilm Corp Curable composition for optical nano imprint lithography, and pattern forming method using the same
EP2330151A1 (en) * 2009-12-04 2011-06-08 Cytec Surface Specialties, S.A. IR_shielding radiation curable compositions
WO2011111741A1 (en) 2010-03-10 2011-09-15 旭化成株式会社 Resin mold
JP2012001629A (en) * 2010-06-16 2012-01-05 Daido Kasei Kogyo Kk Active energy ray-curing composition
JP2012031240A (en) * 2010-07-29 2012-02-16 Hitachi High-Technologies Corp Photopolymerizable resin composition for use in transferring microstructure
JP5755419B2 (en) * 2010-08-27 2015-07-29 協立化学産業株式会社 Photo-curing adhesive composition for bonding optical display or touch sensor and optical display or touch sensor bonded using the same
JP2012099638A (en) * 2010-11-02 2012-05-24 Fujifilm Corp Curable composition for imprint
CN102212304B (en) * 2011-03-25 2013-01-02 北京化工大学 Flexible circuit conductive composition, preparation method and using method thereof
JP6037627B2 (en) * 2011-03-30 2016-12-07 協立化学産業株式会社 Photo-curable resin composition for imprint molding, imprint molding cured body, and production method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5989778A (en) * 1997-07-03 1999-11-23 Sumitomo Chemical Company, Limited Photo-curing resin composition for DVD
US20040115436A1 (en) * 2001-03-02 2004-06-17 Zen Komiya Multilayer coating
US20100286300A1 (en) * 2007-11-29 2010-11-11 Nissan Chemical Industries, Ltd. Three-dimensional pattern forming material
JP2011235571A (en) * 2010-05-12 2011-11-24 Fujifilm Corp Method of manufacturing micropattern and substrate with micropattern
WO2011155499A1 (en) * 2010-06-07 2011-12-15 三菱レイヨン株式会社 Method for producing article having fine recessed and projected structure on surface, mold release treatment method for mold, and active energy ray-curable resin composition for mold surface release treatment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013176020A1 *

Also Published As

Publication number Publication date
US20150147533A1 (en) 2015-05-28
CN104350580A (en) 2015-02-11
TWI605928B (en) 2017-11-21
JP6092200B2 (en) 2017-03-08
EP2858093A1 (en) 2015-04-08
JPWO2013176020A1 (en) 2016-01-12
WO2013176020A1 (en) 2013-11-28
TW201408470A (en) 2014-03-01
JP2017050562A (en) 2017-03-09
KR20150013477A (en) 2015-02-05

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