EP2728990A4 - Système de montage de composant de circuit électronique - Google Patents

Système de montage de composant de circuit électronique

Info

Publication number
EP2728990A4
EP2728990A4 EP12804210.8A EP12804210A EP2728990A4 EP 2728990 A4 EP2728990 A4 EP 2728990A4 EP 12804210 A EP12804210 A EP 12804210A EP 2728990 A4 EP2728990 A4 EP 2728990A4
Authority
EP
European Patent Office
Prior art keywords
electronic circuit
component mounting
circuit component
mounting system
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12804210.8A
Other languages
German (de)
English (en)
Other versions
EP2728990B1 (fr
EP2728990A1 (fr
Inventor
Jun Iisaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of EP2728990A1 publication Critical patent/EP2728990A1/fr
Publication of EP2728990A4 publication Critical patent/EP2728990A4/fr
Application granted granted Critical
Publication of EP2728990B1 publication Critical patent/EP2728990B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
EP12804210.8A 2011-06-28 2012-04-26 Système de montage de composant de circuit électronique Active EP2728990B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011143034A JP5685496B2 (ja) 2011-06-28 2011-06-28 電子回路部品装着システム
PCT/JP2012/061253 WO2013001904A1 (fr) 2011-06-28 2012-04-26 Système de montage de composant de circuit électronique

Publications (3)

Publication Number Publication Date
EP2728990A1 EP2728990A1 (fr) 2014-05-07
EP2728990A4 true EP2728990A4 (fr) 2015-07-15
EP2728990B1 EP2728990B1 (fr) 2018-09-12

Family

ID=47423810

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12804210.8A Active EP2728990B1 (fr) 2011-06-28 2012-04-26 Système de montage de composant de circuit électronique

Country Status (4)

Country Link
EP (1) EP2728990B1 (fr)
JP (1) JP5685496B2 (fr)
CN (1) CN103636300B (fr)
WO (1) WO2013001904A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101915204B1 (ko) * 2013-09-30 2018-11-05 한화에어로스페이스 주식회사 폭 조정이 가능한 트레이 홀더 조립체
US10743445B2 (en) 2013-12-13 2020-08-11 Fuji Corporation Electronic circuit component pick-up instruction data generating device
JP6413081B2 (ja) * 2014-12-22 2018-10-31 パナソニックＩｐマネジメント株式会社 部品供給方法および部品供給装置
JP7113332B2 (ja) * 2018-07-10 2022-08-05 パナソニックＩｐマネジメント株式会社 部品実装装置、および部品実装装置における部品供給方法
JP7386384B2 (ja) * 2019-02-18 2023-11-27 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装装置ならびに実装基板の製造方法
JP7304506B2 (ja) * 2019-02-18 2023-07-07 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装装置ならびに実装基板の製造方法
WO2021009846A1 (fr) * 2019-07-16 2021-01-21 株式会社Ｆｕｊｉ Machine de travail

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176007B1 (en) * 1995-11-27 2001-01-23 Matsushita Electric Industrial Co., Ltd. Equipment and method for mounting electronic components
US20020054813A1 (en) * 2000-03-06 2002-05-09 Davidov Vladimir Nikolayevich Apparatus for handling integrated circuits and trays for integrated circuits

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2824378B2 (ja) 1993-04-02 1998-11-11 富士機械製造株式会社 電子部品装着装置
JP3997101B2 (ja) * 2002-03-18 2007-10-24 富士機械製造株式会社 電子回路部品装着システム
JP5503097B2 (ja) 2005-12-28 2014-05-28 富士機械製造株式会社 部品装着システム
CN1993035B (zh) * 2005-12-28 2011-04-13 富士机械制造株式会社 托盘式元件供给装置以及元件安装系统
JP2007210650A (ja) * 2006-02-10 2007-08-23 Renesas Technology Corp 半導体装置の製造方法およびチップ収納トレイ
JP4712623B2 (ja) 2006-06-28 2011-06-29 ヤマハ発動機株式会社 部品搬送方法、部品搬送装置および表面実装機
JP2009152252A (ja) * 2007-12-18 2009-07-09 Panasonic Corp 部品取り出し順序決定方法、部品取り出し順序決定装置及び部品実装機
JP5580570B2 (ja) * 2009-11-04 2014-08-27 富士機械製造株式会社 トレイ型部品供給装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176007B1 (en) * 1995-11-27 2001-01-23 Matsushita Electric Industrial Co., Ltd. Equipment and method for mounting electronic components
US20020054813A1 (en) * 2000-03-06 2002-05-09 Davidov Vladimir Nikolayevich Apparatus for handling integrated circuits and trays for integrated circuits

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013001904A1 *

Also Published As

Publication number Publication date
JP5685496B2 (ja) 2015-03-18
WO2013001904A1 (fr) 2013-01-03
EP2728990B1 (fr) 2018-09-12
CN103636300B (zh) 2016-01-06
EP2728990A1 (fr) 2014-05-07
CN103636300A (zh) 2014-03-12
JP2013012526A (ja) 2013-01-17

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