EP2044629A4 - Camera system and associated methods - Google Patents

Camera system and associated methods

Info

Publication number
EP2044629A4
EP2044629A4 EP07796897A EP07796897A EP2044629A4 EP 2044629 A4 EP2044629 A4 EP 2044629A4 EP 07796897 A EP07796897 A EP 07796897A EP 07796897 A EP07796897 A EP 07796897A EP 2044629 A4 EP2044629 A4 EP 2044629A4
Authority
EP
European Patent Office
Prior art keywords
camera system
associated methods
methods
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07796897A
Other languages
German (de)
French (fr)
Other versions
EP2044629A2 (en
Inventor
Michael R Feldman
James E Morris
Robert D Tekolste
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flir Systems Trading Belgium BVBA
Original Assignee
DigitalOptics Corp East
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/487,580 external-priority patent/US8049806B2/en
Application filed by DigitalOptics Corp East filed Critical DigitalOptics Corp East
Publication of EP2044629A2 publication Critical patent/EP2044629A2/en
Publication of EP2044629A4 publication Critical patent/EP2044629A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
    • G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Cameras In General (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
EP07796897A 2006-07-17 2007-07-17 Camera system and associated methods Withdrawn EP2044629A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/487,580 US8049806B2 (en) 2004-09-27 2006-07-17 Thin camera and associated methods
US85536506P 2006-10-31 2006-10-31
PCT/US2007/016156 WO2008011003A2 (en) 2006-07-17 2007-07-17 Camera system and associated methods

Publications (2)

Publication Number Publication Date
EP2044629A2 EP2044629A2 (en) 2009-04-08
EP2044629A4 true EP2044629A4 (en) 2012-08-01

Family

ID=38957311

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07796897A Withdrawn EP2044629A4 (en) 2006-07-17 2007-07-17 Camera system and associated methods

Country Status (5)

Country Link
EP (1) EP2044629A4 (en)
JP (2) JP5292291B2 (en)
KR (1) KR101185881B1 (en)
CN (1) CN101512768B (en)
WO (1) WO2008011003A2 (en)

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US20080118241A1 (en) * 2006-11-16 2008-05-22 Tekolste Robert Control of stray light in camera systems employing an optics stack and associated methods
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JPWO2008102773A1 (en) * 2007-02-19 2010-05-27 コニカミノルタオプト株式会社 Imaging lens, imaging device, portable terminal, and manufacturing method of imaging lens
WO2008102776A1 (en) 2007-02-19 2008-08-28 Konica Minolta Opto, Inc. Imaging lens, imaging device, portable terminal and method for manufacturing imaging lens
EP2163931A4 (en) * 2007-07-04 2012-03-07 Konica Minolta Opto Inc Imaging lens, imaging device, and mobile terminal
CN101990711B (en) * 2007-11-27 2017-05-17 新加坡恒立私人有限公司 Encapsulated lens stack
TW200937642A (en) 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
EP2246723A4 (en) 2008-02-20 2013-07-31 Konica Minolta Opto Inc Imaging lens, imaging apparatus, portable terminal, and method for producing imaging lens
US9118825B2 (en) 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
CN102016653B (en) * 2008-04-28 2013-07-10 柯尼卡美能达精密光学株式会社 Method for producing wafer lens assembly and method for producing wafer lens
WO2009137022A1 (en) * 2008-05-06 2009-11-12 Tessera North America, Inc. Camera system including radiation shield and method of shielding radiation
FR2931587B1 (en) 2008-05-21 2011-05-13 Commissariat Energie Atomique METHOD FOR PRODUCING AN OPTICAL DEVICE WITH INTEGRATED OPTOELECTRONIC COMPONENTS
US20090321861A1 (en) * 2008-06-26 2009-12-31 Micron Technology, Inc. Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagers
JP5094802B2 (en) * 2008-09-26 2012-12-12 シャープ株式会社 Optical element wafer manufacturing method
KR101634353B1 (en) 2008-12-04 2016-06-28 삼성전자주식회사 Micro lens, method for manufacturing the micro lens, apparatus for manufacturing the micro lens, camera module including the micro lens
NL1036360C2 (en) * 2008-12-23 2010-06-24 Anteryon B V OPTICAL UNIT.
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KR20100130423A (en) * 2009-06-03 2010-12-13 삼성전자주식회사 Wafer-level lens module and image module including the same
KR101648540B1 (en) 2009-08-13 2016-08-16 삼성전자주식회사 Wafer-level lens module and imaging device including the same
US9419032B2 (en) 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
TW201109165A (en) 2009-09-11 2011-03-16 E Pin Optical Industry Co Ltd Stacked disk-shaped optical lens array, stacked disk-shaped lens module array and the method of manufacturing thereof
US8305699B2 (en) 2009-09-23 2012-11-06 Samsung Electronics Co., Ltd. Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module
JP2011085625A (en) * 2009-10-13 2011-04-28 Toppan Printing Co Ltd Camera module and method for manufacturing the same
JP5556140B2 (en) * 2009-11-20 2014-07-23 凸版印刷株式会社 Camera module and manufacturing method thereof
SG186214A1 (en) * 2010-06-14 2013-01-30 Heptagon Micro Optics Pte Ltd Method of manufacturing a plurality of optical devices
NL2005164C2 (en) 2010-07-28 2012-01-31 Anteryon Internat B V OPTICAL UNIT.
FR2966936B1 (en) * 2010-11-02 2012-12-07 Commissariat Energie Atomique OPTICAL IMAGING SYSTEM FOR A CONCAVE SPHERICAL SURFACE
CN102478695B (en) * 2010-11-25 2016-05-11 鸿富锦精密工业（深圳）有限公司 Lens module array, manufacture method and camera lens
US9910239B2 (en) * 2010-11-30 2018-03-06 Flir Systems Trading Belgium Bvba Wafer level optical elements and applications thereof
KR101262470B1 (en) * 2011-01-31 2013-05-08 엘지이노텍 주식회사 Lens assembly and camera module
NL2006373C2 (en) 2011-03-11 2012-09-17 Anteryon Internat B V OPTICAL UNIT.
US8345360B2 (en) * 2011-06-03 2013-01-01 Visera Technologies Company Limited Camera unit and macro lens thereof
JPWO2012173252A1 (en) * 2011-06-17 2015-02-23 コニカミノルタ株式会社 Wafer lens manufacturing method, wafer lens, lens unit manufacturing method, and lens unit
JP2013007969A (en) * 2011-06-27 2013-01-10 Sharp Corp Imaging lens, lens array, imaging lens producing method, and imaging module
US20130122247A1 (en) 2011-11-10 2013-05-16 Omnivision Technologies, Inc. Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same
JP5469235B2 (en) * 2012-12-20 2014-04-16 オリンパス株式会社 Lens module manufacturing method
US9887221B2 (en) * 2014-02-18 2018-02-06 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
JP6254680B2 (en) * 2014-04-04 2018-01-10 シャープ株式会社 Lens element and imaging device
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
JP6744119B2 (en) * 2016-04-05 2020-08-19 パナソニックｉ−ＰＲＯセンシングソリューションズ株式会社 Endoscope
US9829698B2 (en) 2015-08-31 2017-11-28 Panasonic Corporation Endoscope
US9778443B2 (en) 2015-10-05 2017-10-03 Omnivision Technologies, Inc. Three-surface wide field-of-view lens system
KR101701060B1 (en) * 2015-11-03 2017-01-31 삼성전기주식회사 Camera module
US10677964B2 (en) 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
EP3773145A1 (en) 2018-04-06 2021-02-17 AMO Development LLC Methods and systems for corneal topography with in-focus scleral imaging
KR102555577B1 (en) * 2019-01-28 2023-07-18 삼성전자주식회사 Electronic module including camera module

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EP1239519A2 (en) * 2001-03-05 2002-09-11 Canon Kabushiki Kaisha Image pickup model and image pickup device
US20040047274A1 (en) * 2002-06-27 2004-03-11 Olumpus Optical Co., Ltd. Image pickup lens unit and image pickup device
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Title
See also references of WO2008011003A2 *

Also Published As

Publication number Publication date
EP2044629A2 (en) 2009-04-08
CN101512768A (en) 2009-08-19
JP2009544226A (en) 2009-12-10
CN101512768B (en) 2012-11-21
KR20090034981A (en) 2009-04-08
JP2013153537A (en) 2013-08-08
KR101185881B1 (en) 2012-09-25
JP5372280B2 (en) 2013-12-18
WO2008011003A2 (en) 2008-01-24
JP5292291B2 (en) 2013-09-18
WO2008011003A3 (en) 2008-06-26

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