EP1815554B8 - Coupling conductors for a yig filter or yig oscillator and method for producing said conductors - Google Patents

Coupling conductors for a yig filter or yig oscillator and method for producing said conductors

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Publication number
EP1815554B8
EP1815554B8 EP05813554A EP05813554A EP1815554B8 EP 1815554 B8 EP1815554 B8 EP 1815554B8 EP 05813554 A EP05813554 A EP 05813554A EP 05813554 A EP05813554 A EP 05813554A EP 1815554 B8 EP1815554 B8 EP 1815554B8
Authority
EP
European Patent Office
Prior art keywords
yig
coupling
coupling line
film
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP05813554A
Other languages
German (de)
French (fr)
Other versions
EP1815554A1 (en
EP1815554B1 (en
Inventor
Wilhelm Hohenester
Claus Tremmel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohde and Schwarz GmbH and Co KG
Original Assignee
Rohde and Schwarz GmbH and Co KG
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Publication of EP1815554A1 publication Critical patent/EP1815554A1/en
Application granted granted Critical
Publication of EP1815554B1 publication Critical patent/EP1815554B1/en
Publication of EP1815554B8 publication Critical patent/EP1815554B8/en
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/215—Frequency-selective devices, e.g. filters using ferromagnetic material
    • H01P1/218—Frequency-selective devices, e.g. filters using ferromagnetic material the ferromagnetic material acting as a frequency selective coupling element, e.g. YIG-filters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Definitions

  • the invention relates to coupling lines for use in a YIG bandpass filter or a YIG oscillator according to the preamble of claim 1 and a method for producing such coupling lines, which are suitable for use in a YIG bandpass filter or a YIG oscillator, according to the preamble of claim 11.
  • YIG bandpass filters or YIG oscillators have at least one resonator, which is preferably spherical and made of an yttrium iron garnet (Yttrium-Iron-Garnet YIG).
  • the Resonator Brady is mediated by coupling lines, which must be designed and arranged so that the center of the resonator and the center of the bending radius of a coupling line match exactly.
  • a YIG bandpass filter with correspondingly formed coupling lines is known, for example, from the publication US Pat. No. 4,480,238.
  • the tunable YIG bandpass filter in this case has a base body, which slots for receiving isolated platelets having at one edge a conductive coating which serves as coupling lines comprises. Furthermore, filter chambers are provided for receiving the YIG elements. The platelets are placed over the YIG elements in the slots so that the YIG elements are arranged in indentations in the edges provided with the conductive coating. The YIG elements and the plates are fixed in fixed positions.
  • a disadvantage of the YIG bandpass filter known from the cited document is, in particular, the complicated production of the platelets forming the coupling lines.
  • the serving as a carrier insulator must first be appropriately shaped and then provided with the conductive coating. This is expensive and prone to jeopardy because the coating is sensitive to damage due to the small layer thickness.
  • Object of the present invention is therefore to provide coupling lines that are easy to manufacture, insensitive to damage and easy to install, and to provide a method for producing such coupling lines.
  • the object is achieved with respect to the coupling lines by the characterizing features of claim 1, with respect to the method by the characterizing features of claim 11 and with respect to a film carrier for the coupling lines by the characterizing features of claim 19.
  • FIG. 1A is a schematic perspective view of a preferred embodiment of a main body of a YIG bandpass filter with
  • Resonators and coupling lines, 1B is a schematic perspective view of the resonators and coupling lines without basic body
  • FIG. 2A is a schematic representation of an exemplary coupling loop for two resonators according to the prior art
  • FIG. 2B shows a schematic illustration of an exemplary embodiment of a coupling loop designed according to the invention for two resonators
  • 3A-C are schematic representations of inventively designed coupling lines during the
  • FIG. 1A shows a schematic, perspective view of an exemplary embodiment of a YIG bandpass filter 2, which has a base body 3 and, in the exemplary embodiment, four filter chambers 4 formed in the base body 3 with just as many YIG elements 6.
  • the YIG elements 6 are formed spherically from an yttrium-iron garnet, mounted on holders 10, for example, by gluing with epoxy resin and electromagnetically coupled by coupling lines 1.
  • the filter chambers 4 are interconnected by slots 5, in which the coupling lines 1 are inserted.
  • two of the filter chambers 4 are identical in the embodiment.
  • the filter chambers 4 denoted by 4b have only the YIG elements 6.
  • the number of filter chambers 4b is not limited to two, but may be one or more so that the total number of filter chambers 4 may be either three or five or more.
  • FIG. 1B shows the arrangement of the coupling lines 1 and the YIG elements 6 mounted on their holders 10 without the surrounding base body 3.
  • the coupling lines 1 are executed in the embodiment in two different forms.
  • the filter chambers 4b interconnecting coupling line 1 is designed as an input or output line Ia, while in the embodiment, three further coupling lines 1 are designed as connecting lines Ib.
  • the coupling lines 1 have contact lugs 8, which on the one hand serve to connect the earth in the coupling lines 1 in the base body 3 and on the other hand to fix the coupling lines 1 in the slots 5.
  • the contact lugs 8 are rectangular in shape, wherein an edge length of the contact lugs 8 corresponds approximately to the axial thickness of the base body 2.
  • FIGS. 2A and 2B it is possible to see how the inventive coupling lines 1 according to FIG. 2B differ from conventional coupling lines 1 according to FIG. 2A.
  • the two embodiments have in common that in each case at least one curved portion 17 is provided, which surrounds a respective YIG element 6 so at least partially, that a center of the YIG element 6 coincides with a center of the curved portion 17. Furthermore, at least one line section 18 is provided.
  • the prior art coupling line 1 shown in Fig. 2A is bent from a wire.
  • the YIG elements 6 are introduced into the main body 3, not shown in detail in FIGS. 2A and 2B, and then the only roughly pre-bent wire is inserted into the slots 5.
  • a measurement of the degree of coupling results where the coupling line 1 still needs to be bent. This is done manually by means of a suitable tool. Thereafter must be checked again and readjusted. For this purpose, each time the YIG filter 2 or YIG oscillator must be opened and then reassembled to make the measurement. The method is thus extremely complicated and often even leads to the fact that the workpiece must be completely discarded after several iterations, because no satisfactory coupling is achieved.
  • the inventively designed coupling lines 1 as shown in FIG. 2B made of a metallic foil 7 by suitable methods such as etching, eroding, cutting, especially laser cutting or water jet cutting and / or punching and assembled. Thereafter, the correct positioning of the YIG elements 6 takes place relative to the coupling lines. 1
  • the film 7 is made of a copper-beryllium alloy to meet both the requirements of elasticity and strength.
  • the thickness of the film 7 is preferably about 50 microns.
  • the preparation of the coupling lines 1 from the film 7 takes place in several processing steps. First, the film 7 is cleaned and applied on both sides with a positive resist at an alignment accuracy of about 5 microns in a layer thickness of about 5 microns to create a mask. Thereafter, the preparation of the coupling lines 1, for example, by spray etching with iron chloride. (FeCl 3). Subsequently, the liberated in the form of a carrier 9 with a predetermined number of coupling lines 1 of lacquer residues and galvanically provided with a gold coating of about 5 microns. After that follows a curing process for example, one hour at 325 ° C. Then the coupling lines can be released from the film carrier 9 and installed.
  • the coupling lines 1 have by the manufacturing method described a solid shape with a well-defined radius of curvature in the curved portions 17 at a uniform curvature.
  • the YIG elements 6 are then aligned relative to the coupling lines 1. This is compared to the prior art simpler and associated with considerably less effort, because the manufacturing accuracy is considerably greater in the present invention designed coupling lines 1 as in manually curved coupling lines. 1
  • FIG. 3A shows, in a schematic illustration, a carrier 9 which contains the coupling lines 1 required for a YIG bandpass filter 2 with four YIG elements 6.
  • the coupling lines 1 are formed in the embodiment in the form of an input or output line Ia and three connecting lines Ib.
  • the former is disposed at the bottom of Fig. 3A in the film carrier 9, the latter above.
  • FIGS. 3B and 3C show the sections from the carrier 9 labeled HIB and IIIC in FIG. 3A.
  • FIG. 3B one of the three connecting lines Ib is shown, while FIG. 3C shows the input and output lines Ia.
  • the coupling lines 1 are held in the carrier 9 by webs 12 which are formed on the contact lugs 8 before being singulated.
  • the coupling lines 1 are mounted in the base body 3 according to their shape and fixed in the base body 3 by soldering, welding or another method of maintaining the electrical conductivity.
  • the invention is not limited to the illustrated embodiment and suitable for any configured YIG filter 2 or YIG oscillators.
  • the individual features can be combined with each other as desired.

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  • Control Of Motors That Do Not Use Commutators (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)

Abstract

The invention relates to a coupling conductor (1) for a YIG Filter (2) or YIG oscillator. Said conductor is produced from a metallic foil by the erosion, laser cutting and/or etching of a metallic foil (7). According to the invention, the coupling conductor (1) comprises at least one curved section (17), which at least partially surrounds a YIG element (6) and at least one conductor section (18).

Description

Kopplungs.Leitungen für einen YIG-Filtβr oder YIG- Coupling lines for a YIG filter or YIG
Oszillator und Verfahren zur Herstellung derOscillator and method for producing the
Kopplungsleitungencoupling lines
Die Erfindung betrifft Kopplungsleitungen zur Verwendung in einem YIG-Bandpaßfilter oder einem YIG-Oszillator gemäß dem Oberbegriff des Anspruchs 1 sowie ein Verfahren zur Herstellung von derartigen Kopplungsleitungen, die zur Verwendung in einem YIG-Bandpaßfilter oder einem YIG- Oszillator geeignet sind, gemäß dem Oberbegriff des Anspruchs 11.The invention relates to coupling lines for use in a YIG bandpass filter or a YIG oscillator according to the preamble of claim 1 and a method for producing such coupling lines, which are suitable for use in a YIG bandpass filter or a YIG oscillator, according to the preamble of claim 11.
YIG-Bandpaßfilter oder YIG-Oszillatoren verfügen über zumindest einen Resonator, welcher vorzugsweise kugelförmig ausgebildet und aus einem Yttrium-Eisen-Granat (Yttrium-lIron-Garnet YIG) hergestellt ist. Die Resonatorwirkung wird mittels Kopplungsleitungen vermittelt, die so ausgebildet und angeordnet sein müssen, daß der Mittelpunkt des Resonators und der Mittelpunkt des Biegeradius einer Kopplungsleitung genau übereinstimmen.YIG bandpass filters or YIG oscillators have at least one resonator, which is preferably spherical and made of an yttrium iron garnet (Yttrium-Iron-Garnet YIG). The Resonatorwirkung is mediated by coupling lines, which must be designed and arranged so that the center of the resonator and the center of the bending radius of a coupling line match exactly.
Ein YIG-Bandpaßfilter mit entsprechend ausgebildeten Kopplungsleitungen ist beispielsweise aus der Druckschrift US 4,480,238 bekannt. Der durchstimmbare YIG-Bandpaßfilter weist dabei einen Grundkörper auf, welcher Schlitze zur Aufnahme von isolierten Plättchen, die an einer Kante eine leitfähige Beschichtung aufweisen, die als Kopplungsleitungen dient, umfaßt. Weiterhin sind Filterkammern zur Aufnahme der YIG-Elemente vorgesehen. Die Plättchen werden so über die YIG-Elemente in die Schlitze eingelegt, daß die YIG-Elemente in Einbuchtungen in den mit der leitfähigen Beschichtung versehenen Kanten angeordnet sind. Die YIG-Elemente und die Plättchen werden in festen Positionen fixiert. Nachteilig an dem aus der oben genannten Druckschrift bekannten YIG-Bandpaßfilter ist insbesondere die aufwendige Herstellung der die Kopplungsleitungen bildenden Plättchen. Der als Träger dienende Isolator muß zunächst entsprechend geformt und dann mit der leitfähigen Beschichtung versehen werden. Dies ist aufwendig und ausschußgefährdet, da die Beschichtung durch die geringe Schichtdicke empfindlich gegen Beschädigungen ist.A YIG bandpass filter with correspondingly formed coupling lines is known, for example, from the publication US Pat. No. 4,480,238. The tunable YIG bandpass filter in this case has a base body, which slots for receiving isolated platelets having at one edge a conductive coating which serves as coupling lines comprises. Furthermore, filter chambers are provided for receiving the YIG elements. The platelets are placed over the YIG elements in the slots so that the YIG elements are arranged in indentations in the edges provided with the conductive coating. The YIG elements and the plates are fixed in fixed positions. A disadvantage of the YIG bandpass filter known from the cited document is, in particular, the complicated production of the platelets forming the coupling lines. The serving as a carrier insulator must first be appropriately shaped and then provided with the conductive coating. This is expensive and prone to jeopardy because the coating is sensitive to damage due to the small layer thickness.
Aufgabe der vorliegenden Erfindung ist es demnach, Kopplungsleitungen zu schaffen, die einfach herstellbar, unempfindlich gegen Beschädigungen und leicht einbaubar sind, sowie ein Verfahren zur Herstellung solcher Kopplungsleitungen anzugeben.Object of the present invention is therefore to provide coupling lines that are easy to manufacture, insensitive to damage and easy to install, and to provide a method for producing such coupling lines.
Die Aufgabe wird bezüglich der Kopplungsleitungen durch die kennzeichnenden Merkmale des Anspruchs 1, bezüglich des Verfahrens durch die kennzeichnenden Merkmale des Anspruchs 11 sowie bezüglich eines Folien-Trägers für die Kopplungsleitungen durch die kennzeichnenden Merkmale des Anspruchs 19 gelöst.The object is achieved with respect to the coupling lines by the characterizing features of claim 1, with respect to the method by the characterizing features of claim 11 and with respect to a film carrier for the coupling lines by the characterizing features of claim 19.
Vorteilhafte Weiterbildungen der erfindungsgemäßen Kopplungsleitungen und des erfindungsgemäßen Trägers sowie des erfindungsgemäßen Verfahrens zur Herstellung der Kopplungsleitungen sind in den Unteransprüchen angegeben.Advantageous developments of the coupling lines according to the invention and of the carrier according to the invention and of the method according to the invention for producing the coupling lines are specified in the subclaims.
Im Folgenden werden anhand der Zeichnung bevorzugte Ausführungsbeispiele der Erfindung beispielhaft dargestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigen:In the following, preferred embodiments of the invention are shown by way of example with reference to the drawing and explained in more detail in the following description. Show it:
Fig. IA eine schematische, perspektivische Darstellung eines bevorzugten Ausführungsbeispiels eines Grundkörpers eines YIG-Bandpaßfilters mit1A is a schematic perspective view of a preferred embodiment of a main body of a YIG bandpass filter with
Resonatoren und Koppelungsleitungen, Fig. IB eine schematische, perspektivische Darstellung der Resonatoren und Koppelungsleitungen ohne Grundkörper,Resonators and coupling lines, 1B is a schematic perspective view of the resonators and coupling lines without basic body,
Fig. 2A eine schematische Darstellung einer beispielhaften Koppelungsschlaufe für zwei Resonatoren gemäß dem Stand der Technik,2A is a schematic representation of an exemplary coupling loop for two resonators according to the prior art,
Fig. 2B eine schematische Darstellung eines Ausführungsbeispiels einer erfindungsgemäß ausgestalteten Koppelungsschlaufe für zwei Resonatoren, undFIG. 2B shows a schematic illustration of an exemplary embodiment of a coupling loop designed according to the invention for two resonators, and FIG
Fig. 3A-C schematische Darstellungen von erfindungsgemäß ausgestalteten Koppelungsleitungen während des3A-C are schematic representations of inventively designed coupling lines during the
Herstellungsprozesses vor dem Vereinzeln.Production process before separating.
Fig. IA zeigt in einer schematischen, perspektivischen Ansicht ein Ausführungsbeispiel eines YIG-Bandpaßfilters 2, der einen Grundkörper 3 und im Ausführungsbeispiel vier in dem Grundkörper 3 ausgebildete Filterkammern 4 mit ebenso vielen YIG-Elementen 6 aufweist.1A shows a schematic, perspective view of an exemplary embodiment of a YIG bandpass filter 2, which has a base body 3 and, in the exemplary embodiment, four filter chambers 4 formed in the base body 3 with just as many YIG elements 6.
Die YIG-Elemente 6 sind dabei kugelförmig aus einem Yttrium-Eisen-Granat ausgebildet, auf Haltern 10 beispielsweise durch Kleben mit Epoxydharz montiert und durch Kopplungsleitungen 1 elektromagnetisch gekoppelt.The YIG elements 6 are formed spherically from an yttrium-iron garnet, mounted on holders 10, for example, by gluing with epoxy resin and electromagnetically coupled by coupling lines 1.
Die Filterkammern 4 sind durch Schlitze 5 miteinander verbunden, in welche die Kopplungsleitungen 1 eingelegt sind. Dabei sind im Ausführungsbeispiel jeweils zwei der Filterkammern 4 gleich ausgebildet. In die mit 4a bezeichneten Filterkammern 4 münden Koaxialkabel 11 ein, über die der Signalein- bzw. -auslauf erfolgt. Die mit 4b bezeichneten Filterkammern 4 weisen dagegen nur die YIG- Elemente 6 auf. Die Anzahl der Filterkammern 4b ist dabei nicht auf zwei beschränkt, sondern kann auch eins oder mehr betragen so daß die Gesamtzahl der Filterkammern 4 entweder drei oder fünf oder mehr betragen kann. Fig. IB zeigt zur besseren Verständlichkeit der erfindungsgemäßen Maßnahmen die Anordnung der Kopplungsleitungen 1 sowie der auf ihren Haltern 10 montierten YIG-Elemente 6 ohne den umgebenden Grundkörper 3.The filter chambers 4 are interconnected by slots 5, in which the coupling lines 1 are inserted. In this case, two of the filter chambers 4 are identical in the embodiment. In the designated filter chambers 4 4a 4 open coaxial cable 11, via which the signal input and output takes place. By contrast, the filter chambers 4 denoted by 4b have only the YIG elements 6. The number of filter chambers 4b is not limited to two, but may be one or more so that the total number of filter chambers 4 may be either three or five or more. For better understanding of the measures according to the invention, FIG. 1B shows the arrangement of the coupling lines 1 and the YIG elements 6 mounted on their holders 10 without the surrounding base body 3.
Die Kopplungsleitungen 1 sind im Ausführungsbeispiel in zwei verschiedenen Formen ausgeführt. Die die Filterkammern 4b untereinander verbindende Kopplungsleitung 1 ist als Ein- bzw. Ausgangsleitung Ia ausgeführt, während die im Ausführungsbeispiel drei weiteren Kopplungsleitungen 1 als Verbindungsleitungen Ib ausgeführt sind.The coupling lines 1 are executed in the embodiment in two different forms. The filter chambers 4b interconnecting coupling line 1 is designed as an input or output line Ia, while in the embodiment, three further coupling lines 1 are designed as connecting lines Ib.
Wie aus Fig. IB hervorgeht, weisen die Kopplungsleitungen 1 Kontaktfahnen 8 auf, welche einerseits der Masseverbindung der Kopplungsleitungen 1 im Grundkörper 3 und andererseits der Fixierung der Kopplungsleitungen 1 in den Schlitzen 5 dienen. Die Kontaktfahnen 8 sind dabei rechteckig geformt, wobei eine Kantenlänge der Kontaktfahnen 8 ungefähr der axialen Dicke des Grundkörpers 2 entspricht.As is apparent from FIG. 1B, the coupling lines 1 have contact lugs 8, which on the one hand serve to connect the earth in the coupling lines 1 in the base body 3 and on the other hand to fix the coupling lines 1 in the slots 5. The contact lugs 8 are rectangular in shape, wherein an edge length of the contact lugs 8 corresponds approximately to the axial thickness of the base body 2.
Betrachtet man die Fig. 2A und 2B, ist erkennbar, wodurch sich die erfindungsgemäßen Kopplungsleitungen 1 gemäß Fig. 2B von herkömmlichen Kopplungsleitungen 1 gemäß Fig. 2A unterscheiden.Looking at FIGS. 2A and 2B, it is possible to see how the inventive coupling lines 1 according to FIG. 2B differ from conventional coupling lines 1 according to FIG. 2A.
Den beiden Ausführungsformen ist gemeinsam, daß jeweils zumindest ein gekrümmter Abschnitt 17 vorgesehen ist, der jeweils ein YIG-Element 6 so zumindest teilweise umgreift, daß ein Mittelpunkt des YIG-Elements 6 mit einem Mittelpunkt des gekrümmten Abschnitts 17 zusammenfällt. Weiterhin ist zumindest ein Leitungsabschnitt 18 vorgesehen.The two embodiments have in common that in each case at least one curved portion 17 is provided, which surrounds a respective YIG element 6 so at least partially, that a center of the YIG element 6 coincides with a center of the curved portion 17. Furthermore, at least one line section 18 is provided.
Die in Fig. 2A dargestellte Kopplungsleitung 1 gemäß dem Stand der Technik ist aus einem Draht gebogen. Hierbei werden zunächst die YIG-Elemente 6 in den in Fig. 2A und 2B nicht näher dargestellten Grundkörper 3 eingebracht und dann der nur grob vorgebogene Draht in die Schlitze 5 eingelegt. Eine Messung des Koppelungsgrades ergibt dann, wo die Kopplungsleitung 1 noch nachgebogen werden muß. Dies erfolgt händisch mittels eines geeigneten Werkzeugs. Danach muß erneut kontrolliert und u.U. wieder nachjustiert werden. Zu diesem Zweck muß jedes Mal der YIG-Filter 2 oder YIG-Oszillator geöffnet und anschließend zum Vornehmen der Messung wieder zusammengebaut werden. Das Verfahren ist somit äußerst aufwendig und führt oftmals sogar dazu, daß das Werkstück nach mehreren Iterationen vollkommen verworfen werden muß, weil keine befriedigende Kopplung erreicht wird.The prior art coupling line 1 shown in Fig. 2A is bent from a wire. in this connection First, the YIG elements 6 are introduced into the main body 3, not shown in detail in FIGS. 2A and 2B, and then the only roughly pre-bent wire is inserted into the slots 5. A measurement of the degree of coupling results where the coupling line 1 still needs to be bent. This is done manually by means of a suitable tool. Thereafter must be checked again and readjusted. For this purpose, each time the YIG filter 2 or YIG oscillator must be opened and then reassembled to make the measurement. The method is thus extremely complicated and often even leads to the fact that the workpiece must be completely discarded after several iterations, because no satisfactory coupling is achieved.
Demgegenüber werden die erfindungsgemäß ausgestalteten Kopplungsleitungen 1 gemäß Fig. 2B aus einer metallischen Folie 7 durch geeignete Verfahren wie Ätzen, Erodieren, Schneiden, insbesondere Laserschneiden oder Wasserstrahlschneiden und/oder Stanzen hergestellt und montiert. Danach erfolgt die korrekte Positionierung der YIG-Elemente 6 relativ zu den Kopplungsleitungen 1.In contrast, the inventively designed coupling lines 1 as shown in FIG. 2B made of a metallic foil 7 by suitable methods such as etching, eroding, cutting, especially laser cutting or water jet cutting and / or punching and assembled. Thereafter, the correct positioning of the YIG elements 6 takes place relative to the coupling lines. 1
Die Folie 7 besteht aus einer Kupfer-Beryllium-Legierung, um sowohl den Anforderungen an die Elastizität als auch an die Festigkeit zu genügen. Die Dicke der Folie 7 beträgt dabei vorzugsweise ca. 50 μm.The film 7 is made of a copper-beryllium alloy to meet both the requirements of elasticity and strength. The thickness of the film 7 is preferably about 50 microns.
Die Herstellung der Kopplungsleitungen 1 aus der Folie 7 erfolgt in mehreren Bearbeitungsschritten. Zunächst wird die Folie 7 gereinigt und auf beiden Seiten mit einem Positivlack bei einer Justiergenauigkeit von ca. 5 μm in einer Schichtdicke von ca. 5 μm aufgetragen, um eine Maske zu erstellen. Danach erfolgt die Herstellung der Kopplungsleitungen 1 beispielsweise durch Sprühätzen mit Eisenchlorid. (FeCl3) . Anschließend werden die in Form eines Trägers 9 mit einer vorher festgelegten Anzahl von Kopplungsleitungen 1 von Lackresten befreit und galvanisch mit einer Goldbeschichtung von ca. 5 μm versehen. Danach folgt ein Härtungsvorgang für beispielsweise eine Stunde bei 325°C. Dann können die Kopplungsleitungen aus dem Folien-Träger 9 gelöst und verbaut werden.The preparation of the coupling lines 1 from the film 7 takes place in several processing steps. First, the film 7 is cleaned and applied on both sides with a positive resist at an alignment accuracy of about 5 microns in a layer thickness of about 5 microns to create a mask. Thereafter, the preparation of the coupling lines 1, for example, by spray etching with iron chloride. (FeCl 3). Subsequently, the liberated in the form of a carrier 9 with a predetermined number of coupling lines 1 of lacquer residues and galvanically provided with a gold coating of about 5 microns. After that follows a curing process for example, one hour at 325 ° C. Then the coupling lines can be released from the film carrier 9 and installed.
Die Kopplungsleitungen 1 weisen durch das beschriebene Herstellungsverfahren eine feste Form mit einem genau definierten Krümmungsradius in den gekrümmten Abschnitten 17 bei einer gleichmäßigen Krümmung auf. Die YIG-Elemente 6 werden dann relativ zu den Kopplungsleitungen 1 ausgerichtet. Dies ist gegenüber dem Stand der Technik einfacher und mit erheblich geringerem Aufwand verbunden, weil die Herstellungsgenauigkeit bei den erfindungsgemäß ausgestalteten Kopplungsleitungen 1 erheblich größer ist als bei händisch gebogenen Kopplungsleitungen 1.The coupling lines 1 have by the manufacturing method described a solid shape with a well-defined radius of curvature in the curved portions 17 at a uniform curvature. The YIG elements 6 are then aligned relative to the coupling lines 1. This is compared to the prior art simpler and associated with considerably less effort, because the manufacturing accuracy is considerably greater in the present invention designed coupling lines 1 as in manually curved coupling lines. 1
Fig. 3A zeigt in einer schematischen Darstellung einen Träger 9, welcher die für einen YIG-Bandpaßfilter 2 mit vier YIG-Elementen 6 benötigten Kopplungsleitungen 1 enthält .FIG. 3A shows, in a schematic illustration, a carrier 9 which contains the coupling lines 1 required for a YIG bandpass filter 2 with four YIG elements 6.
Wie bereits weiter oben erwähnt, sind die Kopplungsleitungen 1 im Ausführungsbeispiel in Form einer Ein- bzw. Ausgangsleitung Ia sowie dreier Verbindungsleitungen Ib ausgebildet. Die erstere ist in Fig. 3A ganz unten in dem Folien-Träger 9 angeordnet, die letzteren darüber.As already mentioned above, the coupling lines 1 are formed in the embodiment in the form of an input or output line Ia and three connecting lines Ib. The former is disposed at the bottom of Fig. 3A in the film carrier 9, the latter above.
Die Fig. 3B und 3C zeigen die in Fig. 3A mit HIB und IIIC bezeichneten Ausschnitte aus dem Träger 9. In Fig. 3B ist eine der drei Verbindungsleitungen Ib dargestellt, während Fig. 3C die Ein- bzw. Ausgangsleitung Ia zeigt.FIGS. 3B and 3C show the sections from the carrier 9 labeled HIB and IIIC in FIG. 3A. In FIG. 3B, one of the three connecting lines Ib is shown, while FIG. 3C shows the input and output lines Ia.
Aus den Fig. 3B und 3C ist erkennbar, daß die Kopplungsleitungen 1 nach dem Vorgang des Ätzens, Schneidens, Stanzens oder Erodierens aus der Folie 7 vor dem Vereinzeln in dem Träger 9 durch Stege 12 gehalten werden, die an den Kontaktfahnen 8 ausgebildet sind. Beim Vereinzeln der Kopplungsleitungen 1 werden die Kopplungsleitungen 1 aus dem Träger 9 durch Brechen der Stege 12 separiert. Nach dem Vereinzeln werden die Kopplungsleitungen 1 entsprechend ihrer Form in dem Grundkörper 3 montiert und durch Löten, Schweißen oder ein anderes, die elektrische Leitfähigkeit erhaltendes Verbindungsverfahren in dem Grundkörper 3 fixiert.It can be seen from FIGS. 3B and 3C that after the process of etching, cutting, punching or eroding, the coupling lines 1 are held in the carrier 9 by webs 12 which are formed on the contact lugs 8 before being singulated. When separating the coupling lines 1, the coupling lines 1 from the carrier 9 by breaking the Webs 12 separated. After singulation, the coupling lines 1 are mounted in the base body 3 according to their shape and fixed in the base body 3 by soldering, welding or another method of maintaining the electrical conductivity.
Die Erfindung ist nicht auf das dargestellte Ausführungsbeispiel beschränkt und für beliebig ausgestaltete YIG-Filter 2 oder YIG-Oszillatoren geeignet. Die einzelnen Merkmale sind dabei beliebig miteinander kombinierbar. The invention is not limited to the illustrated embodiment and suitable for any configured YIG filter 2 or YIG oscillators. The individual features can be combined with each other as desired.

Claims

Ansprüche claims
1. Kopplungsleitung (1) für einen YIG-Filter (2) oder YIG- Oszillator, wobei die Kopplungsleitung (1) zumindest einen gekrümmten Abschnitt (17), der zumindest ein YIG-Element (6) zumindest teilweise umgreift, und zumindest einen1. Coupling line (1) for a YIG filter (2) or YIG oscillator, wherein the coupling line (1) at least one curved portion (17) at least partially surrounds at least one YIG element (6), and at least one
Leitungsabschnitt (18) aufweist, dadurch gekennzeichnet, daß die Kopplungsleitung (1) durch Erodieren, Schneiden,Conduction portion (18), characterized in that the coupling line (1) by eroding, cutting,
Stanzen und/oder Ätzen aus einer metallischen Folie (7) hergestellt ist.Punching and / or etching of a metallic foil (7) is made.
2. Kopplungsleitung nach Anspruch 1, dadurch gekennzeichnet, daß das Herstellungsverfahren Sprühätzen unter Verwendung 2. Coupling line according to claim 1, characterized in that the manufacturing method using spray etching
3. Kopplungsleitung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Kopplungsleitung (1) als Ein- bzw. Ausgangs1eitung (Ia) oder als Verbindungsleitung (Ib) ausgebildet ist.3. Coupling line according to claim 1 or 2, characterized in that the coupling line (1) as an input or output line (Ia) or as a connecting line (Ib) is formed.
4. Kopplungsleitung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Kopplungsleitung (6) zumindest eine Kontaktfahne (8) aufweist.4. Coupling line according to one of claims 1 to 3, characterized in that the coupling line (6) has at least one contact lug (8).
5. Kopplungsleitung nach Anspruch 4, dadurch gekennzeichnet, daß die zumindest eine Kontaktfahne (8) einstückig mit der Kopplungsleitung (6) ausgebildet ist.5. Coupling line according to claim 4, characterized in that the at least one contact lug (8) is formed integrally with the coupling line (6).
6. Kopplungsleitung nach Anspruch 4 oder 5, dadurch gekennzeichnet. daß die zumindest eine Kontaktfahne (8) rechteckig geformt ist.6. Coupling line according to claim 4 or 5, characterized. the at least one contact lug (8) is rectangular in shape.
7. Kopplungsleitung nach Anspruch 6, dadurch gekennzeichnet, daß eine Kantenlänge der zumindest einen Kontaktfahne (8) ungefähr einer axialen Dicke eines Grundkörpers (2) des YIG-Filters (2) oder YIG-Oszillators entspricht.7. Coupling line according to claim 6, characterized in that an edge length of the at least one contact lug (8) corresponds approximately to an axial thickness of a base body (2) of the YIG filter (2) or YIG oscillator.
8. Kopplungsleitung nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß die Folie (7) aus einer Legierung aus Kupfer und Beryllium besteht.8. Coupling line according to one of claims 1 to 7, characterized in that the film (7) consists of an alloy of copper and beryllium.
9. Kopplungsleitung nach Anspruch 8, dadurch gekennzeichnet, daß die Dicke der Folie (7) 10 bis 100 μm, besonders bevorzugt 25 bis 75 μm, besonders bevorzugt etwa 50 μm beträgt.9. coupling line according to claim 8, characterized in that the thickness of the film (7) 10 to 100 .mu.m, more preferably 25 to 75 .mu.m, more preferably about 50 microns.
10. Kopplungsleitung nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, daß der zumindest eine gekrümmte Abschnitt (17) der Kopplungsleitung (1) einen definierten reproduzierbaren Krümmungsradius aufweist.10. Coupling line according to one of claims 1 to 9, characterized in that the at least one curved portion (17) of the coupling line (1) has a defined reproducible radius of curvature.
11. Verfahren zur Herstellung einer Kopplungsleitung (1) für einen YIG-Filter (2) oder einen YIG-Oszillator, wobei die Kopplungsleitung (1) zumindest einen gekrümmten Abschnitt (17), der zumindest ein YIG-Element (6) zumindest teilweise umgreift, und zumindest einen11. A method for producing a coupling line (1) for a YIG filter (2) or a YIG oscillator, wherein the coupling line (1) at least one curved portion (17), which surrounds at least one YIG element (6) at least partially , and at least one
Leitungsabschnitt (18) aufweist, dadurch gekennzeichnet, daß die Kopplungsleitung (1) durch Erodieren, Schneiden, Stanzen und/oder Ätzen aus einer metallischen Folie (7) hergestellt wird.Conduction portion (18), characterized in that the coupling line (1) by eroding, cutting, punching and / or etching of a metallic foil (7) is produced.
12. Verfahren nach Anspruch 11, dadurch gekennzeichnet. daß das Verfahren folgende Verfahrensschritte -umfaßt:12. The method according to claim 11, characterized. that the method comprises the following method steps:
- Reinigen einer Folie (7) ,Cleaning a film (7),
- Belacken der Folie (7) ,- coating the film (7),
- Sprühätzen der Kopplungsleitungen (6) aus der Folie (7), - Entlacken der Kopplungsleitungen (6) ,Spray-etching the coupling lines (6) from the film (7), stripping the coupling lines (6),
- Vergolden der Kopplungsleitungen (6),Gilding the coupling lines (6),
- Härten der Kopplungsleitungen (6), und- Hardening of the coupling lines (6), and
- Vereinzeln der Kopplungsleitungen (6) aus der Folie (7) .- Separating the coupling lines (6) from the film (7).
13. Verfahren nach Anspruch 12, dadurch gekennzeichnet, daß der Verfahrensschritt des Belackens der Folie (7) das Belacken einer Vorderseite und einer Rückseite der Folie (7) umfaßt.13. The method according to claim 12, characterized in that the step of coating the film (7) comprises the coating of a front side and a back side of the film (7).
14. Verfahren nach Anspruch 12, dadurch gekennzeichnet, daß die Lackdicke beim Belacken ca. 5 μm beträgt.14. The method according to claim 12, characterized in that the paint thickness during coating is about 5 microns.
15. Verfahren nach Anspruch 13 oder 14, dadurch gekennzeichnet, daß die Justiergenauigkeit dem Belacken etwa 5 μm beträgt.15. The method according to claim 13 or 14, characterized in that the adjustment accuracy is the Belacken about 5 microns.
16. Verfahren nach einem der Ansprüche 13 bis 15, dadurch gekennzeichnet, daß der Lack in Form von Positivlack aufgetragen wird.16. The method according to any one of claims 13 to 15, characterized in that the lacquer is applied in the form of positive lacquer.
17. Verfahren nach Anspruch 12, dadurch gekennzeichnet, daß der Verfahrensschritt des Sprühätzens mit Eisenchlorid FeCl3 durchgeführt wird.17. The method according to claim 12, characterized in that the process step of the spray-etching with iron chloride FeCl 3 is performed.
18. Verfahren nach Anspruch 12, dadurch gekennzeichnet, daß der Verfahrensschritt des Vergoldens bis zu einer Schichtdicke von ca. 5 μm erfolgt.18. The method according to claim 12, characterized in that the process step of gilding takes place up to a layer thickness of about 5 microns.
19. Verfahren nach Anspruch 12, dadurch gekennzeichnet, daß der Verfahrensschritt des Härtens für die Dauer von etwa einer Stunde bei einer Temperatur von ca. 3250C durchgeführt wird.19. The method according to claim 12, characterized that the step of curing is carried out for a period of about one hour at a temperature of about 325 0 C.
20. Verfahren nach einem der Ansprüche 12 bis 19, dadurch gekennzeichnet, daß die Kopplungsleitungen (1) für jeweils einen Grundkörper (3) eines YIG-Bandpaßfilters (2) oder YIG- Oszillators als Einheit in einem Folien-Träger (9) hergestellt werden.20. The method according to any one of claims 12 to 19, characterized in that the coupling lines (1) for each a base body (3) of a YIG bandpass filter (2) or YIG oscillator as a unit in a film carrier (9) are produced ,
21. Folien-Träger (9) für Kopplungsleitungen (1) für YIG-21. Film carrier (9) for coupling lines (1) for YIG
Filter (2) oder YIG-Oszillatoren, wobei dieFilter (2) or YIG oscillators, wherein the
Kopplungsleitungen (1) zumindest einen gekrümmten Abschnitt (17), der zumindest ein YIG-Element (6) umgreift, und zumindest einen Leitungsabschnitt (18) aufweist, dadurch gekennzeichnet, daß der Folien-Träger (9) jeweils so viele Kopplungsleitungen (1) enthält, wie für die Bestückung eines YIG-Filters (2) oder des YIG-Oszillators benötigt werden. Coupling lines (1) at least one curved portion (17) which surrounds at least one YIG element (6) and at least one line section (18), characterized in that the film carrier (9) in each case as many coupling lines (1) contains as needed for equipping a YIG filter (2) or the YIG oscillator.
EP05813554A 2004-11-22 2005-11-07 Coupling conductors for a yig filter or yig oscillator and method for producing said conductors Active EP1815554B8 (en)

Applications Claiming Priority (2)

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DE102004056259A DE102004056259A1 (en) 2004-11-22 2004-11-22 Coupling lines for a YIG filter or YIG oscillator and method for producing the coupling lines
PCT/EP2005/011885 WO2006056314A1 (en) 2004-11-22 2005-11-07 Coupling conductors for a yig filter or yig oscillator and method for producing said conductors

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EP1815554B1 EP1815554B1 (en) 2010-10-27
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WO2020089255A1 (en) * 2018-10-29 2020-05-07 Universität Hamburg Magnetically tunable resonator
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CN110165344B (en) * 2019-05-28 2021-08-27 西南应用磁学研究所 Resonant circuit structure of gyromagnetic filter

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JP4589402B2 (en) 2010-12-01
JP2008521299A (en) 2008-06-19
US8327520B2 (en) 2012-12-11
DE502005010453D1 (en) 2010-12-09
US20080211605A1 (en) 2008-09-04
DE102004056259A1 (en) 2006-05-24
US7573357B2 (en) 2009-08-11
EP1815554B1 (en) 2010-10-27
WO2006056314A1 (en) 2006-06-01
US20090144964A1 (en) 2009-06-11

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