EP0895655B1 - Device for treating substrates in a fluid container - Google Patents

Device for treating substrates in a fluid container Download PDF

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Publication number
EP0895655B1
EP0895655B1 EP97915453A EP97915453A EP0895655B1 EP 0895655 B1 EP0895655 B1 EP 0895655B1 EP 97915453 A EP97915453 A EP 97915453A EP 97915453 A EP97915453 A EP 97915453A EP 0895655 B1 EP0895655 B1 EP 0895655B1
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EP
European Patent Office
Prior art keywords
fluid
nozzles
fluid container
container
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97915453A
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German (de)
French (fr)
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EP0895655A1 (en
Inventor
Martin Weber
John Oshinowo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Scp U s Inc
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Steag Microtech GmbH
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Filing date
Publication date
Priority claimed from DE1996116402 external-priority patent/DE19616402C2/en
Application filed by Steag Microtech GmbH filed Critical Steag Microtech GmbH
Priority to EP02005774A priority Critical patent/EP1239512A3/en
Publication of EP0895655A1 publication Critical patent/EP0895655A1/en
Application granted granted Critical
Publication of EP0895655B1 publication Critical patent/EP0895655B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/26—Nozzle-type reactors, i.e. the distribution of the initial reactants within the reactor is effected by their introduction or injection through nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00049—Controlling or regulating processes
    • B01J2219/00051—Controlling the temperature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Definitions

  • the invention has for its object a device for treatment of substrates in a fluid container to create the optimal flow conditions allows in the fluid container and high circulation or flow speeds allows.
  • the object is achieved according to the invention solved a device according to claim 1.
  • the Device has nozzles in the bottom of the container, as well Frei Albany inlet ports solved that in the tank bottom between the nozzles for flushing areas are provided between the nozzles. In this way it is possible also flush the gaps between the nozzles and the blind spots.
  • a closable opening is provided, which has a large diameter.
  • a power failure or any other irregularity but also in connection with Common process steps make it possible in the fluid container substrates quickly from the treatment medium, for example corrosive substances to get rid of.
  • a collection container below the fluid pool intended is preferably a collection container below the fluid pool intended.
  • Another embodiment of the invention is in addition to the nozzles on the tank bottom nozzles on the side walls of the Provide fluid container in this way to the side or in the area the transition of the fluid bottom to the side walls of fluid in the fluid container initiate so that the flow conditions further improved or thereby the circulation volume will be increased.
  • Another advantageous embodiment of the invention is a to use hood brought over the fluid basin, which preferably at least a fluid inlet opening, in particular for inlet of a fluid for the drying process according to the MARANGONI principle.
  • hood brought over the fluid basin which preferably at least a fluid inlet opening, in particular for inlet of a fluid for the drying process according to the MARANGONI principle.
  • Around Avoiding repetitions to this embodiment is particularly important to DE-A-44 13 077 and the unpublished, to the same applicant declining DE-A-195 00 239, DE-A-196 15 108 and DE-A-196 15,970, filed April 22, 1996.
  • a megasonic emitting device is also advantageous, which preferably is integrated in the form of a Megasonic transducer in the fluid container or are.
  • An advantageous location for this is from the floor and the side walls formed corners of the fluid container, the direction of radiation is preferably 45 ° with respect to the horizontal.
  • the device according to the invention is preferably with a fluid treatment device connected in which fluids or fluid mixtures are collected and processed so that they can be reused and preferably be returned to the fluid container.
  • the base 2 has a plurality of nozzles 7, which are arranged in a matrix are, as can best be seen from Figure 2.
  • the nozzles have different ones Nozzle exit or radiation angle 8, 9 as shown in FIG. 1 is drawn. Because of the different beam angles or due to the different radiation forms result in a good, uniform laminar flow across the entire fluid container profile and the Substrates 5 are made uniform over the entire width fluid exiting the nozzles 7.

Abstract

A device for treating substrates includes a fluid container in which the substrates are contained during treatment. A nozzle system is connected to the sidewalls and/or bottom of the fluid container and includes a plurality of nozzles for introducing a fluid into the fluid container.

Description

Die Erfindung betrifft eine Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter, der auf der Oberseite seiner Seitenwände Überlauföffnungen aufweist.The invention relates to a device for treating substrates in one Fluid container that overflows on the top of its side walls having.

Vorrichtungen dieser Art sind beispielsweise aus der US-PS 5 275 184 oder der auf dieselbe Anmelderin zurückgehenden DE-A-44 13 077 bekannt, bei der ein Fluid über eine Einlaßöffnung bzw. einen Diffusor in das Fluid-Becken eingeleitet wird und über einen Überlauf am oberen Ende aus ihm ausströmt. Bei Verwendung einer einzigen Zuströmöffnung am Boden des Fluidbehälters ist die pro Zeiteinheit einströmende Menge sowie die Geschwindigkeit des einströmenden Fluids begrenzt. Insbesondere ist es damit nicht möglich, im Behälter gleichmäßige Strömungsverhältnisse zu erreichen, um die im Fluid-Becken zu behandelnden Substrate oder Wafer über die gesamte Substratbreite oder -fläche hinweg gleichmäßig mit dem Fluid zu beaufschlagen bzw. zu umspülen. Bei Verwendung eines Diffusors ist es zwar möglich, das einströmende Fluid im Fluid-Behälter besser über die Fluidfläche hinweg zu verteilen, die pro Zeiteinheit einströmende Fluid-Menge und insbesondere auch die Einströmgeschwindigkeit des Fluids ist bei der Verwendung von Diffusoren aber stark beschränkt.Devices of this type are known, for example, from US Pat. No. 5,275,184 or known from DE-A-44 13 077, which goes back to the same applicant, at a fluid into the fluid basin via an inlet opening or a diffuser is introduced and flows out of it via an overflow at the upper end. When using a single inflow opening at the bottom of the fluid container is the amount flowing in per time unit and the speed of the inflowing fluid limited. In particular, it is not possible to Container to achieve even flow conditions around the in the fluid pool substrates or wafers to be treated across the entire substrate width to apply the fluid evenly or across the surface or to wash around. When using a diffuser, it is possible that the inflowing Distribute fluid in the fluid container better across the fluid surface, the amount of fluid flowing in per unit time and in particular also the inflow speed of the fluid is when using diffusers but very limited.

Aus der US-A-4 092 176 ist eine Vorrichtung zum Waschen von Halbleiter-Wafern bekannt, bei der die Waschflüssigkeit über eine perforierte Platte von unten in den Behälter eingeleitet wird. Unterhalb der perforierten Platte befinden sich Düsen, die die Waschflüssigkeit von unten auf die perforierte Platte richten.US-A-4 092 176 discloses a device for washing semiconductor wafers known in which the washing liquid via a perforated plate of is introduced into the bottom of the container. Located below the perforated plate nozzles that wash the washing liquid from below onto the perforated plate judge.

Aus der US-A-4 753 258 ist eine Vorrichtung zum Behandeln von Substraten in einem Fluid- Behälter bekannt, der auf der Oberseite seine Seitenwände Überlauföffnungen aufweist und der in seinem Boden Einlaßöffnungen aufweist.From US-A-4 753 258 an apparatus for Treatment of substrates in a fluid container known, the overflow openings on the top of its side walls has and the inlet openings in its bottom having.

Der Erfindung liegt die Aufgabe zugrunde, eine Vorrichtung zur Behandlung von Substraten in einem Fluid-Behälter zu schaffen, die optimale Strömungsverhältnisse im Fluidbehälter ermöglicht und große Umwälz- bzw. Fließgeschwindigkeiten zuläßt.The invention has for its object a device for treatment of substrates in a fluid container to create the optimal flow conditions allows in the fluid container and high circulation or flow speeds allows.

Die gestellte Aufgabe wird erfindungsgemäß durch eine Vorrichtung gemäß Anspruch 1 gelöst. Die Vorrichtung weist Düsen im Behälter-Boden auf, sowie Freispül-Einlaßöffnungen gelöst, die im Behälter-Boden zwischen den Düsen zum Freispülen von Bereichen zwischen den Düsen vorgesehen sind. Auf diese Weise ist es möglich, auch die Zwischenräume zwischen den Düsen und die toten Winkel freizuspülen.The object is achieved according to the invention solved a device according to claim 1. The Device has nozzles in the bottom of the container, as well Freispül inlet ports solved that in the tank bottom between the nozzles for flushing areas are provided between the nozzles. In this way it is possible also flush the gaps between the nozzles and the blind spots.

Die Freispül-Einlaßöffnungen sind vorteilhafterweise matrixförmig angeordnet. Gemäß einer weiteren Ausführungsform der Erfindung stehen sie dabei vorteilhafterweise ebenso wie die Düsen mit einem darunterliegenden Zuführraum in Verbindung.The flushing inlet openings are advantageously arranged in a matrix. According to a further embodiment of the invention, they advantageously stand just like the nozzles with an inlet space underneath in connection.

Aufgrund mehrerer Düsen ist es möglich, das Fluid mit den gewünschten Strömungsverhältnissen bzw. zum Erreichen gewünschter Strömungsverhältnisse im Fluid-Behälter einströmen zu lassen, so daß der gesamte zu behandelnde Substratbereich gleichmäßig von dem Fluid umspült und beaufschlagt wird. Durch die Verwendung von Düsen zur Einleitung des Fluids ist es auch möglich, das Fluid mit hohen Einströmgeschwindigkeiten und hohen Durchflußmengen pro Zeiteinheit in den Fluid-Behälter einzubringen und in ihm strömen zu lassen, so daß bei Aufrechterhaltung eines laminaren Stromes extrem hohe Fließgeschwindigkeiten erreicht werden. Dadurch wird nicht nur die Behandlung der Substrate verbessert, sondern auch der Behandlungsvorgang verkürzt, so daß die Produktivität der Vorrichtung erhöht wird.Due to several nozzles, it is possible to use the desired fluid Flow conditions or to achieve the desired flow conditions to flow into the fluid container so that the whole to be treated The substrate area is evenly washed around and acted upon by the fluid becomes. By using nozzles to introduce the fluid it is too possible, the fluid with high inflow speeds and high flow rates per unit time in the fluid container and in it to flow so that while maintaining a laminar flow extremely high flow rates can be achieved. This will not only the treatment of the substrates improved, but also the treatment process shortened, so that the productivity of the device is increased.

Gemäß besonders vorteilhaften Ausgestaltungen der Erfindung weisen wenigstens einige Düsen unterschiedliche Abstrahlwinkel auf. Die Abstrahlformen der Düsen können vorzugsweise kegelförmig, aber auch fächerförmig sein, so daß die Einleitung des Fluids je nach den Gegebenheiten des Einzelfalles und der Lage der Düsen im Hinblick auf eine gleichmäßige, laminare Strömung im Fluid-Behälter und eine gleichmäßige Beaufschlagung der Substrate mit dem Fluid optimierbar ist. According to particularly advantageous embodiments of the invention, at least some nozzles have different beam angles. The radiation forms the nozzles can preferably be conical, but also fan-shaped be so that the introduction of the fluid depending on the circumstances of the individual case and the location of the nozzles for uniform, laminar Flow in the fluid container and an even application of the substrates can be optimized with the fluid.

Die Düsen sind im Boden des Fluid-Behälters und gemäß einer besonders vorteilhaften Ausführungsform matrixartig verteilt auf dem Boden des Behälters angeordnet. Auf diese Weise ergibt sich eine gleichmäßige Verteilung der Fluid-Zufuhr über die gesamte Fläche des Fluid-Behälters hinweg und insbesondere ist es auch möglich, in den Randbereichen optimale Strömungsverhältnisse zu schaffen.The nozzles are in the bottom of the fluid container and according to a particularly advantageous embodiment distributed in a matrix on the Bottom of the container arranged. In this way there is a uniform Distribution of the fluid supply over the entire surface of the fluid container away and in particular it is also possible to optimal in the edge areas To create flow conditions.

Die Düsen sind vorteilhafterweise zu Düsengruppen zusammengefaßt, die vorzugsweise an unterschiedlichen Bodenbereichen des Behälters angeordnet sind. Vorteilhaft ist es, wenn eine Düsengruppe im mittleren Bereich und jeweils eine Düsengruppe in den beiden Außenbereichen vorgesehen ist, wobei die Dichte und Anzahl der Düsen in den einzelnen Bereichen unterschiedlich gewählt sein kann. Vorteilhaft ist es auch, wenn die einzelnen Düsen und/oder Düsengruppen voneinander getrennte Fluid-Versorgungseinrichtungen aufweisen, so daß die Düsen mit unterschiedlichem Fluid-Druck beaufschlagbar sind.The nozzles are advantageously combined into nozzle groups which preferably arranged on different bottom areas of the container are. It is advantageous if a nozzle group in the middle and one nozzle group is provided in each of the two outer areas, wherein the density and number of nozzles in the individual areas vary can be chosen. It is also advantageous if the individual nozzles and / or nozzle groups separate fluid supply devices have, so that the nozzles with different fluid pressure are acted upon.

Gemäß einer sehr vorteilhaften Ausführungsform der Erfindung ist unter dem Boden des Fluid-Behälters ein Fluid-Zuführraum vorgesehen, mit dem die Düsen in Verbindung stehen. Dabei ist der Fluid-Zuführraum gemäß einer weiteren Ausführungsform der Erfindung in Teilräume für einzelne Düsen und/oder Düsengruppen unterteilt.According to a very advantageous embodiment of the invention is under the Bottom of the fluid container, a fluid supply space is provided with which the nozzles stay in contact. The fluid supply space is according to another Embodiment of the invention in subspaces for individual nozzles and / or Nozzle groups divided.

Der Fluid-Zuführraum unterhalb des Behälter-Bodens ist vorzugsweise in Form eines Zwischenraums zwischen einem doppelten Boden ausgebildet.The fluid supply space below the tank bottom is preferably in Formed a space between a double floor.

Gemäß einer weiteren sehr vorteilhaften Ausführungsform der Erfindung ist der Boden des Fluid-Behälters geneigt, vorzugsweise fällt der Boden jeweils zur Mitte, etwa zu einer Mittellinie oder zu einem Mittelpunkt des Fluid-Behälters hin ab. Auf diese Weise kann der Fluid-Behälter bei Ablassen des Fluids nach unten schnell und vollständig entleert werden.According to another very advantageous embodiment of the invention the bottom of the fluid container is inclined, preferably the bottom falls in each case to the center, for example to a center line or to a center of the fluid container down. In this way, the fluid container when draining the Fluids can be drained down quickly and completely.

Zum schnellen Ablassen des Fluids ist im Fluid-Behälter, und dort insbesondere in der Mitte bzw. in der Mittellinie, eine verschließbare Öffnung vorgesehen, die einen großen Durchmesser aufweist. Im Falle eines Stromausfalls oder einer sonstigen Unregelmäßigkeit, aber auch im Zusammenhang mit gängigen Verfahrensschritten ist es auf diese Weise möglich, die im Fluid-Behälter befindlichen Substrate schnell von dem Behandlungs-Medium, beispielsweise ätzenden Substanzen, zu befreien. Zur Aufnahme des schnell abgelassenen Fluids ist vorzugsweise unterhalb des Fluidbeckens ein Auffangbehälter vorgesehen.To quickly drain the fluid is in the fluid container, and there in particular in the middle or in the center line, a closable opening is provided, which has a large diameter. In the event of a power failure or any other irregularity, but also in connection with Common process steps make it possible in the fluid container substrates quickly from the treatment medium, for example corrosive substances to get rid of. To accommodate the quickly drained Fluid is preferably a collection container below the fluid pool intended.

Eine weitere Ausführungsform der Erfindung besteht darin, zusätzlich zu den Düsen auf dem Behälter-Boden Düsen an den Seitenwänden des Fluid-Behälters vorzusehen, um auf diese Weise auch seitlich oder im Bereich des Übergangs des Fluid-Bodens zu den Seitenwänden Fluid in den Fluid-Behälter einzuleiten, damit die Strömungsverhältnisse weiter verbessert oder dadurch das Umwälzvolumen erhöht werden bzw. wird.Another embodiment of the invention is in addition to the nozzles on the tank bottom nozzles on the side walls of the Provide fluid container in this way to the side or in the area the transition of the fluid bottom to the side walls of fluid in the fluid container initiate so that the flow conditions further improved or thereby the circulation volume will be increased.

Gemäß einer weiteren sehr vorteilhaften Ausführungsform der Erfindung sind Düsen und/oder Düsengruppen für unterschiedliche Fluids vorgesehen. Die einzelnen Düsen und/oder Düsengruppen für unterschiedliche Gruppen sind dabei auch hinsichtlich der Zuleitungen und Pumpen voneinander getrennt, so daß die unterschiedlichen Fluids, etwa unterschiedliche Chemikalien, durch Düsen- und/oder Düsengruppen eingeleitet werden, die den Chemikalien zugeordnet sind. Auf diese Weise ist ein Fluid-Wechsel schnell und ohne die Gefahr einer Vermischung möglich, da an die jeweiligen Düsen immer nur die diesen Düsen zugeordneten Fluids gelangen.According to a further very advantageous embodiment of the invention Nozzles and / or nozzle groups are provided for different fluids. The individual nozzles and / or nozzle groups for different groups separated from each other with regard to the supply lines and pumps, so that the different fluids, such as different chemicals, by Nozzle and / or nozzle groups are introduced, which are assigned to the chemicals are. In this way, a fluid change is quick and without that Risk of mixing possible, since only the respective nozzles are connected to the respective nozzles fluid associated with these nozzles.

Gemäß einer weiteren sehr vorteilhaften Ausführungsform der Erfindung können zusätzlich zu den über die Düsen eingeleiteten Fluids weitere Fluids, beispielsweise zusätzliche Chemikalien, Gase, Ozon, Wasser usw. in den Fluid-Behälter eingeleitet. Insbesondere zur zusätzlichen Einleitung von Chemikalien, Gasen, Ozon oder Wasser ist im Fluid-Behälter wenigstens ein Diffusor vorgesehen. According to a further very advantageous embodiment of the invention in addition to the fluids introduced via the nozzles, further fluids, for example additional chemicals, gases, ozone, water etc. in the fluid container initiated. Especially for the additional introduction of chemicals, Gases, ozone or water are at least one diffuser in the fluid container intended.

Sehr vorteilhaft ist auch eine Ausführungsform der Erfindung, bei der Sprühdüsen im oberen Bereich des Fluid-Behälters, etwa an den Seitenwänden angeordnet sind, die zur Reinigung des Fluid-Behälters und/oder dazu dienen, die Substrate zwischen unterschiedlichen im selben Fluid-Behälter ablaufenden Verfahren, etwa zwischen dem Ätzprozess, dem Reinigungsprozess und dem Trocknungsvorgang zu befeuchten bzw. naß zu halten. Vorzugsweise werden hierfür Aerosole, Wasser, sonstige Chemikaliendämpfe eingesprüht, oder auch Fluids die auch von unten in die Fluid-Behälter eingeleitet werden.An embodiment of the invention in which spray nozzles are also very advantageous arranged in the upper region of the fluid container, approximately on the side walls are used to clean the fluid container and / or to the substrates between different ones running in the same fluid container Procedures, such as between the etching process, the cleaning process and dampen the drying process or keep it wet. Preferably aerosols, water and other chemical vapors are sprayed in for this purpose, or also fluids that are also introduced into the fluid container from below.

Eine weitere vorteilhafte Ausführungsform der Erfindung besteht darin, eine über das Fluid-Becken bringbare Haube zu verwenden, die vorzugsweise wenigstens eine Fluid-Einlaßöffnung, insbesondere zum Einlassen eines Fluids für den Trocknungsvorgang nach dem MARANGONI-Prinzip, aufweist. Um Wiederholungen zu dieser Ausführungsform zu vermeiden, wird insbesondere auf die DE-A-44 13 077 sowie die nicht vorveröffentlichten, auf dieselbe Anmelderin zurückgehenden DE-A-195 00 239, DE-A-196 15 108 und DE-A-196 15 970, angemeldet am 22. April 1996, verwiesen.Another advantageous embodiment of the invention is a to use hood brought over the fluid basin, which preferably at least a fluid inlet opening, in particular for inlet of a fluid for the drying process according to the MARANGONI principle. Around Avoiding repetitions to this embodiment is particularly important to DE-A-44 13 077 and the unpublished, to the same applicant declining DE-A-195 00 239, DE-A-196 15 108 and DE-A-196 15,970, filed April 22, 1996.

Vorteilhaft ist weiterhin die Verwendung einer Heiz- und/oder Kühleinrichtung zum Erwärmen und/oder Kühlen des Fluids im Fluid-Behälter, mit der die Fluid-Temperatur auf einen wählbaren, optimalen Wert einstellbar ist. Auch ist die Verwendung einer Ultraviolett-Lichtquelle vorteilhaft, die am Boden und/oder an den Seitenwänden des Fluid-Behälters angeordnet ist.The use of a heating and / or cooling device is also advantageous for heating and / or cooling the fluid in the fluid container with which the Fluid temperature is adjustable to a selectable, optimal value. Is too the use of an ultraviolet light source advantageous on the ground and / or is arranged on the side walls of the fluid container.

Eine weitere vorteilhafte Ausgestaltung der Erfindung besteht darin, einen Substrat-Niederhalter etwa in Form einer Halteleiste vorzusehen, die auf den oberen Randbereich der Substrate auflegbar ist. Um Wiederholungen hierzu zu vermeiden, wird auf die auf dieselbe Anmelderin zurückgehende DE-A-196 15 970, angemeldet am 22. April 1996, verwiesen. Another advantageous embodiment of the invention consists in a To provide substrate hold-downs approximately in the form of a retaining strip on the upper edge area of the substrates can be placed. To repeat this to avoid, is based on the same applicant DE-A-196 15,970, filed April 22, 1996.

Vorteilhaft ist weiterhin eine Megasonic-Abstrahlvorrichtung, die vorzugsweise in Form eines Megasonic-Transducers im Fluid-Behälter integriert ist bzw. sind. Ein vorteilhafter Anbringungsort ist dafür die vom Boden und den Seitenwänden gebildeten Ecken des Fluid-Behälters, wobei die Abstrahlrichtung bezüglich der Horizontalen vorzugsweise 45° beträgt.A megasonic emitting device is also advantageous, which preferably is integrated in the form of a Megasonic transducer in the fluid container or are. An advantageous location for this is from the floor and the side walls formed corners of the fluid container, the direction of radiation is preferably 45 ° with respect to the horizontal.

Da mit der erfindungsgemäßen Vorrichtung der Behälter sehr schnell gefüllt werden kann, und eine starke Düsenwirkung beim Einbringen des Fluids in den Behälter auftritt, ist insbesondere eine Vorrichtung zum Abdecken des Fluid-Behälters vorteilhaft, die verhindert, daß Fluid in Form von Spritzern in eine vorhandene Haube gelangt, die vorzugsweise für den Trocknungsvorgang eingesetzt wird.Since the container filled very quickly with the device according to the invention can be, and a strong nozzle effect when introducing the fluid in the container occurs, is in particular a device for covering the Fluid container advantageous, which prevents fluid in the form of splashes in an existing hood arrives, preferably for the drying process is used.

Die erfindungsgemäße Vorrichtung ist vorzugsweise mit einer Fluid-Aufbereitungseinrichtung verbunden, in der Fluids oder Fluidmischungen aufgefangen und aufbereitet werden, so daß sie wiederverwendet werden können und vorzugsweise in den Fluid-Behälter rückgeführt werden.The device according to the invention is preferably with a fluid treatment device connected in which fluids or fluid mixtures are collected and processed so that they can be reused and preferably be returned to the fluid container.

Vorteilhaft ist weiterhin eine Trenn-Anlage, in der die in der Abluft enthaltenen alkalischen und Säuredämpfe getrennt werden.Another advantage is a separation system in which those contained in the exhaust air alkaline and acid vapors are separated.

Insbesondere für die Behandlungs- und Spülvorgänge ist es vorteilhaft, wenn die Substrate im Fluid-Behälter gedreht werden können. Dafür ist vorzugsweise eine Vorrichtung vorgesehen, die die Substrate im Fluid-Behälter dreht.In particular for the treatment and rinsing processes, it is advantageous if the substrates in the fluid container can be rotated. For that is preferable a device is provided which rotates the substrates in the fluid container.

Es ist vorteilhaft, die Fluids bei der Verwendung von Fluid-Mischungen vor dem Einbringen in den Fluid-Behälter vorzumischen.It is advantageous to precede the fluids when using fluid mixtures pre-mix in the fluid container.

Die Erfindung wird nachfolgend anhand von bevorzugten Ausführungsbeispielen unter Bezugnahme auf die Figuren erläutert. Es zeigen:

Fig. 1
eine Ausführungsform der erfindungsgemäßen Vorrichtung im Querschnitt,
Fig. 2
die in der Figur 1 gezeigte Vorrichtung in Aufsicht bzw. mit Blickrichtung von oben in den Fluid-Behälter, und
Fig. 3
einen Querschnitt entlang einer Querschnittsfläche, die gegenüber der Querschnittsfläche der in Figur 1 gezeigten Darstellung um 90° gedreht ist.
The invention is explained below using preferred exemplary embodiments with reference to the figures. Show it:
Fig. 1
an embodiment of the device according to the invention in cross section,
Fig. 2
the device shown in Figure 1 in supervision or looking from above into the fluid container, and
Fig. 3
a cross section along a cross-sectional area which is rotated by 90 ° with respect to the cross-sectional area of the illustration shown in Figure 1.

Wie aus den Figuren ersichtlich ist, weist der Fluid-Behälter 1 der erfindungsgemäßen Vorrichtung einen Boden 2 und Seitenwände 3 auf. Auf den in Figur 1 gegenüberliegenden Seitenwänden 3 sind Schlitze 4 vorgesehen, in denen Substrat-Scheiben 5 geführt sind, und die auf einer Substrat-Aufnahmevorrichtung 6 stehen, die mittels einer nicht dargestellten Antriebsvorrichtung in vertikaler Richtung beweglich ist und die Wafer 5 in den Fluid-Behälter 1 absenkt und aus ihm herausfährt. Die Substrat-Aufnahmevorrichtung 6 besteht bei dem dargestellten Ausführungsbeispiel aus einem messerartigen Steg mit Schlitzen oder Kerben, die entsprechend dem Abstand zwischen den Führungsschlitzen 4 in den einander gegenüberliegenden Seitenwänden 3 beabstandet sind.As can be seen from the figures, the fluid container 1 has the inventive Device on a bottom 2 and side walls 3. In the figure 1 opposite side walls 3, slots 4 are provided in which Substrate discs 5 are guided, and that on a substrate receiving device 6 are available, which are shown in FIG is movable in the vertical direction and lowers the wafer 5 into the fluid container 1 and get out of it. The substrate receiving device 6 is made in the illustrated embodiment with a knife-like web Slots or notches that correspond to the distance between the guide slots 4 spaced apart in the opposite side walls 3 are.

Wie am besten aus Figur 1 ersichtlich ist, ist der Boden 2 auf beiden Seiten einer Mittellinie nach innen geneigt, so daß ein Fluid bei Entleerung des Behälters 1 in der Mitte nach unten ausströmt.As best seen in Figure 1, the bottom 2 is on both sides a center line inclined inward so that a fluid when emptying the container 1 flows down in the middle.

Der Boden 2 weist eine Vielzahl von Düsen 7 auf, die matrixförmig angeordnet sind, wie dies am besten aus Figur 2 zu ersehen ist. Die Düsen weisen unterschiedliche Düsenaustritts- bzw. Abstrahlwinkel 8, 9 auf, wie dies in Figur 1 eingezeichnet ist. Aufgrund der unterschiedlichen Abstrahlwinkel bzw. aufgrund der unterschiedlichen Abstrahlformen ergibt sich eine gute, gleichmäßige laminare Strömung über das gesamte Fluid-Behälterprofil hinweg und die Substrate 5 werden über die gesamte Breite hinweg gleichmäßig mit dem aus den Düsen 7 austretenden Fluid beaufschlagt.The base 2 has a plurality of nozzles 7, which are arranged in a matrix are, as can best be seen from Figure 2. The nozzles have different ones Nozzle exit or radiation angle 8, 9 as shown in FIG. 1 is drawn. Because of the different beam angles or due to the different radiation forms result in a good, uniform laminar flow across the entire fluid container profile and the Substrates 5 are made uniform over the entire width fluid exiting the nozzles 7.

Aus Figur 1 ist ersichtlich, daß unterhalb des Bodens 2 Hohlräume 12, 13, 14, 15 ausgebildet sind, die nach unten durch eine Abschlußplatte 16 abgeschlossen sind. Über die Hohlräume 12 bis 15 wird das Fluid den mit den jeweiligen Hohlräumen in Verbindung stehenden Düsen 7 zugeleitet.From Figure 1 it can be seen that 2 cavities 12, 13, 14, 15 are formed, which are closed at the bottom by an end plate 16 are. Via the cavities 12 to 15, the fluid with the respective Cavities in the related nozzles 7 fed.

Zwischen den Düsen 7 sind im Boden 2 Freispül-Einlaßöffnungen 18 vorgesehen, die entsprechend Figur 2 ebenfalls matrixförmig auf dem Boden 2 des Fluid-Behälters 1 verteilt sind. Die Freispül-Einlaßöffnungen 18 spülen die Bereiche des Bodens 2 zwischen den Düsen 7 frei und stehen ebenfalls für die Fluid-Zufuhr mit entsprechenden Fluid-Zuführräumen 12 bis 15 unterhalb des Bodens 2 in Verbindung.Between the nozzles 7 there are 2 flushing inlet openings 18 in the base, 2 also in matrix form on the bottom 2 of the Fluid container 1 are distributed. The flushing inlet openings 18 flush the areas of the bottom 2 between the nozzles 7 free and also stand for the Fluid supply with corresponding fluid supply spaces 12 to 15 below the Floor 2 in connection.

Wie Figur 1 zeigt, ist in der Mitte des Bodens 2 eine Öffnung 19 für das schnelle Ablassen des im Fluid-Behälter 1 befindlichen Fluids vorgesehen, etwa dann, wenn Stromausfall eintritt und/oder die sich im Fluid-Behälter 1 befindenden Substrate 5 schnell aus der Fluid-Umgebung, beispielsweise einem Ätz-Medium, befreit werden müssen. Bei Öffnen eines Verschlusses 20 wird das Fluid innerhalb eines kleinen Zeitraums in einen nicht dargestellten, unter dem Fluid-Behälter 1 angeordneten Auffangbehälter entleert.As Figure 1 shows, in the middle of the bottom 2 there is an opening 19 for the rapid discharge of the fluid in the fluid container 1 is provided, for example, when there is a power failure and / or in the fluid container 1 substrates 5 quickly from the fluid environment, for example a Etching medium, must be freed. When opening a closure 20 within a short period of time, the fluid is arranged below the fluid container 1 emptied.

Die Substrat-Aufnahmevorrichtung 6 befindet sich im Bereich oberhalb des Verschlusses 20 teilweise innerhalb des Bodens 2 und ragt nur zu einem geringen Teil über die Düsenöffnungen nach oben hinaus. Dadurch ist innerhalb des Fluid-Behälters 1 nur wenig zusätzlicher Raum für die Substrat-Aufnahmevorrichtung erforderlich, so daß das Fluid-Volumen im Fluid-Behälter 1 klein gehalten werden kann.The substrate receiving device 6 is located in the area above the Closure 20 partially inside the bottom 2 and only protrudes to a small extent Part above the nozzle openings upwards. This is within of the fluid container 1 only a little additional space for the substrate receiving device required so that the fluid volume in the fluid container 1 can be kept small.

Auf der Oberseite der Seitenwände 3 befinden sich Überlauf-Öffnungen 21, über die das von unten einströmende Fluid abfließt.On the top of the side walls 3 there are overflow openings 21, through which the fluid flowing in from below flows off.

Die Erfindung wurde zuvor anhand eines bevorzugten Ausführungsbeispiels erläutert. Dem Fachmann sind jedoch zahlreiche Abwandlungen und Ausgestaltungen möglich, ohne daß dadurch der Erfindungsgedanke verlassen wird. Beispielsweise ist über dem Fluid-Behälter 1 eine Haube anbringbar, oder es sind an den Seitenwänden 3 des Fluid-Behälters 1, beispielsweise im oberen Bereich, Sprühdüsen zum Reinigen des Beckens oder zum Besprühen der Substrate 5 zwischen den einzelnen Verfahrensschritten und Behandlungsprozessen vorgesehen. Auch ist der Einsatz von Megasonic-Transducern, von Ultraviolett-Lichtquellen oder von Vorrichtungen zum Drehen der Wafer 5 im Fluid-Behälter 1 möglich, wie dies zuvor bereits beschrieben wurde.The invention was previously based on a preferred embodiment explained. However, numerous modifications and refinements are known to the person skilled in the art possible without leaving the inventive idea. For example, a hood can be attached over the fluid container 1, or it are on the side walls 3 of the fluid container 1, for example in the upper Area, spray nozzles for cleaning the pool or spraying the Substrates 5 between the individual process steps and treatment processes intended. Also the use of Megasonic transducers of ultraviolet light sources or of devices for rotating the wafer 5 in the fluid container 1 is possible, as already described above has been.

Claims (36)

  1. Device for treating substrates (5), with a fluid container (1), which has overflow openings (21) on the upper side of its side walls (3), characterised in that a nozzle system with several nozzles (7) is provided in the container base (2) for conducting in a fluid and that washing-free inlet openings (18) are provided in the container base (2) between the nozzles (7) for washing-free regions between the nozzles (7).
  2. Device according to claim 1, characterised in that the washing-free inlet openings (8) are arranged to be distributed in matrix form on the base (2) of the fluid container (1).
  3. Device according to claim 1 or 2, characterised in that the washing-free inlet openings (18) are connected with a fluid feed chamber (12, 13, 14, 15) disposed thereunder.
  4. Device according to one of the preceding claims, characterised in that the nozzles (7) are combined into nozzle groups.
  5. Device according to one of the preceding claims, characterised in that the nozzles (7) and/or nozzle groups are provided for different fluids.
  6. Device according to claim 5, characterised in that feed ducts to the nozzles (7) and/or nozzle groups provided for different fluids are provided to be respectively separate from one another.
  7. Device according to one of the preceding claims, characterised in that the individual nozzles (7) and/or nozzle groups have fluid supply devices separate from one another.
  8. Device according to claim 3 or according to claim 3 together with one of claims 4 to 7, characterised in that the fluid feed chamber is subdivided into fluid part chambers (12, 13, 14, 15) for individual nozzles (7) and/or nozzle groups.
  9. Device according to daim 3 or according to claim 3 together one of claims 4 to 8, characterised in that the fluid feed chamber (12, 13, 14, 15) is formed by an intermediate space between a double base (2, 16).
  10. Device according to one of the preceding claims, characterised in that at least some nozzles (7) have different angles (8, 9) of radiation.
  11. Device according to one of the preceding claims, characterised in that at least one nozzle (7) has a fan-shaped radiation pattern.
  12. Device according to one of the preceding claims, characterised in that at least one nozzle (7) has a cone-shaped radiation pattern.
  13. Device according to one of the preceding claims, characterised in that the nozzles (7) are arranged to be distributed in matrix form on the container base (2).
  14. Device according to claim 4 or according to claim 4 together with one of claims 5 to 13, characterised in that the nozzle groups are arranged at different base regions of the fluid container (1).
  15. Device according to claim 4 or according to claim 4 together with one of claims 5 to 13, characterised in that one nozzle group is provided in the middle region and a respective nozzle group is provided in each of the two outer regions of the base (2).
  16. Device according to one of the preceding claims, characterised in that the base of the fluid container (1) is inclined.
  17. Device according to claim 16, characterised in that the base (2) drops away each time towards the centre of the fluid container (1).
  18. Device according to one of the preceding claims, characterised by an opening (19) for rapid discharge of the fluid from the fluid container (1).
  19. Device according to claim 18, characterised by a collecting container below the fluid container (1) for the rapid discharge of the fluid.
  20. Device according to one of the preceding claims, characterised in that nozzles (7) are provided at the side walls (3) of the fluid container (1).
  21. Device according to one of the preceding claims, characterised in that the nozzles are provided for conducting several fluids into the fluid container (1).
  22. Device according to claim 21, characterised in that the additional fluids are chemicals, gases, ozone and/or water.
  23. Device according to claim 21 or 22, characterised in that at least one diffuser for conducting in additional fluids is provided.
  24. Device according to one of the preceding claims, characterised by spray nozzles which are arranged at the side walls, preferably in the upper region of the fluid container (1).
  25. Device according to claim 24, characterised in that the spray nozzles are provided for spraying in chemicals.
  26. Device according to one of the preceding claims, characterised by a device for covering the fluid container (1).
  27. Device according to one of the preceding claims, characterised by at least one substrate retaining strip which is provided for resting on the substrates (5) in the upper edge region.
  28. Device according to one of the preceding claims, characterised by a hood placeable over the fluid tank (1).
  29. Device according to claim 28, characterised in that the hood has at least one fluid inlet opening.
  30. Device according to one of the preceding claims, characterised by a heating and/or cooling device for heating and/or cooling the fluid in the fluid container (1).
  31. Device according to one of the preceding claims, characterised by a fluid preparation device.
  32. Device according to one of the preceding claims, characterised by a separating installation for separation of alkaline and acidic vapours contained in the exhaust air.
  33. Device according to one of the preceding claims, characterised by ultraviolet light sources which are arranged at the base (2) and/or at the side walls (3) of the fluid container (1).
  34. Device according to one of the preceding claims, characterised by at least one megasonic radiation device.
  35. Device according to claim 34, characterised in that the megasonic radiation device is arranged in the corners, which are formed by the base (2) and the side walls (3), of the fluid container (1).
  36. Device according to one of the preceding claims, characterised by a device rotating the substrates (5) in the fluid container (1).
EP97915453A 1996-04-24 1997-03-27 Device for treating substrates in a fluid container Expired - Lifetime EP0895655B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP02005774A EP1239512A3 (en) 1996-04-24 1997-03-27 Device and process for treating substrates in a fluid container

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DE19616402 1996-04-24
DE1996116402 DE19616402C2 (en) 1996-04-24 1996-04-24 Device for treating substrates in a fluid container
PCT/EP1997/001580 WO1997040524A1 (en) 1996-04-24 1997-03-27 Device for treating substrates in a fluid container

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EP0895655B1 true EP0895655B1 (en) 2004-02-18

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EP (1) EP0895655B1 (en)
JP (1) JP3493030B2 (en)
KR (1) KR100316823B1 (en)
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Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19616400C2 (en) * 1996-04-24 2001-08-30 Steag Micro Tech Gmbh Device for treating substrates in a fluid container
DE19742680B4 (en) * 1997-09-26 2006-03-02 Siltronic Ag Cleaning process for disc-shaped material
US6273107B1 (en) * 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
US5913981A (en) * 1998-03-05 1999-06-22 Micron Technology, Inc. Method of rinsing and drying semiconductor wafers in a chamber with a moveable side wall
US6372051B1 (en) * 1998-12-04 2002-04-16 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
US6539963B1 (en) * 1999-07-14 2003-04-01 Micron Technology, Inc. Pressurized liquid diffuser
TW434668B (en) * 2000-01-27 2001-05-16 Ind Tech Res Inst Wafer rinse apparatus and rinse method of the same
US6418945B1 (en) * 2000-07-07 2002-07-16 Semitool, Inc. Dual cassette centrifugal processor
US6840250B2 (en) * 2001-04-06 2005-01-11 Akrion Llc Nextgen wet process tank
US6564469B2 (en) * 2001-07-09 2003-05-20 Motorola, Inc. Device for performing surface treatment on semiconductor wafers
US20030192570A1 (en) * 2002-04-11 2003-10-16 Applied Materials, Inc. Method and apparatus for wafer cleaning
US20030192577A1 (en) * 2002-04-11 2003-10-16 Applied Materials, Inc. Method and apparatus for wafer cleaning
DE10313692B4 (en) * 2003-03-26 2005-06-23 Werner Rietmann Method for surface and / or depth treatment of at least one semiconductor substrate and Tauchbadvorrichtung thereto
US7582180B2 (en) * 2004-08-19 2009-09-01 Micron Technology, Inc. Systems and methods for processing microfeature workpieces
DE102004053337A1 (en) * 2004-11-04 2006-05-11 Steag Hama Tech Ag Method and device for treating substrates and nozzle unit therefor
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
KR100644054B1 (en) * 2004-12-29 2006-11-10 동부일렉트로닉스 주식회사 Cleaning apparatus and gate oxide pre-cleaning method
US8070884B2 (en) * 2005-04-01 2011-12-06 Fsi International, Inc. Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas enviroment including a drying enhancement substance
ES2268974B2 (en) * 2005-06-16 2007-12-01 Universidad Politecnica De Madrid EPITAXIAL REACTOR FOR THE PRODUCTION OF LARGE SCALE OBLEAS.
TWI259110B (en) * 2005-09-22 2006-08-01 Delta Electronics Inc Ultrasonic cleaning system and method
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
DE102009035341A1 (en) * 2009-07-23 2011-01-27 Gebr. Schmid Gmbh & Co. Device for cleaning substrates on a support
DE102010028883A1 (en) * 2010-05-11 2011-11-17 Dürr Ecoclean GmbH process vessels
CA2856196C (en) 2011-12-06 2020-09-01 Masco Corporation Of Indiana Ozone distribution in a faucet
US10767270B2 (en) 2015-07-13 2020-09-08 Delta Faucet Company Electrode for an ozone generator
JP6441198B2 (en) * 2015-09-30 2018-12-19 東京エレクトロン株式会社 Substrate liquid processing apparatus, substrate liquid processing method, and computer readable storage medium storing substrate liquid processing program
CA2946465C (en) 2015-11-12 2022-03-29 Delta Faucet Company Ozone generator for a faucet
JP6664952B2 (en) * 2015-12-17 2020-03-13 東レエンジニアリング株式会社 Coating device cleaning device and coating device
CN108463437B (en) 2015-12-21 2022-07-08 德尔塔阀门公司 Fluid delivery system comprising a disinfection device
SE539074C2 (en) * 2016-04-21 2017-04-04 Spinchem Ab A reactor comprising a nozzle for cleaning fluid, a kit and a method
JP2018126697A (en) * 2017-02-09 2018-08-16 新オオツカ株式会社 Laminar flow ultrasonic cleaning apparatus
JP6836980B2 (en) * 2017-10-11 2021-03-03 株式会社荏原製作所 Substrate cleaning method
JP6985957B2 (en) 2018-02-21 2021-12-22 キオクシア株式会社 Semiconductor processing equipment
JP7381370B2 (en) * 2020-03-05 2023-11-15 キオクシア株式会社 Semiconductor manufacturing equipment and semiconductor device manufacturing method
KR102566668B1 (en) * 2021-06-02 2023-08-17 주식회사 아이에스티이 Diffuser structure for purging substrate of display

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964957A (en) * 1973-12-19 1976-06-22 Monsanto Company Apparatus for processing semiconductor wafers
JPS5271871A (en) * 1975-12-11 1977-06-15 Nec Corp Washing apparatus
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
JPS586633A (en) * 1981-07-03 1983-01-14 Pioneer Electronic Corp Transmitting and receiving system
JPS5861632A (en) * 1981-10-07 1983-04-12 Matsushita Electric Ind Co Ltd Washing vessel
JPS59199477A (en) * 1983-04-25 1984-11-12 住友電気工業株式会社 Wafer box
US4671206A (en) * 1983-06-20 1987-06-09 Hoppestad Lamont I Article support rack
US4577650A (en) * 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4753258A (en) * 1985-08-06 1988-06-28 Aigo Seiichiro Treatment basin for semiconductor material
US4795497A (en) * 1985-08-13 1989-01-03 Mcconnell Christopher F Method and system for fluid treatment of semiconductor wafers
US4676008A (en) * 1986-05-16 1987-06-30 Microglass, Inc. Cage-type wafer carrier and method
JP2717408B2 (en) * 1988-03-16 1998-02-18 株式会社トプコン Lightwave ranging device with linearity error correction function
US4858764A (en) * 1988-06-20 1989-08-22 Hughes Aircraft Company Adjustable carrier device for ceramic substrates and the like
JP2733771B2 (en) * 1988-07-29 1998-03-30 日本テキサス・インスツルメンツ株式会社 Liquid processing equipment
JPH02113331U (en) * 1989-02-27 1990-09-11
US5000795A (en) * 1989-06-16 1991-03-19 At&T Bell Laboratories Semiconductor wafer cleaning method and apparatus
US5149244A (en) * 1989-08-18 1992-09-22 Applied Materials, Inc. Apparatus for aligning wafers within a semiconductor wafer cassette
JPH03116731A (en) * 1989-09-28 1991-05-17 Dan Kagaku:Kk Semiconductor wafer transfer equipment
JPH03184337A (en) * 1989-11-13 1991-08-12 Applied Materials Inc Removal of contaminated particles from designated surface of article
JPH03228329A (en) * 1990-02-02 1991-10-09 Nec Corp Wafer treating device
JPH03231428A (en) * 1990-02-07 1991-10-15 Hitachi Cable Ltd Washing of semiconductor wafer
JPH0480924A (en) * 1990-07-24 1992-03-13 Sony Corp Cleaning device and method of semiconductor wafer
US5069235A (en) * 1990-08-02 1991-12-03 Bold Plastics, Inc. Apparatus for cleaning and rinsing wafers
JPH0499025A (en) * 1990-08-07 1992-03-31 Nec Kyushu Ltd Water rinser
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
US5275184A (en) * 1990-10-19 1994-01-04 Dainippon Screen Mfg. Co., Ltd. Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system
JP2901098B2 (en) * 1991-04-02 1999-06-02 東京エレクトロン株式会社 Cleaning device and cleaning method
US5488964A (en) * 1991-05-08 1996-02-06 Tokyo Electron Limited Washing apparatus, and washing method
JPH0555191A (en) * 1991-08-26 1993-03-05 Hitachi Ltd Cleaning bath
JPH05102118A (en) * 1991-10-07 1993-04-23 Mitsubishi Electric Corp Method and apparatus for washing semiconductor wafer
JP2696017B2 (en) * 1991-10-09 1998-01-14 三菱電機株式会社 Cleaning device and cleaning method
JP2920165B2 (en) * 1991-11-29 1999-07-19 エス・イー・エス株式会社 Overflow tank for single wafer cleaning
JPH05190525A (en) * 1992-01-17 1993-07-30 Fujitsu Ltd Washing device
JP3254716B2 (en) * 1992-03-17 2002-02-12 ソニー株式会社 Wafer cleaning equipment
JPH05267262A (en) * 1992-03-23 1993-10-15 Sony Corp Semiconductor-wafer cleaning apparatus
JPH05291228A (en) * 1992-04-07 1993-11-05 Fujitsu Ltd Apparatus and method for cleaning of wafer
JPH05304131A (en) * 1992-04-27 1993-11-16 Nec Kyushu Ltd Chemical processing system for semiconductor substrate
JP2690851B2 (en) * 1992-09-18 1997-12-17 大日本スクリーン製造株式会社 Immersion type substrate processing equipment
JPH06196466A (en) * 1992-10-27 1994-07-15 Sony Corp Wafer cleaning device
JP3194209B2 (en) * 1992-11-10 2001-07-30 東京エレクトロン株式会社 Cleaning equipment
KR960002763B1 (en) * 1992-12-24 1996-02-26 금성일렉트론주식회사 Semiconductor cleaning method and cleaning chemicals
JP3003016B2 (en) * 1992-12-25 2000-01-24 東京エレクトロン株式会社 Processing device and processing method
US5503171A (en) * 1992-12-26 1996-04-02 Tokyo Electron Limited Substrates-washing apparatus
US5383484A (en) * 1993-07-16 1995-01-24 Cfmt, Inc. Static megasonic cleaning system for cleaning objects
JP2888409B2 (en) * 1993-12-14 1999-05-10 信越半導体株式会社 Wafer cleaning tank
DE4413077C2 (en) * 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Method and device for chemical treatment of substrates
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
DE19546990C2 (en) * 1995-01-05 1997-07-03 Steag Micro Tech Gmbh Chemical wet treatment plant
US5593505A (en) * 1995-04-19 1997-01-14 Memc Electronic Materials, Inc. Method for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interface
DE19637875C2 (en) * 1996-04-17 1999-07-22 Steag Micro Tech Gmbh Plant for the wet treatment of substrates
DE19703646C2 (en) * 1996-04-22 1998-04-09 Steag Micro Tech Gmbh Device and method for treating substrates in a fluid container

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WO1997040524A1 (en) 1997-10-30
ID16694A (en) 1997-10-30
ATE259989T1 (en) 2004-03-15
US5992431A (en) 1999-11-30
JPH11510965A (en) 1999-09-21
DE19654903A1 (en) 1997-11-13
TW446575B (en) 2001-07-21
US5921257A (en) 1999-07-13
DE19655219C2 (en) 2003-11-06
DE19654903C2 (en) 1998-09-24
JP3493030B2 (en) 2004-02-03
EP0895655A1 (en) 1999-02-10
MY132460A (en) 2007-10-31
KR20000010575A (en) 2000-02-15
KR100316823B1 (en) 2002-02-19

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