EP0877433A1 - Dielectric filter device - Google Patents
Dielectric filter device Download PDFInfo
- Publication number
- EP0877433A1 EP0877433A1 EP98303595A EP98303595A EP0877433A1 EP 0877433 A1 EP0877433 A1 EP 0877433A1 EP 98303595 A EP98303595 A EP 98303595A EP 98303595 A EP98303595 A EP 98303595A EP 0877433 A1 EP0877433 A1 EP 0877433A1
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- EP
- European Patent Office
- Prior art keywords
- dielectric
- dielectric filter
- filter device
- resonators
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block
Abstract
A dielectric filter device is compact, shows an
enhanced level of mechanical strength and is adapted to
select a circuit constant with ease, wherein it comprises a
dielectric filter having a plurality of resonators (3A; 3B;
3C) provided in a dielectric ceramic block (2; 2'), and a
laminated circuit arrangement (10a; 10b; 10c; 10d; 10e) of
a plurality of dielectric sheets which is fitted to the
open-circuit end surface (2a; 2a') of the dielectric
ceramic block (2; 2') and includes a coupling circuit (L;
B, H) to be coupled to appropriate ones of the resonators
(3A; 3B; 3C) to realize a low-pass (band-pass, high-pass)
filter. The filter device can be made to have a neat and
simple profile and downsized to minimize the space it
requires and can be effectively and efficiently
manufactured on a mass production basis.
Description
This invention relates to a dielectric filter
device comprising a plurality of resonators arranged in
parallel with respect to each other, which can suitably be
used for mobile telecommunications equipment such as an
automobile telephone set or a portable telephone set.
A variety of dielectric filters of this type have
been proposed. FIG. 1 of the accompanying drawings
illustrates one typical example of such dielectric filters
in which a plurality of resonators B are arranged in
parallel along a same direction in a dielectric ceramic
block A, each having a longitudinal through hole and an
inner conductor coating the peripheral wall of the through
hole, the dielectric ceramic block A is coated with a
grounding conductor C on the outer surface except an open-circuit
end surface for exposing the openings of the
through holes, an input terminal pad P1 is coupled to one
of the outermost resonators T and isolated from the
grounding conductor C on a lateral side of the dielectric
ceramic block A and an output terminal pad P2 is coupled to
the other outermost resonator T and isolated from the
grounding conductor C on the lateral side of the dielectric
ceramic block A. Then, an electroconductive layer E is
formed on each of the hollows D gouged around the openings
on the open side of the dielectric ceramic block by coating
the surface of the hollows with a conductor film.
Alternatively, such electroconductive layer may be formed
around each of the openings by printing a patterned
conductor on the open side. Thereafter, the electroconductive
layers E are coupled to each other to produce a
band-pass filter.
However, when a coupling circuit is formed to
couple the resonators by forming hollows or by using a
pattern, the circuit constant obtained as a result of
forming a dielectric filter is accompanied by limitations
that in turn restrict the design of the dielectric filter.
The use of inductors and capacitors having a concentrated
constant has been proposed to solve this problem.
However, while the use of such devices provides an
enhanced level of freedom for designing dielectric filters,
it is accompanied by a number of problems including an
increased number of assembling steps, a rugged profile of
the dielectric filter, increased dimensions, an untidy
circuit arrangement, a complicated circuit design and a
reduced mechanical strength.
There have also been proposed a variety of
dielectric filter devices comprising a dielectric filter in
which a plurality of resonators are in parallel arranged
along a same direction in a dielectric ceramic block which
is coated with a grounded conductor material except an open-circuit
end surface for exposing the openings of through
holes bored through the dielectric ceramic block, and a
substrate for carrying the dielectric filter thereon and
provided with a coupling circuit connected appropriately to
the resonators, said dielectric ceramic block and said
coupling circuit being housed in a metal casing. Such
dielectric filter devices include those proposed in
Japanese Patent Kokai Nos. 61-208902 and 63-311801.
With any of such dielectric filter devices, circuit
members including coupling capacitors are mounted on the
substrate and electric paths are formed on the substrate to
produce a necessary circuit. These elements are covered by
the metal casing that operates as a shield case, and
output/input electrodes are arranged on the substrate for
connecting the dielectric filter with external electric
paths to form a unit, which unit provides an advantage of
easy handling.
A dielectric filter device having the above
described configuration can enjoy an enhanced level of
freedom in terms of designing because coupling capacitors
are mounted on the substrate in a separate manufacturing
step and hence the circuit constants of the dielectric
filter can be selected appropriately depending on the
specific circuit configuration of the dielectric filter.
However, with conventional dielectric filter
devices of the type under consideration, metal terminals
are fitted into the respective resonators of the device and
then connected to the corresponding electric paths formed
on the substrate of the device.
Thus, they have drawbacks of requiring complicated
connections and a separate operation of mounting the
coupling capacitors on the substrate to make the circuit
arrangement a rather complicated one, which is provided
with untidily disposed wires.
It is therefore an object of the present invention
to provide a dielectric filter device that is free from the
above identified problems.
According to the invention, there is provided a
dielectric filter device comprising a dielectric filter
which includes a plurality of resonators arranged in
parallel along a same direction, each having a through hole
provided in a dielectric ceramic block, and an inner
conductor provided on a pheripheral wall of the through
hole, the dielectric ceramic block having an outer surface
coated with a grounding conductor and an open-circuit end
surface which has no grounding conductor, and a coupling
circuit means for connecting predetermined ones of the
resonators of the dielectric filter, wherein the coupling
circuit means comprises a laminated circuit arrangement of
a plurality of dielectric sheets arranged on an open-circuit
end surface of the dielectric filter and connected
to predetermined ones of the resonators.
With the above arrangement, a coupling circuit is
formed simply by arranging dielectric sheets on the open-circuit
end surface of the dielectric ceramic block to
produce a streamlined dielectric filter and a desired
circuit constant can be obtained for it by appropriately
designing the laminated circuit arrangement.
The plurality of dielectric layers may be sintered
to produce a single chip circuit arrangment to be bonded to
the open-circuit end surface of the dielectric ceramic
block. With the use of a single chip circuit arrangment, a
dielectric filter can be prepared simply by bonding the
chip to the open-circuit end surface of the dielectric
ceramic block.
The coupling circuit of the laminated circuit
arrangement may be a low-pass filter coupling circuit, a
band-pass filter coupling circuit or a high-pass filter
coupling circuit coupled to the resonators.
In the filter device according to the present
invention, the dielectric filter and the laminated circuit
arrangement are mounted on a substrate which includes
input/output pads at the surface thereof. The input/output
pads are electrically connected to input/output terminals
arranged on the substrate and connected to external
electric paths.
Additionally, with the above arrangement, a
coupling circuit may be formed simply by arranging
dielectric sheets on the open-circuit end surface of the
dielectric ceramic block to simplify the entire assembling
process and the entire circuit configuration.
The dielectric filter may comprise a plurality of
coaxial type resonators, each of which is formed by boring
a single through hole through a dielectric ceramic block
and coated with an inner conductor on the peripheral wall
of the through hole. With such an arrangement, the coaxial
type resonators can be regulated individually to provide
the dielectric filter with desired characteristics. The
coaxial type resonators may be assembled together before or
after they are rigidly secured to the substrate.
Alternatively, the dielectric filter may be formed
by boring a plurality of through holes through a dielectric
ceramic block and coating the peripheral wall of each of
the through holes with an inner conductor to produce a
plurality of resonators arranged in parallel within the
single dielectric ceramic block. With such an arrangement,
the entire assembling process can be greatly simplified
because the dielectric filter is a single structure.
The plurality of dielectric sheets may be
sintered to produce a single chip circuit arrangement to be
bonded to the open-circuit end surface of the dielectric
ceramic block. With the use of a single chip circuit
arrangement, a dielectric filter can be prepared simply by
bonding the chip to the open-circuit end surface of the
dielectric ceramic block and a dielectric filter device can
be produced simply by bonding the dielectric filter to a
substrate.
Now, the present invention will be described by
referring to the accompanying drawings that illustrate
preferred embodiments of the invention.
FIGS. 2 through 5 schematically illustrate a first
embodiment of the invention. The illustrated dielectric
filter la comprises a rectangular parallelpiped dielectric
ceramic block 2 made of a sintered ceramic dielectric
material such as titanium oxide series ceramics and barium
oxide series ceramics and three resonators 3A, 3B and 3C
arranged in parallel with respect to each other along a
same direction in the dielectric ceramic block 2. This
filter la is intended to constitute a low pass filter
illustrated in FIG. 5.
As shown in FIG. 4, each of the resonators 3A, 3B
and 3C comprises a through hole 4 provided through the
dielectric ceramic block 2 and an inner conductor layer 5
formed on the inner peripheral surface or inner wall of the
through hole 4. The outer surfaces of the dielectric
ceramic block 2 are coated with a grounding conductor layer
6 except an open-circuit end surface 2a thereof where one
of the openings of the respective through hole 4 is
exposed.
The resonators 3A, 3B and 3C have a resonant length
substantially equal to a quarter of the resonant frequency
λ , or λ/4, and constitutes a resonator circuit X shown in
FIG. 5.
On the open-circuit end surface 2a of the
dielectric ceramic block 2 is provided a laminated circuit
arrangement 10a. This laminated circuit arrangement 10a is
bonded to the open-circuit end surface 2a of the dielectric
ceramic blocks 2. The laminated circuit arrangement 10a
may be typically made of a glass ceramic material, a
composite material containing both glass and dielectric
ceramic or a low melting point oxide. As illustrated in
FIG. 2, the laminated circuit arrangment 10a comprises a
plurality of identical rectangularly parallelepipedic
dielectric sheets 11 through 16, each having a contour same
as that of the open-circuit end surface 2a of the
dielectric ceramic block 2, which are stacked sequentially
and sintered together to form a single chip. Thus the
laminated circuit arrangement 10a of a multilayer structure
of the dielectric sheets 11 through 16 operates as a low
pass filter coupling circuit L which is cooperated with the
resonator 3A, 3B and 3C. Since the laminated circuit
arrangement 10a is realized in the form of a single chip
obtained by sintering together the dielectric sheets 11
through 16, the dielectric filter device having a neat
rectangularly parallelepipedic profile can be prepared with
ease simply by bonding the chip to the open-circuit end
surface 2a of the dielectric ceramic body 2 or the
dielectric filter 1a.
Each of the dielectric sheets 11-16 is provided
with a conductor pattern on the surface thereof and cutting
through holes therethrough.
Now, a specific mode of preparing a combination of
the dielectric filter and the laminated circuit arrangement
will be described below.
On the dielectric sheet 11 three through holes h
are provided at positions located vis-a-vis the respective
resonators 3A through 3C and filled with respective
conducting material m as shown in FIG. 2A, and three
electrode layers 11a, 11b and 11c at positions on the front
surface thereof located vis-a-vis the respective resonators
3A through 3C. Therefore, the electrode layers 11a, 11b
and 11c are connected to the inner conductor layers 5 of
the respective resonators 3A, 3B and 3C via the conductors
filled in the corresponding holes h of the dielectric
sheets 11, respectively.
On the dielectric sheet 12, electrode layers 12a,
12b and 12c are formed on the front surface thereof at
positions located vis-a-vis the resonators 3A through 3C
respectively. Thus, capacitors C1, C2 and C3 for the low
pass filter circuit L are formed between the electrode
layers 11a and 12a, between the electrode layers 11b and
12b and between the electrode layers 11c and 12c,
respectively, the capacitances of which capacitors are
determined as a function of the thickness of the dielectric
sheet 12 and the surface areas of the electrode layers 11a
through 11c, respectively.
The dielectric sheet 13 is provided with through
holes h which are filled with respective conducting
material being connected to the respective electrode layers
12a, 12b and 12c. Winding electroconductive paths are
provided on the front surface of the dielectric sheet 13
between the through holes h correlated with the electrode
layers 12a and 12b of the dielectric sheet 12, and between
the through holes h correlated with the electrode layers
12b and 12c of the dielectric sheet 12, respectively, in
order to form inductors L1 and L2.
The dielectric sheet 14 is provided with three
through holes h at positions correlated with the resonators
3A, 3B and 3C. These through holes are filled with
respective conducting material. On the front surface of
the dielectric sheet 14 an input/output connecting
extension 14a is provided to be extended from the through
hole h at position correlated with the resonator 3A to the
upper edge of the dielectric sheet 14. This input/output
connecting extension 14a is connected to the electrode
layer 12a of the dielectric sheet 12 via the conductors
filled in the through holes h of the dielectric sheets 13
and 14 at positions correlated with the resonator 3A.
Also, an input/output connecting extension 14b is extended
from the through hole h at position correlated with the
resonator 3C to the upper edge of the dielectric sheet 14.
The dielectric sheet 15 is provided with through
holes h each being filled with conducting material and
three electrode layers 15a, 15b and 15c on the front
surface thereof at positions correlated with the resonators
3A, 3B and 3C, respectively. The electrode layers 15a, 15b
and 15c are connected to the electrode layers 12a, 12b and
12c on the dielectric sheet 12 via the conductors filled in
the corresponding holes h of the dielectric sheets 13 14,
and 15, respectively.
The dielectric sheet 16 is provided with a
grounding conductor layer 17 on the front surface thereof
which is cooperated with the electrode layers 15a, 15b and
15c by way of the dielectric sheet 16 to form capacitors
C4, C5 and C6.
After the laminated circuit arrangment 10a is
prepared by stacking the dielectric sheets 11 through 16 to
each other, input/output terminal pads 18a and 18b, and a
grounding conductor 19 are provided on the upper surface of
the laminated circuit arrangement 10a as shown in FIG. 3.
The input/output terminal pads 18a and 18b are arranged to
be connected to the input/output connecting extensions 14a
and 14b on the dielectric sheet 14, respectively. The
grounding conductor 19 is arranged to connect the grounding
conductor layer 17 on the front surface of the dielectric
sheet 16 with the grounding conductor layer 6 on the outer
surfaces of the dielectric block 2.
Alternatively, the input/output terminal pads 18a
and 18b and the grounding conductor 19 may be formed by
previously conductor layers on the upper edges or surfaces
of the respective dielectric sheets 11 through 16.
Thus, simply by laying the plurality of dielectric
sheets 11 through 16 on the open-circuit end surfaces 2a of
the dielectric ceramic blocks 2, there is provided the low
pass filter coupling circuit L including the capacitors C1
through C6 and the inductors L1 and L2. The low pass
filter coupling circuit L is coupled to the resonators 3A,
3B and 3C of the resonator circuit X so that the low pass
filter circuit shown in FIG. 5 is provided.
FIGS. 6, 7 and 8 schematically illustrate a second
embodiment of the invention. The illustrated dielectric
filter 1b has substantially the same construction as that
of the dielectric filter la in the first embodiment. That
is the illustrated dielectric filter 1b comprises a
rectangular parallelpiped dielectric ceramic block 2 and
three resonators 3A, 3B and 3C arranged in parallel with
respect to each other along a same direction in the
dielectric ceramic block 2.
A laminated circuit arrangement 10b is intended to
be bonded to an open-circuit end surface 2a of the
dielectric ceramic block 2 for providing a band pass filter
coupling circuit B. The laminated circuit arrangement 10b
comprises a plurality of identical rectangularly parallelepipedic
dielectric sheets 21 through 25, each having a
contour same as that of the open-circuit end surface 2a of
the dielectric ceramic block 2, which are stacked
sequentially and sintered together to form a single chip.
The dielectric sheet 21 is provided with three
through holes h at positions correlated with the resonators
3A, 3B and 3C, which are filled with with respective
conducting material.
The dielectric sheet 22 is provided with three
through holes h at positions correlated with the resonators
3A, 3B and 3C, which are filled with with respective
conducting material. Also, between the through holes h
correlated with the resonators 3A and 3B and between the
through holes h correlated with the resonators 3B and 3C
two paired U-shape electrodes are interdigitally arranged
on the front surface of the dielectric sheet 22 for forming
capacitors C12 and C13.
The dielectric sheet 23 is provided with two
through holes h at positions correlated with the resonators
3A and 3C, which are filled with with respective conducting
material. Also, on the front surface of the dielectric
sheet 23 are arranged two electrode layers 23a and 23b
which are connected to the resonators 3A and 3B through the
conductors filled in the corresponding holes h on the
dielectric sheets 21 and 22.
The dielectric sheet 24 is provided with two
electrode layers 24a and 24b at the positions correlated
with the electrode layers 23a and 23b on the dielectric
sheet 23. The electrode layers 23a and 24a form a
capacitor C11, while the electrode layers 23b and 24b form
a capacitor C14. The capacitances of these capacitors are
determined by the thickness of the the dielectric sheet 23.
An input/output connecting extension 26a is arranged to be
extended from the electrode layers 24a to the upper edge of
the dielectric sheet 24. Another input/output connecting
extension 26b is arranged to be extended from the electrode
layers 24b to the upper edge of the dielectric sheet 24.
The dielectric sheet 25 is provided with a
grounding conductor 27 on the front surface thereof.
In this way, the laminated circuit arrangment 10b
can be prepared by stacking the dielectric sheets 21
through 25 to each other. Then, input/ output terminal pads
28a and 28b and a grounding conductor 29 are provided on
the upper surface of the laminated circuit arrangement 10b
as shown in FIG. 7. The input/ output terminal pads 28a and
28b are arranged to be connected to the input/ output
connecting extensions 26a and 26b on the dielectric sheet
24, respectively. The grounding conductor 29 is arranged
to be connected to the grounding conductor layer 27 on the
front surface of the dielectric sheet 25 and the grounding
conductor layer 6 on the outer surfaces of the dielectric
block 2.
Alternatively, the input/ output terminal pads 28a
and 28b and the grounding conductor 29 may be formed by
previously conductor layers on the upper edges or surfaces
of the respective dielectric sheets 21 through 25.
Thus, simply by laying the plurality of dielectric
sheets 21 through 25 on the open-circuit end surfaces 2a of
the dielectric ceramic blocks 2, there is provided the band
pass filter coupling circuit B including the capacitors C11
through C14. The band pass filter coupling circuit B is
coupled to the resonators 3A, 3B and 3C of the resonator
circuit X so that the band pass filter circuit shown in
FIG. 8 is provided.
FIGS. 9, 10 and 11 schematically illustrate a third
embodiment of the invention in which the illustrated
dielectric filter lc has substantially the same
construction as that of the dielectric filter la in the
first embodiment. That is the illustrated dielectric
filter 1c comprises a rectangular parallelpiped dielectric
ceramic block 2 and three resonators 3A, 3B and 3C arranged
in parallel with respect to each other along a same
direction in the dielectric ceramic block 2.
A laminated circuit arrangement 10c is intended to
be bonded to an open-circuit end surface 2a of the
dielectric ceramic block 2 for providing a high pass filter
coupling circuit H.
The laminated circuit arrangement 10c comprises a
plurality of identical rectangularly parallelepipedic
dielectric sheets 31 through 36, each having a contour same
as that of the open-circuit end surface 2a of the
dielectric ceramic block 2, which are stacked sequentially
and sintered together to form a single chip.
The dielectric sheet 31 is provided with three
through holes h at positions correlated with the resonators
3A, 3B and 3C, which are filled with with respective
conductors. These filled conductors are connected to the
resonators 3A, 3B and 3C,respectively. Also, on the front
surface of the dielectric sheet 31 is provided a grounding
conductor layer 31a which is electrically separated from
the respective conductors filled in the through holes h by
space regions s.
The dielectric sheet 32 includes three electrode
layers 32a, 32b and 32c at positions corresponding to the
resonators 3A, 3B and 3C.
The dielectric sheet 33 includes three electrode
layers 33a, 33b and 33c at positions corresponding to the
resonators 3A, 3B and 3C. The electrode layers 32a and 33a
form a capacitor C21, the electrode layers 32b and 33b form
a capacitor C22, and the electrode layers 32c and 33c form
a capacitor C23. These capacitors C21-C23 have
capacitances which are determined as a function of the
thickness of the dielectric sheet 32 and the surface areas
of the electrode layers. The electrode layers 33a and 33c
are arranged to be spaced from the intermediate electrode
layer 33b so as to provide interstage couplings between
which capacitors C24 and C25 are respectively formed.
The dielectric sheet 34 includes three through
holes h arranged at positions correlated with the
resonators 3A, 3B and 3C and filled with respective
conducting material by which the respective holes h are
connected to the electrode layers 33a, 33b and 33c.
Inductors L21 and L23 of zig-zag electroconductive paths
are provided on the front surface of the dielectric sheet
34 and then are electrically connected to the electrode
layers 33a and 33c via the conductors filled in the righthand
and left-hand through holes h. Each of the inductors
L21 and L23 has one end extended to the lower edge and the
other end extended to the upper edge of the dielectric
sheet 34.
The dielectric sheet 35 includes a through hole h
filled with conducting material and inductor L22 of a zig-zag
electroconductive path which has one end connected to
the electrode layer 33b on the dielectric sheet 33 via the
conductors filled in the through holes of the dielectric
sheets 34 and 35 and the other end extended to the lower
edge of the dielectric sheet 35.
The dielectric sheet 36 includes a grounding
conductor 37 on the front surface thereof.
In this way, the laminated circuit arrangment 10c
can be prepared by stacking the dielectric sheets 31
through 36 to each other. Then, input/ output terminal pads
38a and 38b are provided on the upper surface of the
laminated circuit arrangement 10c as shown in FIG. 10. The
input/output terminal pads 38a is arranged to be connected
to the other end of the inductor L21 on the dielectric
sheet 34, while input/output terminal pads 38b is arranged
to be connected to the other end of the inductor L23 on the
dielectric sheet 34. Grounding conductors 39 are provided
on a center portion of the upper surface and lower surface
of the laminated circuit arrangement 10c and are connected
to the grounding conductor 37 on the front surface of the
dielectric sheet 36 and the the grounding conductor layer 6
on the outer surfaces of the dielectric block 2. Also, the
grounding conductor 39 is connected to the one ends of the
inductors L21 and L23.
Alternatively, the input/ output terminal pads 38a
and 38b and each the grounding conductor 39 may be formed
by previously conductor layers on the upper and lower edges
or surfaces of all or prerdetermined ones of the respective
dielectric sheets 31 through 36.
Thus, the high pass filter coupling circuit H
including the capacitors C21 therough C25 and the inductors
L21 through L23 can be provided simply by bonding the
laminated circuit arrangement 10c of a plurality of
dielectric sheets 31 through 36 on the open-circuit end
surfaces 2a of the dielectric ceramic blocks 2. Then, a
high pass filter circuit shown in FIG. 11 is provided as
the high pass filter coupling circuit H is coupled to the
resonators 3A, 3B and 3C of the resonator circuit X.
FIG. 12 illustrates how the assembly of the
dielectric filter and the laminated circuit arrangement in
each of the first,second and third embodiments is mounted
on a substrate and contained in a metal casing.
In FIG. 12 reference numeral 40 denotes a substrate
on which two conductor pads 41 and input/output terminals
42 are provided. Reference numeral 43 denotes a metal
casing for covering the assembly of the dielectric filter
and the laminated circuit arrangement. The input/output
terminals 42 can be connected to external electric paths.
The dielectric filter 1a or 1b or 1c is placed on the
substrate 40 with the input/output pads 18a and 18b or (28a
and 28b) or (38a and 38b) facing downward, and the
input/output pads are electrically connected to the
conductor pads 41 formed on the substrate 40 so that the
input/output terminals 42 are electrically connected to
appropriate ones of the filter circuits of the dielectric
filter. It will be appreciated that the input/output
terminals 42 are exposed when the metal casing 43 is
arranged in place so that they can be connected to external
electric paths without difficulty.
In short, after mounting the dielectric filter la
or (1b or 1c) on the substrate 40, the metal casing 43 is
arranged in place to cover the dielectric filter and
laminated circuit arrangement with the input/output
electrodes 42 exposed to the outside for easy connection
with external electric paths. Thus, the dielectric filter
device is produced and may be utilized as a simple
resonator unit.
FIG. 13 schematically illustrates a fourth
embodiment of dielectric filter device according to the
invention that comprises a dielectric filter 1d formed by
arranging three coaxial type resonators 3A' through 3C' in
parallel with respect to each other and bonding them
together, a laminated circuit arrangement 10d adapted to
cover the entire open-circuit end surfaces of the coaxial
type resonators 3A' through 3C'.
Each of the resonators 3A' through 3C'comprises a
through hole provided in respective dielectric ceramic
block 2' and an inner conductor layer provided on the inner
wall of the through hole. Each dielectric ceramic block 2'
has an outer surface coated with a grounding conductor
layer 6 and an open-circuit end surface 2a' where such
grounding conductor layer is not provided.
The laminated circuit arrangement 10d has
substantially the same construction as that of the
laminated circuit arrangement 10a in the first embodiment.
Thus, the components of the laminated circuit arrangement
10d are denoted respectively by the same reference symbols
and will not be described here any further.
Thus, a low-pass filter coupling circuit L
including capacitors C1 through C6 and inductors L1 through
L2 is produced simply by bonding the laminated circuit
arrangement 10d of a plurality of dielectric layers 11
through 16 to the open-circuit end surface 2a' of the
dielectric filter 1d. Then, a low-pass filter circuit as
shown in FIG. 5 is provided as the low-pass filter coupling
circuit L is coupled to appropriate ones of the resonators
3A' through 3C' of the resonator circuit X.
FIGS. 14 and 15 show a fifth embodiment of the
invention comprising a dielectric filter 1e and a laminated
circuit arrangement 10e bonded to the dielectric filter le
as a band-pass filter coupling circuit B. The dielectric
filter le has substantially the same construction as that
of the dielectric filter 1d in the fourth embodiment.
Thus, the components of the filter 1e are denoted
respectively by the same reference symbols and will not be
described here any further.
Also, the laminated circuit arrangement 10e has a
configuration same as that of the laminated circuit
arrangement 10b in the second embodiment shown in FIGS. 6,
7 and 8, and thus the components of the laminated circuit
arrangement 10e are denoted respectively by the same
reference symbols. That is, the laminated circuit
arrangement 10e is realized by laying a plurality of
dielectric sheet layers 21 through 25 into a sinle chipe
and forms a band-pass filter coupling circuit as shown in
FIG. 8 when the laminated circuit arrangement 10e is bonded
to the assemblied dielectric ceramic block 2' and coupled
to appropriate ones of the resonators 3A' through 3C' of
the resonator circuit X.
The assembly of the dielectric filter le and the
laminated circuit arrangement 10e thus prepared as an
integral part is then mounted on the substrate 40 as
illustrated in FIGS. 16 and 17. In a manner same as that
illustrated in FIG. 12, the input/output terminals 42 can
be connected to external electric paths. The dielectric
filter 1d or le is placed on the substrate 40 with the
input/output pads facing downward, and the input/output
pads are electrically connected to the conductor pads 41
formed on the substrate 40 so that the input/output
terminals 42 are electrically connected to appropriate ones
of the filter circuits of the dielectric filter. It will
be appreciated that the input/output terminals 42 are
exposed when the metal casing 43 is arranged in place so
that they can be connected to external electric paths
without difficulty. After mounting the dielectric filter
1d or le on the substrate 40, the metal casing 43 is
arranged in place to cover the dielectric filter and
laminated circuit arrangement with the input/output
electrodes 42 exposed to the outside for easy connection
with external electric paths. Thus, the dielectric filter
device is produced and may be utilized as a simple
resonator unit.
In the embodiments illustrated in FIGS. 13-15, it
should be noted that the coaxial type resonators 3A'
through 3C' may alternatively be mounted on the substrate
40 side by side without being bonded to each other.
While the dielectric filter comprises a plurality
of coaxial type resonators in each of the above described
fourth and fifth embodiments, it may alternatively be
formed by boring a plurality of through holes through a
single dielectric block and coating the inner peripheral
surfaces of the through holes with an inner conductor to
produce a plurality of resonators arranged side by side in
a single dielectric ceramic block as in the first, second
and third embodiments.
Thus, according to the present invention, a
laminated circuit arrangement of a plurality of dielectric
sheets is fitted to the open-circuit end surface of a
dielectric filter and its coupling circuit L (B, H) is
coupled to appropriate ones of the resonators 3A through 3C
to realize a low-pass (band-pass, high-pass) filter. Such
a dielectric filter device provides the following
advantages.
1) The filter device can be made to have a neat
and simple profile and downsized to minimize the space it
requires.
2) Since it may comprise only a dielectric ceramic
block and a laminate of dielectric sheets, it shows an
enhanced mechanical strength.
3) Since the coupling circuit L (B, H) is confined
within the laminated circuit arrangement 10a (10b, 10c,
10d, loe), it is isolated from the atmosphere and less
subjected to moisture and mechanical impacts to enjoy
stabilized operations.
4) Since the coupling circuit is formed by a
laminated circuit, a desired circuit constant can be
obtained to provide an enhanced level of freedom of
designing the filter.
5) When the laminated circuit arrangement is
formed by laying a plurality of dielectric sheets and
sintering them into a single chip, a dielectric filter can
be produced simply by bonding the laminated circuit
arrangement to the open-circuit end surface of the
dielectric ceramic block and dielectric filter device
comprising such a dielectric filter can be effectively and
efficiently manufactured on a mass production basis.
6) The entire unit can be made to have a neat and
simple profile and the filter circuit can be downsized to
reduce the surface area of the dielectric ceramic block and
hence the entire dimensions of the unit.
7) Since the coupling circuit is confined within
the laminated circuit arrangement, a simple wiring
arrangement can be used on the substrate so that such units
can be manufactured easily and efficiently.
Claims (11)
- A dielectric filter device comprising a dielectric filter (1a; 1b; 1c; 1d; 1e) which includes a plurality of resonators (3A, 3B, 3C; 3A', 3B', 3C') arranged in parallel along a same direction, each having a through hole (4) provided in a dielectric ceramic block (2; 2'), and an inner conductor (5) provided on a pheripheral wall of the through hole (4), the dielectric ceramic block (2; 2') having an outer surface coated with a grounding conductor (6) and an open-circuit end surface (2a; 2a') which has no grounding conductor, and an LC coupling circuit means for connecting predetermined ones of the resonators (3A, 3B, 3C; 3A', 3B', 3C') of the dielectric filter (1a; 1b; 1c; 1d; 1e), characterized in thatsaid LC coupling circuit means comprises a laminated circuit arrangement (10a; 10b; 10c; 10d; 10e) of a plurality of dielectric sheets (11, 12, 13, 14, 15, 16; 21, 22, 23, 24, 25; 31, 32, 33, 34, 35, 36) arranged on an open-circuit end surface (2a; 2a') of the dielectric filter (1a; 1b; 1c; 1d; 1e) and connected to predetermined ones of the resonators (3A, 3B, 3C; 3A', 3B', 3C').
- A dielectric filter device as claimed in claim 1, wherein said dielectric filter (1a; 1b; 1c; 1d; 1e) comprises a single dielectric block (2) in which a plurality of coaxial type resonators (3A, 3B, 3C) are arranged in parallel with the respect to each other.
- A dielectric filter device as claimed in claim 1, wherein said dielectric filter (1a; 1b; 1c; 1d; 1e) comprises a plurality of dielectric blocks (2'), each including a coaxial type resonator (3A', 3B', 3C'), and the dielectric blocks (2') are integrally assembled.
- A dielectric filter device as claimed in claim 1, wherein the dielectric sheets (11, 12, 13, 14, 15, 16; 21, 22, 23, 24, 25; 31, 32, 33, 34, 35, 36) of said laminated circuit arrangement (10a; 10b; 10c; 10d; 10e) are sintered to form a single ship to be bonded to the open-circuit end surface (2a; 2a') of the dielectric filter (1a; 1b; 1c; 1d; 1e).
- A dielectric filter device as claimed in claim 4, wherein said laminated circuit arrangement (10a; 10d) comprises a low-pass filter coupling circuit (L) including inductors and capacitors (L1, L2, C1, C2, C3, C4, C5, C6).
- A dielectric filter device as claimed in claim 4, wherein said laminated circuit arrangement (10b; 10e) comprises a band-pass filter coupling circuit (B) including capacitors (C11, C12, C13, C14).
- A dielectric filter device as claimed in claim 4, wherein said laminated circuit arrangement (10c) comprises a high-pass filter coupling circuit (H) including inductors and capacitors (L21, L22, L23, C21, C22, C23, C24, C25).
- A dielectric filter device as claimed in claim 4, wherein said laminated circuit arrangement (10a; 10b; 10c; 10d; 10e) includes input/output terminal pads (18a, 18b; 28a, 28b; 38a, 38b) and a grounding conductor arranged to be connected to the grounding conductor (6) on the dielectric filter (1a; 1b; 1c; 1d; 1e).
- A dielectric filter device as claimed in claim 1, wherein the filter device further comprises a substrate (40) on which said dielectric filter (1a; 1b; 1c; 1d; 1e) and said laminated circuit arrangement (10a; 10b; 10c; 10d; 10e) are mounted.
- A dielectric filter device as claimed in claim 9, wherein said substrate (40) includes conductor pads (41) arranged to be connected to input/output terminal pads (18a, 18b; 28a, 28b; 38a, 38b) and input/output terminals (42).
- A dielectric filter device as claimed in claim 1, wherein the filter device further comprises a metal casing (43) for containing said dielectric filter (1a; 1b; 1c; 1d; 1e) and said laminated circuit arrangement (10a; 10b; 10c; 10d; 10e).
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP134347/97 | 1997-05-07 | ||
JP134348/97 | 1997-05-07 | ||
JP13434897A JPH10308605A (en) | 1997-05-07 | 1997-05-07 | Dielectric filter device |
JP13434797 | 1997-05-07 | ||
JP22110297A JPH1127006A (en) | 1997-05-07 | 1997-07-31 | Dielectric filter |
JP221102/97 | 1997-07-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0877433A1 true EP0877433A1 (en) | 1998-11-11 |
Family
ID=27316876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98303595A Withdrawn EP0877433A1 (en) | 1997-05-07 | 1998-05-07 | Dielectric filter device |
Country Status (1)
Country | Link |
---|---|
EP (1) | EP0877433A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005122323A1 (en) * | 2004-06-08 | 2005-12-22 | Filtronic Comtek Oy | Adjustable resonator filter |
EP2624361A1 (en) * | 2010-09-29 | 2013-08-07 | Kyocera Corporation | Coaxial resonator and dielectric filter, wireless communications module, and wireless communications device using same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06125206A (en) * | 1992-10-12 | 1994-05-06 | Tdk Corp | Dielectric filter |
US5374910A (en) * | 1991-11-29 | 1994-12-20 | Kyocera Corporation | Dielectric filter having coupling means disposed on a laminated substrate |
JPH07170109A (en) * | 1993-12-15 | 1995-07-04 | Murata Mfg Co Ltd | Dielectric resonator |
JPH07176913A (en) * | 1993-12-20 | 1995-07-14 | Murata Mfg Co Ltd | Dielectric resonator |
JPH07336109A (en) * | 1994-06-03 | 1995-12-22 | Murata Mfg Co Ltd | Dielectric filter |
-
1998
- 1998-05-07 EP EP98303595A patent/EP0877433A1/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5374910A (en) * | 1991-11-29 | 1994-12-20 | Kyocera Corporation | Dielectric filter having coupling means disposed on a laminated substrate |
JPH06125206A (en) * | 1992-10-12 | 1994-05-06 | Tdk Corp | Dielectric filter |
JPH07170109A (en) * | 1993-12-15 | 1995-07-04 | Murata Mfg Co Ltd | Dielectric resonator |
JPH07176913A (en) * | 1993-12-20 | 1995-07-14 | Murata Mfg Co Ltd | Dielectric resonator |
JPH07336109A (en) * | 1994-06-03 | 1995-12-22 | Murata Mfg Co Ltd | Dielectric filter |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 18, no. 416 (E - 1588) 4 August 1994 (1994-08-04) * |
PATENT ABSTRACTS OF JAPAN vol. 95, no. 10 30 November 1995 (1995-11-30) * |
PATENT ABSTRACTS OF JAPAN vol. 96, no. 4 30 April 1996 (1996-04-30) * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005122323A1 (en) * | 2004-06-08 | 2005-12-22 | Filtronic Comtek Oy | Adjustable resonator filter |
US7236069B2 (en) | 2004-06-08 | 2007-06-26 | Filtronic Comtek Oy | Adjustable resonator filter |
EP2624361A1 (en) * | 2010-09-29 | 2013-08-07 | Kyocera Corporation | Coaxial resonator and dielectric filter, wireless communications module, and wireless communications device using same |
EP2624361A4 (en) * | 2010-09-29 | 2014-07-09 | Kyocera Corp | Coaxial resonator and dielectric filter, wireless communications module, and wireless communications device using same |
US9153852B2 (en) | 2010-09-29 | 2015-10-06 | Kyocera Corporation | Coaxial resonator, and dielectric filter, wireless communication module, and wireless communication device employing the coaxial resonator |
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