EP0685109B1 - Micromechanical relay with hybrid actuator - Google Patents
Micromechanical relay with hybrid actuator Download PDFInfo
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- EP0685109B1 EP0685109B1 EP94906870A EP94906870A EP0685109B1 EP 0685109 B1 EP0685109 B1 EP 0685109B1 EP 94906870 A EP94906870 A EP 94906870A EP 94906870 A EP94906870 A EP 94906870A EP 0685109 B1 EP0685109 B1 EP 0685109B1
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- armature
- substrate
- electrode
- base
- base substrate
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- 238000005452 bending Methods 0.000 claims abstract description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
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- 239000011521 glass Substances 0.000 claims description 3
- 239000005297 pyrex Substances 0.000 claims description 3
- 230000005284 excitation Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 230000004044 response Effects 0.000 abstract description 4
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- 238000009413 insulation Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
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- 230000000717 retained effect Effects 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H57/00—Electrostrictive relays; Piezoelectric relays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
- H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
- H01H1/20—Bridging contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/50—Means for increasing contact pressure, preventing vibration of contacts, holding contacts together after engagement, or biasing contacts to the open position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0052—Special contact materials used for MEMS
- H01H2001/0057—Special contact materials used for MEMS the contact materials containing refractory materials, e.g. tungsten
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H57/00—Electrostrictive relays; Piezoelectric relays
- H01H2057/006—Micromechanical piezoelectric relay
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
- H01H2059/0081—Electrostatic relays; Electro-adhesion relays making use of micromechanics with a tapered air-gap between fixed and movable electrodes
Definitions
- the invention relates to a micromechanical relay with a base substrate, which carries a flat base electrode and at least one fixed mating contact piece, with an armature substrate which is arranged on the base substrate and consists of selectively etchable material and from which at least one armature in the form of a tongue connected on one side is etched free carries an armature electrode opposite the base electrode and an armature contact piece opposite the counter contact piece and which has an elastically flexible region between its connection to the armature substrate and the armature contact piece, such that the armature is attracted to the base substrate when an electrical voltage is applied between the armature electrode and the base electrode , and with electrical leads to the electrodes and to the contact pieces provided on the base substrate or on the armature substrate.
- a micromechanical relay with an electrostatic drive is known, for example, from an essay by Minoru Sakata: "An Electrostatic Microactuator for Electro-Mechanical Relay", IEEE Micro Electro Mechanical Systems, February 1989, pages 149 to 151.
- voltage is applied between the armature electrode and one of the two base electrodes, so that the armature optionally carries out a pivoting movement to one side or the other. Due to the distance of the torsion bearing to the base, a certain wedge-shaped air gap remains between the electrodes even after the pivoting movement, so that the electrostatic attraction remains relatively low. This also results in a relatively low contact force.
- a relay of the type mentioned is already described in DE-C-42 05 029.
- the tongue-shaped armature with its armature electrode forms a wedge-shaped air gap with a base electrode arranged obliquely to it, on which the armature rolls during the tightening movement until it lies on the base electrode over a large area in the tightened state. This results in a high electrostatic attraction force, which ensures a sufficient contact force even with micromechanical dimensions.
- an electrostatic drive for relays has the disadvantage that at the beginning of the armature movement, that is to say with a large distance between the electrodes, the tightening force is relatively low, so that the relay responds only slowly or requires high response voltages.
- the aim of the present invention is therefore to develop a micromechanical relay of the type mentioned in such a way that the response characteristic is improved, so that the advantages of the electrostatic drive - a relatively high contact force when the armature is attracted - are retained, but at the same time the forces at the beginning of Responsiveness can be increased.
- this aim is achieved in the micromechanical relay mentioned at the outset in that the armature is provided in at least part of the above-mentioned flexible region with a piezo layer acting as a bending transducer with electrical leads, the bending force of which, when excited, supports the electrostatic attraction between the base electrode and the armature electrode.
- the armature is therefore provided with a piezo drive in addition to the electrostatic drive.
- the properties of two drive systems are usefully combined in such a way that the advantages of one drive outweigh the disadvantages of the other drive:
- the piezo drive can move the armature by a large distance or over a large switching stroke, but produces with large armature deflection , ie in the working position, only a small force.
- the electrostatic drive produces in Working position, ie when the armature is attracted, a large contact force, but the electrostatic attraction force at the beginning of the armature movement, that is to say with large electrode spacings, is only slight.
- the armature in the form of a tongue carrying the armature electrode and the piezo layer is pivotally connected on one side to an armature substrate.
- a more or less wedge-shaped air gap between the armature and the base generates a relatively high electrostatic attraction force from the start, which, however, is further improved by superimposition with the piezoelectric force.
- the base electrode is preferably arranged on an obliquely etched section of the base substrate in such a way that the armature electrode forms the wedge-shaped air gap mentioned with it in the idle state and rests approximately parallel to it in the excited state. Since no air gap remains between the electrodes after the armature has been tightened, apart from the necessary thin insulating layers, relatively high contact forces can be obtained.
- a micromechanical hybrid relay is shown schematically in FIG. 1, the actual size relationships being neglected in favor of clarity.
- a base substrate 51 is provided, which can consist, for example, of silicon, but preferably also of Pyrex glass.
- An armature substrate 52 which can preferably consist of silicon, is arranged and fastened on this base substrate 51.
- a tongue-shaped armature 53 is formed in this armature substrate 52 as a surface area that is etched free.
- the base substrate 51 and the armature substrate 52 are connected to areas etched free at their edges such that the armature 53 lies in a closed contact space 54.
- the armature has an armature contact piece 55 which interacts with a fixed mating contact element 56 of the base substrate. Furthermore, an armature electrode 57 in the form of a metal layer is arranged on the armature on its surface area facing the base, which in turn is opposed to a base electrode 58 of the base substrate. These two electrodes 57 and 58 form an electrostatic drive for the relay.
- the base electrode 58 is arranged on a beveled section 59 of the base substrate, so that the armature electrode 57, as shown in FIG. 1, rests continuously on the base electrode 58 in the drawn-up state of the armature.
- the armature 53 has a piezoelectric drive in the form of a piezo layer 60, which works as a bending transducer and, above all at the start of the armature movement, applies the necessary tightening force for the armature.
- the tongue end provided with the contact piece 55 could bend elastically to increase the contact force, while the lateral tongue ends with the electrode layer lying thereon lie flat on the base electrode 58.
- suitable insulation layers although these layers are not specifically shown.
- the two parts forming the relay are shown again in a somewhat enlarged representation before assembly, in order to emphasize the layers somewhat more clearly.
- the geometric relationships do not correspond to the actual lengths and thicknesses of the individual layers.
- An SiO 2 layer is produced thereon as an insulation layer and a metal layer is applied to this, which layer consists, for example, of aluminum and, on the one hand, the anchor electrode 57, but on the other hand also the feed line for the contact piece 55 and the inner electrode 61 for the piezoelectric layer to be subsequently applied 60 forms. Insofar as the metallic surfaces or lines have to be insulated from one another, this is done by appropriate longitudinal interruptions. After the piezoelectric layer 60, its outer electrode 62 is also a metal layer upset. At the free end of the tongue or the armature 53, the contact piece 55 is applied galvanically. In addition, the front end of the tongue can be divided into two by a slot in a switch spring and two laterally located electrostatic anchor elements.
- the base is also produced from a base substrate 51 by etching from silicon or from Pyrex glass.
- a trough 54a is produced anisotropically or isotropically, the bottom of which is parallel to the wafer surface.
- a wedge-shaped recess for producing the bevel 59 is then etched into the trough base using a technique known per se, which is inclined at a flat angle against the surface of the substrate. The inclination is exaggerated in the drawing. In a practical example, the angle is on the order of 3 °.
- a metal layer is then formed on the etched surface shape to form the base electrode 58 and the required leads.
- the contact piece 56 is generated galvanically.
- an insulation layer 63 for example made of SiO 2 , is applied in a conventional manner.
- the piezoelectric layer 60 can also extend over the entire length of the tongue. In this case, it would act as an insulation layer between the electrodes 57 and 58, so that the additional insulation layer 63 would be unnecessary.
- the two substrates 51 and 52 are joined together in a known manner, for example by anodic bonding.
- the corresponding supply lines to the metal layers are also provided without this needing to be shown in the figure.
- FIG. 3 shows a simple circuit for a hybrid drive according to FIG. 1.
- a base electrode 11 is parallel to an armature electrode 23, which face each other in the form of a plate and when a voltage is applied from the voltage source 40 serve as an electrostatic drive.
- Parallel to this electrostatic drive is a piezo transducer 41 with its electrodes 42 and 43, the electrode 43 being able to be formed from the same layer as the electrode 23.
- the electrostatic drive with the electrodes 11 and 23 and the piezo drive with the electrodes 42 and 43 can be applied in parallel to the voltage source 40 via the switch 44. Both drives respond simultaneously and overlap their forces to close the respective contact.
- the characteristic of the two drives is shown schematically in FIG.
- the force F is plotted over an axis for the anchor spacing s.
- the electrostatic force denoted by f1 is relatively low; it increases as the armature approaches the base electrode and reaches a high value when the distance s approaches 0.
- the piezoelectric attraction, denoted by f2 is greatest at the beginning of the armature movement, i.e. when the armature distance is large. It becomes smaller with increasing deflection of the bending transducer towards the base electrode.
- the piezoelectric force f2 thus compensates for the small value of f1 at the large armature distance a, while the electrostatic force f1 compensates for the small value of the piezoelectric force f2 after the armature has been closed.
- the result is an overall course of the forces f3, which can overcome the counteracting spring force f4 of the elastic bearing strips over the entire course of the path and can generate a large contact force when the armature is closed.
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Abstract
Description
Die Erfindung betrifft ein mikromechanisches Relais mit einem Basissubstrat, welches eine flächige Basiselektrode und zumindest ein feststehendes Gegenkontaktstück trägt, mit einem auf dem Basissubstrat angeordneten, aus selektiv ätzbarem Material bestehenden Ankersubstrat, aus welchem mindestens ein Anker in Form einer einseitig angebundenen Zunge freigeätzt ist, der eine der Basiselektrode gegenüberliegende Ankerelektrode sowie ein dem Gegenkontaktstück gegenüberliegendes Ankerkontaktstück trägt und der zwischen seiner Anbindung an dem Ankersubstrat und dem Ankerkontaktstück einen elastisch biegsamen Bereich aufweist, derart, daß bei Anlegen einer elektrischen Spannung zwischen der Ankerelektrode und der Basiselektrode der Anker an das Basissubstrat angezogen wird, und mit auf dem Basissubstrat bzw. auf dem Ankersubstrat vorgesehenen elektrischen Zuleitungen zu den Elektroden und zu den Kontaktstücken.The invention relates to a micromechanical relay with a base substrate, which carries a flat base electrode and at least one fixed mating contact piece, with an armature substrate which is arranged on the base substrate and consists of selectively etchable material and from which at least one armature in the form of a tongue connected on one side is etched free carries an armature electrode opposite the base electrode and an armature contact piece opposite the counter contact piece and which has an elastically flexible region between its connection to the armature substrate and the armature contact piece, such that the armature is attracted to the base substrate when an electrical voltage is applied between the armature electrode and the base electrode , and with electrical leads to the electrodes and to the contact pieces provided on the base substrate or on the armature substrate.
Ein mikromechanisches Relais mit elektrostatischem Antrieb ist beispielsweise bekannt aus einem Aufsatz von Minoru Sakata: "An Electrostatic Microactuator for Electro-Mechanical Relay", IEEE Micro Electro Mechanical Systems, February 1989, Seiten 149 bis 151. Dort ist ein aus einem Siliziumsubstrat freigeätzter Anker über zwei Torsionsstege in einer Mittellinie so gelagert, daß jeder seiner beiden Flügel einer unterhalb liegenden Basiselektrode gegenübersteht. Für eine elektrostatische Erregung dieses Relais wird jeweils Spannung zwischen der Ankerelektrode und einer der beiden Basiselektroden angelegt, so daß der Anker wahlweise eine Schwenkbewegung nach der einen oder anderen Seite ausführt. Aufgrund des Abstandes der Torsionslagerung zur Basis verbleibt auch nach der Schwenkbewegung ein gewisser keilförmiger Luftspalt zwischen den Elektroden, so daß die elektrostatische Anziehungskraft verhältnismäßig gering bleibt. Dies wirkt sich auch in einer relativ geringen Kontaktkraft aus.A micromechanical relay with an electrostatic drive is known, for example, from an essay by Minoru Sakata: "An Electrostatic Microactuator for Electro-Mechanical Relay", IEEE Micro Electro Mechanical Systems, February 1989, pages 149 to 151. There is an anchor etched free from a silicon substrate two torsion bars in a center line so that each of its two wings faces an underlying base electrode. For an electrostatic excitation of this relay, voltage is applied between the armature electrode and one of the two base electrodes, so that the armature optionally carries out a pivoting movement to one side or the other. Due to the distance of the torsion bearing to the base, a certain wedge-shaped air gap remains between the electrodes even after the pivoting movement, so that the electrostatic attraction remains relatively low. This also results in a relatively low contact force.
In der DE 32 07 920 C2 ist bereits ein Verfahren zur Herstellung eines elektrostatischen Relais beschrieben. Dort wird ein Anker aus einer Rahmenplatte aus kristallinem Halbleitermaterial herausgeätzt; mit der Rahmenplatte wird der Anker auf eine isolierende Unterlage gesetzt, welche auch die Gegenelektrode trägt. Allerdings besteht zwischen dem Anker und der Gegenelektrode ein verhältnismäßig großer Abstand, der auch bei angezogenem Anker erhalten bleibt. Um bei diesem Abstand zwischen Anker und Gegenelektrode die gewünschten Kontaktkräfte zu erzeugen, sind bei diesem bekannten Relais verhältnismäßig große Spannungen erforderlich.DE 32 07 920 C2 already describes a method for producing an electrostatic relay. There an anchor is etched out of a frame plate made of crystalline semiconductor material; with the frame plate, the anchor is placed on an insulating base, which also carries the counter electrode. However, there is a relatively large distance between the armature and the counterelectrode, which is retained even when the armature is attracted. In order to generate the desired contact forces at this distance between the armature and counterelectrode, relatively large voltages are required in this known relay.
Ein Relais der eingangs genannten Art ist bereits in der DE-C-42 05 029 beschrieben. Der zungenförmige Anker mit seiner Ankerelektrode bildet dort mit einer schräg zu ihm angeordneten Basiselektrode einen keilförmigen Luftspalt, auf dem der Anker während der Anzugsbewegung abrollt, bis er im angezogenen Zustand großflächig auf der Basiselektrode aufliegt. Dadurch ergibt sich eine hohe elektrostatische Anzugskraft, die auch bei mikromechanischen Abmessungen eine ausreichende Kontaktkraft gewährleistet.A relay of the type mentioned is already described in DE-C-42 05 029. The tongue-shaped armature with its armature electrode forms a wedge-shaped air gap with a base electrode arranged obliquely to it, on which the armature rolls during the tightening movement until it lies on the base electrode over a large area in the tightened state. This results in a high electrostatic attraction force, which ensures a sufficient contact force even with micromechanical dimensions.
Zusätzlich ist in dem Dokument SU-A-738 009 bereits vorgeschlagen worden, zur Erzielung einer geringeren Ansprechspannung einen elektrostatischen Antrieb mit einem piezoelektrischen Antrieb zu kombinieren. Allerdings wird dort eine an gegenüberliegenden Rändern eingespannte Membran aus einem polymeren Polyvinylidenfluorid vorgeschlagen, die als Anker wirken soll und zur Erzeugung eines elektrostatischen Antriebs mit Elektroden versehen ist. Da diese Piezofolie wegen ihrer zweiseitigen Einspannung nur durch mittige Ausknickung aufgrund einer piezoelektrisch erzeugten Längenänderung wirksam werden kann, können keine großen aufeinanderliegenden Elektrodenflächen im Endzustand erreicht werden, so daß die elektrostatische Anzugskraft zur Erzeugung der Kontaktkraft relativ gering sein muß.In addition, it has already been proposed in document SU-A-738 009 to combine an electrostatic drive with a piezoelectric drive in order to achieve a lower response voltage. However, a membrane made of a polymeric polyvinylidene fluoride which is clamped on opposite edges is proposed there, which is to act as an anchor and is provided with electrodes for generating an electrostatic drive. Since this piezo film can only be effective due to its double-sided clamping due to a central buckling due to a piezoelectrically generated length change, large electrode surfaces lying on top of one another cannot be reached in the final state, so that the electrostatic attraction force for generating the contact force must be relatively low.
Generell hat ein elektrostatischer Antrieb für Relais den Nachteil, daß zu Beginn der Ankerbewegung, also bei großem Abstand zwischen den Elektroden, die Anzugskraft relativ gering ist, so daß das Relais nur zögernd anspricht bzw. hohe Ansprechspannungen erfordert. Ziel der vorliegenden Erfindung ist es deshalb, ein mikromechanisches Relais der eingangs genannten Art so weiterzubilden, daß die Ansprechcharakteristik verbessert wird, daß also die Vorteile des elektrostatischen Antriebs - eine relativ hohe Kontaktkraft bei angezogenem Anker - erhalten bleiben, zugleich aber die Kräfte zu Beginn des Ansprechens erhöht werden.In general, an electrostatic drive for relays has the disadvantage that at the beginning of the armature movement, that is to say with a large distance between the electrodes, the tightening force is relatively low, so that the relay responds only slowly or requires high response voltages. The aim of the present invention is therefore to develop a micromechanical relay of the type mentioned in such a way that the response characteristic is improved, so that the advantages of the electrostatic drive - a relatively high contact force when the armature is attracted - are retained, but at the same time the forces at the beginning of Responsiveness can be increased.
Erfindungsgemäß wird dieses Ziel in dem eingangsgenannten mikromechanischen Relais dadurch erreicht, daß der Anker in zumindest einem Teil des vorgenannten biegsamen Bereiches mit einer als Biegewandler wirkenden Piezoschicht mit elektrischen Zuleitungen versehen ist, deren Biegekraft bei Erregung die elektrostatische Anzugskraft zwischen der Basiselektrode und der Ankerelektrode unterstützt.According to the invention, this aim is achieved in the micromechanical relay mentioned at the outset in that the armature is provided in at least part of the above-mentioned flexible region with a piezo layer acting as a bending transducer with electrical leads, the bending force of which, when excited, supports the electrostatic attraction between the base electrode and the armature electrode.
Bei dem erfindungsgemäßen Relais ist also der Anker zusätzlich zu dem elektrostatischen Antrieb mit einem Piezoantrieb versehen. Bei diesem so gebildeten Hybridantrieb werden die Eigenschaften zweier Antriebssysteme nutzbringend derart kombiniert, daß die Vorteile des einen Antriebs die Nachteile des jeweils anderen Antriebs aufwiegen: Der Piezoantrieb kann den Anker um ein großes Wegstück bzw. über einen großen Schalthub verschieben, erzeugt aber bei großer Ankerauslenkung, d. h. in der Arbeitsposition, nur eine kleine Kraft. Andererseits erzeugt der elektrostatische Antrieb zwar in der Arbeitsstellung, d. h. bei angezogenem Anker, eine große Kontaktkraft, jedoch ist die elektrostatische Anzugskraft zu Beginn der Ankerbewegung, also bei großen Elektrodenabständen, nur gering.In the relay according to the invention, the armature is therefore provided with a piezo drive in addition to the electrostatic drive. In this hybrid drive, the properties of two drive systems are usefully combined in such a way that the advantages of one drive outweigh the disadvantages of the other drive: The piezo drive can move the armature by a large distance or over a large switching stroke, but produces with large armature deflection , ie in the working position, only a small force. On the other hand, the electrostatic drive produces in Working position, ie when the armature is attracted, a large contact force, but the electrostatic attraction force at the beginning of the armature movement, that is to say with large electrode spacings, is only slight.
In dem erfindungsgemäßen Relais ist der Anker in Form einer die Ankerelektrode und die Piezoschicht tragenden Zunge einseitig mit einem Ankersubstrat schwenkbar verbunden. Bei diesem Relais wird mit einem mehr oder weniger keilförmigen Luftspalt zwischen Anker und Basis von Beginn an eine relativ hohe elektrostatische Anzugskraft erzeugt, die jedoch durch Überlagerung mit der piezoelektrischen Kraft noch verbessert wird. Vorzugsweise ist dabei die Basiselektrode auf einem schräg geätzten Abschnitt des Basissubstrats angeordnet, derart, daß die Ankerelektrode mit ihr im Ruhezustand den erwähnten keilförmigen Luftspalt bildet und sich im Erregungszustand annähernd parallel an sie anlegt. Da hierbei nach dem Anziehen des Ankers zwischen den Elektroden, abgesehen von den notwendigen dünnen Isolierschichten, keinerlei Luftspalt verbleibt, lassen sich verhältnismäßig hohe Kontaktkräfte gewinnen.In the relay according to the invention, the armature in the form of a tongue carrying the armature electrode and the piezo layer is pivotally connected on one side to an armature substrate. With this relay, a more or less wedge-shaped air gap between the armature and the base generates a relatively high electrostatic attraction force from the start, which, however, is further improved by superimposition with the piezoelectric force. The base electrode is preferably arranged on an obliquely etched section of the base substrate in such a way that the armature electrode forms the wedge-shaped air gap mentioned with it in the idle state and rests approximately parallel to it in the excited state. Since no air gap remains between the electrodes after the armature has been tightened, apart from the necessary thin insulating layers, relatively high contact forces can be obtained.
Die Erfindung wird nachfolgend an einem Ausführungsbeispiel anhand der Zeichnung näher erläutert. Es zeigt
- Figur 1 ein Hybridrelais mit einem zungenförmigen, einseitig gelagerten Anker,
- Figur 2 eine vergrößert dargestellte, nicht maßstäbliche Schnittdarstellung der Schichten im Anker- und Basissubstrat eines Relais gemäß Figur 1,
- Figur 3 eine schematische Ansteuerschaltung für ein Hybridrelais und
- Figur 4 ein schematisiertes Kräftediagramm für ein Hybridrelais.
- FIG. 1 shows a hybrid relay with a tongue-shaped armature mounted on one side,
- FIG. 2 shows an enlarged sectional view, not to scale, of the layers in the armature and base substrate of a relay according to FIG. 1,
- Figure 3 is a schematic control circuit for a hybrid relay and
- Figure 4 is a schematic force diagram for a hybrid relay.
In Figur 1 ist schematisch ein mikromechanisches Hybridrelais dargestellt, wobei die tatsächlichen Größenverhältnisse zugunsten der Anschaulichkeit vernachlässigt werden. Dabei ist ein Basissubstrat 51 vorgesehen, welches beispielsweise aus Silizium, vorzugsweise jedoch auch aus Pyrex-Glas, bestehen kann. Auf diesem Basissubstrat 51 ist ein Ankersubstrat 52 angeordnet und befestigt, das vorzugsweise aus Silizium bestehen kann. In diesem Ankersubstrat 52 ist ein zungenförmiger Anker 53 als freigeätzter Oberflächenbereich ausgebildet. Das Basissubstrat 51 und das Ankersubstrat 52 sind mit freigeätzten Bereichen an ihren Rändern so verbunden, daß der Anker 53 in einem geschlossenen Kontaktraum 54 liegt.A micromechanical hybrid relay is shown schematically in FIG. 1, the actual size relationships being neglected in favor of clarity. In this case, a
Der Anker besitzt an seinem freien Ende ein Ankerkontaktstück 55, das mit einem feststehenden Gegenkontaktelement 56 des Basissubstrats zusammenwirkt. Weiterhin ist auf dem Anker an seinem der Basis zugewandten Oberflächenbereich eine Ankerelektrode 57 in Form einer Metallschicht angeordnet, die ihrerseits einer Basiselektrode 58 des Basissubstrats gegenübersteht. Diese beiden Elektroden 57 und 58 bilden einen elektrostatischen Antrieb für das Relais. Die Basiselektrode 58 ist dabei auf einem abgeschrägten Abschnitt 59 des Basissubstrats angeordnet, so daß die Ankerelektrode 57 im angezogenen Zustand des Ankers - wie in Figur 1 dargestellt - durchgehend parallel auf der Basiselektrode 58 aufliegt.At its free end, the armature has an
Zusätzlich besitzt der Anker 53 einen piezoelektrischen Antrieb in Form einer Piezoschicht 60, welche als Biegewandler arbeitet und vor allem zu Beginn der Ankerbewegung die notwendige Anzugskraft für den Anker aufbringt.In addition, the
Obwohl in Figur 1 nur andeutungsweise mit 64 dargestellt, müssen natürlich elektrische Zuleitungen zu den Kontaktstücken 55 und 56 sowie zu den Elektroden 57 und 59 und zu den nicht weiter dargestellten Elektroden des piezoelektrischen Wandlers 60 vorgesehen werden. Diese Zuleitungen werden in üblicher Schichttechnik aufgebracht, wobei natürlich einzelne Leiterbahnen in einer Ebene nebeneinander liegen können. So kann die Zuleitung zu dem beweglichen Kontaktstück 55 mit der Elektrode 57 in einer Ebene liegen und innerhalb dieser Ebene von dieser durch entsprechende Zwischenräume getrennt sein. Das Zungenende des Ankers 53 kann auch durch Längsschlitze beispielsweise in drei gegeneinander bewegbare Enden aufgeteilt werden. Auf diese Weise könnte das mit dem Kontaktstück 55 versehene Zungenende sich zur Erhöhung der Kontaktkraft elastisch durchbiegen, während die seitlichen Zungenenden mit der auf ihnen liegenden Elektrodenschicht flach auf der Basiselektrode 58 aufliegen. Nur der Vollständigkeit halber sei erwähnt, daß die Isolierung von Schichten unterschiedlichen Potentials durch geeignete Isolationsschichten sichergestellt wird, obwohl diese Schichten nicht eigens dargestellt sind.Although only hinted at 64 in FIG. 1, electrical supply lines to the
In Figur 2 sind die das Relais bildenden zwei Teile vor dem Zusammenbau in etwas vergrößerter Darstellung noch einmal gezeigt, um die Schichten etwas deutlicher hervorzuheben. Es sei jedoch betont, daß in dieser schematischen Darstellung die geometrischen Verhältnisse nicht maßstäblich den tatsächlichen Längen und Dicken der einzelnen Schichten entsprechen. Bei der Herstellung wird aus dem Ankersubstrat 52 die den Anker 53 bildende Zunge durch selektives Ätzen freigelegt. Diese Zunge besteht also aus Silizium wie das Substrat selbst, ist jedoch durch Dotierung ätzresistent gemacht. Darauf wird eine SiO2-Schicht als Isolationsschicht erzeugt und auf diese wiederum wird eine Metallschicht aufgebracht, welche beispielsweise aus Aluminium besteht und einerseits die Ankerelektrode 57, andererseits aber auch die Zuleitung für das Kontaktstück 55 und die innere Elektrode 61 für die danach aufzubringende piezoelektrische Schicht 60 bildet. Soweit die metallischen Flächen oder Leitungen gegeneinander isoliert werden müssen, erfolgt dies durch entsprechende Längsunterbrechungen. Nach der piezoelektrischen Schicht 60 wird deren äußere Elektrode 62 ebenfalls als Metallschicht aufgebracht. Am freien Ende der Zunge bzw. des Ankers 53 wird das Kontaktstück 55 galvanisch aufgebracht. Außerdem kann das vordere Ende der Zunge durch zwei Schlitze in eine Schaltfeder und zwei seitlich liegende elektrostatische Ankerelemente unterteilt sein.In FIG. 2, the two parts forming the relay are shown again in a somewhat enlarged representation before assembly, in order to emphasize the layers somewhat more clearly. However, it should be emphasized that in this schematic representation the geometric relationships do not correspond to the actual lengths and thicknesses of the individual layers. During manufacture, the tongue forming the
Die Basis wird aus einem Basissubstrat 51 ebenfalls durch Ätzen aus Silizium oder aus Pyrex-Glas hergestellt. In einem ersten Ätzschritt wird anisotrop oder isotrop eine Wanne 54a hergestellt, deren Boden parallel zur Waferoberfläche ist. In einem zweiten Ätzschritt wird dann in den Wannenboden mit einer an sich bekannten Technik eine keilförmige Ausnehmung zur Erzeugung der Schräge 59 geätzt, die in einem flachen Winkel gegen die Oberfläche des Substrats geneigt ist. Die Neigung ist in der Zeichnung übertrieben dargestellt. Bei einem praktischen Beispiel liegt der Winkel in der Größenordnung von 3°. Auf die geätzte Oberflächenform wird dann eine Metallschicht zur Bildung der Basiselektrode 58 und der erforderlichen Zuleitungen erzeugt. Das Kontaktstück 56 wird galvanisch erzeugt. Außerdem wird eine Isolationsschicht 63, beispielsweise aus SiO2, in herkömmlicher Weise aufgebracht. In einer möglichen Abwandlung kann auch die piezoelektrische Schicht 60 über die gesamte Länge der Zunge erstreckt werden. In diesem Falle würde sie als Isolationsschicht zwischen den Elektroden 57 und 58 wirken, so daß die zusätzliche Isolationsschicht 63 entbehrlich wäre.The base is also produced from a
Die beiden Substrate 51 und 52 werden in bekannter Weise, beispielsweise durch anodisches Bonden, zusammengefügt. Dabei werden auch die entsprechenden Zuleitungen zu den Metallschichten vorgesehen, ohne daß dies in der Figur näher dargestellt zu werden braucht.The two
Figur 3 zeigt eine einfache Schaltung für einen Hybridantrieb gemäß Figur 1. Dabei liegt eine Basiselektrode 11 parallel zu einer Ankerelektrode 23, welche plattenförmig einander gegenüberstehen und bei Anlegung einer Spannung von der Spannungsquelle 40 als elektrostatischer Antrieb dienen. Parallel zu diesem elektrostatischen Antrieb liegt ein Piezowandler 41 mit seinen Elektroden 42 und 43, wobei die Elektrode 43 von der gleichen Schicht wie die Elektrode 23 gebildet sein kann. Über den Schalter 44 können der elektrostatische Antrieb mit den Elektroden 11 und 23 sowie der Piezoantrieb mit den Elektroden 42 und 43 parallel an die Spannungsquelle 40 angelegt werden. Dabei sprechen beide Antriebe gleichzeitig an und überlagern ihre Kräfte zum Schließen des jeweiligen Kontaktes.FIG. 3 shows a simple circuit for a hybrid drive according to FIG. 1. A base electrode 11 is parallel to an
Die Charakteristik der beiden Antriebe ist schematisch in Figur 4 gezeigt. Über einer Achse für den Ankerabstand s ist die Kraft F aufgetragen. Im Ruhezustand, wenn der Ankerabstand den Wert a besitzt, ist die mit f1 bezeichnete elektrostatische Kraft verhältnismäßig gering; sie steigt mit zunehmender Annäherung des Ankers an die Basiselektrode an und erreicht einen hohen Wert, wenn der Abstand s gegen 0 geht. Die piezoelektrische Anziehungskraft, mit f2 bezeichnet, ist am größten am Anfang der Ankerbewegung, also bei großem Ankerabstand. Sie wird mit zunehmender Auslenkung des Biegewandlers zur Basiselektrode hin kleiner. Somit kompensiert die piezoelektrische Kraft f2 bei dem großen Ankerabstand a den geringen Wert von f1, während die elektrostatische Kraft f1 nach dem Schließen des Ankers den kleinen Wert der piezoelektrischen Kraft f2 kompensiert. Es entsteht dabei ein Gesamtverlauf der Kräfte f3, der über den gesamten Wegverlauf die entgegenwirkende Federkraft f4 der elastischen Lagerbänder zu überwinden und bei geschlossenem Anker eine große Kontaktkraft zu erzeugen vermag.The characteristic of the two drives is shown schematically in FIG. The force F is plotted over an axis for the anchor spacing s. In the idle state, when the armature distance has the value a, the electrostatic force denoted by f1 is relatively low; it increases as the armature approaches the base electrode and reaches a high value when the distance s approaches 0. The piezoelectric attraction, denoted by f2, is greatest at the beginning of the armature movement, i.e. when the armature distance is large. It becomes smaller with increasing deflection of the bending transducer towards the base electrode. The piezoelectric force f2 thus compensates for the small value of f1 at the large armature distance a, while the electrostatic force f1 compensates for the small value of the piezoelectric force f2 after the armature has been closed. The result is an overall course of the forces f3, which can overcome the counteracting spring force f4 of the elastic bearing strips over the entire course of the path and can generate a large contact force when the armature is closed.
Claims (3)
- Micromechanical relay having a base substrate (51) which is fitted with a flat base electrode (58) and at least one stationary mating contact piece (56), having an armature substrate (52) which is arranged on the base substrate (51), is composed of material which can be etched selectively and from which at least one armature (53) is etched free in the form of a tongue which is attached on one side, which armature (53) is fitted with an armature electrode (57), which is opposite the base electrode (58), as well as an armature contact piece (55), which is opposite the mating contact piece (56), and has an elastically flexible region between its attachment to the armature substrate (52) and the armature contact piece (55), in such a manner that the armature is attracted towards the base substrate when an electrical voltage is applied between the armature electrode (23; 57) and the base electrode (11; 58), and having electrical supply leads, which are provided on the base substrate (51) and on the armature substrate (52), to the electrodes (57, 58) and to the contact pieces (55, 56), characterized in that the armature (53) is provided in at least one part of the abovementioned flexible region with a piezo-layer (60) which has electrical supply leads, acts as a bending transducer and whose bending force, on excitation, assists the electrostatic attraction force between the base electrode and the armature electrode.
- Relay according to Claim 1, characterized in that the base electrode (58) is arranged on an obliquely etched section of the base substrate (51) in such a manner that the armature electrode (57) forms a wedge-shaped air gap with it in the quiescent state and rests on it, approximately parallel, in the energized state.
- Relay according to Claim 1 or 2, characterized in that the armature (53) is formed from a surface layer, which is exposed on three sides and is undercut by etching, of an armature substrate (52) which is composed of semiconductor material, preferably silicon, and in that the base substrate (51), which is formed from silicon or pyrex glass, is connected to the surface of the armature substrate (52).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4305033 | 1993-02-18 | ||
| DE19934305033 DE4305033A1 (en) | 1992-02-21 | 1993-02-18 | Micro-mechanical relay with hybrid drive - has electrostatic drive combined with piezoelectric drive for high force operation and optimum response |
| PCT/DE1994/000152 WO1994019819A1 (en) | 1993-02-18 | 1994-02-14 | Micromechanical relay with hybrid actuator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0685109A1 EP0685109A1 (en) | 1995-12-06 |
| EP0685109B1 true EP0685109B1 (en) | 1997-08-13 |
Family
ID=6480807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP94906870A Expired - Lifetime EP0685109B1 (en) | 1993-02-18 | 1994-02-14 | Micromechanical relay with hybrid actuator |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5666258A (en) |
| EP (1) | EP0685109B1 (en) |
| JP (1) | JPH08506690A (en) |
| CN (1) | CN1040049C (en) |
| AT (1) | ATE156934T1 (en) |
| CA (1) | CA2156257A1 (en) |
| DE (1) | DE59403733D1 (en) |
| WO (1) | WO1994019819A1 (en) |
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|---|---|---|---|---|
| TW379346B (en) * | 1996-08-27 | 2000-01-11 | Omron Tateisi Electronics Co | Micro-relay and the method of manufacturing thereof |
| US6115231A (en) * | 1997-11-25 | 2000-09-05 | Tdk Corporation | Electrostatic relay |
| FR2776160A1 (en) * | 1998-03-10 | 1999-09-17 | Philips Consumer Communication | Transmitter/receiver switching mechanism for mobile telephones |
| US6320145B1 (en) * | 1998-03-31 | 2001-11-20 | California Institute Of Technology | Fabricating and using a micromachined magnetostatic relay or switch |
| FI108583B (en) * | 1998-06-02 | 2002-02-15 | Nokia Corp | resonator structures |
| US6236491B1 (en) | 1999-05-27 | 2001-05-22 | Mcnc | Micromachined electrostatic actuator with air gap |
| US6229683B1 (en) | 1999-06-30 | 2001-05-08 | Mcnc | High voltage micromachined electrostatic switch |
| US6057520A (en) * | 1999-06-30 | 2000-05-02 | Mcnc | Arc resistant high voltage micromachined electrostatic switch |
| US6359374B1 (en) | 1999-11-23 | 2002-03-19 | Mcnc | Miniature electrical relays using a piezoelectric thin film as an actuating element |
| US6373682B1 (en) | 1999-12-15 | 2002-04-16 | Mcnc | Electrostatically controlled variable capacitor |
| US6485273B1 (en) | 2000-09-01 | 2002-11-26 | Mcnc | Distributed MEMS electrostatic pumping devices |
| US6590267B1 (en) | 2000-09-14 | 2003-07-08 | Mcnc | Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods |
| US6377438B1 (en) | 2000-10-23 | 2002-04-23 | Mcnc | Hybrid microelectromechanical system tunable capacitor and associated fabrication methods |
| US6396620B1 (en) | 2000-10-30 | 2002-05-28 | Mcnc | Electrostatically actuated electromagnetic radiation shutter |
| JP4109992B2 (en) * | 2001-01-30 | 2008-07-02 | 株式会社アドバンテスト | Switch and integrated circuit device |
| KR100456771B1 (en) * | 2002-02-04 | 2004-11-12 | 주식회사 엠에스솔루션 | Piezoelectric switching device for high frequency |
| US6784389B2 (en) * | 2002-03-13 | 2004-08-31 | Ford Global Technologies, Llc | Flexible circuit piezoelectric relay |
| US7432788B2 (en) * | 2003-06-27 | 2008-10-07 | Memscap, Inc. | Microelectromechanical magnetic switches having rotors that rotate into a recess in a substrate |
| GB0320405D0 (en) * | 2003-08-30 | 2003-10-01 | Qinetiq Ltd | Micro electromechanical system switch |
| JP2005302711A (en) * | 2004-03-15 | 2005-10-27 | Matsushita Electric Ind Co Ltd | Actuator, its control method and switch using this |
| EP1792088A1 (en) * | 2004-07-23 | 2007-06-06 | AFA Controls, LLC | Microvalve assemblies and related methods |
| US7633213B2 (en) * | 2005-03-15 | 2009-12-15 | Panasonic Corporation | Actuator, switch using the actuator, and method of controlling the actuator |
| JP4586642B2 (en) * | 2005-06-14 | 2010-11-24 | ソニー株式会社 | Movable element, and semiconductor device, module and electronic equipment incorporating the movable element |
| JP2007015067A (en) * | 2005-07-08 | 2007-01-25 | Fujifilm Holdings Corp | Minute thin film movable element, minute thin film movable element array, and image forming device |
| KR20070053515A (en) | 2005-11-21 | 2007-05-25 | 삼성전자주식회사 | Rf mems switch and the method for producing the same |
| US7487678B2 (en) * | 2006-12-13 | 2009-02-10 | Honeywell International Inc. | Z offset MEMS devices and methods |
| JP2008238330A (en) | 2007-03-27 | 2008-10-09 | Toshiba Corp | Mems device and portable communication terminal having the same device |
| JP2009238546A (en) * | 2008-03-26 | 2009-10-15 | Panasonic Electric Works Co Ltd | Micro electric machine switch |
| JP5081038B2 (en) * | 2008-03-31 | 2012-11-21 | パナソニック株式会社 | MEMS switch and manufacturing method thereof |
| US8354899B2 (en) * | 2009-09-23 | 2013-01-15 | General Electric Company | Switch structure and method |
| WO2013051064A1 (en) * | 2011-10-06 | 2013-04-11 | 富士通株式会社 | Mems switch |
| US9251984B2 (en) * | 2012-12-27 | 2016-02-02 | Intel Corporation | Hybrid radio frequency component |
| US10825628B2 (en) * | 2017-07-17 | 2020-11-03 | Analog Devices Global Unlimited Company | Electromagnetically actuated microelectromechanical switch |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU738009A1 (en) * | 1977-04-07 | 1980-05-30 | За витель | Electrostatic relay electrode |
| GB2095911B (en) * | 1981-03-17 | 1985-02-13 | Standard Telephones Cables Ltd | Electrical switch device |
| US4819126A (en) * | 1988-05-19 | 1989-04-04 | Pacific Bell | Piezoelectic relay module to be utilized in an appliance or the like |
| DE4205029C1 (en) * | 1992-02-19 | 1993-02-11 | Siemens Ag, 8000 Muenchen, De | Micro-mechanical electrostatic relay - has tongue-shaped armature etched from surface of silicon@ substrate |
| DE4205340C1 (en) * | 1992-02-21 | 1993-08-05 | Siemens Ag, 8000 Muenchen, De | Micro-mechanical electrostatic relay with parallel electrodes - has frame shaped armature substrate with armature contacts above base electrode contacts on base substrate |
-
1994
- 1994-02-14 CN CN94191220A patent/CN1040049C/en not_active Expired - Fee Related
- 1994-02-14 AT AT94906870T patent/ATE156934T1/en not_active IP Right Cessation
- 1994-02-14 US US08/505,312 patent/US5666258A/en not_active Expired - Fee Related
- 1994-02-14 EP EP94906870A patent/EP0685109B1/en not_active Expired - Lifetime
- 1994-02-14 JP JP6518543A patent/JPH08506690A/en not_active Ceased
- 1994-02-14 DE DE59403733T patent/DE59403733D1/en not_active Expired - Fee Related
- 1994-02-14 CA CA002156257A patent/CA2156257A1/en not_active Abandoned
- 1994-02-14 WO PCT/DE1994/000152 patent/WO1994019819A1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| ATE156934T1 (en) | 1997-08-15 |
| US5666258A (en) | 1997-09-09 |
| DE59403733D1 (en) | 1997-09-18 |
| EP0685109A1 (en) | 1995-12-06 |
| JPH08506690A (en) | 1996-07-16 |
| CA2156257A1 (en) | 1994-09-01 |
| CN1040049C (en) | 1998-09-30 |
| WO1994019819A1 (en) | 1994-09-01 |
| CN1118199A (en) | 1996-03-06 |
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