DK2592915T3 - Fremstillingsfremgangsmåde til lamineret printplade - Google Patents

Fremstillingsfremgangsmåde til lamineret printplade Download PDF

Info

Publication number
DK2592915T3
DK2592915T3 DK11803570.8T DK11803570T DK2592915T3 DK 2592915 T3 DK2592915 T3 DK 2592915T3 DK 11803570 T DK11803570 T DK 11803570T DK 2592915 T3 DK2592915 T3 DK 2592915T3
Authority
DK
Denmark
Prior art keywords
circuit board
printed circuit
manufacturing process
laminated printed
laminated
Prior art date
Application number
DK11803570.8T
Other languages
English (en)
Inventor
Masahiro Okamoto
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Application granted granted Critical
Publication of DK2592915T3 publication Critical patent/DK2592915T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
DK11803570.8T 2010-07-06 2011-07-05 Fremstillingsfremgangsmåde til lamineret printplade DK2592915T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010153738 2010-07-06
PCT/JP2011/065336 WO2012005236A1 (ja) 2010-07-06 2011-07-05 積層配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
DK2592915T3 true DK2592915T3 (da) 2022-04-19

Family

ID=45441215

Family Applications (1)

Application Number Title Priority Date Filing Date
DK11803570.8T DK2592915T3 (da) 2010-07-06 2011-07-05 Fremstillingsfremgangsmåde til lamineret printplade

Country Status (6)

Country Link
US (1) US8941016B2 (da)
EP (1) EP2592915B1 (da)
JP (1) JP5411362B2 (da)
CN (1) CN102986314B (da)
DK (1) DK2592915T3 (da)
WO (1) WO2012005236A1 (da)

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JP5719740B2 (ja) * 2011-09-30 2015-05-20 株式会社日立製作所 配線材料および、それを用いた半導体モジュール
JP5749235B2 (ja) * 2012-09-25 2015-07-15 パナソニック株式会社 回路部品内蔵基板の製造方法
CN203151864U (zh) * 2013-03-05 2013-08-21 奥特斯(中国)有限公司 印制电路板
JP2014192321A (ja) * 2013-03-27 2014-10-06 Ibiden Co Ltd 電子部品内蔵配線板およびその製造方法
JP5583815B1 (ja) * 2013-04-22 2014-09-03 株式会社フジクラ 多層配線基板及びその製造方法
CN104219883B (zh) * 2013-05-29 2017-08-11 碁鼎科技秦皇岛有限公司 具有内埋元件的电路板及其制作方法
GB2518858A (en) * 2013-10-02 2015-04-08 Univ Exeter Graphene
WO2015198870A1 (ja) * 2014-06-23 2015-12-30 株式会社村田製作所 部品内蔵基板および部品内蔵基板の製造方法
US9627311B2 (en) * 2015-01-22 2017-04-18 Mediatek Inc. Chip package, package substrate and manufacturing method thereof
JP6806354B2 (ja) * 2015-04-20 2021-01-06 サムソン エレクトロ−メカニックス カンパニーリミテッド． キャパシタ部品及びこれを備えた実装基板
WO2016170894A1 (ja) * 2015-04-21 2016-10-27 株式会社村田製作所 配線基板及び積層チップコンデンサ
WO2016181958A1 (ja) * 2015-05-11 2016-11-17 学校法人早稲田大学 電子デバイスおよびその製造方法
KR101666757B1 (ko) * 2015-07-13 2016-10-24 앰코 테크놀로지 코리아 주식회사 반도체 패키지
JP6741419B2 (ja) * 2015-12-11 2020-08-19 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージおよびその製造方法
KR102450576B1 (ko) * 2016-01-22 2022-10-07 삼성전자주식회사 전자 부품 패키지 및 그 제조방법
CN105848416B (zh) * 2016-03-31 2019-04-26 华为技术有限公司 一种基板及移动终端
WO2018097828A1 (en) * 2016-11-23 2018-05-31 Intel IP Corporation Component terminations for semiconductor packages
WO2018126052A1 (en) 2016-12-29 2018-07-05 Invensas Bonding Technologies, Inc. Bonded structures with integrated passive component
CN107342264B (zh) * 2017-07-21 2019-09-17 华进半导体封装先导技术研发中心有限公司 扇出型封装结构及其制造方法
CN107275302B (zh) * 2017-07-21 2019-08-30 华进半导体封装先导技术研发中心有限公司 扇出型封装结构及其制造方法
CN107342265B (zh) * 2017-07-21 2019-08-30 华进半导体封装先导技术研发中心有限公司 扇出型封装结构及其制造方法
US11901281B2 (en) 2019-03-11 2024-02-13 Adeia Semiconductor Bonding Technologies Inc. Bonded structures with integrated passive component
US11309295B2 (en) * 2019-08-26 2022-04-19 Advanced Semiconductor Engineering, Inc. Semiconductor device package

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Also Published As

Publication number Publication date
EP2592915A4 (en) 2016-03-30
EP2592915B1 (en) 2022-01-26
WO2012005236A1 (ja) 2012-01-12
CN102986314A (zh) 2013-03-20
JP5411362B2 (ja) 2014-02-12
EP2592915A1 (en) 2013-05-15
US20130118791A1 (en) 2013-05-16
US8941016B2 (en) 2015-01-27
JPWO2012005236A1 (ja) 2013-09-02
CN102986314B (zh) 2016-10-12

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