DE69515140T2 - Planarisierung in der Herstellung von Anordnungen - Google Patents
Planarisierung in der Herstellung von AnordnungenInfo
- Publication number
- DE69515140T2 DE69515140T2 DE69515140T DE69515140T DE69515140T2 DE 69515140 T2 DE69515140 T2 DE 69515140T2 DE 69515140 T DE69515140 T DE 69515140T DE 69515140 T DE69515140 T DE 69515140T DE 69515140 T2 DE69515140 T2 DE 69515140T2
- Authority
- DE
- Germany
- Prior art keywords
- planarization
- creation
- arrangements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24527994A | 1994-05-18 | 1994-05-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69515140D1 DE69515140D1 (de) | 2000-03-30 |
DE69515140T2 true DE69515140T2 (de) | 2000-08-31 |
Family
ID=22926037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69515140T Expired - Fee Related DE69515140T2 (de) | 1994-05-18 | 1995-05-10 | Planarisierung in der Herstellung von Anordnungen |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0683511B1 (de) |
JP (1) | JPH0888169A (de) |
KR (1) | KR100374915B1 (de) |
DE (1) | DE69515140T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10332112A1 (de) * | 2003-07-09 | 2005-01-27 | Carl Zeiss Smt Ag | Projektionsbelichtungsverfahren und Projektionsbelichtungssystem |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5967030A (en) | 1995-11-17 | 1999-10-19 | Micron Technology, Inc. | Global planarization method and apparatus |
US6331488B1 (en) | 1997-05-23 | 2001-12-18 | Micron Technology, Inc. | Planarization process for semiconductor substrates |
US6316363B1 (en) | 1999-09-02 | 2001-11-13 | Micron Technology, Inc. | Deadhesion method and mechanism for wafer processing |
US5932045A (en) * | 1997-06-02 | 1999-08-03 | Lucent Technologies Inc. | Method for fabricating a multilayer optical article |
US6036586A (en) | 1998-07-29 | 2000-03-14 | Micron Technology, Inc. | Apparatus and method for reducing removal forces for CMP pads |
US6218316B1 (en) | 1998-10-22 | 2001-04-17 | Micron Technology, Inc. | Planarization of non-planar surfaces in device fabrication |
US6518172B1 (en) | 2000-08-29 | 2003-02-11 | Micron Technology, Inc. | Method for applying uniform pressurized film across wafer |
JP3927768B2 (ja) * | 2000-11-17 | 2007-06-13 | 松下電器産業株式会社 | 半導体装置の製造方法 |
US6721076B2 (en) | 2001-08-03 | 2004-04-13 | Inphase Technologies, Inc. | System and method for reflective holographic storage with associated multiplexing techniques |
US7112359B2 (en) | 2001-08-22 | 2006-09-26 | Inphase Technologies, Inc. | Method and apparatus for multilayer optical articles |
US7001541B2 (en) | 2001-09-14 | 2006-02-21 | Inphase Technologies, Inc. | Method for forming multiply patterned optical articles |
US6825960B2 (en) | 2002-01-15 | 2004-11-30 | Inphase Technologies, Inc. | System and method for bitwise readout holographic ROM |
US7455955B2 (en) * | 2002-02-27 | 2008-11-25 | Brewer Science Inc. | Planarization method for multi-layer lithography processing |
US7790231B2 (en) | 2003-07-10 | 2010-09-07 | Brewer Science Inc. | Automated process and apparatus for planarization of topographical surfaces |
JP4801584B2 (ja) * | 2003-07-10 | 2011-10-26 | ブルーワー サイエンス アイ エヌ シー. | トポグラフィカル表面を平坦化するための自動処理方法と装置 |
US7775785B2 (en) | 2006-12-20 | 2010-08-17 | Brewer Science Inc. | Contact planarization apparatus |
CN102089708A (zh) * | 2008-06-09 | 2011-06-08 | 得克萨斯州大学系统董事会 | 适应性纳米形貌雕刻 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2033287A (en) | 1934-06-30 | 1936-03-10 | Bell Telephone Labor Inc | Switching device |
US4689289A (en) | 1986-04-30 | 1987-08-25 | General Electric Company | Block polymer compositions |
JPH0770527B2 (ja) * | 1987-02-27 | 1995-07-31 | アメリカン テレフォン アンド テレグラフ カムパニー | デバイス作製方法 |
US4882201A (en) | 1988-03-21 | 1989-11-21 | General Electric Company | Non-toxic aryl onium salts, UV curable coating compositions and food packaging use |
GB9321900D0 (en) * | 1993-10-23 | 1993-12-15 | Dobson Christopher D | Method and apparatus for the treatment of semiconductor substrates |
-
1995
- 1995-05-10 EP EP95303160A patent/EP0683511B1/de not_active Expired - Lifetime
- 1995-05-10 DE DE69515140T patent/DE69515140T2/de not_active Expired - Fee Related
- 1995-05-17 JP JP7141337A patent/JPH0888169A/ja active Pending
- 1995-05-18 KR KR1019950012357A patent/KR100374915B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10332112A1 (de) * | 2003-07-09 | 2005-01-27 | Carl Zeiss Smt Ag | Projektionsbelichtungsverfahren und Projektionsbelichtungssystem |
Also Published As
Publication number | Publication date |
---|---|
JPH0888169A (ja) | 1996-04-02 |
EP0683511A2 (de) | 1995-11-22 |
KR100374915B1 (ko) | 2003-05-09 |
EP0683511B1 (de) | 2000-02-23 |
DE69515140D1 (de) | 2000-03-30 |
EP0683511A3 (de) | 1996-05-01 |
KR950034598A (ko) | 1995-12-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |