DE69429466D1 - Optische Vorrichtung - Google Patents

Optische Vorrichtung

Info

Publication number
DE69429466D1
DE69429466D1 DE69429466T DE69429466T DE69429466D1 DE 69429466 D1 DE69429466 D1 DE 69429466D1 DE 69429466 T DE69429466 T DE 69429466T DE 69429466 T DE69429466 T DE 69429466T DE 69429466 D1 DE69429466 D1 DE 69429466D1
Authority
DE
Germany
Prior art keywords
optical device
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69429466T
Other languages
English (en)
Other versions
DE69429466T2 (de
Inventor
Teruhiro Shiono
Hisahito Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69429466D1 publication Critical patent/DE69429466D1/de
Publication of DE69429466T2 publication Critical patent/DE69429466T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/124—Geodesic lenses or integrated gratings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/34—Optical coupling means utilising prism or grating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
    • G11B7/124—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate the integrated head arrangements including waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Head (AREA)
  • Semiconductor Lasers (AREA)
DE69429466T 1993-03-05 1994-03-04 Optische Vorrichtung Expired - Fee Related DE69429466T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5044833A JP2842132B2 (ja) 1993-03-05 1993-03-05 光学デバイス

Publications (2)

Publication Number Publication Date
DE69429466D1 true DE69429466D1 (de) 2002-01-31
DE69429466T2 DE69429466T2 (de) 2002-05-29

Family

ID=12702473

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69429466T Expired - Fee Related DE69429466T2 (de) 1993-03-05 1994-03-04 Optische Vorrichtung

Country Status (4)

Country Link
US (1) US5402435A (de)
EP (1) EP0614098B1 (de)
JP (1) JP2842132B2 (de)
DE (1) DE69429466T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3864428B2 (ja) * 1995-02-24 2006-12-27 ソニー株式会社 光学装置及び記録媒体再生装置
KR0166232B1 (ko) * 1995-11-27 1999-03-20 배순훈 초소형 광 픽-업장치
US5888906A (en) * 1996-09-16 1999-03-30 Micron Technology, Inc. Plasmaless dry contact cleaning method using interhalogen compounds
US6055107A (en) * 1997-08-12 2000-04-25 Industrial Technology Research Institute Diffractive lens and preparation method thereof
US6072815A (en) * 1998-02-27 2000-06-06 Litton Systems, Inc. Microlaser submount assembly and associates packaging method
JP4074724B2 (ja) * 1999-04-07 2008-04-09 日本オプネクスト株式会社 波長可変光源及びそれを用いた光学装置
DE10203720B4 (de) 2001-02-02 2012-11-22 Nippon Telegraph And Telephone Corp. Blutflußmesser und Sensorteil des Blutflußmessers
FI20010778A (fi) * 2001-04-12 2002-10-13 Nokia Corp Optinen kytkentäjärjestely
JP2003110180A (ja) * 2001-07-25 2003-04-11 Furukawa Electric Co Ltd:The 半導体レーザモジュール並びに光測定方法及び光測定装置
US7129560B2 (en) * 2003-03-31 2006-10-31 International Business Machines Corporation Thermal memory cell and memory device including the thermal memory cell
US7091124B2 (en) * 2003-11-13 2006-08-15 Micron Technology, Inc. Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US20050247894A1 (en) 2004-05-05 2005-11-10 Watkins Charles M Systems and methods for forming apertures in microfeature workpieces
US7232754B2 (en) 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7425499B2 (en) * 2004-08-24 2008-09-16 Micron Technology, Inc. Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
US7083425B2 (en) 2004-08-27 2006-08-01 Micron Technology, Inc. Slanted vias for electrical circuits on circuit boards and other substrates
US7300857B2 (en) * 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7271482B2 (en) * 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7262134B2 (en) * 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7622377B2 (en) 2005-09-01 2009-11-24 Micron Technology, Inc. Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
US7863187B2 (en) * 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US20070045120A1 (en) * 2005-09-01 2007-03-01 Micron Technology, Inc. Methods and apparatus for filling features in microfeature workpieces
US7749899B2 (en) * 2006-06-01 2010-07-06 Micron Technology, Inc. Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
JP5192667B2 (ja) * 2006-07-26 2013-05-08 パナソニック株式会社 発光装置
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7902643B2 (en) 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
US7804175B2 (en) * 2007-01-31 2010-09-28 Hewlett-Packard Development Company, L.P. Semiconductor structures including conductive vias continuously extending therethrough and methods of making the same
SG150410A1 (en) * 2007-08-31 2009-03-30 Micron Technology Inc Partitioned through-layer via and associated systems and methods
US7884015B2 (en) * 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
DE102014105851B3 (de) * 2014-04-25 2015-10-22 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zur Herstellung einer optischen Baueinheit
DE102015114990B4 (de) * 2015-09-07 2022-05-12 tooz technologies GmbH Linsenanordnung, insbesondere Brillenglasanordnung, Anzeigevorrichtung und Verfahren zum Herstellen einer Linsenanordnung
KR20170104715A (ko) * 2016-03-07 2017-09-18 삼성디스플레이 주식회사 백라이트 유닛 및 이를 포함하는 표시 장치
JP2019160859A (ja) * 2018-03-08 2019-09-19 豊田合成株式会社 発光装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651884A (en) * 1979-10-03 1981-05-09 Hitachi Ltd Light sending and recieving element
EP0219359B1 (de) * 1985-10-16 1990-03-07 BRITISH TELECOMMUNICATIONS public limited company Fabry-Perot-Interferometer
JPS62211980A (ja) * 1986-03-12 1987-09-17 Ricoh Co Ltd 半導体レ−ザ−装置の製作方法
US4711997A (en) * 1986-11-14 1987-12-08 American Telephone And Telegraph Company, At&T Bell Laboratories Optical interconnection of devices on chips
JPS63228790A (ja) * 1987-03-18 1988-09-22 Matsushita Electric Ind Co Ltd 半導体発光装置およびその製造方法
JP2579317B2 (ja) * 1987-07-20 1997-02-05 ローム 株式会社 半導体レ−ザ装置
JPH0230192A (ja) * 1988-07-20 1990-01-31 Fujitsu Ltd 半導体レーザ装置
JPH0281493A (ja) * 1988-09-16 1990-03-22 Sanyo Electric Co Ltd 半導体レーザ装置
US5017263A (en) * 1988-12-23 1991-05-21 At&T Bell Laboratories Optoelectronic device package method
JPH02271586A (ja) * 1989-04-12 1990-11-06 Mitsubishi Electric Corp 半導体レーザ装置
JP2704951B2 (ja) * 1989-12-15 1998-01-26 富士通株式会社 半導体レーザ装置のマウント方法
US5317551A (en) * 1990-07-16 1994-05-31 Matsushita Electric Industrial Co., Ltd. Optical disk head including a light path having a thickness and width greater than the light beam wavelength by a predetermined amount
JPH04219640A (ja) * 1990-07-16 1992-08-10 Matsushita Electric Ind Co Ltd 光学ヘッド及びその製造方法
JPH04139628A (ja) * 1990-09-28 1992-05-13 Matsushita Electron Corp 光半導体装置およびその製造方法
JPH04247346A (ja) * 1991-02-04 1992-09-03 Hitachi Ltd 光磁気記録媒体
JPH04310639A (ja) * 1991-04-08 1992-11-02 Matsushita Electric Ind Co Ltd 光学ヘッド及びその製造方法
JP2528445B2 (ja) * 1991-04-10 1996-08-28 株式会社三協精機製作所 光ピックアップ装置

Also Published As

Publication number Publication date
US5402435A (en) 1995-03-28
JPH06259800A (ja) 1994-09-16
DE69429466T2 (de) 2002-05-29
EP0614098B1 (de) 2001-12-19
JP2842132B2 (ja) 1998-12-24
EP0614098A2 (de) 1994-09-07
EP0614098A3 (de) 1996-01-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee