DE68920405T2 - Alignment device. - Google Patents
Alignment device.Info
- Publication number
- DE68920405T2 DE68920405T2 DE68920405T DE68920405T DE68920405T2 DE 68920405 T2 DE68920405 T2 DE 68920405T2 DE 68920405 T DE68920405 T DE 68920405T DE 68920405 T DE68920405 T DE 68920405T DE 68920405 T2 DE68920405 T2 DE 68920405T2
- Authority
- DE
- Germany
- Prior art keywords
- alignment device
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C19/00—Bearings with rolling contact, for exclusively rotary movement
- F16C19/50—Other types of ball or roller bearings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75822—Rotational mechanism
- H01L2224/75823—Pivoting mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Automatic Assembly (AREA)
- Eye Examination Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/264,713 US4875614A (en) | 1988-10-31 | 1988-10-31 | Alignment device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68920405D1 DE68920405D1 (en) | 1995-02-16 |
DE68920405T2 true DE68920405T2 (en) | 1995-07-13 |
Family
ID=23007290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68920405T Expired - Fee Related DE68920405T2 (en) | 1988-10-31 | 1989-08-01 | Alignment device. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4875614A (en) |
EP (1) | EP0366880B1 (en) |
JP (1) | JPH0650752B2 (en) |
DE (1) | DE68920405T2 (en) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5016804A (en) * | 1989-01-10 | 1991-05-21 | Siemens Aktiengesellschaft | Soldering apparatus having at least one stirrup electrode |
US4982890A (en) * | 1989-01-10 | 1991-01-08 | Siemens Aktiengesellschaft | Soldering means having at least one stirrup electrode and two soldering webs lying opposite one another or four soldering webs lying opposite one another in pairs |
JPH02303100A (en) * | 1989-05-17 | 1990-12-17 | Matsushita Electric Ind Co Ltd | Mounting method for component |
US5051555A (en) * | 1990-02-26 | 1991-09-24 | Universal Instruments Corporation | Hot-bar suspension system |
US5052606A (en) * | 1990-06-29 | 1991-10-01 | International Business Machines Corp. | Tape automated bonding feeder |
US5207467A (en) * | 1990-08-31 | 1993-05-04 | International Business Machines Corporation | Monitor for detecting the absence of an electronic component on a vacuum pickup |
JP2835983B2 (en) * | 1990-10-31 | 1998-12-14 | 株式会社新川 | Bonding head |
US5092510A (en) * | 1990-11-20 | 1992-03-03 | International Business Machines Corporation | Method and apparatus for circuit board support during component mounting |
US5185509A (en) * | 1991-02-19 | 1993-02-09 | Toddco General, Inc. | Robotic arm tool mounting apparatus |
US5150827A (en) * | 1991-11-22 | 1992-09-29 | Hughes Aircraft Company | Self-leveling reflow solder head with double pivot |
ATA70592A (en) * | 1992-04-03 | 1996-02-15 | Alcatel Austria Ag | POSITIONING DEVICE FOR ASSEMBLING PCBS |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US20050062492A1 (en) * | 2001-08-03 | 2005-03-24 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
US5377897A (en) * | 1993-07-29 | 1995-01-03 | Zimmer; Gero | Compensation of non-parallelism (balancing) of a first body to a second body |
US5368217A (en) * | 1993-08-25 | 1994-11-29 | Microelectronics And Computer Technology Corporation | High force compression flip chip bonding method and system |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US5683026A (en) * | 1995-05-31 | 1997-11-04 | Sony Corporation | Pressure-bonding unit and pressure-bonding head unit |
US6047875A (en) * | 1995-09-20 | 2000-04-11 | Unitek Miyachi Coporation | Reflow soldering self-aligning fixture |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US6019154A (en) * | 1996-09-20 | 2000-02-01 | Motorola, Inc. | Self leveling operation stage for ultrasonic welding |
US6041996A (en) * | 1996-11-22 | 2000-03-28 | Matsushita Electric Industrial Co., Ltd. | Method of pressure bonding a bumped electronic part and an apparatus for pressure bonding a bumped electronic part |
JP3298810B2 (en) * | 1997-07-09 | 2002-07-08 | 株式会社新川 | Die bonding equipment |
US5996434A (en) * | 1997-07-29 | 1999-12-07 | Swanson; David W. | Pressure head with dual horns |
US6012711A (en) * | 1997-12-10 | 2000-01-11 | International Business Machines Corporation | Alignment device for establishing a coplanar relationship between first and second surfaces |
JP4544755B2 (en) * | 2001-01-17 | 2010-09-15 | パナソニック株式会社 | Bonding head and component mounting device |
US7296727B2 (en) * | 2001-06-27 | 2007-11-20 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting electronic components |
DE10304777B4 (en) * | 2003-02-05 | 2006-11-23 | Infineon Technologies Ag | Method for producing a chip using a heat and pressure process using a thermoplastic material and apparatus for carrying out the method |
TWI234804B (en) * | 2004-08-03 | 2005-06-21 | Chunghwa Picture Tubes Ltd | Chip compressing mechanism and chip compressing process |
WO2007079769A1 (en) * | 2005-12-23 | 2007-07-19 | Alphasem Gmbh | Tool for picking up, placing or pressing a flat object, and use of the tool |
DE102006003735A1 (en) * | 2006-01-26 | 2007-08-09 | Infineon Technologies Ag | Arrangement for fixing electronic components on a support |
WO2008052594A1 (en) * | 2006-10-31 | 2008-05-08 | Alphasem Gmbh | Device for positioning and/or pressing a planar component relative to a substrate and method for positioning a picking tool relative to a substrate |
US7845543B1 (en) * | 2009-11-17 | 2010-12-07 | Asm Assembly Automation Ltd | Apparatus and method for bonding multiple dice |
US8113411B2 (en) * | 2010-03-30 | 2012-02-14 | Flextronics Ap, Llc | Universal radio frequency shield removal |
US8683882B2 (en) | 2011-09-23 | 2014-04-01 | Ascent Ventures, Llc | Apparatus for ultrasonic transducer or other contact sensor placement against a test material |
US8387851B1 (en) * | 2012-05-04 | 2013-03-05 | Asm Technology Singapore Pte. Ltd. | Apparatus for aligning a bonding tool of a die bonder |
US9334066B2 (en) * | 2013-04-12 | 2016-05-10 | The Boeing Company | Apparatus for automated rastering of an end effector over an airfoil-shaped body |
TWI531013B (en) * | 2013-06-26 | 2016-04-21 | Shinkawa Kk | Wafer holding tool for flip chip bonding and method for flip chip bonding |
US20180109661A1 (en) * | 2016-10-14 | 2018-04-19 | Steven Palen | Mobile device stand |
JP6984179B2 (en) * | 2017-05-30 | 2021-12-17 | Tdk株式会社 | Manufacturing method of thermocompression bonding equipment and electronic parts |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1059545A (en) * | 1912-03-21 | 1913-04-22 | Paulin Karl Kunze | Device for obtaining intimate contact with, engaging, or clamping bodies of any shape. |
US2325387A (en) * | 1940-12-09 | 1943-07-27 | Fredrickson Ernst Waldemar | Work clamping device |
US3259367A (en) * | 1964-01-13 | 1966-07-05 | Superior Scaffold Co | Shoring jack |
GB1150661A (en) * | 1965-04-08 | 1969-04-30 | Ampep Ind Products Ltd | Improvements relating to Bearing Units |
US3574923A (en) * | 1967-06-15 | 1971-04-13 | Western Electric Co | Compensating base for simultaneously bonding multiple leads |
US3529759A (en) * | 1967-06-15 | 1970-09-22 | Bell Telephone Labor Inc | Apparatus for bonding a beam-lead device to a substrate |
US3442432A (en) * | 1967-06-15 | 1969-05-06 | Western Electric Co | Bonding a beam-leaded device to a substrate |
US3608809A (en) * | 1968-08-16 | 1971-09-28 | Western Electric Co | Apparatus for uniform multiple-lead bonding |
US3669333A (en) * | 1970-02-02 | 1972-06-13 | Western Electric Co | Bonding with a compliant medium |
US3823863A (en) * | 1973-02-16 | 1974-07-16 | Western Electric Co | Compensating base for lead-frame bonding |
US3905537A (en) * | 1974-07-08 | 1975-09-16 | Western Electric Co | Method and apparatus for compensating for substance variations during lead frame bonding |
US3957185A (en) * | 1975-08-25 | 1976-05-18 | Western Electric Company, Inc. | Methods of and apparatus for thermocompression bonding with a compensating system |
JPS5252369A (en) * | 1975-10-25 | 1977-04-27 | Fujitsu Ltd | Junction head |
DE2640613C2 (en) * | 1976-09-09 | 1985-03-07 | Siemens AG, 1000 Berlin und 8000 München | Method and device for contacting circuit components in a layer circuit |
JPS5737842A (en) * | 1980-08-19 | 1982-03-02 | Seiko Epson Corp | Device for gang bonding |
JPS58215286A (en) * | 1982-06-09 | 1983-12-14 | Nissan Motor Co Ltd | Holder for electrode chip |
JPH0673364B2 (en) * | 1983-10-28 | 1994-09-14 | 株式会社日立製作所 | Integrated circuit chip cooler |
US4600228A (en) * | 1984-05-31 | 1986-07-15 | Sperry Corporation | Lockable compliant end effector apparatus |
JPS62256441A (en) * | 1986-04-30 | 1987-11-09 | Hitachi Ltd | Die-bonder |
JPS63200541A (en) * | 1987-02-17 | 1988-08-18 | Toshiba Corp | Mechanism for adjusting inclination of bonding tool |
USH539H (en) * | 1987-04-01 | 1988-11-01 | The United States Of America As Represented By The Secretary Of The Navy | Arcuate rolling bearing |
-
1988
- 1988-10-31 US US07/264,713 patent/US4875614A/en not_active Expired - Fee Related
-
1989
- 1989-08-01 EP EP89114147A patent/EP0366880B1/en not_active Expired - Lifetime
- 1989-08-01 DE DE68920405T patent/DE68920405T2/en not_active Expired - Fee Related
- 1989-08-18 JP JP1211544A patent/JPH0650752B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4875614A (en) | 1989-10-24 |
EP0366880A3 (en) | 1991-05-29 |
EP0366880B1 (en) | 1995-01-04 |
DE68920405D1 (en) | 1995-02-16 |
EP0366880A2 (en) | 1990-05-09 |
JPH0650752B2 (en) | 1994-06-29 |
JPH02137241A (en) | 1990-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |