DE60031867T2 - Scalable process transmitter - Google Patents
Scalable process transmitter Download PDFInfo
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- DE60031867T2 DE60031867T2 DE60031867T DE60031867T DE60031867T2 DE 60031867 T2 DE60031867 T2 DE 60031867T2 DE 60031867 T DE60031867 T DE 60031867T DE 60031867 T DE60031867 T DE 60031867T DE 60031867 T2 DE60031867 T2 DE 60031867T2
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- 238000010963 scalable process Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims description 58
- 230000008569 process Effects 0.000 claims description 54
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000004886 process control Methods 0.000 claims description 15
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- 238000007789 sealing Methods 0.000 claims description 4
- 238000004880 explosion Methods 0.000 claims description 2
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D1/00—Measuring arrangements giving results other than momentary value of variable, of general application
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
- G01L13/025—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
- G01L13/026—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms involving double diaphragm
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0663—Flame protection; Flame barriers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/069—Protection against electromagnetic or electrostatic interferences
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/08—Means for indicating or recording, e.g. for remote indication
- G01L19/083—Means for indicating or recording, e.g. for remote indication electrical
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/527—Flameproof cases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R29/00—Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, programmable connectors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/912—Electrical connectors with testing means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Measuring Fluid Pressure (AREA)
Description
HINTERGRUND DER ERFINDUNGBACKGROUND THE INVENTION
Die vorliegende Erfindung betrifft industrielle Prozesssteuerungsvorrichtungen. Insbesondere betrifft die vorliegende Erfindung Messswert-Transmitter, welche zur Messung verschiedener Parameter (Prozessvariablen) in industriellen Prozessen verwendet werden.The The present invention relates to industrial process control devices. In particular, the present invention relates to measured value transmitters, which are used to measure various parameters (process variables) in industrial processes are used.
Messwert-Transmitter werden in Verarbeitungs- und Fertigungsanlagen zur Messung von beispielsweise Druck, Temperatur, Strömung, Dichte, Viskosität und vieler anderer chemischer, physikalischer und elektrischer Eigenschaften von Fluiden eingesetzt. Transmitter werden für gewöhnlich auf Tanks, Rohren und anderen Fluidbehältern befestigt und übertragen ein Signal, welches eine Eigenschaft des Fluids wiedergibt, an einen entfernten Ort wie beispielsweise eine Steuerwarte.Measured value transmitter are used in processing and manufacturing equipment for measuring, for example Pressure, temperature, flow, Density, viscosity and many other chemical, physical and electrical properties used by fluids. Transmitters are usually used on tanks, pipes and other fluid containers attached and transferred a signal representing a property of the fluid to a remote location such as a control room.
Transmitter weisen für gewöhnlich ein Sensorgehäuse für eine Sensor-Schaltkreisanordnung sowie ein Transmittergehäuse für eine Transmitter-Schaltkreisanordnung auf. Die beiden Gehäuse sind an einer feuer- oder flammensicheren mechanischen Verbindungsstelle oder einem Gelenk verbunden. Für gewöhnlich sind die Dichtungen, die Software und die elektrischen Schnittstellen zwischen der Sensor-Schaltkreisanordnung und der Transmitter- Schaltkreisanordnung nicht genormt, wodurch es nicht praktisch oder geeignet ist, Sensor- und Transmitter-Bauteile unterschiedlicher Erzeugnisprogramme zu kombinieren.transmitter show for usually a sensor housing for one Sensor circuit arrangement and a transmitter housing for a transmitter circuit arrangement on. The two cases are at a fire or flameproof mechanical joint or a joint connected. For usually are the seals, the software and the electrical interfaces between the sensor circuitry and the transmitter circuitry not standardized, whereby it is not practical or suitable to use sensor and transmitter components of different product programs combine.
Für gewöhnlich ist der Innenraum des Sensorgehäuses zum Innenraum des Transmittergehäuses hin offen, um zu ermöglichen, dass Drähte durch die Schraubverbindung verlaufen. In einer Anlagenumgebung ist es nicht praktisch, eine Feldverkabelung ohne Verwendung eines Transmittergehäuses direkt zu dem Sensorgehäuse zu verlegen, da das Sensorgehäuse an sich nicht gegen die Umgebung abgedichtet und vor ihr feuersicher ist. Des Weiteren ist die Sensor-Schaltkreisanordnung nicht in der Lage, über eine große Entfernung zu übertragen oder zu senden.Usually is the interior of the sensor housing to the interior of the transmitter housing open to allow that wires pass through the screw connection. In a plant environment it is not practical to use a field wiring without using a Transmitter housing directly to the sensor housing to lay, because the sensor housing not sealed against the environment and fireproof is. Furthermore, the sensor circuit arrangement is not in the Able to over a big Transfer distance or to send.
Innerhalb eines Erzeugnisprogramms von Druck-Transmittern ist der Endbenutzer für gewöhnlich in der Lage, Bauteile zur Herstellung unterschiedlicher Kombinationen von Druckbereichen, benetzter Werkstoffe und elektrischer oder Anzeigevorrichtungen zu kombinieren. Darüber hinaus muss diese Verbindung oder Zusammenfügung normalerweise vom Hersteller durchgeführt werden. Im Allgemeinen ist es jedoch nicht praktisch für den Benutzer, Sensor- und Transmitterbauteile aus unterschiedlichen Erzeugnisprogrammen aufgrund ihrer elektrischen, softwarebedingten und mechanischen fehlenden Kompatibilität oder Unverträglichkeit zusammenzuführen.Within a product program of print transmitters is the end user usually in capable of producing components for producing different combinations of pressure areas, wetted materials and electrical or display devices to combine. About that In addition, this connection or assembly is usually required by the manufacturer carried out become. In general, however, it is not practical for the user to Sensor and transmitter components from different product programs due to their electrical, software-related and mechanical lack of compatibility or incompatibility merge.
Es besteht ein Bedarf an einer Transmitter-Anordnung, bei der der Sensorabschnitt direkt mit einem Steuersystem oder mit anderen benachbarten Bauteilen verdrahtet werden kann, indem ein lokaler Bus zur Erhöhung der Funktionalität und Skalierbarkeit eingesetzt wird. Darüber hinaus besteht ein Bedarf an Transmitter-Bauteilen, die auch mit Bauteilen aus anderen Erzeugnispro grammen zusammengeführt werden können, ohne dass die Notwendigkeit für erhebliche Modifikationen durch den Endbenutzer vorliegt.It There is a need for a transmitter arrangement in which the sensor section directly with a control system or with other neighboring components can be wired by using a local bus to increase the functionality and scalability is used. In addition, there is a need on transmitter components, which also with components from other product programs together can be without the need for significant modifications have been made by the end user.
ZUSAMMENFASSUNG DER ERFINDUNGSUMMARY THE INVENTION
Die vorliegende Erfindung stellt ein Sensormodul, ein Transmittermodul und Verfahren zur Herstellung des Sensormoduls und des Transmittermoduls gemäß Darlegung in den Ansprüchen 1, 19, 48 und 49 bereit. Die Erfindung stellt zudem einen Messumformer bereit, welcher ein Transmittermodul und ein Sensor-Modul gemäß Darlegung in Anspruch 36 aufweist.The The present invention provides a sensor module, a transmitter module and method of manufacturing the sensor module and the transmitter module as stated in the claims 1, 19, 48 and 49 ready. The invention also provides a transmitter ready, which a transmitter module and a sensor module as explained in claim 36.
Es wird ein modulares Sensormodul bereitgestellt, welches Folgendes aufweist: ein Sensorgehäuse, welches so ausgelegt ist, dass es das modulare Sensormodul auf einer Prozessöffnung stützt, wobei das Gehäuse eine einen Hohlraum umgebende Außenwand sowie ein mit der Außenwand integrales oder einstückig gebildetes Anschlussstück aufweist und derart ausgelegt ist, dass es ein skalierbares Transmittermodul stützt, wobei sich das Anschlüssstück zum Hohlraum hin öffnet; einen Schaltkreis in dem Hohlraum, wobei der Schaltkreis einen Sensor aufweist, der an die Prozessöffnung koppelt und ein Sensor-Ausgangssignal bereitstellt; und eine Durchführung, welche das Anschlussstück abdichtet und externe Leiter aufweist, welche den Schaltkreis erregen und das Sensor-Ausgangssignal bereitstellen, wobei das Sensor-Ausgangssignal für eine lokale Verbindung mit einem skalierbaren Transmittermodul konfigurierbar ist und für eine direkte Verdrahtung mit einem entfernt gelegenen Empfänger konfigurierbar ist.It a modular sensor module is provided which includes the following comprising: a sensor housing, which is designed so that it is the modular sensor module on a process opening supports, where the housing an outer wall surrounding a cavity and one with the outer wall integral or in one piece having formed connecting piece and is designed to be a scalable transmitter module supports, with the connecting piece to the cavity opens; a circuit in the cavity, wherein the circuit is a sensor which is attached to the process opening couples and provides a sensor output; and an implementation which the connector seals and has external conductors which energize the circuit and provide the sensor output, wherein the sensor output is for a local Configurable with a scalable transmitter module is and for a direct wiring with a remote receiver configurable is.
Des Weiteren wird ein Transmitter bereitgestellt, welcher ein skalierbares Transmittermodul aufweist, welches mit einem erfindungsgemäßen modularen Sensormodul gekoppelt ist.Of Furthermore, a transmitter is provided which is a scalable Transmitter module, which with a modular according to the invention Sensor module is coupled.
Darüber hinaus wird ein skalierbares Transmittermodul bereitgestellt, welches ein Gehäuse aufweist, das derart ausgelegt ist, dass es auf einem modularen Sensormodul befestigt ist, wobei das Gehäuse eine einen Hohlraum umgebende Außenwand aufweist und eine erste Öffnung besitzt, die derart ausgelegt ist, dass sie auf einem Anschlussstück des modularen Sensormoduls befestigt werden kann, sowie eine zweite Öffnung, welche zum Anschluss an einen Kabelkanal zu einem entfernt gelegenen Empfänger ausgelegt ist, wobei die erste und die zweite Öffnung in den Hohlraum sowie der Hohlraum eine abnehmbare oder entfernbare Abdeckung aufweisen; und einen Schaltkreis in dem Hohlraum, welcher eine Steckverbindung oder einen Stecker aufweist, welcher derart ausgelegt ist, dass er mit einer Durchführung des modularen Sensormoduls zusammenpasst, wobei der Schaltkreis derart ausgelegt ist, dass er einen Sensorausgang von dem modularen Sensormodul empfängt und einen skalierbaren Ausgang auf Schaltkreisanschlüssen erzeugt, welche durch Entfernen der Abdeckung zugänglich sind, wobei der skalierbare Ausgang zum Anschluss an den entfernt gelegenen Empfänger ausgelegt ist.Furthermore a scalable transmitter module is provided which includes a casing which is designed to be modular Sensor module is attached, wherein the housing surrounding a cavity Exterior wall has and a first opening which is designed to be mounted on a connector of the modular Sensor module can be attached, as well as a second opening, which for connection to a cable duct to a remote receiver is designed, with the first and the second opening in the cavity as well the cavity has a removable or removable cover; and a circuit in the cavity, which is a plug connection or a plug which is designed such that he with an execution of the modular sensor module, the circuit is designed to receive a sensor output from the modular sensor module receives and generates a scalable output on circuit terminals, which are accessible by removing the cover, being the scalable Output designed for connection to the remote receiver is.
Es wird ein Transmitter bereitgestellt, welcher ein modulares Sensormodul aufweist, welches mit einem skalierbaren Transmittermodul gemäß der vorliegenden Erfindung gekoppelt ist.It a transmitter is provided which is a modular sensor module which is provided with a scalable transmitter module according to the present invention Invention is coupled.
Des Weiteren wird ein Verfahren zur Herstellung eines skalierbaren Transmittermoduls bereitgestellt, welches die folgenden Schritte aufweist: Bildung eines Gehäuses zur Befestigung auf einem modularen Sensormodul, wobei das Gehäuse eine einen Hohlraum umgebende Außenwand und eine erste Öffnung aufweist, welche derart ausgelegt ist, dass sie auf einem Anschlussstück des modularen Sensormoduls befestigt werden kann, sowie eine zweite Öffnung, welche zum Anschluss an einen Kabelkanal zu einem entfernt gelegenen Empfänger ausgelegt ist, und Bereitstellung von Öffnungen durch die erste und zweite Öffnung in den Hohlraum sowie Abdeckung des Hohlraums mit einer abnehmbaren Abdeckung; und Installation eines Schaltkreises in dem Hohlraum, wobei der Schaltkreis einen Stecker aufweist, der derart ausgelegt ist, dass er mit einer Durchführung des modularen Sensormoduls zusammenpasst, wobei der Schaltkreis für den Empfang eines Sensor- Ausgangssignals von dem modularen Sensormodul ausgelegt ist und einen skalierbaren Ausgang auf Schaltkreisanschlüssen erzeugt, welche durch Entfernen der Abdeckung zugänglich sind, wobei der skalierbare Ausgang zum Anschluss an den entfernt gelegenen Empfänger ausgelegt ist.Of Another is a method of making a scalable transmitter module provided comprising the following steps: formation a housing for mounting on a modular sensor module, the housing having a a cavity surrounding outer wall and a first opening which is designed so that it fits on a connector of the modular Sensor module can be attached, as well as a second opening, which for connection to a cable duct to a remote receiver is designed, and providing openings through the first and second opening in the cavity as well as covering the cavity with a removable Cover; and installing a circuit in the cavity, wherein the circuit has a plug designed in such a way is that he is having an implementation of the modular sensor module, the circuit for the Reception of a sensor output signal is designed by the modular sensor module and a scalable output on circuit connections generated, which are accessible by removing the cover, wherein the scalable output for connection to the remote receiver is designed.
Darüber hinaus wird ein Verfahren zur Herstellung eines modularen Sensormoduls bereitgestellt, welches die folgenden Schritte aufweist: Bereitstellung eines Gehäuses, welches derart ausgelegt ist, dass es das modulare Sensormodul auf einer Prozessöffnung stützt, Bereitstellung einer Außenwand für das Gehäuse, welche einen Hohlraum umgibt, und Bereitstellung eines Anschlussstücks für das Gehäuse, welches derart ausgelegt ist, dass es ein skalierbares Transmittermodul stützt, und Öffnen des Anschlussstücks zum Hohlraum hin; Installation eines Schaltkreises in dem Hohlraum, wobei der Schaltkreis einen Sensor aufweist, der an den Prozessbehälter koppelt und einen Sensorausgang bereitstellt; und Abdichtung einer Durchführung in dem Anschlussstück sowie Bereitstellung von externen Leitern auf der mit dem Sensor-Ausgangssignal verbundenen Durchführung, und Anpassung der Leiter für sowohl einen lokalen Anschluss an ein skalierbares Transmittermodul als auch eine direkte Verdrahtung mit einem entfernt gelegenen Empfänger.Furthermore is a method of making a modular sensor module provided comprising the steps of: providing a housing, which is designed to accommodate the modular sensor module a process opening supports, Providing an exterior wall for the Casing, which surrounds a cavity, and providing a fitting for the housing, which is designed such that it is a scalable transmitter module supports, and opening the fitting towards the cavity; Installation of a circuit in the cavity, wherein the circuit has a sensor that couples to the process vessel and providing a sensor output; and sealing a passage in the connection piece as well as providing external conductors on the with the sensor output signal connected implementation, and adaptation of the ladder for both a local connection to a scalable transmitter module as well as direct wiring to a remote receiver.
Ausführungsformen stellen ein modulares Sensormodul bereit, welches Folgendes aufweist: eine Vorrichtung zur Unterbringung oder eine Gehäusevorrichtung, welche derart ausgelegt ist, dass sie das modulare Sensormodul auf einer Prozessöffnung stützen, wobei die Gehäusevorrichtung eine Außenwand aufweist, welche einen Hohlraum umgibt, sowie ein Anschlussstück, welches derart ausgelegt ist, dass es ein skalierbares Transmittermodul stützt, wobei sich das Anschlussstück zum Hohlraum hin öffnet; eine Messvorrichtung, welche einen Schaltkreis in dem Hohlraum aufweist, wobei der Schaltkreis einen an den Prozessbehälter koppelnden Sensor aufweist und einen Sensorausgang bereitstellt; und eine Anschluss- oder Verbindungsvorrichtung, welche eine Durchführung, die das Anschlussstück abdichtet, und mit dem Sensoraus gang verbundene externe Leiter aufweist, die sowohl für einen lokalen Anschluss an ein skalierbares Transmittermodul als auch für eine direkte Verdrahtung mit einem entfernt gelegenen Empfänger anpassbar sind.embodiments provide a modular sensor module comprising: a Housing device or a housing device, which is such is designed to support the modular sensor module on a process opening, wherein the housing device an outer wall having a cavity surrounding, and a connecting piece, which is designed such that it is a scalable transmitter module supports, with the fitting opens towards the cavity; a measuring device having a circuit in the cavity, wherein the circuit has a sensor coupled to the process vessel and providing a sensor output; and a connection or connection device, which one implementation, the connecting piece seals, and with the Sensoraus gear connected external conductor, which both for a local connection to a scalable transmitter module as well for one direct wiring with a remote receiver customizable are.
Ausführungsformen stellen ein skalierbares Transmittermodul bereit, welches eine Gehäusevorrichtung aufweist, die derart ausgelegt ist, dass sie auf einem modularen Sensormodul befestigt werden kann, wobei die Gehäusevorrichtung eine einen Hohlraum umgebende Außenwand und eine erste Öffnung aufweist, die derart ausgelegt ist, dass sie auf einem Anschlussstück des modularen Sensormoduls befestigt werden kann, sowie eine zweite Öffnung, welche zum Anschluss an einen Kabelkanal zu einem entfernt gelegenen Empfänger ausgelegt ist, und Öffnungen durch die erste und zweite Öffnung in den Hohlraum sowie eine entfernbare Abdeckung, welche den Hohlraum abdeckt; und eine Messvorrichtung in dem Hohlraum, welche einen Schaltkreis mit einem Stecker einschließt, welcher derart ausgelegt ist, dass er mit einer Durchführung des modularen Sensormoduls zusammenpasst, wobei der Schaltkreis derart ausgelegt ist, dass er ein Sensor-Ausgangssignal von dem modularen Sensormodul empfängt und ein skalierbares Ausgangssignal auf Schaltkreisanschlüssen, welche durch Entfernen der Abdeckung zugänglich sind, erzeugt, wobei das skalierbare Ausgangssignal zur Verbindung mit dem entfernt gelegenen Empfänger ausgelegt ist.Embodiments provide a scalable transmitter module having a housing device configured to be mounted on a modular sensor module, the housing device having an outer wall surrounding a cavity and a first opening configured to rest on a housing A connector of the modular sensor module can be attached, and a second opening, which is designed for connection to a cable channel to a remote receiver, and openings through the first and second openings in the cavity and a removable cover which covers the cavity; and a measurement device in the cavity that includes a circuit with a plug configured to mate with a feedthrough of the modular sensor module, the circuit configured to receive a sensor output signal from the modular sensor and generates a scalable output on circuit terminals accessible by removing the cover, the scalable output being adapted for connection to the remote receiver.
Ausführungsformen stellen ein modulares Sensormodul bereit, welches in vielerlei Hinsicht gesehen direkt mit einem Steuer- oder Regelsystem oder anderen benachbarten Bauteilen verdrahtet werden kann. Ein optisches skalierbares Transmittermodul kann zur Bereitstellung einer erhöhten Funktionalität und Skalierbarkeit für unterschiedliche Anwendungen an das Sensormodul koppeln. Das Sensormodul schließt einen Sensorausgang ein, welcher so konfiguriert sein kann, dass er zur Bildung eines Transmitters lokal an das skalierbare Transmittermodul koppelt, oder dass er direkt mit einem entfernt gelegenen Empfänger verdrahtet werden kann. Ein Gehäuse für das modulare Sensormodul lagert die Schaltkreis anordnung in einem Hohlraum sowie einen Sensor, der eine Prozessvariable messen kann. Eine Durchführung dichtet ein Anschlussstück des Gehäuses ab, welches eine externe Verbindung mit dem Sensormodul bereitstellt.embodiments provide a modular sensor module, which in many ways seen directly with a control system or other neighboring Components can be wired. An optical scalable transmitter module can provide increased functionality and scalability for different Couple applications to the sensor module. The sensor module closes one Sensor output, which can be configured so that it to Formation of a transmitter locally to the scalable transmitter module couples, or that it is wired directly to a remote receiver can be. A housing for the Modular sensor module supports the circuit arrangement in a cavity and a sensor that can measure a process variable. A passage seals a connector of the housing which provides an external connection to the sensor module.
Weitere Einzelheiten, Merkmale und Vorteile ergeben sich aus der nachfolgenden Kurzbeschreibung der Erfindung anhand der Zeichnungen.Further Details, features and advantages will be apparent from the following Brief description of the invention with reference to the drawings.
KURZBESCHREIBUNG DER ZEICHNUNGENSUMMARY THE DRAWINGS
Es zeigen:It demonstrate:
AUSFÜHRLICHE BESCHREIBUNG DER BEVORZUGTEN AUSFÜHRUNGSFORMENDETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Die vorliegende Erfindung stellt eine neue Sensor- und Transmittermodul-Architektur zur Verwendung in industriellen Prozessen bereit. Diese neue Architektur ist modular und in hohem Maße skalierbar und kann im Gegensatz zu typischen Konstruktionen des Standes der Technik in einer großen Anzahl von Konfigurationen eingesetzt werden. Bei der vorliegenden Erfindung kann ein modulares Sensormodul (oder "Supermodul") allein zur Erfassung und Messung von Prozessvariablen verwendet werden, oder es kann in Kombination mit einer "Merkmals-Leiterplatte", welche in dem optionalen Transmittermodul untergebracht ist, verwendet werden. Die Merkmals-Leiterplatte kann verwendet werden, um dem Supermo dul wunschgemäß für eine besondere Anwendung fortschrittlichere Merkmale hinzuzufügen, oder dann, wenn sich die Anforderungen für eine besondere Anwendung im Laufe der Zeit verändern. Diese Modularität und Skalierbarkeit verringert die Herstellungskosten und reduziert Bestandsanforderungen. Des Weiteren stellen diese Eigenschaften für einen Benutzer mehr Konfigurationvarianten- oder Auswahlmöglichkeiten bereit und verringern zudem die Anzahl unterschiedlicher spezifischer Transmitter-Konfigurationen, die von einem Benutzer erworben werden müssen. Das Sensormodul und das Transmittermodul erfüllen vorzugsweise Eigensicherheitsnormen, während sie immer noch die Fähigkeit zur Skalierung beibehalten, ohne dass das Modul oder die Module aus dem "Feld oder Arbeitsbereich" entfernt werden.The present invention provides a new sensor and transmitter module architecture for use in industrial processes. This new architecture is modular and highly scalable and, unlike typical prior art designs, can be used in a wide variety of configurations. In the present invention, a modular sensor module (or "supermodule") may be used alone to detect and measure process variables, or it may be used in combination with a "feature board" housed in the optional transmitter module. The feature board may be used to add more advanced features to the supermodule, as desired for a particular application, or as the requirements for a particular application change over time. This modularity and scalability reduces manufacturing costs and reduces inventory requirements. Furthermore, these properties provide more configuration options or choices for a user and also reduce the number of different specific transs mitter configurations that must be purchased by a user. The sensor module and the transmitter module preferably satisfy intrinsic safety standards while still maintaining the ability to scale without removing the module or modules from the "field or work area".
In
der in
Die
Konfiguration des modularen Sensormoduls
In
einer Konfiguration liefert der Bus
Vorzugsweise
ist das Modul
Die
Zusätzlich zu den vorstehend erörterten Vorteilen ermöglicht die Skalierbarkeit der Erfindung die Verwendung einer gemeinsamen Merkmals-Leiterplatte bei einer Familie von Sensormodulen. Jedes Sensormodul in der Familie kann unterschiedliche Leistungspegel bereitstellen, für verschiedene Arten von Prozessfluiden oder Umgebungen konstruiert sein, und/oder verschiedene Hardware-/Software-Fähigkeiten bereitstellen. Neue Merkmals-Leiterplatten können zu bereits bestehenden Sensormodulen hinzugefügt werden, um neue Fähigkeiten wie beispielsweise ein neues Kommunikationsprotokoll oder eine neue Diagnosefunktion bereitzustellen. Als weiteres Beispiel kann eine neue Merkmals-Leiterplatte mit möglicherweise neuen Fähigkeiten hinzugefügt werden, um mit einer Vielzahl von Sensormodulen in einer einzigartigen Architektur zu arbeiten oder zu funktionieren.In addition to those discussed above Benefits possible the scalability of the invention the use of a common Feature board in a family of sensor modules. Each sensor module in the family can provide different levels of performance for different Be constructed types of process fluids or environments, and / or provide various hardware / software capabilities. New Feature boards can to be added to existing sensor modules to new skills such as a new communication protocol or a new one Provide diagnostic function. As another example, a new feature board with maybe new skills added Become to having a variety of sensor modules in a unique Architecture to work or work.
Ein
Speicher
Die
Ein
Sensormodul-Schaltkreis
Eine
Durchführung
Der
Sensorausgang
Das
Anschlussstück
Das
Anschlussstück
In
den
Die
Die Architektur der Erfindung stellt ein abgedichtetes modulares Sensormodul bereit, welches zur Lieferung eines direkt mit einem Steuersystem verdrahteten Basis-Ausgangssignal konfiguriert sein kann. Wenn spezialisiertere Arten von Transmitter-Ausgängen oder visuelle Anzeigen oder Displays erwünscht werden, kann das modulare Sensormodul zur Bereitstellung eines lokalen Ausgangs konfiguriert sein, welcher ein skalierbares Transmittermodul stützt. Ein skalierbares Transmittermodul kann im Wirkungsfeld oder Arbeitsbereich hinzugefügt werden und eine Schaltkreisanordnung aufweisen, die skaliert ist, um die Anforderungen der Anwendung zu erfüllen.The Architecture of the invention provides a sealed modular sensor module ready for delivery of a wired directly to a control system Basic output signal can be configured. If more specialized Types of transmitter outputs or visual displays or displays are desired, the modular Sensor module configured to provide a local output which supports a scalable transmitter module. One scalable transmitter module can be in the field of action or workspace added and have a circuit arrangement that is scaled, to meet the requirements of the application.
In einer Ausführungsform werden eine feuersichere Verbindungsstelle, eine Dichtung und elektrische Verbindungen alle in einem einzigen Kopf kombiniert, der einstückig mit dem Gehäuse des modularen Sensormoduls ausgebildet ist. Der Kopf ist genormt, um eine direkte Verbindung mit einem Steuersystem oder einer Befestigung eines skalierbaren Transmittermoduls auf dem Kopf zu ermöglichen. Elektrische, mechanische und Software-Schnittstellen sind am Kopf genormt, um zu ermöglichen, das dieselbe Gruppe skalierbarer Transmittermodule bei unterschiedlichen Erzeugnisprogrammen modularer Sensormodule eingesetzt werden kann.In an embodiment be a fire-proof joint, a gasket and electrical Compounds all combined in a single head, integral with the housing is formed of the modular sensor module. The head is standardized, to connect directly to a control system or attachment to enable a scalable transmitter module on the head. electric, mechanical and software interfaces are standardized at the head to to enable the same group of scalable transmitter modules at different Product programs modular sensor modules can be used.
Obwohl die vorliegende Erfindung mit Bezug auf bevorzugte Ausführungsformen beschrieben worden ist, werden Fachleute in der Technik erkennen, dass Veränderungen hinsichtlich Form und Detail vorgenommen werden können, ohne vom Schutzumfang der Erfindung, welcher lediglich durch die Formulierung der anliegenden Ansprüche beschränkt ist, abzuweichen. Es können andere physikalische oder elektrische Architekturen verwendet werden, um die Skalierbarkeit der vorliegenden Erfindung zu erzielen. Das Sensormodul kann kann jede beliebige Art von Sensor einschließen, welche basierend auf jeder beliebigen Art von Messtechnologie zur Messung einer Prozessvariablen verwendet wird, wie beispielsweise Druck-, Durchfluss-, Temperatur- oder Füllstand-Sensoren. Vorzugsweise erfüllen alle Kopplungen an die Module und die Module selbst Eigensicherheitsanforderungen, während sie ihre Modularität bewahren.Even though the present invention with reference to preferred embodiments will be appreciated by those skilled in the art, that changes in terms of shape and detail can be made without from the scope of the invention, which only by the formulation the appended claims limited is to deviate. It can other physical or electrical architectures are used to achieve the scalability of the present invention. The Sensor module may include any type of sensor which based on any type of measurement technology for measurement a process variable is used, such as print, Flow, temperature or level sensors. Preferably fulfill all couplings to the modules and the modules themselves intrinsic safety requirements, while her modularity preserve.
Claims (49)
Applications Claiming Priority (3)
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PCT/US2000/026561 WO2001023858A1 (en) | 1999-09-28 | 2000-09-27 | Scalable process transmitter |
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DE60031867T2 true DE60031867T2 (en) | 2007-06-21 |
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DE60224881D1 (en) * | 2001-07-20 | 2008-03-20 | Texas A & M Univ Sys | PLANE FINISHING AREA OF A BOX BALANCE |
-
2000
- 2000-03-07 US US09/519,781 patent/US6484107B1/en not_active Expired - Lifetime
- 2000-07-31 US US09/638,181 patent/US6593857B1/en not_active Expired - Lifetime
- 2000-09-22 US US09/667,289 patent/US6609427B1/en not_active Expired - Lifetime
- 2000-09-27 EP EP00968435A patent/EP1216404B1/en not_active Expired - Lifetime
- 2000-09-27 US US09/671,495 patent/US6457367B1/en not_active Expired - Lifetime
- 2000-09-27 DE DE60031867T patent/DE60031867T2/en not_active Expired - Lifetime
- 2000-09-27 JP JP2001527195A patent/JP4208465B2/en not_active Expired - Lifetime
- 2000-09-27 CN CNB00813488XA patent/CN1174228C/en not_active Expired - Lifetime
- 2000-09-27 WO PCT/US2000/026561 patent/WO2001023858A1/en active IP Right Grant
- 2000-09-27 AU AU78350/00A patent/AU7835000A/en not_active Abandoned
- 2000-09-27 BR BRPI0014359A patent/BRPI0014359B1/en not_active IP Right Cessation
-
2002
- 2002-04-18 US US10/125,286 patent/US6568279B2/en not_active Expired - Lifetime
-
2003
- 2003-05-27 US US10/445,710 patent/US6898980B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1174228C (en) | 2004-11-03 |
EP1216404A1 (en) | 2002-06-26 |
US6898980B2 (en) | 2005-05-31 |
DE60031867D1 (en) | 2006-12-28 |
US6484107B1 (en) | 2002-11-19 |
US6568279B2 (en) | 2003-05-27 |
EP1216404B1 (en) | 2006-11-15 |
US6593857B1 (en) | 2003-07-15 |
WO2001023858A1 (en) | 2001-04-05 |
US20020108448A1 (en) | 2002-08-15 |
JP2003510598A (en) | 2003-03-18 |
BR0014359A (en) | 2002-06-11 |
AU7835000A (en) | 2001-04-30 |
WO2001023858A9 (en) | 2002-10-03 |
CN1376261A (en) | 2002-10-23 |
US6609427B1 (en) | 2003-08-26 |
BRPI0014359B1 (en) | 2017-06-06 |
JP4208465B2 (en) | 2009-01-14 |
US20040089075A1 (en) | 2004-05-13 |
US6457367B1 (en) | 2002-10-01 |
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